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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 127 records · Page 7
All sourcesNASA NTRSDOE OSTI
NASA NTRS1986

The 60 GHz IMPATT diode development

The objective is to develop 60 GHz IMPATT diodes suitable for communications applications. The performance goals of the 60 GHz IMPATT is 1W CW output power with a conversion efficiency of 15 percent and 10-year lifetime. The final design of the 60 GHz IMPATT structure evolved from computer simulations performed at the University of Michigan. The initial doping profile, involving a hybrid double-drift (HDD) design, was derived from a drift-diffusion model that used the static velocity-field characteristics for GaAs. Unfortunately, the model did not consider the effects of velocity undershoot and delay of the avalanche process due to energy relaxation. Consequently, the initial devices were oscillating at a much lower frequency than anticipated. With a revised simulation program that included the two effects given above, a second HDD profile was generated and was used as a basis for fabrication efforts. In the area of device fabrication, significant progress was made in epitaxial growth and characterization, wafer processing, and die assembly. The organo-metallic chemical vapor deposition (OMCVD) was used. Starting with a baseline X-Band IMPATT technology, appropriate processing steps were modified to satisfy the device requirements at V-Band. In terms of efficiency and reliability, the device requirements dictate a reduction in its series resistance and thermal resistance values. Qualitatively, researchers were able to reduce the diodes' series resistance by reducing the thickness of the N+ GaAs substrate used in its fabrication.

Dat, Rovindra↗
NASA NTRSDate not supplied

Production and Characterization of Additively Manufactured Radiator Panels with Integral Branching Heat Pipes for High-Temperature Heat Rejection

Emerging concepts for fission surface power and nuclear electric propulsion necessitate lightweight, mechanically robust, and thermally efficient heat rejection radiators. State-of-the-art intermediate-temperature (~400 K) composite radiator assemblies have been developed based on titanium-water heat pipes bonded to metal, graphite, and carbon-fiber-based panels. NASA has identified a need for new radiator concepts that can operate at even higher temperatures (500 – 600 K), minimize thermal resistances and thermal stress failures at bond interfaces, and approach areal densities of 2 – 3 kg m -2 . To meet these needs, our team is developing additively manufactured (AM) radiator panels with integral branching wicking heat pipe networks. Water is selected as the working fluid for this temperature range. Based on simulations and thermal vacuum experiments, these branching embedded heat pipe networks can efficiently distribute heat over panels for finned surface efficiencies of η f >70% at T H = 500 K input heat. This paper first presents laser powder-bed fusion AM strategies to produce embedded porous structures for wicking heat pipes in Inconel 718 and titanium alloys (commercially pure and Ti-6Al-4V alloys). Post-build chemical and thermal treatments are described that yield hydrophilic wicking surfaces for operation with water. Transient rate-of-rise experiments with water and acetone are reported that yield estimates for AM wick porosity (ϵ), permeability (K), and effective pore radius (r pore ). Based on the wick characterization results, small prototype radiator panels (75 × 125 mm) with integrated heat pipe networks were manufactured. Heat rejection performance data are presented from cold thermal vacuum testing, with heat input temperatures up to ~510 K. Future efforts will focus on improving heat pipe performance, optimizing radiator mass, and evaluating larger panels to assess scalability.

thermal management↗
NASA NTRS2024

Production and Characterization of Additively Manufactured Radiator Panels With Integral Branching Heat Pipes for High-Temperature Heat Rejection

Emerging concepts for fission surface power and nuclear electric propulsion necessitate lightweight, mechanically robust, and thermally efficient heat rejection radiators. State-of-the-art intermediate-temperature (~400 K) composite radiator assemblies have been developed based on titanium-water heat pipes bonded to metal, graphite, and carbon-fiber-based panels. NASA has identified a need for new radiator concepts that can operate at even higher temperatures (500 – 600 K), minimize thermal resistances and thermal stress failures at bond interfaces, and approach areal densities of 2 – 3 kg m -2 . To meet these needs, our team is developing additively manufactured (AM) radiator panels with integral branching wicking heat pipe networks. Water is selected as the working fluid for this temperature range. Based on simulations and thermal vacuum experiments, these branching embedded heat pipe networks can efficiently distribute heat over panels for finned surface efficiencies of η f >70% at T H = 500 K input heat. This paper first presents laser powder-bed fusion AM strategies to produce embedded porous structures for wicking heat pipes in Inconel 718 and titanium alloys (commercially pure and Ti-6Al-4V alloys). Post-build chemical and thermal treatments are described that yield hydrophilic wicking surfaces for operation with water. Transient rate-of-rise experiments with water and acetone are reported that yield estimates for AM wick porosity (ϵ), permeability (K), and effective pore radius ( r pore ). Based on the wick characterization results, small prototype radiator panels (75 × 125 mm) with integrated heat pipe networks were manufactured. Heat rejection performance data are presented from cold thermal vacuum testing, with heat input temperatures up to ~510 K. Future efforts will focus on improving heat pipe performance, optimizing radiator mass, and evaluating larger panels to assess scalability.

nuclear electric propulsion↗
DOE OSTI2022

FEMTOSECOND LASER DRILLING OF SILICON NITRIDE

Ceramics are employed in various engineering applications including electronics, semiconductors, automotive and aerospace industry, among others. Ceramics are desirable materials due to their high hardness, thermal resistance, chemical, thermal, and mechanical properties. A drawback of engineering ceramics is the manufacturing process. Ceramics are hard and brittle and conventional drilling or cutting methods can damage the material. These challenges in manufacturing have limited the application of ceramics in certain engineering applications. The non-contact machining of ceramics through ultrashort pulsed laser drilling offers a possible solution to the manufacturing issues. The advantage of laser drilling is the ability to machine hard and brittle materials. A laser, pulsed in the time regime of femtoseconds (fs), drills/machines sharp and well-defined holes and cuts. Additionally, the short pulse width results in limited melting, cracking, or heat transfer to the surrounding material, as well as no residual stresses. This non-contact process can greatly aid in the machining of hard materials. This study focuses on drilling into silicon nitride to produce zero-taper through holes. With this, other thicknesses can be explored, to achieve zero-taper holes.

Femtosecond laser ablation, Ceramics, Silicon Nitr↗
DOE OSTI2021

Thickness-Independent Vibrational Thermal Conductance across Confined Solid-Solution Thin Films

In this study, we experimentally show that the thermal conductance across confined solid-solution crystalline thin films between parent materials does not necessarily lead to an increase in thermal resistances across the thin-film geometries with increasing film thicknesses, which is counterintuitive to the notion that adding a material serves to increase the total thermal resistance. Confined thin epitaxial Ca 0.5 Sr 0.5 TiO 3 solid-solution films with systematically varying thicknesses in between two parent perovskite materials of calcium titanate and (001)-oriented strontium titanate are grown, and thermoreflectance techniques are used to accurately measure the thermal boundary conductance across the confined solid-solution films, showing that the thermal resistance does not substantially increase with the addition of solid-solution films with increasing thicknesses from ~1 to ~10 nm. Contrary to the macroscopic understanding of thermal transport where adding more material along the heat propagation direction leads to larger thermal resistances, our results potentially offer experimental support to the computationally predicted concept of vibrational matching across interfaces. This concept is based on the fact that a better match in the available heat-carrying vibrations due to an interfacial layer can lead to lower thermal boundary resistances, thus leading to an enhancement in thermal boundary conductance across interfaces driven by the addition of a thin “vibrational bridge” layer between two solids.

36 MATERIALS SCIENCE↗
DOE OSTI2025

High-heat transfer lithium-ion batteries: A new era in battery thermal management

Despite advances in lithium-ion battery technology, critical challenges remain that must be addressed to accelerate electric vehicle (EV) adoption and global energy transformation. Significantly improved battery thermal management (BTM) is key to overcoming these challenges. BTM approaches focus on increasing heat transfer coefficients via air, liquid, or refrigerant cooling, but less attention is given to reducing the battery's thermal resistance, a major bottleneck for heat transfer. This work introduces a novel approach to reduce battery thermal resistance by integrating in-plane heat transfer with optimized cell geometry, minimized thermal resistances, and reduced interfacial resistances, representing a departure from previous methods. The standard prismatic can cell incorporating this technology is referred to as the high heat transfer (HHT) battery. An equivalent resistance battery thermal model is developed for speed and accuracy, validated against experimental data in the literature, demonstrating strong correlation and ensuring reliable predictions for real-world performance. Thermal performance metrics of the conventional and HHT batteries are compared using a parametric study with air, liquid, and refrigerant boundary conditions across a range of aspect ratios. The HHT battery shows a heat removal rate up to 20 times higher than a conventional battery. These findings suggest that HHT technology could be transformative for EV battery performance, enabling fast charging, mitigating thermal runaway, extending battery life, reducing cold-weather power loss, increasing reliability, lowering costs, and enabling higher energy density, all critical for EV adoption and energy transformation. Future work will focus on prototyping and real-world testing to refine these findings for commercial-scale applications.

25 ENERGY STORAGE↗
NASA NTRS1993

Thermal shock resistance of ceramic matrix composites

The experimental and analytical investigation of the thermal shock phenomena in ceramic matrix composites is detailed. The composite systems examined were oxide-based, consisting of an aluminosilicate matrix with either polycrystalline aluminosilicate or single crystal alumina fiber reinforcement. The program was divided into three technical tasks; baseline mechanical properties, thermal shock modeling, and thermal shock testing. The analytical investigation focused on the development of simple expressions for transient thermal stresses induced during thermal shock. The effect of various material parameters, including thermal conductivity, elastic modulus, and thermal expansion, were examined analytically for their effect on thermal shock performance. Using a simple maximum stress criteria for each constituent, it was observed that fiber fracture would occur only at the most extreme thermal shock conditions and that matrix fracture, splitting parallel to the reinforcing fiber, was to be expected for most practical cases. Thermal shock resistance for the two material systems was determined experimentally by subjecting plates to sudden changes in temperature on one surface while maintaining the opposite surface at a constant temperature. This temperature change was varied in severity (magnitude) and in number of shocks applied to a given sample. The results showed that for the most severe conditions examined that only surface matrix fracture was present with no observable fiber fracture. The impact of this damage on material performance was limited to the matrix dominated properties only. Specifically, compression strength was observed to decrease by as much as 50 percent from the measured baseline.

Carper, D. M.↗
NASA NTRS1973

Thermal contact resistance in a non-ideal joint

Analysis has been conducted to determine thermal contact resistance at interface of two heat conductors and effect of roughness of mating surfaces on pressure distribution. Investigation reveals how heat transfer resistance may be decreased or increased by changing surface properties of particular interface being considered.

Roca, R. T.↗
DOE OSTI2023

Heat transfer augmentation of natural convection heat sink through notched fin design

A novel notched fin heat sink with a central opening is proposed in the present study to augment the heat transfer performance of the natural convection heat sink under horizontal configuration. Thermal and airflow behavior in the heat sinks were studied using both experimental and numerical methods. The results showed that the performance of the conventional heat sink can be enhanced by optimizing its fin design. The basic heat sink model provided a 17% reduction in thermal resistance when its fin height and fin spacing were doubled, and it was accompanied by a 21% increase in surface area. The heat sink with a notched fin design with a less surface area offered a 13% lower thermal resistance compared to the basic model by entraining more airflow into the interior fin region. Providing a central opening in the notched fin heat sink can further reduce the thermal resistance by about 13%. Further, this study also analyzed the influence of emissivity of the heat sink on natural convection conditions. The findings demonstrated that the heat sink with an emissivity of 0.9 can reduce the thermal resistance by nearly 23% compared to one with an emissivity of 0.15.

42 ENGINEERING↗
DOE OSTI2022

Single-Phase Dielectric Fluid Thermal Management for Power-Dense Automotive Power Electronics

This paper describes the design and performance of a dielectric fluid cooling concept for automotive power electronics. The concept combines a low-thermal-resistance package (which eliminates metalized ceramic substrates) with a high-performance convective cooling strategy (slot jets impinging on finned surfaces). Modeling was first used to design the cooling system to maximize thermal performance and minimize pumping power. Additionally, a prototype was then fabricated, and experiments were conducted to validate the model predictions using three fluids at various fluid flow rates (16.7 cm 3 /s [1 L/min] to 68.3 cm 3 /s [4.1 L/min]) and inlet temperatures (30C and 70C). The final design was compact (120-cm 3 total volume, including heat exchanger and conceptual power modules) and cooled 12 devices (e.g., silicon carbide). The validated model was then used to predict the junction-to-fluid thermal resistance and pumping power for various conditions, including 40C fluid temperature. The results predict thermal resistance values as low as 19 mm 2 K/W are possible using the dielectric fluid cooling approach. The dielectric fluid cooling system is predicted to provide thermal resistance and pumping power values that are approximately 56% and 90% lower, respectively, compared to an automotive power electronics cooling system.

30 DIRECT ENERGY CONVERSION↗
NASA NTRS1994

Measurement of a surface heat flux and temperature

The Heat Flux Microsensor is a new sensor which was recently patented by Virginia Tech and is just starting to be marketed by Vatell Corp. The sensor is made using the thin-film microfabrication techniques directly on the material that is to be measured. It consists of several thin-film layers forming a differential thermopile across a thermal resistance layer. The measured heat flux q is proportional to the temperature difference across the resistance layer q= k(sub g)/delta(sub g) x (t(sub 1) - T(sub 2)), where k(sub g) is the thermal conductivity and delta (sub g) is the thickness of the thermal resistance layer. Because the gages are sputter coated directly onto the surface, their total thickness is less than 2 micrometers, which is two orders of magnitude thinner than previous gages. The resulting temperature difference across the thermal resistance layer (delta is less than 1 micrometer) is very small even at high heat fluxes. To generate a measurable signal many thermocouple pairs are put in series to form a differential thermopile. The combination of series thermocouple junctions and thin-film design creates a gage with very attractive characteristics. It is not only physically non-intrusive to the flow, but also causes minimal disruption of the surface temperature. Because it is so thin, the response time is less than 20 microsec. Consequently, the frequency response is flat from 0 to over 50 kHz. Moreover, the signal of the Heat Flux Microsensor is directly proportional to the heat flux. Therefore, it can easily be used in both steady and transient flows, and it measures both the steady and unsteady components of the surface heat flux. A version of the Heat Flux Microsensor has been developed to meet the harsh demands of combustion environments. These gages use platinum and platinum-10 percent rhodium as the thermoelectric materials. The thermal resistance layer is silicon monoxide and a protective coating of Al2O3 is deposited on top of the sensor. The superimposed thin-film pattern of all six layers is presented. The large pads are for connection with pins used to bring the signal out the back of the ceramic. In addition to the heat flux measurement, the surface temperature is measured with a platinum resistance layer (RTS). The resistance of this layer increases with increasing temperature. Therefore, these gages simultaneously measure the surface temperature and heat flux. The demonstrated applications include rocket nozzles, SCRAM jet engines, gas turbine engines, boiling heat transfer, flame experiments, basic fluid heat transfer, hypersonic flight, and shock tube testing. The laboratory involves using one of these sensors in a small combustion flame. The sensor is made on a 2.5 cm diameter piece of aluminum nitride ceramic.

Davis, R. M.↗
DOE OSTI2025

The impact of pulse width modulation on heat accumulation in AlGaN channel HEMTs

The poor thermal properties of Aluminum–Gallium Nitride (AlGaN) channel High Electron Mobility Transistors (HEMTs) on sapphire limit the device’s maximum switching frequency due to high channel temperatures. Extracting the correct thermal time constants can provide guidelines for the device’s safe frequency operation. This study experimentally quantifies the impact of pulse width and duty cycle on the transient thermal dynamics of multi-finger AlGaN channel HEMTs. In most transient thermal metrology, lock-in averaging approaches are leveraged to increase signal-to-noise ratio and measure the device’s relative temperature rise. Assuming no heat accumulation, the temperature rise is used to quantify the device’s thermal resistance under continued pulsed biasing. For devices grown on sapphire substrates, however, heat accumulation leads to elevated reference temperatures and causes the differential measurement to underestimate the peak temperature. This study demonstrates the capability of transient Gate Resistance Thermometry (tGRT) to measure the absolute temperature, which is required to precisely evaluate the device’s thermal resistance. When an absolute temperature measurement is not feasible (such as thermoreflectance imaging), a solution is proposed to derive the peak temperature under pulsed biasing based on the differential temperature under pulsing and the steady-state thermal resistance (which is typically easier to obtain). Finally, additional tGRT (without averaging) is performed to demonstrate the temperature-dependent thermal time constants required to minimize heat accumulation effects.

Field effect transistors↗
DOE OSTI2022

Thermal Optimization of a Silicon Carbide, Half-Bridge Power Module

This project describes the modeling process to design the packaging and heat exchanger for a half-bridge wide-bandgap (WBG) power semiconductor module. The module uses two silicon carbide, metal-oxide-semiconductor field-effect transistor (MOSFET) devices per switch position that are soldered to an aluminum nitride, direct-bond copper (DBC) substrate. A baseplate cooling configuration (e.g., no thermal grease) is used along with a water-ethylene glycol, jet-impingement-style heat exchanger. The heat exchanger was designed to be fabricated using prototyping equipment from the National Renewable Energy Laboratory, complies with automotive standards (for minimal channel sizes, flow rates, and coolant), and considers reliability aspects (i.e., erosion/corrosion). Device-scale computational fluid dynamics (CFD) is used first to design the slot jet impingement cooling configuration and compute the effective heat transfer coefficient (HTC) of the concept. The computed HTCs are then used as boundary conditions for a finite element study to optimize the package geometry (e.g., device layout and baseplate thickness) to minimize thermal resistance and minimize temperature variation between the module's four devices. Finally, a fluid manifold is designed to generate the slot jets and cool the devices. Module-scale CFD predicts a relatively low junction-to-fluid thermal resistance of 16.7 mm2 K/W, a 1.4 degrees C temperature variation between devices, and a total pressure drop of 5,860 Pa (0.85 psi) for the design. The thermal resistance of the module design is about 67% lower than the 2015 BMW i3 power electronics/modules thermal resistance.

DIRECT ENERGY CONVERSION↗
DOE OSTI2022

Numerical modeling based machine learning approach for the optimization of falling - film evaporator in thermal desalination application

Scale formation that drastically increases thermal resistance and reduces freshwater production remains a critical challenge in thermal desalination. Novel designs of falling film evaporator and optimal operating condition hold great promise to mitigate scale formation, and increase heat transfer performance and fresh water production. In this work, CFD simulation based machine learning and multi-objective optimization are performed to identify optimal conditions and tube arrangement for evaporator. Non-dominated sorting genetic algorithm is adopted to determine and analyze the optimal pareto front for multiple objectives in desalination criteria. The errors of training, validation, and testing set are computed to identify an optimal hyperparameter set. For performance ratio, fouling resistance, and water production rate, the average relative error is 2.26%, 3.67%, and 3.24%. At pareto front, both performance ratio and water production rate increase at high temperature with fouling resistance (thermal resistance of the fouling layer) increasing as well. Tradeoffs between mitigating scale formation and enhancing desalination performance are evaluated in optimizations for different objectives. Finally, potential optima are identified and can be applied as guidelines to determine evaporator design and system operating conditions.

42 ENGINEERING↗
NASA NTRS1988

Comparison of methods for the calculation of thermal contact resistance of the first Brazilian satellite

A comparative study of the methods developed for the calculation of thermal contact resistance between two surfaces submitted to a perpendicular heat flux is presented. Several factors affecting this resistance are analyzed and a brief historical review of the works in this field is made, spotting the methods of interest for space applications. These are compared to experimental data so as to establish the most proper method for the couplings of the first Brazilian satellite.

Mantelli, Marcia B. H.↗
NASA NTRS1974

Model for thermal stress resistance of truly elastic materials containing more than one crack

The model was developed upon the physical properties of surface energy and intrinsic modulus of elasticity of a material containing a number of equal sized microcracks which are independent of one another. The effect of these cracks upon the strain energy per unit volume of material necessary to continue simultaneous crack growth as well as the measured physical properties was established, and the thermal stress resistance is developed in terms of this energy. The model is expressed in its final form in terms of the measured physical properties of fracture strength, effective modulus of elasticity, and coefficient of thermal expansion. The model was applied to existent thermal stress data of ceramic materials for which these physical properties had been measured. On the basis of these data it was concluded that the thermal stress resistance of a material may be improved by increasing the fracture strength.

Lineback, L. D.↗