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At least 127 records · Page 7

Scalable low-loss cryogenic packaging of quantum memories in CMOS-foundry processed photonic chips

Optically linked solid-state quantum memories such as color centers in diamond are a promising platform for distributed quantum information processing and networking. Photonic integrated circuits (PICs) have emerged as a crucial enabling technology for these systems, integrating quantum memories with efficient electrical and optical interfaces in a compact and scalable platform. Packaging these hybrid chips into deployable modules while maintaining low optical loss and resiliency to temperature cycling is a central challenge to their practical use. We demonstrate a packaging method for PICs using surface grating couplers and angle-polished fiber arrays that is robust to temperature cycling, offers scalable channel count, applies to a wide variety of PIC platforms and wavelengths, and offers pathways to automated high-throughput packaging. Using this method, we show optically and electrically packaged quantum memory modules integrating all required qubit controls on chip, operating at millikelvin temperatures with <3 dB losses achievable from fiber to quantum memory for the TE 0 mode at a wavelength of 737 nm.

Bernson, Robert [Tyndall National Institute, Cork

End-Use Savings Shapes Upgrade Package Documentation: Wall and Roof Insulation and New Windows

Building on the successfully completed effort to calibrate and validate the U.S. Department of Energy's ResStock and ComStock models over the past 3 years, the objective of this work is to produce national data sets that empower analysts working for federal, state, utility, city, and manufacturer stakeholders to answer a broad range of analysis questions. The goal of this work is to develop energy efficiency, electrification, and demand flexibility end-use load shapes (electricity, gas, propane, or fuel oil) that cover a majority of the high-impact, market-ready (or nearly market-ready) upgrade measures, or upgrades. "Measures" refers to energy efficiency variables that can be applied to buildings during modeling. An end-use savings shape is the difference in energy consumption between a baseline building and a building with an energy efficiency, electrification, or demand flexibility upgrade applied. It results in a time-series profile that is broken down by end use and fuel (electricity or on-site gas, propane, or fuel oil use) at each time step. ComStock is a highly granular, bottom-up model that uses multiple data sources, statistical sampling methods, and advanced building energy simulations to estimate the annual subhourly energy consumption of the commercial building stock across the United States. The baseline model intends to represent the U.S. commercial building stock as it existed in 2018. The methodology and results of the baseline model are discussed in the final technical report of the End-Use Load Profiles project. This documentation focuses on an upgrade package of three end-use savings shapes upgrades - Window Replacement, Exterior Wall Insulation, and Roof Insulation, which we will refer to collectively as the "High Efficiency Envelope" package. More details on the individual upgrades can be found on the ComStock Measures Documentation page. An upgrade package applies two or more EUSS upgrades to a single building model simulation. Since ComStock is a bottom-up physics-based model, an upgrade package will go beyond aggregating or summing the individual upgrade results and produce novel results by simulating interactions between the upgrades. For example, pairing an envelope upgrade with an electrification upgrade would likely result in higher savings results than the sum of these upgrades individually, and the size of the heating, ventilating, and air conditioning (HVAC) equipment may be reduced if the envelope upgrade reduces the loads significantly.

29 ENERGY PLANNING, POLICY, AND ECONOMY

End-Use Savings Shapes Upgrade Package Documentation: LED Lighting, HP-RTU and ASHP-Boiler

Building on the successfully completed effort to calibrate and validate the U.S. Department of Energy's ResStock and ComStock models over the past 3 years, the objective of this work is to produce national data sets that empower analysts working for federal, state, utility, city, and manufacturer stakeholders to answer a broad range of analysis questions. The goal of this work is to develop energy efficiency, electrification, and demand flexibility end-use load shapes (electricity, gas, propane, or fuel oil) that cover a majority of the high-impact, market-ready (or nearly market-ready) upgrade measures, or upgrades. "Measures" refers to energy efficiency variables that can be applied to buildings during modeling. An end-use savings shape is the difference in energy consumption between a baseline building and a building with an energy efficiency, electrification, or demand flexibility upgrade applied. It results in a time-series profile that is broken down by end use and fuel (electricity or on-site gas, propane, or fuel oil use) at each time step. ComStock is a highly granular, bottom-up model that uses multiple data sources, statistical sampling methods, and advanced building energy simulations to estimate the annual subhourly energy consumption of the commercial building stock across the United States. The baseline model intends to represent the U.S. commercial building stock as it existed in 2018. The methodology and results of the baseline model are discussed in the final technical report of the End-Use Load Profiles project. This documentation focuses on an upgrade package of three end-use savings shapes upgrades - Light Emitting Diode (LED) Lighting, Heat Pump Rooftop Unit (RTU) (HP-RTU), and Air-Source Heat Pump (ASHP) Boiler, which we will refer to collectively as the "Interior Lighting and Heat Pump" package. More details on the individual upgrades can be found on the ComStock Measures Documentation page. An upgrade package applies two or more EUSS upgrades to a single building model simulation. Since ComStock is a bottom-up physics-based model, an upgrade package will go beyond aggregating or summing the individual upgrade results and produce novel results by simulating interactions between the upgrades. For example, pairing an envelope upgrade with an electrification upgrade would likely result in higher savings results than the sum of these upgrades individually, and the size of the heating, ventilating, and air conditioning (HVAC) equipment may be reduced if the envelope upgrade reduces the loads significantly.

29 ENERGY PLANNING, POLICY, AND ECONOMY

Multi-package development at Fermilab with Spack

The Spack package manager has been widely adopted in the supercomputing community as a means of providing consistently built on-demand software for the platform of interest. Members of the high-energy and nuclear physics (HENP) community, in turn, have recognized Spack’s strengths, used it for their own projects, and even become active Spack developers to better support HENP needs. Code development in a Spack context, however, can be challenging as the provision of external software via Spack must integrate with the developed packages’ build systems. Spack’s own development features can be used for this task, but they tend to be inefficient and cumbersome. We present a solution pursued at Fermilab called MPD (multi-package development). MPD aims to facilitate the development of multiple Spack-based packages in concert without the overhead of Spack’s own development facilities. In addition, MPD allows physicists to create multiple development projects with an interface that insulates users from the many commands required to use Spack well.

Knoepfel, Kyle James [Fermilab]

DeepDiagnostics: A Software Package for Streamlined Posterior Evaluation

Automated prediction techniques like simulation-based inference (SBI) are important tasks for science experiments that produce large amounts of complex, raw data. However, their development remains in its early stages because the uncertainties of these techniques lack sufficient trustworthiness and interpretability. Packages for SBI provide a growing set of diagnostics; however, the software requirements are substantial, as they are tied to the inference technology itself, and the APIs lack adaptability. We introduce the DeepDiagnostics package for diagnosing posteriors from analytic likelihood-based methods and SBI methods, such as neural posterior estimation. DeepDiagnostics produces a comprehensive set of high-quality visualizations and metrics in a highly accessible, easy-to-use, and flexible package. We address all of these goals by providing a command-line inference tool and a Python API that is controlled through a configuration file. The package includes common diagnostics, such as parity plots, corner (covariance) plots, simulation-based calibration (SBC) diagnostics (including posterior coverage and rank histograms), Lemos et al. s PQMass and TARP, Masserano et al. s WALDO, Linhart et al. s LC2ST, as well as credible region diagnostics developed by our group.

Voetberg, Maggie [Fermilab]

Design of a Cryogenic Assembly for Comparing Qubit Infrared Packaging Inefficiencies

It is well known that everything emits infrared (IR) light in the form of thermal radiation. IR radiation on superconducting qubits carries enough energy to cause decoherence and so-called “quasiparticle poisoning.” Therefore, proper IR shielding is needed to keep the qubit in a high-coherence state. However, trying to extract IR-specific information from a qubit is difficult, so a microwave kinetic inductance detector (MKID) can be used instead. We show that the IR shielding inefficiencies of MKID packages can only be compared with other packaging inefficiencies. We create a cryogenic assembly CAD design, consisting of magnetic shield cans, a copper mounting plate and mounts, and an MKID enclosure, which thermalizes the assembly to dilution refrigerator temperatures. Phase 1 of this design involves using a narrowband IR laser source to test the IR shielding of packaging at the laser’s wavelength. When the best IR shielding packaging is determined, the superconducting qubit can replace the MKID, allowing the qubit to avoid decoherence due to IR radiation and boost its performance and coherence lifetime.

Mailliard, Robert J. [Fermilab] (ORCID:00090000277

Design of a Cryogenic Assembly for Comparing Qubit Infrared Packaging Inefficiencies

It is well known that everything emits infrared (IR) light in the form of thermal radiation. IR radiation on superconducting qubits carries enough energy to cause decoherence and so-called “quasiparticle poisoning.” Therefore, proper IR shielding is needed to keep the qubit in a high-coherence state. However, trying to extract IR-specific information from a qubit is difficult, so a microwave kinetic inductance detector (MKID) can be used instead. We show that the IR shielding inefficiencies of MKID packages can only be compared with other packaging inefficiencies. We create a cryogenic assembly CAD design, consisting of magnetic shield cans, a copper mounting plate and mounts, and an MKID enclosure, which thermalizes the assembly to dilution refrigerator temperatures. Phase 1 of this design involves using a narrowband IR laser source to test the IR shielding of packaging at the laser’s wavelength. When the best IR shielding packaging is determined, the superconducting qubit can replace the MKID, allowing the qubit to avoid decoherence due to IR radiation and boost its performance and coherence lifetime.

Mailliard, Robert J. [Fermilab] (ORCID:00090000277

Design of a Cryogenic Assembly for Comparing Qubit Infrared Packaging Inefficiencies

It is well known that everything emits infrared (IR) light in the form of thermal radiation. IR radiation on superconducting qubits carries enough energy to cause decoherence and so-called “quasiparticle poisoning.” Therefore, proper IR shielding is needed to keep the qubit in a high coherence state. However, trying to extract IR-specific information from a qubit is difficult, so a microwave kinetic inductance detector (MKID) can be used instead. We show that the IR shielding inefficiencies of MKID packages can only be compared with other packaging inefficiencies. We create a cryogenic assembly CAD design, consisting of magnetic shield cans, a copper mounting plate and mounts, and an MKID enclosure, which thermalizes the assembly to dilution refrigerator temperatures. Phase 1 of this design involves using a narrowband IR laser source to test the IR shielding of packaging at the laser’s wavelength. When the best IR shielding packaging is determined, the superconducting qubit can replace the MKID, allowing the qubit to avoid decoherence due to IR radiation and boost its performance and coherence lifetime.

Mailliard, Robert J. [Fermilab] (ORCID:00090000277

Space shuttle food system study: Food and beverage package development, modification 8S

A new, highly utile rehydration package was developed for foods in zero gravity. Rehydratable foods will become more acceptable as a result of their overall rehydration capability and improved palatability. This new package design is greatly enhanced by the specified spacecraft condition of atmospheric pressure; the pressure differential between the atmosphere and the package carries the functional responsibility for rapid food rehydration without excess package manipulation by the consumer. Crew acceptance will further be enhanced by less manipulation, hotter rehydration water temperatures and the ability to hold the foods at preparation temperatures until they are consumed.

Source record

A geometry package for generation of input data for a three-dimensional potential-flow program

The preparation of geometric data for input to three-dimensional potential flow programs was automated and simplified by a geometry package incorporated into the NASA Langley version of the 3-D lifting potential flow program. Input to the computer program for the geometry package consists of a very sparse set of coordinate data, often with an order of magnitude of fewer points than required for the actual potential flow calculations. Isolated components, such as wings, fuselages, etc. are paneled automatically, using one of several possible element distribution algorithms. Curves of intersection between components are calculated, using a hybrid curve-fit/surface-fit approach. Intersecting components are repaneled so that adjacent elements on either side of the intersection curves line up in a satisfactory manner for the potential-flow calculations. Many cases may be run completely (from input, through the geometry package, and through the flow calculations) without interruption. Use of the package significantly reduces the time and expense involved in making three-dimensional potential flow calculations.

Halsey, N. D.

The augment precompiler as a tool for the development of special purpose arithmetic packages

A FORTRAN precompiler, AUGMENT, is used to develop packages for nonstandard arithmetics. It renders the source code more lucid, reduces the number of lines of code in a nonstandard arithmetic package, facilitates modification, and decreases the problems of transporting such a package to another host system. AUGMENT is briefly described and its use in the construction of the interval package is discussed. Other applications of AUGMENT are also included.

Crary, F. D.

User's manual for the coupled rotor/airframe vibration analysis graphic package

User instructions for a graphics package for coupled rotor/airframe vibration analysis are presented. Responses to plot package messages which the user must make to activate plot package operations and options are described. Installation instructions required to set up the program on the CDC system are included. The plot package overlay structure and subroutines which have to be modified for the CDC system are also described. Operating instructions for CDC applications are included.

Studwell, R. E.

General specifications for the development of a USL NASA PC R and D statistical analysis support package

The University of Southwestern Louisiana (USL) NASA PC R and D statistical analysis support package is designed to be a three-level package to allow statistical analysis for a variety of applications within the USL Data Base Management System (DBMS) contract work. The design addresses usage of the statistical facilities as a library package, as an interactive statistical analysis system, and as a batch processing package.

Dominick, Wayne D.

Considerations for the design of Ada reusable packages

Two important considerations that precede the design of Ada reusable packages (commonality and programming standards) are discuessed. First, the importance of designing packages to yield widespread commonality is expressed. A means of measuring the degree of applicability of packages both within and across applications areas is presented. Design consideration that will improve commonality are also discussed. Second, considerations for the development of programming standards are set forth. These considerations will lead to standards that will improve the reusability of Ada packages.

Nise, Norman S.

Vector-matrix-quaternion, array and arithmetic packages: All HAL/S functions implemented in Ada

The HAL/S avionics programmers have enjoyed a variety of tools built into a language tailored to their special requirements. Ada is designed for a broader group of applications. Rather than providing built-in tools, Ada provides the elements with which users can build their own. Standard avionic packages remain to be developed. These must enable programmers to code in Ada as they have coded in HAL/S. The packages under development at JPL will provide all of the vector-matrix, array, and arithmetic functions described in the HAL/S manuals. In addition, the linear algebra package will provide all of the quaternion functions used in Shuttle steering and Galileo attitude control. Furthermore, using Ada's extensibility, many quaternion functions are being implemented as infix operations; equivalent capabilities were never implemented in HAL/S because doing so would entail modifying the compiler and expanding the language. With these packages, many HAL/S expressions will compile and execute in Ada, unchanged. Others can be converted simply by replacing the implicit HAL/S multiply operator with the Ada *. Errors will be trapped and identified. Input/output will be convenient and readable.

Klumpp, Allan R.

Pressure visualization (PreViz) package version 1.0 user's guide

The Pressure Visualization (PreViz) package is a software tool which merges a wireframe model of the test aircraft with pressure data represented as a series of displacement vectors normal to the aircraft's skin. The PreViz package automates much of the researcher's data reduction effort, reduces the time required to review large amounts of pressure data, presents the data more clearly than tabular listings, and provides a wireframe description for a black and white graphic suitable for a technical publication (the actual graphic images must be created by a local package since PreViz has no graphics capability). Although designed for pressure data, the PreViz package works equally well for any surface property (such as structural loading or skin temperature). Written in ANSI-standard FORTRAN 77 and self-contained, PreViz executes in UNIX, VAX/VMS, and CDC/NOS host environments.

Bingel, Bradford D.

Hermetic Packages For Millimeter-Wave Circuits

Advanced hermetic packages developed to house electronic circuits operating at frequencies from 1 to 100 gigahertz and beyond. Signals coupled into and out of packages electromagnetically. Provides circuit packages small, lightweight, rugged, and inexpensive in mass production. Packages embedded in planar microstrip and coplanar waveguide circuits, in waveguide-to-planar and planar-to-waveguide circuitry, in waveguide-to-waveguide circuitry, between radiating (antenna) elements, and between planar transmission lines and radiating elements. Other applications in automotive, communication, radar, remote sensing, and biomedical electronic systems foreseen.

Herman, Martin I.

TROJID: A portable software package for upper-stage trajectory optimization

Performance optimization for upper-stage exoatmospheric vehicles often is performed within the framework of a full capability trajectory simulation package requiring either a large mainframe computer or powerful work-station. Since these software packages tend to include capabilities providing for high-fidelity boost and reentry simulations, the programs usually are quite large and not very portable. The program TROJID is an attempt to provide an environment for the optimization of upper-stage trajectories within a small package capable of being run on a standard desktop microcomputer. Utilizing a state-of-the-art nonlinear programming algorithm and a trajectory simulator implementing impulsive burns and an analytic coast phase propagator, TROJID is capable of producing trajectories for optimal multi-burn upper-stage orbit transfers. The package has been designed to allow full generality in definition of both the trajectory simulator and the parameter optimization problem.

Hammes, Steven M.