Ultra-thin targets or target-backings for accelerator
A procedure has been developed for fabrication of ultra-thin titanium foils for accelerator-based experiments. Evaporation of thin titanium layers on thin copper foils allows mechanical manipulation of the layered-foil prior to dissolution of the copper layer which leaves the thin titanium foil attached to a target frame. This is the rst time that thin titanium foils have been produced in this manner. Electrodeposition techniques can be used to result in radioactive deposits being placed ultimately on an ultra-thin titanium backing. This method was used in the past for thin nickel foils, but has been "lost" due to the companies that used to manufacture such foils not being in business any more, removing the source of copper backed foils from the market. The technique can be used for thin nickel or chromium foils, as well as several other types of foils. Titanium foils as thin as 100 nm (45 μg/cm 2 ), nickel foils as thin as 50 nm (45 μg/cm 2 ), and chromium foils as thin as 400 nm (290 μg/cm 2 ) have been successfully attached to stainless steel target frames.