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At least 127 records · Page 7

Tin Whisker Electrical Short Circuit Characteristics Part 2

Existing risk simulations make the assumption that when a free tin whisker has bridged two adjacent exposed electrical conductors, the result is an electrical short circuit. This conservative assumption is made because shorting is a random event that has a currently unknown probability associated with it. Due to contact resistance electrical shorts may not occur at lower voltage levels. In this experiment, we study the effect of varying voltage on the breakdown of the contact resistance which leads to a short circuit. From this data we can estimate the probability of an electrical short, as a function of voltage, given that a free tin whisker has bridged two adjacent exposed electrical conductors. In addition, three tin whiskers grown from the same Space Shuttle Orbiter card guide used in the aforementioned experiment were cross-sectioned and studied using a focused ion beam (FIB).

Courey, Karim J.↗

An Investigation of the Electrical Short Circuit Characteristics of Tin Whiskers

Existing risk simulations make the assumption that when a free tin whisker has bridged two adjacent exposed electrical conductors, the result is an electrical short circuit. This conservative assumption is made because shorting is a random event that has a currently unknown probability associated with it. Due to contact resistance electrical shorts may not occur at lower voltage levels. In this experiment, we study the effect of varying voltage on the breakdown of the contact resistance which leads to a short circuit. From this data we can estimate the probability of an electrical short, as a function of voltage, given that a free tin whisker has bridged two adjacent exposed electrical conductors. Also, three tin whiskers grown from the same Space Shuttle Orbiter card guide used in the aforementioned experiment were cross-sectioned and studied using a focused ion beam (FIB). The rare polycrystalline structure seen in the FIB cross section was confirmed using transmission electron microscopy (TEM). The FIB was also used to cross section two card guides to facilitate the measurement of the grain size to determine that the tin plating on the card guides had a bright finish.

Courey, Karim J.↗

An Investigation of the Electrical Short Circuit Characteristics of Tin Whiskers

Existing risk simulations make the assumption that when a free tin whisker has bridged two adjacent exposed electrical conductors, the result is an electrical short circuit. This conservative assumption is made because shorting is a random event that has a currently unknown probability associated with it. Due to contact resistance electrical shorts may not occur at lower voltage levels. In this experiment, we study the effect of varying voltage on the breakdown of the contact resistance which leads to a short circuit. From this data we can estimate the probability of an electrical short, as a function of voltage, given that a free tin whisker has bridged two adjacent exposed electrical conductors. Also, three tin whiskers grown from the same Space Shuttle Orbiter card guide used in the aforementioned experiment were cross-sectioned and studied using a focused ion beam (FIB). The rare polycrystalline structure seen in the FIB cross section was confirmed using transmission electron microscopy (TEM). The FIB was also used to cross section two card guides to facilitate the measurement of the grain size to determine that the tin plating on the card guides had a bright finish.

Courey, Karim J.↗

An Empirical Model for Estimating the Probability of Electrical Short Circuits from Tin Whiskers-Part I

Existing risk simulations make the assumption that when a free tin whisker has bridged two adjacent exposed electrical conductors, the result is an electrical short circuit. This conservative assumption is made because shorting is a random event that has a currently unknown probability associated with it. Due to contact resistance, electrical shorts may not occur at lower voltage levels. In this experiment, we study the effect of varying voltage on the breakdown of the contact resistance which leads to a short circuit. From this data, we can estimate the probability of an electrical short, as a function of voltage, given that a free tin whisker has bridged two adjacent exposed electrical conductors. In addition, three tin whiskers grown from the same Space Shuttle Orbiter card guide used in the aforementioned experiment were cross sectioned and studied using a focused ion beam (FIB).

Courey, Karim↗

Eddy current jet engine disk-crack monitor

A disk-crack monitor is described that is suitable for use on the ground or in flight. The system consists of an engine-mounted eddy current sensor, a series capacitance in each leg of the sensor circuit, and a capacitance-conductance bridge followed by an oscilloscope capable of advanced signal processing. It was applied to the detection of service-induced cracks in the first-stage turbine wheel of a helicopter engine. A 3.5 mm long radial fatigue crack plus smaller cracks, all located in the blade root region of the wheel, were detected during engine test stand operation at ground idle speed and temperature. The calculation of the value of series capacitance is also presented.

Barranger, J. P.↗

Comb/serpentine/cross-bridge test structure for fabrication process evaluation

The comb/serpentine/cross-bridge structure was developed to monitor and evaluate same layer shorts and step coverage problems (open and high-resistance wire over steps) for integrated circuit fabrication processes. The cross-bridge provides local measurements of wire sheet resistance and wirewidth. These local parametric measurements are used in the analysis of the serpentine wire, which identifies step coverage problems. The comb/serpentine/cross-bridge structure was fabricated with 3 microns CMOS/bulk p-well process and tested using a computer-controlled parametric test system.

Sayah, Hoshyar R.↗

Performance of an SOI Boot-Strapped Full-Bridge MOSFET Driver, Type CHT-FBDR, under Extreme Temperatures

Electronic systems designed for use in deep space and planetary exploration missions are expected to encounter extreme temperatures and wide thermal swings. Silicon-based devices are limited in their wide-temperature capability and usually require extra measures, such as cooling or heating mechanisms, to provide adequate ambient temperature for proper operation. Silicon-On-Insulator (SOI) technology, on the other hand, lately has been gaining wide spread use in applications where high temperatures are encountered. Due to their inherent design, SOI-based integrated circuit chips are able to operate at temperatures higher than those of the silicon devices by virtue of reducing leakage currents, eliminating parasitic junctions, and limiting internal heating. In addition, SOI devices provide faster switching, consume less power, and offer improved radiation-tolerance. Very little data, however, exist on the performance of such devices and circuits under cryogenic temperatures. In this work, the performance of an SOI bootstrapped, full-bridge driver integrated circuit was evaluated under extreme temperatures and thermal cycling. The investigations were carried out to establish a baseline on the functionality and to determine suitability of this device for use in space exploration missions under extreme temperature conditions.

Patterson, Richard↗

Evaluation of a High Temperature SOI Half-Bridge MOSFET Driver, Type CHT-HYPERION

Silicon-On-Insulator (SOI) technology utilizes the addition of an insulation layer in its structure to reduce leakage currents and to minimize parasitic junctions. As a result, SOIbased devices exhibit reduced internal heating as compared to the conventional silicon devices, consume less power, and can withstand higher operating temperatures. In addition, SOI electronic integrated circuits display good tolerance to radiation by virtue of introducing barriers or lengthening the path for penetrating particles and/or providing a region for trapping incident ionization. The benefits of these parts make them suitable for use in deep space and planetary exploration missions where extreme temperatures and radiation are encountered. Although designed for high temperatures, very little data exist on the operation of SOI devices and circuits at cryogenic temperatures. In this work, the performance of a commercial-off-the-shelf (COTS) SOI half-bridge driver integrated circuit was evaluated under extreme temperatures and thermal cycling. The investigations were carried out to establish a baseline on the functionality and to determine suitability of this device for use in space exploration missions under extreme temperature conditions.

Patterson, Richard↗

Estimating the Probability of Electrical Short Circuits from Tin Whiskers

To comply with lead-free legislation, many manufacturers have converted from tin-lead to pure tin finishes of electronic components. However, pure tin finishes have a greater propensity to grow tin whiskers than tin-lead finishes. Since tin whiskers present an electrical short circuit hazard in electronic components, simulations have been developed to quantify the risk of said short circuits occurring. Existing risk simulations make the assumption that when a free tin whisker has bridged two adjacent exposed electrical conductors, the result is an electrical short circuit. This conservative assumption is made because shorting is a random event that had an unknown probability associated with it. Note however that due to contact resistance electrical shorts may not occur at lower voltage levels. In our first article we developed an empirical probability model for tin whisker shorting. In this paper, we develop a more comprehensive empirical model using a refined experiment with a larger sample size, in which we studied the effect of varying voltage on the breakdown of the contact resistance which leads to a short circuit. From the resulting data we estimated the probability distribution of an electrical short, as a function of voltage. In addition, the unexpected polycrystalline structure seen in the focused ion beam (FIB) cross section in the first experiment was confirmed in this experiment using transmission electron microscopy (TEM). The FIB was also used to cross section two card guides to facilitate the measurement of the grain size of each card guide's tin plating to determine its finish .

Courey, Karim J.↗

Estimating the Probability of Electrical Short Circuits from Tin Whiskers

To comply with lead-free legislation, many manufacturers have converted from tin-lead to pure tin finishes of electronic components. However, pure tin finishes have a greater propensity to grow tin whiskers than tin-lead finishes. Since tin whiskers present an electrical short circuit hazard in electronic components, simulations have been developed to quantify the risk of said short circuits occurring. Existing risk simulations make the assumption that when a free tin whisker has bridged two adjacent exposed electrical conductors, the result is an electrical short circuit. This conservative assumption is made because shorting is a random event that had an unknown probability associated with it. Note however that due to contact resistance electrical shorts may not occur at lower voltage levels. In our first article we developed an empirical probability model for tin whisker shorting. In this paper, we develop a more comprehensive empirical model using a refined experiment with a larger sample size, in which we studied the effect of varying voltage on the breakdown of the contact resistance which leads to a short circuit. From the resulting data we estimated the probability distribution of an electrical short, as a function of voltage.

Courey, Karim J.↗

Developing an Empirical Model for Estimating the Probability of Electrical Short Circuits from Tin Whiskers

To comply with lead-free legislation, many manufacturers have converted from tin-lead to pure tin finishes of electronic components. However, pure tin finishes have a greater propensity to grow tin whiskers than tin-lead finishes. Since tin whiskers present an electrical short circuit hazard in electronic components, simulations have been developed to quantify the risk of said short circuits occurring. Existing risk simulations make the assumption that when a free tin whisker has bridged two adjacent exposed electrical conductors, the result is an electrical short circuit. This conservative assumption is made because shorting is a random event that had an unknown probability associated with it. Note however that due to contact resistance electrical shorts may not occur at lower voltage levels. In our first article we developed an empirical probability model for tin whisker shorting. In this paper, we develop a more comprehensive empirical model using a refined experiment with a larger sample size, in which we studied the effect of varying voltage on the breakdown of the contact resistance which leads to a short circuit. From the resulting data we estimated the probability distribution of an electrical short, as a function of voltage. In addition, the unexpected polycrystalline structure seen in the focused ion beam (FIB) cross section in the first experiment was confirmed in this experiment using transmission electron microscopy (TEM). The FIB was also used to cross section two card guides to facilitate the measurement of the grain size of each card guide's tin plating to determine its finish.

Courey, Karim J.↗

A Planar Dielectric-Filled-Parabolic-Feed Frequency Multiplier

In this paper, we present a novel quasi-optical all-planar frequency doubler that could provide an alternative approach to conventional waveguide circuits for millimeter- and submillimeter-wave signal generation. By utilizing a quad-bridge-diode configuration, we are able to isolate the input and the output circuits without the use of complicated filter structures.

frequency doubler waveguide circuits signal genera↗

Integrated photo-responsive metal oxide semiconductor circuit

An infrared photoresponsive element (RD) is monolithically integrated into a source follower circuit of a metal oxide semiconductor device by depositing a layer of a lead chalcogenide as a photoresistive element forming an ohmic bridge between two metallization strips serving as electrodes of the circuit. Voltage from the circuit varies in response to illumination of the layer by infrared radiation.

Jhabvala, Murzban D.↗

Electronic strain-level counter

Counter for aircraft counts and records number of times the strain at a point in a structural member exceeds each of four preset levels. Counter uses 28 volt dc power supply, metallic resistance strain gage bridge as sensor, integrated and solid state circuits for signal processing, and electromechanical counters for data storage and readout.

Pitts, F. L.↗

Rain and Dew Detector

Multifinger transducer actuates simple circuit that sets off alarm when moisture bridges fingers.

Laue, E. G.↗

Correlated Electromagnetic Levitation Actuator: A Reaction Sphere Based Attitude Control System

To address problems experienced by current reaction wheels and control moment gyroscopebased attitude control systems (ACS), researchers at NASA’s Marshall Space Flight Center have begun developing a reaction sphere actuator based on correlated electromagnetic levitation that will be immune to destructive bearing friction, momentum saturation, and gimbal lock. The Correlated Electromagnetic Levitation Actuator (CELA) advances the state of the art of reaction sphere ACSs by employing the concept of correlated magnetics. It is a frictionless, direct-drive reaction sphere that harnesses a unique technology with an array of applications across multiple disciplines. Correlated electromagnets function in a manner that is analogous to a matched filter; the convolution of two signals is peaked at the index representing the greatest match. For CELA, the signals are the patterns of magnetic flux density as a function of position. The magnitude of the convolution equates to an attractive or repulsive force, and these forces can be azimuthal or radial. The development of CELA is based in four distinct disciplines: Advanced Manufacturing, Prototype Development, Electromagnetic Modeling, and Controls. We are developing novel manufacturing techniques required to build arrays of permanent and electromagnet dipoles on curved surfaces. To print the permanent magnetic array, we have developed a probe with pyramidal magnets that will reside on a robotic arm to induce localized magnetic fields on a surface. The probe also includes the ability to erase dipole patterns from a permanent magnet by heating the surface to its Curie temperature. A number of test articles and prototypes have been developed using additive manufacturing methods. These prototypes have included hemispherical motors to test the drive algorithm, and a levitation test bed that demonstrates a magnetic bearing method based on attractive magnetic forces and ratiometric Hall effect sensors. We developed an array of electromagnetic dipoles on a printed circuit board (PCB) with individual H-bridges controlling each coil. This device created various flux density patterns and we measured their magnetic fields using a custom Hall effect 3-D probe and a LabVIEW virtual instrument. These data will serve as a benchmark for characterizing the accuracy of future models. Current work is focused on modeling the magnetic fields of our prototype arrays using COMSOL Finite Element Analysis and verifying the model against our test data. Accurate modeling will allow us to quickly test new patterns of electromagnets and their macro behavior. Eventually, the magnetic field models will be implemented in our controls simulations to facilitate precise control of the reaction sphere. Initial model results agree with field measurements to within 1 G (5% of measured flux density). Currently, we are testing different material properties of the electromagnets and their magnetic fields and thermal effects. These results will be used to refine the design of the electromagnetic dipoles. Our control efforts have centered on developing commutation, levitation, and field pattern shaping hardware in the form of breadboards and PCBs with software running on a local microcontroller. In addition, our partners developed MATLAB Simulink models to demonstrate a PID controller thatmitigates disturbance forces resulting from the interaction of drive and levitation magnetics. Finally, we have designed a three-axis test stand that will be used in future work to demonstrate CELA’s orientation control capability.

controls↗

Correlated Electromagnetic Levitation Actuator: A Reaction Sphere-Based Attitude Control System

To address problems experienced by current reaction wheels and control moment gyroscopebased attitude control systems (ACS), researchers at National Aeronautics and Space Administration’s (NASA’s) Marshall Space Flight Center (MSFC) have begun developing a reaction sphere actuator based on correlated electromagnetic levitation that will be immune to destructive bearing friction, momentum saturation, and gimbal lock. The Correlated Electromagnetic Levitation Actuator (CELA) advances the state of the art of reaction sphere ACSs by employing the concept of correlated magnetics. It is a frictionless, direct-drive reaction sphere that harnesses a unique technology with an array of applications across multiple disciplines. Correlated electromagnets function in a manner that is analogous to a matched filter; the convolution of two signals is peaked at the index representing the greatest match. For CELA, the signals are the patterns of magnetic flux density as a function of position. The magnitude of the convolution equates to an attractive or repulsive force, and these forces can be azimuthal or radial. The development of CELA is based in four distinct disciplines: Advanced Manufacturing, Prototype Development, Electromagnetic Modeling, and Controls. We are developing novel manufacturing techniques required to build arrays of permanent and electromagnet dipoles on curved surfaces. To print the permanent magnetic array, we have developed a probe with pyramidal magnets that will reside on a robotic arm to induce localized magnetic fields on a surface. We have also used high temperature ovens to erase dipole patterns from a permanent magnet by heating the surface to its Curie temperature. A number of test articles and prototypes have been developed using additive manufacturing methods. These prototypes have included hemispherical motors to test the drive algorithm, and a levitation test bed that demonstrates a magnetic bearing method based on attractive magnetic forces and ratiometric Hall effect sensors. We developed an array of electromagnetic dipoles on a printed circuit board (PCB) with individual H-bridges controlling each coil. This device created various flux density patterns and we measured their magnetic fields using a custom Hall effect 3-D probe and a LabVIEW virtual instrument. These data will serve as a benchmark for characterizing the accuracy of future models. Current work is focused on modeling the magnetic fields of our prototype arrays using COMSOL finite element analysis (FEA) and verifying the model against our test data. Accurate modeling will allow us to quickly test new patterns of electromagnets and their macro behavior. Eventually, the magnetic field models will be implemented in our controls simulations to facilitate precise control of the reaction sphere. Initial model results agree with field measurements to within 1 G (5% of measured flux density). Currently, we are testing different material properties of the electromagnets and their magnetic fields and thermal effects. These results will be used to refine the design of the electromagnetic dipoles. Our control efforts have centered on developing commutation, levitation, and field pattern shaping hardware in the form of breadboards and PCBs with software running on a local microcontroller. In addition, our partners developed MATLAB Simulink models to demonstrate a PID controller that mitigates disturbance forces resulting from the interaction of drive and levitation magnetics. Finally, we have designed a three-axis test stand that will be used in future work to demonstrate CELA’s orientation control capability.

reaction sphere↗

Reconditioning experience at Marshall Space Flight Center

Problems encountered on Skylab prompted the development of a reconditioning circuit which involves a DC to DC converter, a circuit sensing device, and the capability of switching several size reconditioners onto a circuit. Across each cell there is a full bridge rectifier. During battery discharge, if there is low cell voltage, the reconditioning systems holds that voltage up and permits discharge to continue on the system. When the cell is good, the voltage is up about one volt, the diodes are back, or reversed biased, and the current drawn out of the system is very low. The system has a standby power thrown at about one volt. As the voltage drops on a cell, the circuit strts picking up the load and helps hold the overall battery voltage up.

Paschal, L. E.↗