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At least 127 records · Page 7

Test aspects of the JPL Viterbi decoder

The generation of test vectors and design-for-test aspects of the Jet Propulsion Laboratory (JPL) Very Large Scale Integration (VLSI) Viterbi decoder chip is discussed. Each processor integrated circuit (IC) contains over 20,000 gates. To achieve a high degree of testability, a scan architecture is employed. The logic has been partitioned so that very few test vectors are required to test the entire chip. In addition, since several blocks of logic are replicated numerous times on this chip, test vectors need only be generated for each block, rather than for the entire circuit. These unique blocks of logic have been identified and test sets generated for them. The approach employed for testing was to use pseudo-exhaustive test vectors whenever feasible. That is, each cone of logid is tested exhaustively. Using this approach, no detailed logic design or fault model is required. All faults which modify the function of a block of combinational logic are detected, such as all irredundant single and multiple stuck-at faults.

Breuer, M. A.↗

A laser plotting system for VLSI chip layouts

One of the most time consuming facets of custom Very Large Scale Integration (VLSI) design is obtaining hardcopy plots of the mask geometries of cells and chips. The traditional method of generating these plots is to use a multicolor pen plotter. Pen plotters are inherently slow and the plotting speed increases linearly with the number of edges that must be plotted. A moderate custom chip design at the Jet Propulsion Laboratory (JPL) now consists of more than 200,000 such edges and can take as much as eight hours to plot using a pen plotter. Software is described that was written at JPL to produce similar plots using a laser printer. It is shown that, for rather small layouts, the laser printer can provide nearly instantaneous turnaround. For moderate to large chip designs, the laser printer provides a factor of five or more improvement is speed over pen plotting.

Deutsch, L. J.↗

Large ejecta fragments from asteroids

The asteroid 4 Vesta, with its unique basaltic crust, remains a key mystery of planetary evolution. A localized olivine feature suggests excavation of subcrustal material in a crater or impact basin comparable in size to the planetary radius (R(sub vesta) is approximately = 280 km). Furthermore, a 'clan' of small asteroids associated with Vesta (by spectral and orbital similarities) may be ejecta from this impact 151 and direct parents of the basaltic achondrites. To escape, these smaller (about 4-7 km) asteroids had to be ejected at speeds greater than the escape velocity, v(sub esc) is approximately = 350 m/s. This evidence that large fragments were ejected at high speed from Vesta has not been reconciled with the present understanding of impact physics. Analytical spallation models predict that an impactor capable of ejecting these 'chips off Vesta' would be almost the size of Vesta! Such an impact would lead to the catastrophic disruption of both bodies. A simpler analysis is outlined, based on comparison with cratering on Mars, and it is shown that Vesta could survive an impact capable of ejecting kilometer-scale fragments at sufficient speed. To what extent does Vesta survive the formation of such a large crater? This is best addressed using a hydrocode such as SALE 2D with centroidal gravity to predict velocities subsequent to impact. The fragmentation outcome and velocity subsequent to the impact described to demonstrate that Vesta survives without large-scale disassembly or overturning of the crust. Vesta and its clan represent a valuable dataset for testing fragmentation hydrocodes such as SALE 2D and SPH 3D at planetary scales. Resolution required to directly model spallation 'chips' on a body 100 times as large is now marginally possible on modern workstations. These boundaries are important in near-surface ejection processes and in large-scale disruption leading to asteroid families and stripped cores.

Asphaug, E.↗

A new VLSI architecture for a single-chip-type Reed-Solomon decoder

A new very large scale integration (VLSI) architecture for implementing Reed-Solomon (RS) decoders that can correct both errors and erasures is described. This new architecture implements a Reed-Solomon decoder by using replication of a single VLSI chip. It is anticipated that this single chip type RS decoder approach will save substantial development and production costs. It is estimated that reduction in cost by a factor of four is possible with this new architecture. Furthermore, this Reed-Solomon decoder is programmable between 8 bit and 10 bit symbol sizes. Therefore, both an 8 bit Consultative Committee for Space Data Systems (CCSDS) RS decoder and a 10 bit decoder are obtained at the same time, and when concatenated with a (15,1/6) Viterbi decoder, provide an additional 2.1-dB coding gain.

Hsu, I. S.↗

VLSI-Chip Tester

Compact test set integrated in computer-aided design system. Test set performs functional tests on very-large-scale integrated (VLSI) circuits. Makes tests from points within VLSI chip as well as at input and output pins. Used for quality control and design; in latter capacity, checks internal logic functions on chip and feed results directly to computer-aided design system for correction. Also simulates operation of chip design before chip is made. VLSI Tester contains three power supplies, control logic, and standard multibus circuit board in aluminum chassis. Chassis fits under platform of microprobe station. Multibus board links tester to interactive terminals and to host computer.

Deutsch, Leslie J.↗

Testing interconnected VLSI circuits in the Big Viterbi Decoder

The Big Viterbi Decoder (BVD) is a powerful error-correcting hardware device for the Deep Space Network (DSN), in support of the Galileo and Comet Rendezvous Asteroid Flyby (CRAF)/Cassini Missions. Recently, a prototype was completed and run successfully at 400,000 or more decoded bits per second. This prototype is a complex digital system whose core arithmetic unit consists of 256 identical very large scale integration (VLSI) gate-array chips, 16 on each of 16 identical boards which are connected through a 28-layer, printed-circuit backplane using 4416 wires. Special techniques were developed for debugging, testing, and locating faults inside individual chips, on boards, and within the entire decoder. The methods are based upon hierarchical structure in the decoder, and require that chips or boards be wired themselves as Viterbi decoders. The basic procedure consists of sending a small set of known, very noisy channel symbols through a decoder, and matching observables against values computed by a software simulation. Also, tests were devised for finding open and short-circuited wires which connect VLSI chips on the boards and through the backplane.

Onyszchuk, I. M.↗

Chip level modeling of LSI devices

The advent of Very Large Scale Integration (VLSI) technology has rendered the gate level model impractical for many simulation activities critical to the design automation process. As an alternative, an approach to the modeling of VLSI devices at the chip level is described, including the specification of modeling language constructs important to the modeling process. A model structure is presented in which models of the LSI devices are constructed as single entities. The modeling structure is two layered. The functional layer in this structure is used to model the input/output response of the LSI chip. A second layer, the fault mapping layer, is added, if fault simulations are required, in order to map the effects of hardware faults onto the functional layer. Modeling examples for each layer are presented. Fault modeling at the chip level is described. Approaches to realistic functional fault selection and defining fault coverage for functional faults are given. Application of the modeling techniques to single chip and bit slice microprocessors is discussed.

Armstrong, J. R.↗

A VLSI single chip 8-bit finite field multiplier

A Very Large Scale Integration (VLSI) architecture and layout for an 8-bit finite field multiplier is described. The algorithm used in this design was developed by Massey and Omura. A normal basis representation of finite field elements is used to reduce the multiplication complexity. It is shown that a drastic improvement was achieved in this design. This multiplier will be used intensively in the implementation of an 8-bit Reed-Solomon decoder and in many other related projects.

Deutsch, L. J.↗

Accelerated Adaptive MGS Phase Retrieval

The Modified Gerchberg-Saxton (MGS) algorithm is an image-based wavefront-sensing method that can turn any science instrument focal plane into a wavefront sensor. MGS characterizes optical systems by estimating the wavefront errors in the exit pupil using only intensity images of a star or other point source of light. This innovative implementation of MGS significantly accelerates the MGS phase retrieval algorithm by using stream-processing hardware on conventional graphics cards. Stream processing is a relatively new, yet powerful, paradigm to allow parallel processing of certain applications that apply single instructions to multiple data (SIMD). These stream processors are designed specifically to support large-scale parallel computing on a single graphics chip. Computationally intensive algorithms, such as the Fast Fourier Transform (FFT), are particularly well suited for this computing environment. This high-speed version of MGS exploits commercially available hardware to accomplish the same objective in a fraction of the original time. The exploit involves performing matrix calculations in nVidia graphic cards. The graphical processor unit (GPU) is hardware that is specialized for computationally intensive, highly parallel computation. From the software perspective, a parallel programming model is used, called CUDA, to transparently scale multicore parallelism in hardware. This technology gives computationally intensive applications access to the processing power of the nVidia GPUs through a C/C++ programming interface. The AAMGS (Accelerated Adaptive MGS) software takes advantage of these advanced technologies, to accelerate the optical phase error characterization. With a single PC that contains four nVidia GTX-280 graphic cards, the new implementation can process four images simultaneously to produce a JWST (James Webb Space Telescope) wavefront measurement 60 times faster than the previous code.

Lam, Raymond K.↗

Scaling and Single Event Effects (SEE) Sensitivity

This paper begins by discussing the potential for scaling down transistors and other components to fit more of them on chips in order to increasing computer processing speed. It also addresses technical challenges to further scaling. Components have been scaled down enough to allow single particles to have an effect, known as a Single Event Effect (SEE). This paper explores the relationship between scaling and the following SEEs: Single Event Upsets (SEU) on DRAMs and SRAMs, Latch-up, Snap-back, Single Event Burnout (SEB), Single Event Gate Rupture (SEGR), and Ion-induced soft breakdown (SBD).

Oldham, Timothy R.↗

A systolic architecture for the correlation and accumulation of digital sequences

A fully systolic architecture for the implementation of digital sequence correlator/accumulators is described. These devices consist of a two-dimensional array of processing elements that are conceived for efficient fabrication in Very Large Scale Integrated (VLSI) circuits. A custom VLSI chip that was implemented using these concepts is described. The chip, which contains a four-lag three-level sequence correlator and four bits of accumulation with overflow detection, was designed using the Integrated UNIX-Based Computer Aided Design (CAD) System. Applications of such devices include the synchronization of coded telemetry data, alignment of both real time and non-real time Very Large Baseline Interferometry (VLBI) signals, and the implementation of digital filters and processes of many types.

Deutsch, L. J.↗

On-chip Broadband Load Calibrators for Characterizing Transition-Edge Sensor Bolometers

We describe the design and fabrication of on-chip broadband load calibrators for element-by- element and full circuit characterization of transition-edge sensor (TES) bolometers for cosmic microwave background (CMB) polarimetry. Fabricated in a 4 X 4 grid on a 100 mm silicon wafer, the chips allow systematic testing of individual detector circuit elements without the need for an external blackbody source. This in-situ testing approach provides rapid and efficient characterization of various pixel designs in order to optimize the optical efficiency and control of systematic effects of the detectors. In this work, we demonstrate the on-chip calibrators on the Cosmology Large Angular Scale Surveyor (CLASS) W-band pixels. In particular, we investigate the loss on microstrip transmission lines and measure the performance of various designs of TESs, magic-tees, via-less crossovers, and signal terminations. We also test a filter-bank spectrometer with eight resonators spanning 80 – 105 GHz to characterize the spectral response of circuit elements across the detector bandwidth.

Sumit Dahal↗

Finite element analysis of a micromechanical deformable mirror device

A monolithic spatial light modulator chip was developed consisting of a large number of micrometer-scale mirror cells which can be rotated through an angle by application of an electrostatic field. The field is generated by electronics integral to the chip. The chip has application in photoreceptor based non-impact printing technologies. Chips containing over 16000 cells were fabricated, and were tested to several billions of cycles. Finite Element Analysis (FEA) of the device was used to model both the electrical and mechanical characteristics.

Sheerer, T. J.↗

Generating Weighted Test Patterns for VLSI Chips

Improved built-in self-testing circuitry for very-large-scale integrated (VLSI) digital circuits based on version of weighted-test-pattern-generation concept, in which ones and zeros in pseudorandom test patterns occur with probabilities weighted to enhance detection of certain kinds of faults. Requires fewer test patterns and less computation time and occupies less area on circuit chips. Easy to relate switching activity in outputs with fault-detection activity by use of probabilistic fault-detection techniques.

Siavoshi, Fardad↗

Technology achievements and projections for communication satellites of the future

Multibeam systems of the future using monolithic microwave integrated circuits to provide phase control and power gain are contrasted with discrete microwave power amplifiers from 10 to 75 W and their associated waveguide feeds, phase shifters and power splitters. Challenging new enabling technology areas include advanced electrooptical control and signal feeds. Large scale MMIC's will be used incorporating on chip control interfaces, latching, and phase and amplitude control with power levels of a few watts each. Beam forming algorithms for 80 to 90 deg. wide angle scanning and precise beam forming under wide ranging environments will be required. Satelllite systems using these dynamically reconfigured multibeam antenna systems will demand greater degrees of beam interconnectivity. Multiband and multiservice users will be interconnected through the same space platform. Monolithic switching arrays operating over a wide range of RF and IF frequencies are contrasted with current IF switch technology implemented discretely. Size, weight, and performance improvements by an order of magnitude are projected.

Bagwell, J. W.↗

Technology achievements and projections for communication satellites of the future

Multibeam systems of the future using monolithic microwave integrated circuits to provide phase control and power gain are contrasted with discrete microwave power amplifiers from 10 to 75 W and their associated waveguide feeds, phase shifters and power splitters. Challenging new enabling technology areas include advanced electrooptical control and signal feeds. Large scale MMIC's will be used incorporating on chip control interfaces, latching, and phase and amplitude control with power levels of a few watts each. Beam forming algorithms for 80 to 90 deg wide angle scanning and precise beam forming under wide ranging environments will be required. Satellite systems using these dynamically reconfigured multibeam antenna systems will demand greater degrees of beam interconnectivity. Multiband and multiservice users will be interconnected through the same space platform. Monolithic switching arrays operating over a wide range of RF and IF frequencies are contrasted with current IF switch technology implemented discretely. Size, weight, and performance improvements by an order of magnitude are projected.

Bagwell, J. W.↗

Analog VLSI neural network integrated circuits

Two analog very large scale integration (VLSI) vector matrix multiplier integrated circuit chips were designed, fabricated, and partially tested. They can perform both vector-matrix and matrix-matrix multiplication operations at high speeds. The 32 by 32 vector-matrix multiplier chip and the 128 by 64 vector-matrix multiplier chip were designed to perform 300 million and 3 billion multiplications per second, respectively. An additional circuit that has been developed is a continuous-time adaptive learning circuit. The performance achieved thus far for this circuit is an adaptivity of 28 dB at 300 KHz and 11 dB at 15 MHz. This circuit has demonstrated greater than two orders of magnitude higher frequency of operation than any previous adaptive learning circuit.

Kub, F. J.↗

Low-Power CMOS Digital Autocorrelator Spectrometer

Prototype digital autocorrelator spectrometer circuit designed and built as assembly of few very-large-scale integrated (VLSI) complementary metal oxide/semiconductor (CMOS) circuit chips. Spectrometer contains 128 frequency channels and operates at clock rate of as much as 40 MHz. Total dc power needed is only 6 W. Digital autocorrelator spectrometer consists of four 32-channel autocorrelator chips that collectively produce 128-point spectrum of input signal as computed by use of Fourier transform.

Chandra, Kumar M.↗