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At least 127 records · Page 7

Advances in Thin Film Thermocouple Durability Under High Temperature and Pressure Testing Conditions

Thin film thermocouples for measuring material surface temperature have been previously demonstrated on several material systems and in various hostile test environments. A well-developed thin film fabrication procedure utilizing shadow masking for patterning the sensors elements had produced thin films with sufficient durability for applications in high temperature and pressure environments that exist in air-breathing and hydrogen-fueled burner rig and engine test facilities. However, while shadow masking had been a reliable method for specimens with flat and gently curved surfaces, it had not been consistently reliable for use on test components with sharp contours. This work reports on the feasibility of utilizing photolithography processing for patterning thin film thermocouples. Because this patterning process required changes in the thin film deposition process from that developed for shadow masking, the effect of these changes on thin film adherence during burner rig testing was evaluated. In addition to the results of changing the patterning method, the effects on thin film adherence of other processes used in the thin film fabrication procedure is also presented.

Martin, Lisa C.↗

Fabrication of Pop-up Detector Arrays on Si Wafers

High sensitivity is a basic requirement for a new generation of thermal detectors. To meet the requirement, close-packed, two-dimensional silicon detector arrays have been developed in NASA Goddard Space Flight Center. The goal of the task is to fabricate detector arrays configured with thermal detectors such as infrared bolometers and x-ray calorimeters to use in space fliGht missions. This paper focuses on the fabrication and the mechanical testing of detector arrays in a 0.2 mm pixel size, the smallest pop-up detectors being developed so far. These array structures, nicknamed "PUDS" for "Pop-Up Detectors", are fabricated on I pm thick, single-crystal, silicon membranes. Their designs have been refined so we can utilize the flexibility of thin silicon films by actually folding the silicon membranes to 90 degrees in order to obtain close-packed two-dimensional arrays. The PUD elements consist of a detector platform and two legs for mechanical support while also serving as electrical and thermal paths. Torsion bars and cantilevers connecting the detector platform to the legs provide additional flexures for strain relief. Using micro-electromechanical structure (MEMS) fabrication techniques, including photolithography, anisotropic chemical etching, reactive-ion etching, and laser dicing, we have fabricated PLTD detector arrays of fourteen designs with a variation of four parameters including cantilever length, torsion bar length and width, and leg length. Folding tests were conducted to test mechanical stress distribution for the array structures. We obtained folding yields and selected optimum design parameters to reach minimal stress levels. Computer simulation was also employed to verify mechanical behaviors of PUDs in the folding process. In addition, scanning electron microscopy was utilized to examine the flatness of detectors and the alignment of detector pixels in arrays. The fabrication of thermistors and heaters on the pop-up detectors is under way, preparing us for the next step of the experiment, the thermal test.

Li, Mary J.↗

Stratified Volume Diffractive Optical Elements as Low-Mass Coherent Lidar Scanners

Transmissive scanning elements for coherent laser radar systems are typically optical wedges, or prisms, which deflect the lidar beam at a specified angle and are then rotated about the instrument optical axis to produce a scan pattern. The wedge is placed in the lidar optical system subsequent to a beam-expanding telescope, implying that it has the largest diameter of any element in the system. The combination of the wedge diameter and asymmetric profile result in the element having very large mass and, consequently, relatively large power consumption required for scanning. These two parameters, mass and power consumption, are among the instrument requirements which need to be minimized when designing a lidar for a space-borne platform. Reducing the scanner contributions in these areas will have a significant effect on the overall instrument specifications, Replacing the optical wedge with a diffraction grating on the surface of a thin substrate is a straight forward approach with potential to reduce the mass of the scanning element significantly. For example, the optical wedge that will be used for the SPAce Readiness Coherent Lidar Experiment (SPARCLE) is approximately 25 cm in diameter and is made from silicon with a wedge angle designed for 30 degree deflection of a beam operating at approx. 2 micrometer wavelength. The mass of this element could be reduced by a factor of four by instead using a fused silica substrate, 1 cm thick, with a grating fabricated on one of the surfaces. For a grating to deflect a beam with a 2 micrometer wavelength by 30 degrees, a period of approximately 4 micrometers is required. This is small enough that fabrication of appropriate high efficiency blazed or multi-phase level diffractive optical gratings is prohibitively difficult. Moreover, bulk or stratified volume holographic approaches appear impractical due to materials limitations at 2 micrometers and the need to maintain adequate wavefront quality. In order to avoid the difficulties encountered in these approaches, we have developed a new type of high-efficiency grating which we call a Stratified Volume Diffractive Optical Element (SVDOE). The features of the gratings in this approach can be easily fabricated using standard photolithography and etching techniques and the materials used in the grating can be chosen specifically for a given application, In this paper we will briefly discuss the SVDOE technique and will present an example design of a lidar scanner using this approach. We will also discuss performance predictions for the example design.

Chambers, Diana M.↗

Scaling Properties of Algorithms in Nanotechnology

At the present time, several technologies are pressing the limits of microminiature manufacturing. In semiconductor technology, for example, the Intel Pentium Pro (which is used in the Department of Energy's ASCI 'red' parallel supercomputer system) and the DEC Alpha 21164 (which is used in the CRAY T3E) both are fabricated using 0.35 micron process technology. Recently Texas Instruments (TI) announced the availability of 0.25 micron technology chips by the end of 1996 and plans to have 0.18 micron devices in production within two years. However, some significant challenges lie down the road. These include the skyrocketing cost of manufacturing plants, the 0.1 micron foreseeable limit of the photolithography process, quantum effects, data communication bandwidth limitations, heat dissipation, and others. Some related microminiature technologies include micro-electromechanical systems (MEMS), opto-electronic devices, quantum computing, biological computing, and others. All of these technologies require the fabrication of devices whose sizes are approaching the nanometer level. As such they are often collectively referred to with the name 'nanotechnology'. Clearly nanotechnology in this general sense is destined to be a very important technology of the 21st century. The ultimate dream in this arena is 'molecular nanotechnology', in other words the fabrication of devices and materials with most or all atoms and molecules in a pre-programmed position, possibly placed there by 'nano-robots'. This futuristic capability will probably not be achieved for at least two decades. However, it appears that somewhat less ambitious variations of molecular nanotechnology, such as devices and materials based on 'buckyballs' and 'nanotubes' may be realized significantly sooner, possibly within ten years or so. Even at the present time, semiconductor devices are approaching the regime where quantum chemical effects must be considered in design.

Saini, Subhash↗

Silica Integrated Optical Circuits Based on Glass Photosensitivity

Integrated optical circuits play a major rule in the new photonics technology both in communication and sensing due to their small size and compatibility with integrated circuits. Currently integrated optical circuits (IOCs) are fabricated using similar manufacturing to those used in the semiconductor industry. In this study we are considering a new technique to fabricate IOCs which does not require layers of photolithography, depositing and etching. This method is based on the photosensitivity of germanosilicate glasses. Waveguides and other IOC devises can be patterned in these glasses by exposing them using UV lasers. This exposure by UV light changes the index of refraction of the germanosilicate glass. This technique enjoys both the simplicity and flexibility of design and fabrication with also the potential of being fast and low cost.

Abushagur, Mustafa A. G.↗

Mirrors Steer NASA in the Right Direction

Left Hand Design completed the production of the fine-steering mirror technology through 1995 Phase I and 1996 Phase II SBIR contracts with JPL's Interferometric Astronomy group. Presently, the work resulting from the collaboration with NASA represents the company's main line of products for the commercial sector. Aerospace-related applications include: image motion compensation; interceptor seekers for the U.S. Army and Navy; Earth observation and resource monitoring from spacecraft and airborne platforms; space astronomy; helicopter-based surveillance; and interferometric metrology. Left Hand Design's fine-steering mirrors have also penetrated the commercial marketplace with non-aerospace applications, including laser communications, video cameras, infrared inspection, solar observatories, and bathymeters. These cost-effective, commercial mirrors perform a variety of functions, such as scanning, alignment, chopping, tracking, pointing, and beam stabilization. Potential future applications include laser surgery and photolithography.

Source record↗

Poly(ethylene glycol) hydrogel microstructures encapsulating living cells

We present an easy and effective method for the encapsulation of cells inside PEG-based hydrogel microstructures fabricated using photolithography. High-density arrays of three-dimensional microstructures were created on substrates using this method. Mammalian cells were encapsulated in cylindrical hydrogel microstructures of 600 and 50 micrometers in diameter or in cubic hydrogel structures in microfluidic channels. Reducing lateral dimension of the individual hydrogel microstructure to 50 micrometers allowed us to isolate 1-3 cells per microstructure. Viability assays demonstrated that cells remained viable inside these hydrogels after encapsulation for up to 7 days.

Non-NASA Center↗

Using Wind Driven Tumbleweed Rovers to Explore Martian Gully Features

Gully features have been observed on the slopes of numerous Martian crater walls, valleys, pits, and graben. Several mechanisms for gully formation have been proposed, including: liquid water aquifers (shallow and deep), melting ground ice, snow melt, CO2 aquifers, and dry debris flow. Remote sensing observations indicate that the most likely erosional agent is liquid water. Debate concerns the source of this water. Observations favor a liquid water aquifer as the primary candidate. The current strategy in the search for life on Mars is to "follow the water." A new vehicle known as a Tumbleweed rover may be able to conduct in-situ investigations in the gullies, which are currently inaccessible by conventional rovers. Deriving mobility through use of the surface winds on Mars, Tumbleweed rovers would be lightweight and relatively inexpensive thus allowing multiple rovers to be deployed in a single mission to survey areas for future exploration. NASA Langley Research Center (LaRC) is developing deployable structure Tumbleweed concepts. An extremely lightweight measurement acquisition system and sensors are proposed for the Tumbleweed rover that greatly increases the number of measurements performed while having negligible mass increase. The key to this method is the use of magnetic field response sensors designed as passive inductor-capacitor circuits that produce magnetic field responses whose attributes correspond to values of physical properties for which the sensors measure. The sensors do not need a physical connection to a power source or to data acquisition equipment resulting in additional weight reduction. Many of the sensors and interrogating antennae can be directly placed on the Tumbleweed using film deposition methods such as photolithography thus providing further weight reduction. Concepts are presented herein for methods to measure subsurface water, subsurface metals, planetary winds and environmental gases.

Antol, Jeffrey↗

Using Wind Driven Tumbleweed Rovers to Explore Martian Gully Features

Gully features have been observed on the slopes of numerous Martian crater walls, valleys, pits, and graben. Several mechanisms for gully formation have been proposed, including: liquid water aquifers (shallow and deep), melting ground ice, snow melt, CO2 aquifers, and dry debris flow. Remote sensing observations indicate that the most likely erosional agent is liquid water. Debate concerns the source of this water. Observations favor a liquid water aquifer as the primary candidate. The current strategy in the search for life on Mars is to "follow the water." A new vehicle known as a Tumbleweed rover may be able to conduct in-situ investigations in the gullies, which are currently inaccessible by conventional rovers. Deriving mobility through use of the surface winds on Mars, Tumbleweed rovers would be lightweight and relatively inexpensive thus allowing multiple rovers to be deployed in a single mission to survey areas for future exploration. NASA Langley Research Center (LaRC) is developing deployable structure Tumbleweed concepts. An extremely lightweight measurement acquisition system and sensors are proposed for the Tumbleweed rover that greatly increases the number of measurements performed while having negligible mass increase. The key to this method is the use of magnetic field response sensors designed as passive inductor-capacitor circuits that produce magnetic field responses whose attributes correspond to values of physical properties for which the sensors measure. The sensors do not need a physical connection to a power source or to data acquisition equipment resulting in additional weight reduction. Many of the sensors and interrogating antennae can be directly placed on the Tumbleweed using film deposition methods such as photolithography thus providing further weight reduction. Concepts are presented herein for methods to measure subsurface water, subsurface metals, planetary winds and environmental gases.

Antol, Jeffrey↗

High Sensitivity, Low Power Nano Sensors and Devices for Chemical Sensing

The chemical sensor market has been projected to grow to better than $40 billion dollars worldwide within the next 10 years. Some of the primary motivations to develop nanostructured chemical sensors are monitoring and control of environmental pollution; improved diagnostics for consumption; improvement in measurement precision and accuracy; and improved detection limits for Homeland security, battlefield environments, and process and quality control of industrial applications. In each of these applications, there is demand for sensitivity, selectivity and stability of environmental and biohazard detection and capture beyond what is currently commercially available. Nanotechnology offers the ability to work at the molecular level, atom by atom, to create large structures with fundamentally new molecular organization. It is essentially concerned with materials, devices, and systems whose structures and components exhibit novel and significantly improved physical, chemical and biological properties, phenomena, and process control due to their nanoscale size. One such nanotechnology-enabled chemical sensor has been developed at NASA Ames leveraging nanostructures, such as single walled carbon nanotubes (SWNTs) and metal oxide nanobelts or nanowires, as a sensing medium bridging a pair of interdigitated electrodes (IDE) realized through a silicon-based microfabrication and micromachining technique. The DE fingers are fabricated on a silicon substrate using standard photolithography and thin film metallization techniques. It is noteworthy that the fabrication techniques employed are not confined to the silicon substrate. Through spin casting and careful substrate selection (i.e. clothing, glass, polymer, etc.), additional degrees of freedom can be exploited to enhance sensitivity or to conform to unique applications. Both in-situ growth of nanostructured materials and casting of nanostructured dispersions were used to produce analogous chemical sensing devices.

Li, Jing↗

Genome-wide transcriptional analysis of flagellar regeneration in Chlamydomonas reinhardtii identifies orthologs of ciliary disease genes

The important role that cilia and flagella play in human disease creates an urgent need to identify genes involved in ciliary assembly and function. The strong and specific induction of flagellar-coding genes during flagellar regeneration in Chlamydomonas reinhardtii suggests that transcriptional profiling of such cells would reveal new flagella-related genes. We have conducted a genome-wide analysis of RNA transcript levels during flagellar regeneration in Chlamydomonas by using maskless photolithography method-produced DNA oligonucleotide microarrays with unique probe sequences for all exons of the 19,803 predicted genes. This analysis represents previously uncharacterized whole-genome transcriptional activity profiling study in this important model organism. Analysis of strongly induced genes reveals a large set of known flagellar components and also identifies a number of important disease-related proteins as being involved with cilia and flagella, including the zebrafish polycystic kidney genes Qilin, Reptin, and Pontin, as well as the testis-expressed tubby-like protein TULP2.

Polycystic Kidney Diseases/genetics↗

High-Temperature, Thin-Film Strain Gages Improved

Conventional resistance strain gage technology uses "bonded" strain gages. These foil or wire gages are bonded onto the surface of the test article with glue, ceramic cements, or flame-sprayed ceramics. These bonding agents can, in some instances, limit both the degree of strain transmission from the test structure to the gage and the maximum working temperature of the gage. Also, the bulky, bonded gage normally disrupts aerodynamic gas flow on the surface of the test structure because of its intrusive character. To respond to the urgent needs in aeronautic and aerospace research where stress and temperature gradients are high, aerodynamic effects need to be minimized, and higher operational temperatures are required, the NASA Lewis Research Center developed a thin film strain gage. This gage, a vacuum-deposited thin film formed directly on the surface of a test structure, operates at much higher temperatures than commercially available gages do and with minimal disruption of the aerodynamic flow. The gage uses an alloy, palladium-13 wt % chromium (hereafter, PdCr), which was developed by United Technologies Research Center under a NASA contract. PdCr is structurally stable and oxidation resistant up to at least 1100 C (2000 F); its temperature-induced resistance change is linear, repeatable, and not sensitive to the rates of heating and cooling. An early strain gage, which was made of 25-micrometer-diameter PdCr wire and demonstrated to be useable to 800 C, won an R&D 100 award in 1991. By further improving the purity of the material and by developing gage fabrication techniques that use sputter-deposition, photolithography patterning, and chemical etching, we have made an 8- to 10-m PdCr thin-film strain gage that can measure dynamic and static strain to at least 1100 C. For static strain measurements, a 5-m-thick Pt element serves as a temperature compensator to further minimize the temperature effect of the gage. These thin-film gages provide the advantage of minimally intrusive surface strain measurements and give highly repeatable readings with low drift at temperatures from ambient to 1100 C. This is a 300 C advance in operating temperature over the PdCr wire gage and a 500 C advance over commercially available gages made of other materials.

Source record↗

Innovative, Inexpensive Etching Technique Developed for Polymer Electro- Optical Structures

Electro-optic, polymer-based integrated optic devices for high-speed communication and computing applications offer potentially significant advantages over conventional inorganic electro-optic crystals. One key area of integrated optical technology--primary processing and fabrication--may particularly benefit from the use of polymer materials. However, as efforts concentrate on the miniaturization of electro-integrated circuit pattern geometries, the ability to etch fine features and smoothly sloped sidewalls is essential to make polymers useful for electro-integrated circuit applications. There are many existing processes available to etch polymer materials, but they all yield nearly vertical sidewalls. Vertical sidewalls are too difficult to reliably cover with a metal layer, and incomplete metalization degrades microwave performance, particularly at high frequency. However, obtaining a very sloped sidewall greatly improves the deposition of metal on the sidewall, leading to low-loss characteristics, which are essential to integrating these devices in highspeed electro-optic modulators. The NASA Lewis Research Center has developed in-house an inexpensive etching technique that uses a photolithography method followed by a simple, wet chemical etching process to etch through polymer layers. In addition to being simpler and inexpensive, this process can be used to fabricate smoothly sloped sidewalls by using a commercial none rodible mask: Spin-On-Glass. A commercial transparent material, Spin-On-Glass, uses processes and equipment similar to that for photoresist techniques.

Nguyen, Hung D.↗

MOVPE of GaSb/InGaAsSb Multilayers and Fabrication of Dual Band Photodetectors

Metalorganic vapor phase epitaxy (MOVPE) of GaSb/InGaAsSb multilayer thin films and fabrication of bias-selectable dual band photodetectors are reported. For the dual band photodetectors the short wavelength detector, or the upper p- GaSb/n-GaSb junction photodiode, is placed optically ahead of the long wavelength one, or the lower photodiode. The latter is based on latticed-matched In0.13Ga0.87As0.11Sb0.89 with bandgap near 0.6 eV. Specifically, high quality multilayer thin films are grown sequentially from top to bottom as p+-GaSb/p-GaSb/n-GaSb/n-InGaAsSb/p-InGaAsSb/p-GaSb on undoped p-type GaSb substrate, and as n-GaSb/p-GaSb/p-InGaAsSb/n-InGaAsSb/n-GaSb on Te-doped n-type GaSb substrate respectively. The multilayer thin films are characterized by optical microscope, atomic force microscope (AFM), electron microprobe analyses etc. The photodiode mesa steps are patterned by photolithography with wet chemical etching and the front metallization is carried out by e-beam evaporation with Pd/Ge/Au/Ti/Au to give ohmic contact on both n- and p-type Sb based layer surfaces. Dark I-V measurements show typical diode behavior for both the upper and lower photodiodes. The photoresponsivity measurements indicate that both the upper and lower photodiodes can sense the infrared illumination corresponding to their cutoff wavelengths respectively, comparable with the simulation results. More work is underway to bring the long wavelength band to the medium infrared wavelength region near 4 micrometers.

Xiao, Ye-Gao↗

Optical Coupling Mechnisms in Quantum Well Infrared Photodetectors

Light coupling systems, such as gratings are required becuase Quantum Well Infrared Photodetectors do not respond to normal incident light due to the quantum mechanical selection rules associated with intersubband transitions. The resolution of the photolithography and acuracy of the etching beomce key issues in producing smaller rating feature sizes expecially in shorter wavelengths.

Quantum Wells Intersubband infrared detectors grat↗

Bolometeric detector arrays for CMB polarimetry

We describe the development of antenna coupled bolometers for CMB polarization experiments. The necessary components of a bolometric CMB polarimeter - a beam forming element, a band defining filter, and detectors - are all fabricated on a silicon chip with photolithography.

TES bolometers↗

Method of forming multi-element thin hot film sensors on polyimide film

The invention comprises a method of forming a multi-element, thin hot film sensor on a polyimide film. The sensor is formed by first cleaning one surface of the polyimide. Then, under a continuous vacuum, the surface is simultaneously cleaned by ion bombardment while nickel is deposited by evaporation. The ion beam cleaning is discontinued and copper is then deposited to an initial thickness by evaporation without a break in the vacuum. The vacuum is then removed and a final thickness of copper is deposited by plating. Sensor patterns are then defined in the nickel and copper layers using conventional photolithography and etching techniques.

Hopson, Jr., Purnell↗

Method of making a semiconductor device

There is disclosed herein a method of making a device made up of at least two separate parts each of which is formed of a patterned array with the parts being mounted one on the other, with the patterned arrays of the parts being aligned, such as a CCD imager having a color filter thereon. The two parts are made on separate substrates with a first alignment key being formed on each substrate. The first alignment keys are formed by photolithography using the same mask to form the first alignment keys on each substrate. The various features of each of the parts are then formed on each substrate with each feature being formed by a photolithographic step using a mask which is aligned to a first alignment key so as to align all the features. A second alignment key is formed on each substrate and is positioned on each substrate in the same relationship with a first alignment key. The second alignment keys are of a material and construction so as to be visible when radiation of a desired wavelength is directed through the substrates. A part formed on one of the substrates is placed over a part formed on the other substrate. Radiation is directed through the substrates and the second alignment keys are aligned so as to align the patterned array of the two parts.

Elabd, Hammam↗