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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 127 records · Page 7
All sourcesNASA NTRSDOE OSTI
NASA NTRS1996

Chip-on-Board Technology 1996 Year-end Report (Design, Manufacturing, and Reliability Study)

The major impetus for flight qualifying Chip-On-Board (COB) packaging technology is the shift in emphasis for space missions to smaller, better, and cheaper spacecraft and satellites resulting from the NASA New Millenium initiative and similar requirements in DoD-sponsored programs. The most important benefit that can potentially be derived from miniaturizing spacecraft and satellites is the significant cost saving realizable if a smaller launch vehicle may be employed. Besides the program cost saving, there are several other advantages to building COB-based space hardware. First, once a well-controlled process is established, COB can be low cost compared to standard Multi-Chip Module (MCM) technology. This cost competitiveness is regarded as a result of the generally greater availability and lower cost of Known Good Die (KGD). Coupled with the elimination of the first level of packaging (chip package), compact, high-density circuit boards can be realized with Printed Wiring Boards (PWB) that can now be made with ever-decreasing feature size in line width and via hole. Since the COB packaging technique in this study is based mainly on populating bare dice on a suitable multi-layer laminate substrate which is not hermetically sealed, die coating for protection from the environment is required. In recent years, significant improvements have been made in die coating materials which further enhance the appeal of COB. Hysol epoxies, silicone, parylene and silicon nitride are desirable because of their compatible Thermal Coefficient of Expansion (TCE) and good moisture resistant capability. These die coating materials have all been used in the space and other industries with varying degrees of success. COB technology, specifically siliconnitride coated hardware, has been flown by Lockheed on the Polar satellite. In addition, DARPA has invested a substantial amount of resources on MCM and COB-related activities recently. With COB on the verge of becoming a dominant player in DoD programs, DARPA is increasing its support of the availability of KGDs which will help decrease their cost. Aside from the various major developments and trends in the space and defense industries that are favorable to the acceptance and widespread use of'COB packaging technology, implementing COB can be appealing in other aspects. Since the interconnection interface is usually the weak link in a system, the overall circuit or system reliability may actually be improved because of the elimination of a level of interconnect/packaging at the chip. With COB, mixing packaging technologies is possible. Because some devices are only available in commercial plastic packages, populating a multi-layer laminate substrate with both bare dice and plastic-package parts is inevitable. Another attractive feature of COB is that re-workability is possible if die coating is applied only on the die top. This method allows local replacement of individual dice that were found to be defective instead of replacing an entire board. In terms of thermal management, unpackaged devices offer a shorter thermal resistance path than their packaged counterparts thereby improving thermal sinking and heat removal from the parts.

Le, Binh Q.↗
DOE OSTI2020

Power Electronics Materials and Bonded Interfaces - Reliability and Lifetime

The emergence of wide-bandgap (WBG) devices in power electronics packages has brought significant attention to the reliability and thermal performance of the bonded interfaces. These interfaces, such as die-attach and substrate-attach, need to withstand the severe stress induced on them by the high-temperature (> 200°C) operation of the WBG devices. Sintered silver and transient liquid phase alloys are key bonded interfaces that can enable the high-temperature operation of WBG devices, however it is essential to evaluate their reliability and study the possible failure mechanisms before they can be used in power electronics packages. Sintered silver is already being adopted in commercial packages as a die-attach, but large-area substrate-attach offers additional reliability challenges. In this project, we investigate the reliability of these interface materials under accelerated thermal cycling and correlate these results with finite element simulations to develop lifetime prediction models. The failure mechanisms of these bonded interfaces are also studied.

47 OTHER INSTRUMENTATION↗
DOE OSTI2022

Perovskite Photovoltaics: Venturing Outdoors

Metal halide perovskite solar cells have shown promising performance, but mainly on small-area devices and under laboratory conditions. Now, researchers have demonstrated the fabrication of large-area devices assembled and packaged into modules and reported on their operation outdoors.

field testing↗
DOE OSTI2021

A perspective on the electro-thermal co-design of ultra-wide bandgap lateral devices

Fundamental research and development of ultra-wide bandgap (UWBG) semiconductor devices are under way to realize next-generation power conversion and wireless communication systems. Devices based on aluminum gallium nitride (AlxGa1-xN, x is the Al composition), ..beta..-phase gallium oxide (..beta..-Ga2O3), and diamond give promise to the development of power switching devices and radio frequency power amplifiers with higher performance and efficiency than commercial wide bandgap semiconductor devices based on gallium nitride (GaN) and silicon carbide (SiC). However, one of the most critical challenges for the successful deployment of UWBG device technologies is to overcome adverse thermal effects that impact the device performance and reliability. Overheating of UWBG devices originates from the projected high power density operation and poor intrinsic thermal properties of AlxGa1-xN and ..beta..-Ga2O3. This Perspective delineates the need and process for the "electro-thermal co-design" of laterally configured UWBG electronic devices and provides a comprehensive review of current state-of-the-art thermal characterization methods, device thermal modeling practices, and both device- and package-level thermal management solutions.

71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSIC↗
NASA NTRS1972

Active seismic experiment

The Apollo 16 active seismic experiment (ASE) was designed to generate and monitor seismic waves for the study of the lunar near-surface structure. Several seismic energy sources are used: an astronaut-activated thumper device, a mortar package that contains rocket-launched grenades, and the impulse produced by the lunar module ascent. Analysis of some seismic signals recorded by the ASE has provided data concerning the near-surface structure at the Descartes landing site. Two compressional seismic velocities have so far been recognized in the seismic data. The deployment of the ASE is described, and the significant results obtained are discussed.

Kovach, R. L.↗
NASA NTRS1978

Preliminary study of the reliability of imaging charge coupled devices

Imaging CCDs are capable of low light level response and high signal-to-noise ratios. In space applications they offer the user the ability to achieve extremely high resolution imaging with minimum circuitry in the photo sensor array. This work relates the CCD121H Fairchild device to the fundamentals of CCDs and the representative technologies. Several failure modes are described, construction is analyzed and test results are reported. In addition, the relationship of the device reliability to packaging principles is analyzed and test data presented. Finally, a test program is defined for more general reliability evaluation of CCDs.

Beall, J. R.↗
NASA NTRS1979

Design, processing and testing of LSI arrays: Hybrid microelectronics task

Mathematical cost factors were generated for both hybrid microcircuit and printed wiring board packaging methods. A mathematical cost model was created for analysis of microcircuit fabrication costs. The costing factors were refined and reduced to formulae for computerization. Efficient methods were investigated for low cost packaging of LSI devices as a function of density and reliability. Technical problem areas such as wafer bumping, inner/outer leading bonding, testing on tape, and tape processing, were investigated.

Himmel, R. P.↗
NASA NTRS1989

The use of aircraft and satellite remote sensing of phytoplankton chlorophyll concentrations in case 2 estuarine waters of the Chesapeake Bay

Two projects using remote sensing of phytoplankton chlorophyll concentrations in the Chesapeake Bay estuary were proposed. The first project used aircraft remote sensing with a compact radiometer system developed at NASA's Goddard Space Flight Center (GSFC), the Ocean Data Acquisition System (ODAS). ODAS includes three radiometers at 460, 490, and 520 nm, an infrared temperature sensor (PRT-5), Loran-C for navigation, and a data acquisition system using a PC and mass storage device. This instrument package can be flown in light aircraft at relatively low expense, permitting regular and frequent flights. Sixteen flights with ODAS were completed using the Virginia Institute of Marine Science's De Havilland 'Beaver'. The goal was to increase spatial and temporal resolution in assaying phytoplankton pigment concentrations in the Chesapeake. At present, analysis is underway of flight data collected between March and July 1989. The second project focused on satellite data gathered with the Nimbus-7 Coastal Zone Color Scanner (CZSC) between late 1978 and mid 1986. The problem in using CZSC data for the Chesapeake Bay is that the optical characteristics of this (and many) coastal and estuarine waters are distinct from those of the open ocean for which algorithms for computing pigment concentrations were developed. The successful use of CZCS data for the estuary requires development of site-specific algorithms and analytical approaches. Of principal importance in developing site-specific procedures is the availability of in-situ data on pigment concentrations. A significant data set was acquired from EPA's Chesapeake Bay Program in Annapolis, Maryland, and clear satellite scenes are being analyzed for which same-day sea truth measurements of pigment were obtained. Both the University of Miami and GSFC Seapak systems are being used in this effort. The main finding to date is an expected one, i.e., the algorithms developed for oceanic waters are inadequate to compute pigment concentrations for the Case 2 waters of the Chesapeake Bay. One reason is the overestimation of aerosol radiances by assuming that water-leaving radiance in Band 4 of CZCS (670 nm) is zero, an assumption that is invalid for the Bay. This prompted any attempts to iterative procedures for estimating the proportion of the Band 4 radiance that is actually attributable to aerosol by estimating the water-leaving component using optical data. A cruise on the Chesapeake the week of 7 August 1989 was conducted to collect additional optical data necessary to this task.

Harding, Lawrence W., Jr.↗
NASA NTRS1999

MEMS Reliability Assurance Guidelines for Space Applications

This guide is a reference for understanding the various aspects of microelectromechanical systems, or MEMS, with an emphasis on device reliability. Material properties, failure mechanisms, processing techniques, device structures, and packaging techniques common to MEMS are addressed in detail. Design and qualification methodologies provide the reader with the means to develop suitable qualification plans for the insertion of MEMS into the space environment.

Stark, Brian↗
NASA NTRS2000

Coupling, Q-Factor, and Integration Aspects of Microsphere Applications

With suggested applications varying from microlaser and cavity QED through optical locking of diode lasers to modulators and sensors, high-Q silica microspheres with whispering-gallery (WG) modes so far remain the subject of tabletop feasibility demonstrations. Despite the uniquely high quality-factor and submillimeter dimensions suitable for tight packaging, this novel type of high-finesse cavity still has to be adapted to fiber- and integrated-optic hardware. In the visible and near infrared-band experiments (633-850nm) measuring the ringdown time tau of free oscillations, Q = (0.6 to 0.8 ) x 10(exp 10) has been obtained in silica spheres of diameter -800 microns (corresponding tau = 3 to 4 microseconds). It was proved that under normal laboratory conditions, quality-factor is subject to deterioration within several-minute scale down to (2 ... 3 ) x 10(exp 9). The responsible mechanism was identified as adsorption of a monolayer of atmospheric water, so that preservation of the ultimate Q requires manipulation in dry environment, or fast packaging into sealed devices. Larger Q can be expected closer to minimum of attenuation in fused silica alpha = 0.2 dB/km; Q greater than or equal to 1 x 10(exp 11) at lambda=1.55 microns, with corresponding energy storage time tau approx. 0.1ms. Experiments are currently underway to determine whether this high Q can be realized experimentally. The evident difficulty is that OH-related optical absorption has its peaks located near the reported minimum of attenuation in silica. We can also mention here that some of proposed fiber materials, yet not ready for fiber drawing, have been predicted to have smaller attenuation than fused silica and may be suitable for microsphere fabrication (sodium-magnesium silicate glass, alpha = 0.06dB/km). WG modes possess very small radiative loss (it does not prevent Q-10(exp 20) and more) and therefore are electromagnetically isolated and cannot be excited by free-space beams. If no modification (such as grating) is made on the sphere surface, the coupling has to he provided by an appropriate near-field device. A systematic theoretical approach has been recently developed to quantify the performance of near-field couplers for WG modes. Efficient coupling can be obtained upon fulfillment of two main conditions: (1) mode matching and (2) sufficient coupling strength to provide the buildup of a WG mode with a given intrinsic loss. In other words, the wave in the coupler has to be phase-matched and sufficiently overlapped with the WG mode to provide enough buildup in the cavity. If the coupling efficiency is characterized by the fractional depth K(sup 2) of the resonance dip in intensity transmittance observed upon varying the frequency of the exciting wave in the coupler.

Ilchenko, V. S.↗
NASA NTRS2006

Cryogenic Cooling for Myriad Applications-A STAR Is Born

Cryogenics, the science of generating extremely low temperatures, has wide applicability throughout NASA. The Agency employs cryogenics for rocket propulsion, high-pressure gas supply, breathable air in space, life support equipment, electricity, water, food preservation and packaging, medicine, imaging devices, and electronics. Cryogenic liquid oxygen and liquid hydrogen systems are also replacing solid rocket motor propulsion systems in most of the proposed launch systems, a reversion to old-style liquid propellants. In the late 1980s, NASA wanted a compact linear alternator/motor with reduced size and mass, as well as high efficiency, that had unlimited service life for use in a thermally driven power generator for space power applications. Prior development work with free-piston Stirling converters (a Stirling engine integrated with a linear actuator that produces electrical power output) had shown the promise of that technology for high-power space applications. A dual use for terrestrial applications exists for compact Stirling converters for onsite combined heat and power units. The Stirling cycle is also usable in reverse as a refrigeration cycle suitable for cryogenic cooling, so this Stirling converter work promised double benefits as well as dual uses. The uses for cryogenic coolers within NASA abound; commercial applications are similarly wide-ranging, from cooling liquid oxygen and nitrogen, to cryobiology and bio-storage, cryosurgery, instrument and detector cooling, semiconductor manufacturing, and support service for cooled superconducting power systems.

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NASA NTRS2010

Photonic Choke-Joints for Dual-Polarization Waveguides

Photonic choke joint (PCJ) structures for dual-polarization waveguides have been investigated for use in device and component packaging. This interface enables the realization of a high performance non-contacting waveguide joint without degrading the in-band signal propagation properties. The choke properties of two tiling approaches, symmetric square Cartesian and octagonal quasi-crystal lattices of metallic posts, are explored and optimal PCJ design parameters are presented. For each of these schemes, the experimental results for structures with finite tilings demonstrate near ideal transmission and reflection performance over a full waveguide band.

Wollack, Edward J.↗
NASA NTRS2018

SiAl Alloy Feedhorn Arrays: Material Properties, Feedhorn Design, and Astrophysical Applications

We present here a study of the use of the SiAl alloy CE7 for the packaging of silicon devices at cryogenic temperatures. We report on the development of baseplates and feedhorn arrays for millimeter wave bolometric detectors for astrophysics. Existing interfaces to such detectors are typically made either of metals, which are easy to machine but mismatched to the thermal contraction profile of Si devices, or of silicon, which avoids the mismatch but is difficult to directly machine. CE7 exhibits properties of both Si and Al, which makes it uniquely well suited for this application. We measure CE7 to a) superconduct below a critical transition temperature, T (sub c), 1.2 K, b) have a thermal contraction profile much closer to Si than metals, which enables simple mating, and c) have a low thermal conductivity which can be improved by Au-plating. Our investigations also demonstrate that CE7 can be machined well enough to fabricate small structures, such as #0-80 threaded holes, to tight tolerances (approximately 25 microns) in contrast with pure silicon and similar substrates. We have fabricated CE7 baseplates being deployed in the 93 gigahertz polarimetric focal planes used in the Cosmology Large Angular Scale Surveyor (CLASS). We also report on the development of smooth-walled feedhorn arrays made of CE7 that will be used in a focal plane of dichroic 150/220 gigahertz detectors for the CLASS High-Frequency camera.

Ali, Aamir M.↗
DOE OSTI2022

Power Electronics Materials and Bonded Interfaces - Reliability and Lifetime

Wide-bandgap devices have pushed the operational limit of semiconductor devices in automotive power electronics packages to higher temperatures (>200 C). While a higher efficiency can be achieved through the use of wide-bandgap devices, the entire package must be re-designed with components that can withstand the higher temperature limits. Sintered silver and transient liquid phase bonds are potential candidates as bonded materials for use in higher temperatures however, the underlying mechanics of deformation under thermal loads and the resulting failure mechanisms in these materials are not well understood. Accelerated experiments conducted at NREL reveal that high-lead solder joints have better reliability than sintered silver under extreme thermal cycling conditions. Furthermore, efforts to develop a crack propagation model for the high-temperature materials are described.

ADVANCED PROPULSION SYSTEMS↗
DOE OSTI2022

Achieving American Leadership in the Semiconductors Supply Chain Factsheet

Semiconductors are a keystone technology that are essential for the operation of every electronic device, including those that are critical to a clean energy economy. The semiconductor industry has a complex, competitive, and highly integrated international supply chain in which the United States has historically enjoyed a dominant position, but where this position has been eroding over time. In 1995, 26% of global semiconductor manufacturing capacity was located in the United States; this had decreased to 10% by 2020. Investments in key semiconductor manufacturing technologies such as high-voltage power electronics, energy-efficient conventional devices, and advanced packaging point the way to secure a strong domestic semiconductor industrial base.

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