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Multiple element continuity gage measures plane stress crack growth plus surface crack growth under plane strain conditions. The gage measures flat and curved surfaces and operates at cryogenic temperatures.
Fastening device that consists of internally threaded silica insert, silica plug, and molded rubber retainer, seals holes in ceramic tiles securely over wide temperature excursions without cracking from thermal stresses. Device proves useful in high-temperature industrial applications.
Study of the kinetics of hydrogen-induced cracking in the Ti-5Al-2.5Sn titanium alloy, which has a structure of acicular alpha platelets in a beta matrix. The crack-growth rate at low stress-intensity levels was found to be exponentially dependent on stress intensity but essentially independent of temperature. The crack-growth rate at intermediate stress-intensity levels was found to be independent of stress intensity but dependent on temperature in such a way that crack-growth rate was controlled by a thermally activated mechanism having an activation energy of 5500 cal/mole and varied as the square root of the hydrogen pressure. The crack-growth rate at stress-intensity levels very near the fracture toughness is presumed to be independent of environment. The results are interpreted to suggest that crack growth at high stress intensities is controlled by normal, bulk failure mechanisms such as void coalescence and the like. At intermediate stress-intensity levels the transport of hydrogen to some interaction site along the alpha-beta boundary is the rate-controlling mechanism. The crack-growth behavior at low stress intensities suggests that the hydrogen interacts at this site to produce a strain-induced hydride which, in turn, induces crack growth by restricting plastic flow at the crack tip.
Inconel 718 sheet material was tested to determine fatigue crack growth rate (FCGR) at cryogenic conditions representative of a liquid hydrogen (LH2) environment at -423 degree F. Tests utilized M(T) and ESE(T) specimen geometries and environments were either cold gaseous helium or submersion in LH2. The test results support a significant improvement in the fatigue crack growth threshold at -423 degree F compared to -320 degree F or 70 degree F.
Stress corrosion tests of titanium alloys in distilled and aqueous salt solutions at ambient temperatures employing single edge notched specimens
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Two superalloys used in gas-turbine disks, Rene 95 and IN-100 were tested in several forms at 0.33 Hz in air, and the results were compared with earlier data on Astroloy to gain a better understanding of the effects of grain size, strength, and alloy composition on the fatigue crack propagation behavior. In addition, selected forms of Rene 95 were tested at 0.33 Hz in vacuum and in air using a cycle with a 120-sec tensile dwell to evaluate the effects of environment and creep. Results of the study emphasize the beneficial effect of large grain size on the fatigue and crep-fatigue crack growth resistance of the superalloys in the temperature range corresponding to the operating temperatures of aircraft gas-turbine engine disk rims.
Some 10 wt percent nickel is added to an Fe-base alloy which has a ferrite microstructure to improve the high temperature castability and crack resistance while about 0.2 wt percent zirconium is added for improved high temperatur cyclic oxidation and corrosion resistance. The basic material is a high temperature FeCrAl heater alloy, and the addition provides a material suitable for burner rig nozzles.
Mechanisms of slat stress corrosion cracking of titanium alloys at high temperatures
Composites used in space structures are exposed to both extremes in temperature and applied mechanical loads. Cracks in the matrix form, changing the laminate thermoelastic properties. The goal of the present investigation is to develop a predictive methodology to quantify microcracking in general composite laminates under both thermal and mechanical loading. This objective is successfully met through a combination of analytical modeling and experimental investigation. In the analysis, the stress and displacement distributions in the vicinity of a crack are determined using a shear lag model. These are incorporated into an energy based cracking criterion to determine the favorability of crack formation. A progressive damage algorithm allows the inclusion of material softening effects and temperature-dependent material properties. The analysis is implemented by a computer code which gives predicted crack density and degraded laminate properties as functions of any thermomechanical load history. Extensive experimentation provides verification of the analysis. AS4/3501-6 graphite/epoxy laminates are manufactured with three different layups to investigate ply thickness and orientation effects. Thermal specimens are cooled to progressively lower temperatures down to -184 C. After conditioning the specimens to each temperature, cracks are counted on their edges using optical microscopy and in their interiors by sanding to incremental depths. Tensile coupons are loaded monotonically to progressively higher loads until failure. Cracks are counted on the coupon edges after each loading. A data fit to all available results provides input parameters for the analysis and shows them to be material properties, independent of geometry and loading. Correlation between experiment and analysis is generally very good under both thermal and mechanical loading, showing the methodology to be a powerful, unified tool. Delayed crack initiation observed in a few cases is attributed to a lack of preexisting flaws assumed by the analysis. Some interactions between adjacent ply groups are attributed to local stress concentrations. These two effects are not captured by the analysis due to its global nature. The analysis is conservative in these cases and agrees well with data after the observed onset of cracking.
Indentation behavior of Ce-TZP, Y-TZP, and Mg-PSZ between room temperature and 1300 C was investigated. Hardness decreased with increasing temperature for all three materials, but indentation cracking increased with increasing temperature. The opposing temperature dependences are discussed in terms of dislocation and transformation plasticity.
The fatigue crack growth behavior of Grainex Mar-M 247 is evaluated for NASA s Turbine Seal Test Facility. The facility is used to test air-to-air seals primarily for use in advanced jet engine applications. Because of extreme seal test conditions of temperature, pressure, and surface speeds, surface cracks may develop over time in the disk bolt holes. An inspection interval is developed to preclude catastrophic disk failure by using experimental fatigue crack growth data. By combining current fatigue crack growth results with previous fatigue strain-life experimental work, an inspection interval is determined for the test disk. The fatigue crack growth life of the NASA disk bolt holes is found to be 367 cycles at a crack depth of 0.501 mm using a factor of 2 on life at maximum operating conditions. Combining this result with previous fatigue strain-life experimental work gives a total fatigue life of 1032 cycles at a crack depth of 0.501 mm. Eddy-current inspections are suggested starting at 665 cycles since eddy current detection thresholds are currently at 0.381 mm. Inspection intervals are recommended every 50 cycles when operated at maximum operating conditions.
Pressure and temperature dependence of slow crack growth in hardened steel in gaseous hydrogen environment
Various electrolyte materials for solid oxide fuel cells were fabricated by hot pressing 10 mol% yttria-stabilized zirconia (10-YSZ) reinforced with two different forms of alumina particulates and platelets each containing 0 to 30 mol% alumina. Flexure strength and fracture toughness of platelet composites were determined as a function of alumina content at 1000 C in air and compared with those of particulate composites determined previously. In general, elevated-temperature strength and fracture toughness of both composite systems increased with increasing alumina content. For a given alumina content, flexure strength of particulate composites was greater than that of platelet composites at higher alumina contents (greater than or equal to 20 mol%), whereas, fracture toughness was greater in platelet composites than in particulate composites, regardless of alumina content. The results of slow crack growth (SCG) testing, determined at 1000 C via dynamic fatigue testing for three different composites including 0 mol% (10-YSZ matrix), 30 mol % particulate and 30 mol% platelet composites, showed that susceptibility to SCG was greatest with SCG parameter n = 6 to 8 for both 0 and 30 mol% particulate composites and was least with n = 33 for the 30 mol% platelet composite.
The figure depicts a proposed semiconductor laser, based on In(As)Sb quantum dots on a (001) InP substrate, that would operate in the wavelength range between 1.8 and 2.3 m. InSb and InAsSb are the smallest-bandgap conventional III-V semiconductor materials, and the present proposal is an attempt to exploit the small bandgaps by using InSb and InAsSb nanostructures as midinfrared emitters. The most closely related prior III-V semiconductor lasers are based, variously, on strained InGaAs quantum wells and InAs quantum dots on InP substrates. The emission wavelengths of these prior devices are limited to about 2.1 m because of critical quantum-well thickness limitations for these lattice mismatched material systems. The major obstacle to realizing the proposed laser is the difficulty of fabricating InSb quantum dots in sufficient density on an InP substrate. This difficulty arises partly because of the weakness of the bond between In and Sb and partly because of the high temperature needed to crack metalorganic precursor compounds during the vapor-phase epitaxy used to grow quantum dots: The mobility of the weakly bound In at the high growth temperature is so high that In adatoms migrate easily on the growth surface, resulting in the formation of large InSb islands at a density, usually less than 5 x 10(exp 9) cm(exp -2), that is too low for laser operation. The mobility of the In adatoms could be reduced by introducing As atoms to the growth surface because the In-As bond is about 30 percent stronger than is the In-Sb bond. The fabrication of the proposed laser would include a recently demonstrated process that involves the use of alternative supplies of precursors to separate group-III and group-V species to establish local non-equilibrium process conditions, so that In(As)Sb quantum dots assemble themselves on a (001) InP substrate at a density as high as 4 x 10(exp 10) cm(exp -2). Room-temperature photoluminescence spectra of quantum dots formed by this process indicate that they emit at wavelengths from 1.7 to 2.3 microns.
Solar array design for any spacecraft is determined by the orbit parameters. For example, operational voltage for spacecraft in Low Earth Orbit (LEO) is limited by significant differential charging due to interactions with low temperature plasma. In order to avoid arcing in LEO, solar array is designed to generate electrical power at comparatively low voltages (below 100 V) or to operate at higher voltages with encapsulated of all suspected discharge locations. In Geosynchronous Orbit (GEO) differential charging is caused by energetic electrons that produce differential potential between coverglass and conductive spacecraft body in a kilovolt range. In such a case, weakly conductive layer over coverglass (ITO) is one of possible measures to eliminate dangerous discharges on array surface. Temperature variations for solar arrays in both orbits are measured and documented within the range of -150 C +110 C. This wide interval of operational temperatures is regularly reproduced in ground tests with radiative heating and cooling inside shroud with flowing liquid nitrogen. The requirements to solar array design and tests turn out to be more complicated when planned trajectory crosses these two orbits and goes closer to Sun. Conductive layer over coverglass causes sharp increase in parasitic current collected from LEO plasma, high temperature may cause cracks in encapsulating material (RTV), radiative heating of coupon in vacuum chamber becomes practically impossible above 150 C, conductivities of glass and adhesive go up with temperature that decrease array efficiency, and mechanical stresses grow up to critical magnitudes. A few test arrangements and respective results are presented in current paper. Coupons were tested against arcing in simulated LEO and GEO environments under elevated temperatures up to 200 C. The dependence of leakage current on temperature was measured, and electrostatic cleanness was verified for coupons with antireflection (AR) coating over ITO layer.
Two quantitative models based on experimentally observed fatigue damage processes have been made: (1) a model of low cycle fatigue life based on fatigue crack growth under general-yielding cyclic loading; and (2) a model of accelerated fatigue crack growth at elevated temperatures based on grain boundary oxidation. These two quantitative models agree very well with the experimental observations.
Sample titles of the space shuttle reusable surface insulation was subjected alternately to simulated mission heating and either real or simulated environmental exposure for up to 34 cycles. The coating cracked as a result of exposure to high temperature and moisture conditions, and insulation with cracked coatings absorbed significant quantities of water in the launch-pad environment. Cracking was a complex function of time, temperature, and moisture exposure. Cracked coatings remained adherent to the insulation for up to 24 cycles past initial cracking.