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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 127 records · Page 7
All sourcesNASA NTRSDOE OSTI
NASA NTRS1980

Model of coupling discharges into spacecraft structures

The calculated results of a semiempirical model for electron-caused electromagnetic pulse (ECEMP) are compared to the experimental data for three spacecraft geometries. The appropriateness of certain model assumptions which have been employed in the absence of a microscopic theory for dielectric breakdown and associated electron blowoff is discussed. Results are limited to the exterior response of spacecraft structures, although neither the model nor the experiments were limited to the outside problem. Rationales for model assumptions are provided.

Woods, A. J.↗
NASA NTRS1982

Photovoltaic module reliability improvement through application testing and failure analysis

During the first four years of the U.S. Department of Energy (DOE) National Photovoltatic Program, the Jet Propulsion Laboratory Low-Cost Solar Array (LSA) Project purchased about 400 kW of photovoltaic modules for test and experiments. In order to identify, report, and analyze test and operational problems with the Block Procurement modules, a problem/failure reporting and analysis system was implemented by the LSA Project with the main purpose of providing manufacturers with feedback from test and field experience needed for the improvement of product performance and reliability. A description of the more significant types of failures is presented, taking into account interconnects, cracked cells, dielectric breakdown, delamination, and corrosion. Current design practices and reliability evaluations are also discussed. The conducted evaluation indicates that current module designs incorporate damage-resistant and fault-tolerant features which address field failure mechanisms observed to date.

Dumas, L. N.↗
NASA NTRS1984

Improved Hollow Cathode

Improved hollow cathode for neutral-beam injector ion sources rapidly started by dielectric breakdown of ignitor plug located at one end of open ended tube. Used in low-current ion implantation, milling, sputtering, and bombardment for surface treatment.

Aston, G.↗
NASA NTRS1985

Reliability analysis

The objective was to search for and demonstrate approaches and concepts for fast wafer probe tests of mechanisms affecting the reliability of MOS technology and, based on these, develop and optimize test chips and test procedures. Progress is reported on four important wafer-level reliability problems: gate-oxide radiation hardness; hot-electron effects; time-dependence dielectric breakdown; and electromigration.

Source record↗
NASA NTRS1989

Laser damage threshold of diamond films

The possibility that diamond films may inhibit laser-induced damage to optical components in laser systems films was investigated by measuring laser damage thresholds of free-standing diamond film windows, diamond films deposited on silicon substrates, and bare silicon substrate. Polycrystalline diamond films were deposited using a dc plasma-enhanced CVD process. It was found that free-standing diamond films had the highest laser damage threshold at 1064 nm. For a diamond film of 630 nm, the damage threshold was found to be 7 J/sq cm, as compared to a damage threshold of 4.5 J/sq cm for bare silicon, and a low value of 1.5 J/sq cm for the film/substrate combination. The damage mechanism is considered to involve melting or dielectric breakdown induced by laser radiation. The low value of the film/substrate combination is attributed to film stress and conditions of film deposition.

Albin, Sacharia↗
NASA NTRS1989

Product assurance technology for procuring reliable, radiation-hard, custom LSI/VLSI electronics

Advanced measurement methods using microelectronic test chips are described. These chips are intended to be used in acquiring the data needed to qualify Application Specific Integrated Circuits (ASIC's) for space use. Efforts were focused on developing the technology for obtaining custom IC's from CMOS/bulk silicon foundries. A series of test chips were developed: a parametric test strip, a fault chip, a set of reliability chips, and the CRRES (Combined Release and Radiation Effects Satellite) chip, a test circuit for monitoring space radiation effects. The technical accomplishments of the effort include: (1) development of a fault chip that contains a set of test structures used to evaluate the density of various process-induced defects; (2) development of new test structures and testing techniques for measuring gate-oxide capacitance, gate-overlap capacitance, and propagation delay; (3) development of a set of reliability chips that are used to evaluate failure mechanisms in CMOS/bulk: interconnect and contact electromigration and time-dependent dielectric breakdown; (4) development of MOSFET parameter extraction procedures for evaluating subthreshold characteristics; (5) evaluation of test chips and test strips on the second CRRES wafer run; (6) two dedicated fabrication runs for the CRRES chip flight parts; and (7) publication of two papers: one on the split-cross bridge resistor and another on asymmetrical SRAM (static random access memory) cells for single-event upset analysis.

Buehler, M. G.↗
NASA NTRS1992

Plasma effects on the passive external thermal control coating of Space Station Freedom

The current baseline chromic acid anodized thermal control coating on 6061-T6 aluminum meteoroid debris (M/D) shields for SSF has been evaluated. The degradation of the solar absorptance, alpha, and the thermal emittance, epsilon, of chromic acid anodized aluminum due to dielectric breakdown in plasma was measured to predict the on-orbit lifetime of the SSF M/D shields. The lifetime of the thermal control coating was based on the surface temperatures achieved with degradation of the thermal control properties, alpha and epsilon. The temperatures of each M/D shield from first element launch (FEL) through FEL+15 years were analyzed. It is shown that the baseline thermal control coating cannot withstand the -140 V potential between the conductive structure of the SSF and the current plasma environment.

Carruth, Ralph, Jr.↗
NASA NTRS1993

Environmental interactions and the SP-100 power system

Interactions of the SP-100 power system with its expected ambient environments are defined. SP-100 payloads will float 100 V negative of the low Earth orbit (LEO) plasma. Choice of proper geometries and materials will prevent arcing at conductor-insulator junctions in LEO. Care in selecting surface coatings will prevent dielectric breakdown. Sputtering is a concern for long-duration LEO missions. Atomic oxygen durability of SP-100 materials will be tested in ground and flight tests. Evaluation of SP-100 in lunar and planetary environments has begun. The report of a recent workshop on Chemical and Electrical Interactions on Mars identified many of the primary interactions.

Ferguson, Dale C.↗
NASA NTRS1992

Space Station Freedom structure floating potential and the probability of arcing

The interaction between a space system and the space environment has been one of the driving questions for the design of spacecraft since the dawn of the space age. The Space Station Freedom will represent a significant increase in spacecraft size, power, and activity relative to spacecraft that are currently in orbit. The structure floating potential on Space Station Freedom is studied with simple analytical models of the current collection. The probability of arcing due to dielectric breakdown is assessed.

Hastings, Daniel E.↗
NASA NTRS2000

Increasing Importance of Material Electrical Interaction with the Space Environment

The electrical properties of materials have always been important for spacecraft in charging environments. However, in recent years consideration of interactions of materials and systems with the plasma environment has become more and more important in spacecraft design. This has primarily been driven by independent factors including increase in power and high voltage power systems, operation of tethered satellites, and science requirements for electrostatic clean spacecraft. Increased need for power has led to increased operating voltages for spacecraft. The Upper Atmospheric Research Satellite (UARS) was one of the first to operate at near 100 V solar array potential and demonstrate that the spacecraft floated nearly the entire voltage negative of the ionospheric plasma. The high voltage, 160 V, of the solar arrays on the International Space Station (ISS) led to the requirement to have a plasma contactor to control structure potential relative to the local plasma. Issues such as sputtering, dielectric breakdown, capacitive energy storage in the structure, space debris impact induced arcs and other arcing mechanisms had to be addressed. Recently commercial satellites, driven to higher voltages for efficiency, have experienced arcing problems which led to severe, permanent power degradation. The first tethered satellite, Tethered Satellite System (TSS), was deployed from the Space Shuttle. A conductive coating was developed which provided a low resistivity and also the required solar absorptivity and emittance. Other tether systems are being designed which will have similar requirements but also long life and "bare tether" designs are also being built for flight experiments. The wire requires an electrically conductive coating with proper thermal control properties, which a bare wire doesn't possess. Increasing sophistication of scientific instruments and measurements which scientists want to make have led to increasing requirements for conducting thermal control coatings to provide electrostatic cleanliness. These issues, which are increasing the importance of electrical interaction of materials to the space environment, will be discussed in this paper as well as research into material development to meet thermal and electrical requirements and research to understand phenomena regarding such interactions.

Carruth, M. R., Jr.↗
NASA NTRS2005

NASA GRC and MSFC Space-Plasma Arc Testing Procedures

Tests of arcing and current collection in simulated space plasma conditions have been performed at the NASA Glenn Research Center (GRC) in Cleveland, Ohio, for over 30 years and at the Marshall Space Flight Center (MSFC) in Huntsville, Alabama, for almost as long. During this period, proper test conditions for accurate and meaningful space simulation have been worked out, comparisons with actual space performance in spaceflight tests and with real operational satellites have been made, and NASA has achieved our own internal standards for test protocols. It is the purpose of this paper to communicate the test conditions, test procedures, and types of analysis used at NASA GRC and MSFC to the space environmental testing community at large, to help with international space-plasma arcing-testing standardization. To be discussed are: 1.Neutral pressures, neutral gases, and vacuum chamber sizes. 2. Electron and ion densities, plasma uniformity, sample sizes, and Debuy lengths. 3. Biasing samples versus self-generated voltages. Floating samples versus grounded. 4. Power supplies and current limits. Isolation of samples from power supplies during arcs. 5. Arc circuits. Capacitance during biased arc-threshold tests. Capacitance during sustained arcing and damage tests. Arc detection. Prevention sustained discharges during testing. 6. Real array or structure samples versus idealized samples. 7. Validity of LEO tests for GEO samples. 8. Extracting arc threshold information from arc rate versus voltage tests. 9. Snapover and current collection at positive sample bias. Glows at positive bias. Kapon (R) pyrolisis. 10. Trigger arc thresholds. Sustained arc thresholds. Paschen discharge during sustained arcing. 11. Testing for Paschen discharge threshold. Testing for dielectric breakdown thresholds. Testing for tether arcing. 12. Testing in very dense plasmas (ie thruster plumes). 13. Arc mitigation strategies. Charging mitigation strategies. Models. 14. Analysis of test results. Finally, the necessity of testing will be emphasized, not to the exclusion of modeling, but as part of a complete strategy for determining when and if arcs will occur, and preventing them from occurring in space.

Ferguson, Dale C.↗
NASA NTRS2005

NASA GRC and MSFC Space-Plasma Arc Testing Procedures

Tests of arcing and current collection in simulated space plasma conditions have been performed at the NASA Glenn Research Center (GRC) in Cleveland, Ohio, for over 30 years and at the Marshall Space flight Center (MSFC) for almost as long. During this period, proper test conditions for accurate and meaningful space simulation have been worked out, comparisons with actual space performance in spaceflight tests and with real operational satellites have been made, and NASA has achieved our own internal standards for test protocols. It is the purpose of this paper to communicate the test conditions, test procedures, and types of analysis used at NASA GRC and MSFC to the space environmental testing community at large, to help with international space-plasma arcing testing standardization. To be discussed are: 1. Neutral pressures, neutral gases, and vacuum chamber sizes. 2. Electron and ion densities, plasma uniformity, sample sizes, and Debye lengths. 3. Biasing samples versus self-generated voltages. Floating samples versus grounded. 4. Power supplies and current limits. Isolation of samples from power supplies during arcs. Arc circuits. Capacitance during biased arc-threshold tests. Capacitance during sustained arcing and damage tests. Arc detection. Preventing sustained discharges during testing. 5. Real array or structure samples versus idealized samples. 6. Validity of LEO tests for GEO samples. 7. Extracting arc threshold information from arc rate versus voltage tests. 8 . Snapover and current collection at positive sample bias. Glows at positive bias. Kapton pyrolization. 9. Trigger arc thresholds. Sustained arc thresholds. Paschen discharge during sustained arcing. 10. Testing for Paschen discharge thresholds. Testing for dielectric breakdown thresholds. Testing for tether arcing. 11. Testing in very dense plasmas (ie thruster plumes). 12. Arc mitigation strategies. Charging mitigation strategies. Models. 13. Analysis of test results. Finally, the necessity of testing will be emphasized, not to the exclusion of modeling, but as part of a complete strategy for determining when and if arcs will occur, and preventing them from occurring in space.

Ferguson, Dale C.a↗
NASA NTRS2007

NASA GRC and MSFC Space-Plasma Arc Testing Procedures

Tests of arcing and current collection in simulated space plasma conditions have been performed at the NASA Glenn Research Center (GRC) in Cleveland, Ohio, for over 30 years and at the Marshall Space Flight Center (MSFC) in Huntsville, Alabama, for almost as long. During this period, proper test conditions for accurate and meaningful space simulation have been worked out, comparisons with actual space performance in spaceflight tests and with real operational satellites have been made, and NASA has achieved our own internal standards for test protocols. It is the purpose of this paper to communicate the test conditions, test procedures, and types of analysis used at NASA GRC and MSFC to the space environmental testing community at large, to help with international space-plasma arcing-testing standardization. Discussed herein are neutral gas conditions, plasma densities and uniformity, vacuum chamber sizes, sample sizes and Debye lengths, biasing samples versus self-generated voltages, floating samples versus grounded samples, test electrical conditions, arc detection, preventing sustained discharges during testing, real samples versus idealized samples, validity of LEO tests for GEO samples, extracting arc threshold information from arc rate versus voltage tests, snapover, current collection, and glows at positive sample bias, Kapton pyrolysis, thresholds for trigger arcs, sustained arcs, dielectric breakdown and Paschen discharge, tether arcing and testing in very dense plasmas (i.e. thruster plumes), arc mitigation strategies, charging mitigation strategies, models, and analysis of test results. Finally, the necessity of testing will be emphasized, not to the exclusion of modeling, but as part of a complete strategy for determining when and if arcs will occur, and preventing them from occurring in space.

Ferguson, Dale C.↗
NASA NTRS2005

An Improved Thermal Conductivity Polyurethane Composite for a Space Borne 20KV Power Supply

This effort was designed to find a way to reduce the temperature rise of critical components of a 20KV High Voltage Power Supply (HVPS) by improving the overall thermal conductivity of the encapsulated modules. Three strategies were evaluated by developing complete procedures, preparing samples, and performing tests. The three strategies were: 1. Improve the thermal conductivity of the polyurethane encapsulant through the addition of thermally conductive powder while minimizing impact on other characteristics of the encapsulant. 2. Improve the thermal conductivity of the polyurethane encapsulated assembly by the addition of a slab of thermally conductive, electrically insulating material, which is to act as a heat spreader. 3. Employ a more thermally conductive substrate (Al203) with the existing encapsulation scheme. The materials were chosen based on the following criteria: high dielectric breakdown strength; high thermal conductivity, ease of manufacturing, high compliance, and other standard space qualified materials properties (low out-gassing, etc.). An optimized cure was determined by a statistical design of experiments for both filled and unfilled materials. The materials were characterized for the desired properties and a complete process was developed and tested. The thermal performance was substantially improved and the strategies may be used for space flight.

Pb free↗
NASA NTRS2006

Impact of Solar Array Position on ISS Vehicle Charging

The International Space Station (ISS), because of its large structure and high voltage solar arrays, has a complex plasma interaction with the ionosphere in low Earth orbit (LEO). This interaction of the ISS US Segment photovoltaic (PV) power system with the LEO ionospheric plasma produces floating potentials on conducting elements of the ISS structure relative to the local plasma environment. To control the ISS floating potentials, two Plasma Contactor Units (PCUs) are installed on the Z1 truss. Each PCU discharges accumulated electrons from the Space Station structure, thus reducing the potential difference between the ISS structure and the surrounding charged plasma environment. Operations of the PCUs were intended to keep the ISS floating potential to 40 Volts (Reference 1). Exposed dielectric surfaces overlying conducting structure on the Space Station will collect an opposite charge from the ionosphere as the ISS charges. In theory, when an Extravehicular Activity (EVA) crewmember is tethered to structure via the crew safety tether or when metallic surfaces of the Extravehicular Mobility Unit (EMU) come in contact with conducting metallic surfaces of the ISS, the EMU conducting components, including the perspiration-soaked crewmember inside, can become charged to the Space Station floating potential. The concern is the potential dielectric breakdown of anodized aluminum surfaces on the EMU producing an arc from the EMU to the ambient plasma, or nearby ISS structure. If the EMU arcs, an electrical current of an unknown magnitude and duration may conduct through the EVA crewmember, producing an unacceptable condition. This electrical current may be sufficient to startle or fatally shock the EVA crewmember (Reference 2). Hence, as currently defined by the EVA community, the ISS floating potential for all nominal and contingency EVA worksites and translation paths must have a magnitude less than 40 volts relative to the local ionosphere at all times during EVA. Arcing from the EMU is classified as a catastrophic hazard, which requires two-failure tolerant controls, i.e., three hazard controls. Each PCU is capable of maintaining the ISS floating potential below the requirement during EVA. The two PCUs provide a single failure tolerant control of ISS floating potential. In the event of the failure of one or two PCUs, a combination of solar array shunting and turning the solar arrays into their own wakes will be used to supply control of the plasma hazard (Reference 3). The purpose of this paper is to present on-orbit information that shows that ISS solar array placement with respect to the ISS velocity vector can control solar array plasma charging, and hence, provide an operational control for the plasma hazard. Also, this paper will present on-orbit information that shows that shunting of the ISS solar arrays can control solar array plasma charging, and hence, provide an additional operational control for the plasma hazard.

Alred, John↗
NASA NTRS2006

Analysis of ISS Plasma Interaction

To date, the International Space Station (ISS) has been one of the largest objects flown in lower earth orbit (LEO). The ISS utilizes high voltage solar arrays (160V) that are negatively grounded leading to pressurized elements that can float negatively with respect to the plasma. Because laboratory measurements indicate a dielectric breakdown potential difference of 80V, arcing could occur on the ISS structure. To overcome the possibility of arcing and clamp the potential of the structure, two Plasma Contactor Units (PCUs) were designed, built, and flown. Also a limited amount of measurements of the floating potential for the present ISS configuration were made by a Floating Potential Probe (FPP), indicating a minimum potential of 24 Volts at the measurement location. A predictive tool, the ISS Plasma Interaction Model (PIM) has been developed accounting for the solar array electron collection, solar array mast wire and effective conductive area on the structure. The model has been used for predictions of the present ISS configuration. The conductive area has been inferred based on available floating potential measurements. Analysis of FPP and PCU data indicated distribution of the conductive area along the Russian segment of the ISS structure. A significant input to PIM is the plasma environment. The International Reference Ionosphere (IRI 2001) was initially used to obtain plasma temperature and density values. However, IRI provides mean parameters, leading to difficulties in interpretation of on-orbit data, especially at eclipse exit where maximum charging can occur. This limits our predicative capability. Satellite and Incoherent Scatter Radar (ISR) data of plasma parameters have also been collected. Approximately 130,000 electron temperature (Te) and density (Ne) pairs for typical ISS eclipse exit conditions have been extracted from the reduced Langmuir probe data flown aboard the NASA DE-2 satellite. Additionally, another 18,000 Te and Ne pairs of ISR data from several radar locations around the globe were used to assure consistency of the satellite data. PIM predictions for ISS charging made with this data correlated very well with FPP data, indicating that the general physics of spacecraft charging with high voltage solar arrays have been captured. The predictions also provided the probabilities of occurrences for ISS charging. These probabilities give a numerical measure of the number of times when the ISS will approach or exceed the vehicle plasma hazard conditions for each configuration. In this paper we shall present the interaction mechanisms between the ISS and the surrounding plasma and give an overview of the PIM components. PIM predictions are compared with available data followed by a discussion of the variability of plasma parameters and the conductive area on the ISS. The ISS PIM will be further tested and verified as data from the Floating Potential Measurement Unit become available, and construction of the ISS continues.

Reddell, Brandon↗
NASA NTRS2006

Product Reliability Trends, Derating Considerations and Failure Mechanisms with Scaled CMOS

As microelectronics is scaled into the deep sub-micron regime, space and aerospace users of advanced technology CMOS are reassessing how scaling effects impact long-term product reliability. The effects of electromigration (EM), time-dependent-dielectric-breakdown (TDDB) and hot carrier degradation (HCI and NBTI) wearout mechanisms on scaled technologies and product reliability are investigated, accelerated stress testing across several technology nodes is performed, and FA is conducted to confirm the failure mechanism(s).

CMOS integrated circuits↗