Comparison between cemented and soldered cover glass for silicon solar cells
Comparison between cemented and soldered cover glass for radiation protection of silicon solar cells
Broder, J. D.↗
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Results for “solder”
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Welding, brazing, and soldering handbook
Handbook gives information on the selection and application of welding, brazing, and soldering techniques for joining various metals. Summary descriptions of processes, criteria for process selection, and advantages of different methods are given.
Kilgore, A. B.↗
Development of Highly Reliable Soldered Joints for Printed Circuit Boards Final Report, 28 Jun. 1967 - 28 Jun. 1968
Highly reliable soldered joints for printed circuit boards
Source record↗
Solder study conducted on Apollo telescope mount gyro processor /group 1 and 2 tests/ Final test report
Thermal cycling machines and accelerated test techniques to improve solder joints for Apollo Telescope Mount
Diel, D. F.↗
Metallographic examination of soldering of multilayer boards for airlock
Microstructure and void formation in solder connections of components on multilayer boards
Huffstutler, R. M.↗
Evaluation testing of thermofit solder sleeves
Thermofit solder sleeve evaluation tests
Source record↗
Evaluation testing of thermofit solder sleeves
Performance test of thermofit solder sleeve on copper and alloy wires
Source record↗
Performance of soldered and cemented cover glass silicon solar cells
Performance of soldered and cemented cover glass silicon solar cells
Broder, J. D.↗
Solder flux which leaves corrosion-resistant coating Patent
Hydrazine monoperfluoro alkanoate solder flux leaving corrosion resistant coating, for metals such as copper
Bauman, A. J.↗
Method of coating circuit paths on printed circuit boards with solder Patent
Solder coating process for printed copper circuit protection
Wittmann, A. E.↗
Solder-circuitry separation problems associated with plated printed circuit boards
Investigation of soldered component failure in plated printed circuit boards consisting of tinned laminate copper, plated copper, and gold overplate
Pasciak, A. M.↗
Soldering iron temperature indicator
Thermocouple implanted in metal mass simulates heat transfer characteristics of connection which is to be soldered. Light signals indicate whether temperature is right, too high, or too low.
Baker, C. D.↗
Positive contact resistance soldering unit
Ohmmeter is used to indicate positive contact between electrodes and workpiece. This permits good soldering and prevents damage to electronic devices.
Banta, R. D.↗
Automatic soldering machine
Fully-automatic tube-joint soldering machine can be used to make leakproof joints in aluminum tubes of 3/16 to 2 in. in diameter. Machine consists of temperature-control unit, heater transformer and heater head, vibrator, and associated circuitry controls, and indicators.
Stein, J. A.↗
Improved soldering iron tip
Nickel-plated device, with machined recesses matching the multipin pattern of particular circuit module, facilitates repairs to electronic systems and reduces chance of damage to adjacent components. Nickel-plating reduces oxidation and scaling. Recesses retain sufficient amount of molten solder to uniformly wet pins for simultaneous heating and extraction.
Vanasse, M. A.↗
Soldering high-impedance nichrome wire
Nickel wire segment allows Nichrome wire to be soldered without changing its electrical characteristics.
Spruill, M.↗
Vacuum soldering a metalized ceramic to a metal carrier
Using vacuum-soldering method, attachments that are 85 to 95 percent void free can be made. Method is useful for various large scale substrate attachment processes in microelectronic industry.
Gallagher, B. D.↗
Bench-top soldering aid for PC boards
Multiple-board rack allows technician to insert components into several boards, flip them all in single motion, and then systematically solder leads on reverse side. Two adjustable crossbars allow boards of any size up to 10 by 24 inches. Operator can rotate racks and adjust angle of boards from standing or sitting position.
Manton, N. R.↗