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At least 127 records · Page 7

Mapping Electrical Crosstalk in Pixelated Sensor Arrays

The effects of inter pixel capacitance in a pixilated array may be measured by first resetting all pixels in the array to a first voltage, where a first image is read out, followed by resetting only a subset of pixels in the array to a second voltage, where a second image is read out, where the difference in the first and second images provide information about the inter pixel capacitance. Other embodiments are described and claimed.

Seshadri, Suresh↗

Compliant tactile sensor that delivers a force vector

Tactile Sensor. The sensor includes a compliant convex surface disposed above a sensor array, the sensor array adapted to respond to deformation of the convex surface to generate a signal related to an applied force vector. The applied force vector has three components to establish the direction and magnitude of an applied force. The compliant convex surface defines a dome with a hollow interior and has a linear relation between displacement and load including a magnet disposed substantially at the center of the dome above a sensor array that responds to magnetic field intensity.

Torres-Jara, Eduardo↗

Method and apparatus for positioning a robotic end effector

A robotic end effector and operation protocol for a reliable grasp of a target object irrespective of the target's contours is disclosed. A robotic hand includes a plurality of jointed fingers, one of which, like a thumb, is in opposed relation to the other. Each finger is comprised of at least two jointed sections, and provided with reflective proximity sensors, one on the inner surface of each finger section. Each proximity sensor comprises a transmitter of a beam of radiant energy and means for receiving reflections of the transmitted energy when reflected by a target object and for generating electrical signals responsive thereto. On the fingers opposed to the thumb, the proximity sensors on the outermost finger sections are aligned in an outer sensor array and the sensors on the intermediate finger sections and sensors on the innermost finger sections are similarly arranged to form an intermediate sensor array and an inner sensor array, respectively. The invention includes a computer system with software and/or circuitry for a protocol comprising the steps in sequence of: (1) approach axis alignment to maximize the number of outer layer sensors which detect the target; (2) non-contact contour following the target by the robot fingers to minimize target escape potential; and (3) closing to rigidize the target including dynamically re-adjusting the end effector finger alignment to compensate for target motion. A signal conditioning circuit and gain adjustment means are included to maintain the dynamic range of low power reflection signals.

Hess, Clifford W.↗

Fabrication and Performance of Large Format Transition Edge Sensor Microcalorimeter Arrays

We have produced a variety of superconducting transition edge sensor array designs for microcalorimetric detection of x-rays. Designs include kilopixel scale arrays of relatively small sensors (~75 micron pitch) atop a thick metal heatsinking layer as well as arrays of membrane-isolated devices on 250 micron pitch and smaller arrays of devices up to 600 micron pitch. We discuss the fabrication techniques used for each type of array focusing on unique aspects where processes vary to achieve the particular designs and required device parameters. For example, we evaluate various material combinations in the production of the thick metal heatsinking, including superconducting and normal metal adhesion layers. We also evaluate the impact of added heatsinking on the membrane isolated devices as it relates to basic device parameters. Arrays can be characterized with a time division SQUID multiplexer such that greater than 10 devices from an array can be measured in the same cooldown. Device parameters can be measured simultaneously so that environmental events such as thermal drifts or changes in magnetic fields can be controlled. For some designs, we will evaluate the uniformity of parameters impacting the intrinsic performance of the microcalorimeters under bias in these arrays and assess the level of thermal crosstalk.

Chervenak, James A.↗

Performance of Large Format Transition Edge Sensor Microcalorimeter Arrays

We have produced a variety of superconducting transition edge sensor array designs for microcalorimetric detection of x-rays. Arrays are characterized with a time division SQUID multiplexer such that greater than 10 devices from an array can be measured in the same cooldown. Designs include kilo pixel scale arrays of relatively small sensors (-75 micron pitch) atop a thick metal heatsinking layer as well as arrays of membrane-isolated devices on 250 micron and up to 600 micron pitch. We discuss fabrication and performance of microstripline wiring at the small scales achieved to date. We also address fabrication issues with reduction of absorber contact area in small devices.

Chervenak, J. A.↗

Large Format Transition Edge Sensor Microcalorimeter Arrays

We have produced a variety of superconducting transition edge sensor array designs for microcalorimetric detection of x-rays. Designs include kilopixel scale arrays of relatively small sensors (approximately 75 micron pitch) atop a thick metal heat sinking layer as well as arrays of membrane-isolated devices on 250 micron and up to 600 micron pitch. We discuss fabrication and performance of microstripline wiring at the small scales achieved to date. We also address fabrication issues with reduction of absorber contact area in small devices.

Chervenak, J. A.↗

The application of smart sensor techniques to a solid-state array multispectral sensor

The solid-state array spectroradiometer (SAS) developed at JSC for remote sensing applications is a multispectral sensor which has no moving parts, is virtually maintenance-free, and has the ability to provide data which requires a minimum of processing. The instrument is based on the 42 x 342 element charge injection device (CID) detector. This system allows the combination of spectral scanning and across-track spatial scanning along with its associated digitization electronics into a single detector.

Mcfadin, L. W.↗