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At least 127 records · Page 7

Millimeter-wave monolithic diode-grid frequency multiplier

A semiconductor diode structure useful for harmonic generation of millimeter or submillimeter wave radiation from a fundamental input wave is fabricated on a GaAs substrate. A heavily doped layer of n(sup ++) GaAs is produced on the substrate and then a layer of intrinsic GaAs on said heavily doped layer on top of which a sheet of heavy doping (++) is produced. A thin layer of intrinsic GaAs grown over the sheet is capped with two metal contacts separated by a gap to produce two diodes connected back to back through the n(sup ++) layer for multiplication of frequency by an odd multiple. If only one metal contact caps the thin layer of intrinsic GaAs, the second diode contact is produced to connect to the n(sup ++) layer for multiplication of frequency by an even number. The odd or even frequency multiple is selected by a filter. A phased array of diodes in a grid will increase the power of the higher frequency generated.

Maserjian, Joseph↗

CMOS Imager Has Better Cross-Talk and Full-Well Performance

A complementary metal oxide/semiconductor (CMOS) image detector now undergoing development is designed to exhibit less cross-talk and greater full-well capacity than do prior CMOS image detectors of the same type. Imagers of the type in question are designed to operate from low-voltage power supplies and are fabricated by processes that yield device features having dimensions in the deep submicron range. Because of the use of low supply potentials, maximum internal electric fields and depletion widths are correspondingly limited. In turn, these limitations are responsible for increases in cross-talk and decreases in charge-handling capacities. Moreover, for small pixels, lateral depletion cannot be extended. These adverse effects are even more accentuated in a back-illuminated CMOS imager, in which photogenerated charge carriers must travel across the entire thickness of the device. The figure shows a partial cross section of the structure in the device layer of the present developmental CMOS imager. (In a practical imager, the device layer would sit atop either a heavily doped silicon substrate or a thin silicon oxide layer on a silicon substrate, not shown here.) The imager chip is divided into two areas: area C, which contains readout circuits and other electronic circuits; and area I, which contains the imaging (photodetector and photogenerated-charge-collecting) pixel structures. Areas C and I are electrically isolated from each other by means of a trench filled with silicon oxide. The electrical isolation between areas C and I makes it possible to apply different supply potentials to these areas, thereby enabling optimization of the supply potential and associated design features for each area. More specifically, metal oxide semiconductor field-effect transistors (MOSFETs) that are typically included in CMOS imagers now reside in area C and can remain unchanged from established designs and operated at supply potentials prescribed for those designs, while the dopings and the lower supply potentials in area I can be tailored to optimize imager performance. In area I, the device layer includes an n+ -doped silicon layer on which is grown an n-doped silicon layer. A p-doped silicon layer is grown on top of the n -doped layer. The total imaging device thickness is the sum of the thickness of the n+, n, and p layers. A pixel photodiode is formed between a surface n+ implant, a p implant underneath it, the aforementioned p layer, and the n and n+ layers. Adjacent to the diode is a gate for transferring photogenerated charges out of the photodiode and into a floating diffusion formed by an implanted p+ layer on an implanted n-doped region. Metal contact pads are added to the back-side for providing back-side bias.

Pain, Bedabrata↗

SRMS Assisted Docking and Undocking for the Orbiter Repair Maneuver

As part of the Orbiter Repair Maneuver (ORM) planned for Return to Flight (RTF) operations, the Shuttle Remote Manipulator System (SRMS) must undock the Orbiter, maneuver it through a complex trajectory at extremely low rates, present it to an EVA crewman at the end of the Space Station Remote Manipulator System to perform the Thermal Protection System (TPS) repair, and then retrace back through the trajectory to dock the Orbiter with the Orbiter Docking System (ODS). The initial and final segments of this operation involve the interaction between the SRMS, ISS, Orbiter and ODS. Previously, a technique entitled "SRMS assisted docking" for installation of a payload to the ODS had been developed and was utilized for the Russian provided Docking Module on STS-74 during Shuttle-Mir missions and both the Node 1 and FGB elements on STS-88/Flight 2A. This procedure consisted of the SRMS grappling the respective payload, maneuvering it to a pre-install position inches above the ODS Androgynous Peripheral Attachment System (APAS) ring, commanding the SRMS into Test mode (which allows brakes-off motion of the joints), and then down-firing Primary Reaction Control System (PRCS) jets in order to effect a capture of the APAS latches. Once a successful capture had been achieved, then the AP AS was operated through its nominal retraction sequence to complete the mating sequence. While this technique can once again be used for the tail end docking portion of the ORM, the initial undocking of the orbiter and ISS vehicles with the assistance of the SRMS has yet to be attempted on orbit. The objective here is to determine the most efficient means to separate or extract the vehicles. Two techniques were analyzed in support of RTF: (1) the 'nominal' demating from the mated interface, and (2) the SRMS performing the operation (either in an active or passive fashion). In the first operation, the demating process would replicate standard undocking operations, with the exception that the SRMS is allowed to arrest the resulting motion. The second operation would be to extend the APAS ring to a ready to dock position, open the capture latches, and then detach the vehicles using the SRMS either actively or passively. In the active case, the APAS ring is extended and latched, and the SRMS is commanded to pull the two interfaces apart (assuming that the effective pull force of the SRMS can overcome the spec values of the combined latch resistance). In the passive case, the SRMS brakes are engaged and the AP AS mechanism is commanded to retract, pulling the two interfaces apart. Since the emphasis of both STS-74 and STS-88 had solely been on the installation operation, as opposed to the separation operation, two new models required development and incorporation within simulation tools designed to analyze those scenarios. These enhancements included: (1) a detailed demating dynamics model to characterize the pusher spring characteristics during undocking, and (2) contact and mechanical system modeling of the back side of the latches to represent unlatching dynamics. This paper first provides an overview of the Monte-Carlo screening analysis for the installation (both nominal and contingency), including the variation of separation distance, misalignment conditions, SRMS joint/brake parameter characteristics, and PRCS jet combinations and corresponding thrust durations. The resulting 'optimum' solution is presented based on trade studies between predicted capture success and integrated system loads. This paper then discusses the upgrades to the APAS math model associated with the new SRMS assisted undocking technique and reviews simulation results for various options investigated for either the active and passive separation of the ISS from the Orbiter.

Space Station Remote Manipulator System↗

In-Situ Detection of Process-Induced Porosity During Cure of Out-of-Autoclave Composites

Composite materials offer unique benefits in aerospace applications, including high strength-to-weight ratio, and are becoming increasingly used by industry manufacturers. Current manufacturing and processing methods can lead to defects in the composites, which are identified after fabrication using inspection methods. This study utilized a high-temperature ultrasonic inspection system to detect process-induced porosity in an out-of-autoclave (OOA) composite panel during cure. In order to perform ultrasonic scans in-situ during cure, the system needed to be able to operate at oven temperatures up to 200 °C. There are no commercially available ultrasonic scanning systems that can operate continuously at these temperatures, so an enclosure was fabricated to insulate the ultrasonic system in the curing oven. The enclosure housed a MISTRAS® motorized X-Y raster scanner and contact transducer (Olympus® X2002). The Olympus® X2002 contact transducer is a continuous high-temperature delay line transducer with a center frequency of 2.25 MHz. In order to prevent the inside of the enclosure from reaching high temperatures, a sparge pipe inside the cooling enclosure was connected to a liquid nitrogen (LN2) tank outside of the oven via insulated hoses. The cooling system was automatically controlled by a temperature controller that was programmed to open a solenoid valve along the hose at 31 ℃ and close at 28 ℃ inside the cooling enclosure. When the solenoid valve was open, LN2 would flow from the LN2 tank and vaporize prior to reaching cooling enclosure. A U-shaped sparge pipe had holes drilled along its length to uniformly introduce cold nitrogen gas into the cooling enclosure. This prevented the motors from ever reaching the maximum desired operating temperature of 38 ℃. In the bottom of the enclosure, the tool plate was placed with the composite facing the outside of the enclosure, exposing it to the temperatures of the oven. The tool plate was 63.5 mm thick borosilicate glass, which was chosen for its low ultrasonic attenuation and moderate thermal conductivity. A thin layer of ultrasonic couplant was placed on the tool plate. The transducer sent and received ultrasonic waves through the tool plate into the composite. A MISTRAS® Remote UT System performed all wave generation, analog to digital conversion, and data acquisition and processing. The transducer was connected directly to the Remote UT System via a high-temperature BNC cable (CD International, RG-316). Polyimide insulated copper wire was used to connect the scanner to a 2-axis motor drive, which was connected to the Remote UT System. The motor drive and Remote UT System were located outside the industrial oven. A diagram of the ultrasonic system is shown in Figure 1. Figure 1: Diagram of ultrasonic in-situ defect detection system. In this study, a porosity gradient was introduced into the carbon fiber reinforced polymer (CFRP) composite through a misfit of the part and caul plate. A 24-ply quasi-isotropic ([0/90, ±45]12S) composite panel was laid up using Newport® AS4C-M/NB321 out-of-autoclave (OOA) plain weave (PW) prepreg (42% resin content, 195 g/m2). The first 16 plies were 203 mm × 203 mm. Ply drops were incorporated into the panel by decreasing the length of plies 17-24. The sizes of each ply are included in Table 1. All plies were centered along their length (x-axis) creating a trapezoidal type cross-section. Table 1: Ply sizes Plies Length (mm) Width (mm) 1-16 203 203 17-18 102 203 19-20 85 203 21-22 68 203 23-24 51 203 A 15-5 stainless steel caul plate (Size: 203 × 203 × 1.2 mm) was placed on the laminate. The composite and caul plate were vacuum bagged to the tool plate. Per the product datasheet, Newport 321 can be cured between 121 °C and 149 °C, depending on service temperature, with a hold for 90-120 minutes. Based on prior thermal testing of the cooling enclosure, the desired composite temperature cycle could be attained when the air temperature of the oven was ramped to 160 °C at a rate of 1.7 °C/min with a 3 hour hold. The extended hold was not necessary to cure the composite, but did allow for additional scans at the cure temperature during preliminary testing. The composite panel was under vacuum pressure for the entire cure cycle. Under vacuum, the caul plate deformed causing high and low pressure regions. The low-pressure regions formed high porosity in the composite part. The ultrasonic data collected showed that the inspection system was able to monitor the evolution of porosity within the composite throughout the cure cycle. Fifty scans of a 203 mm × 51 mm (8 in. × 2 in.) area of the composite were completed throughout the cure cycle. The scan speed was set to 43 mm/s in the x-direction and 36 mm/s in the y-direction, with a 1.0 mm/pixel resolution in both directions. Each scan took approximately five minutes to complete. Figure 2 shows C-scan amplitude data (top view) from one scan during the cure cycle. The color map indicates the maximum amplitude (%) measured with a time gate that contains reflections from the back surface (furthest from the transducer in contact with the caul plate) of the composite. Because porosity in the composite increases the ultrasonic attenuation in the composite part, a higher amplitude (red) indicates low porosity and a lower amplitude (blue) indicates high porosity. The regions where the caul plate was applying increased pressure (center and ends of the panel) resulted in reduced porosity, whereas the ply drop regions had reduced pressure and thus had higher porosity. Figure 2: Amplitude C-scan (top view) of OOA composite from one scan during the 160 °C temperature hold. Higher amplitude (red) indicates low porosity. Lower amplitude (blue) indicates high porosity. A B-scan is a two-dimensional image plotting the ultrasonic signals from a single y-position at every x-location of the composite panel. The travel time (μs) of the ultrasonic wave (representing the through-thickness location) is plotted along the y-axis, and the ultrasonic wave signal is represented as a contour map. Based on the B-scan data, the location of the defects with respect to the composite thickness was able to be determined. The ply drop regions had high porosity near the front (tool plate) surface of the composite (Figure 3). Figure 3: B-scan (cross-section view) of OOA composite from one scan during the 160 °C temperature hold. Using the data obtained from amplitude C-scans and B-scans throughout the cure cycle, the high and low porosity regions within the composite laminate were detected and localized with high spatial resolution. This paper will discuss the evolution of porosity content in the OOA composite during cure. OOA tests aided the transition of this system to an autoclave, which is the primary method of curing aerospace-grade thermoset composites.

Tyler B. Hudson↗

Thin silicon solar cell performance characteristics

Refined techniques for surface texturizing, back surface field and back surface reflector formation were evaluated for use with shallow junction, single-crystal silicon solar cells. Each process was characterized individually and collectively as a function of device thickness and bulk resistivity. Among the variables measured and reported are open circuit voltage, short circuit current and spectral response. Substantial improvements were obtained by the utilization of a low cost aluminum paste process to simultaneously remove the unwanted n(+) diffused region, form the back surface field and produce an ohmic contact metallization. The highly effective BSF which results from applying this process has allowed fabrication of cells 0.05 mm thick with initial outputs as high as 79.5 mW/4 sq cm (28 C, AM0) and superior electron radiation tolerance. Cells of 0.02 mm to 0.04 mm thickness have been fabricated with power to mass ratios well in excess of 2 watts per gram.

Gay, C. F.↗

Design requirements for high-efficiency high concentration ratio space solar cells

A miniaturized Cassegrainian concentrator system concept was developed for low cost, multikilowatt space solar arrays. The system imposes some requirements on solar cells which are new and different from those imposed for conventional applications. The solar cells require a circular active area of approximately 4 mm in diameter. High reliability contacts are required on both front and back surfaces. The back area must be metallurgically bonded to a heat sink. The cell should be designed to achieve the highest practical efficiency at 100 AMO suns and at 80 C. The cell design must minimize losses due to nonuniform illumination intensity and nonnormal light incidence. The primary radiation concern is the omnidirectional proton environment.

Rauschenbach, H.↗

High temperature flexible seal

This device is concerned with sealing the sliding interfaces between structural panels that are roughly perpendicular to each other or whose edges are butted against one another. The gap which the seal element must seal is not uniform along the seal length requiring significant seal flexibility. The seal is mounted in a rectangular groove in a moveable structural panel. The seal comprises a plurality of rectangular shaped wafers stacked next to one another and preloaded in the axial direction to minimize leakage between wafers. The wafers are laterally preloaded to maintain sealing contact along the wafer faces which engage the adjacent wall of a sidewall using one of several approaches, such as the pressurized linear bellows. The seal accommodates distortions in the adjacent panel by relative sliding between adjacent wafers. Leakage between wafers is further minimized with good wafer surface finishes. Leakage between the seal nose and the adjacent structural panel is minimized when sealing against a distorted sidewall with relatively thin wafers and suitable seal preload apparatus. Leakage behind the seal is minimized with good groove tolerances and good sealing contact between the preload system and the back of the peripheral edge of the wafers.

Steinetz, Bruce M.↗

Preliminary Test Results of a Non-Contacting Finger Seal on a Herringbone-Grooved Rotor

The baseline non-contacting finger seal is a NASA patented design. The primary difference between it and Gul Aroras design patented by AlliedSignal is that there are no lift pads on the high pressure fingers. The baseline non-contacting finger seal is comprised of a back plate, aft spacer, aft (or low pressure) finger element, forward (or high pressure) finger element, forward spacer, and front plate. The components are held together with 20 flat head screws. A typical seal would have a back plate of approximately the same thickness as the front plate and would be riveted together. The thicker back plate allows use of threaded fasteners so that different finger elements can be tested without having to replace all the individual seal components. The finger elements are essentially washers made of thin sheet stock with multiple curved slots machined around the inner diameter to form the fingers. They are clocked so that the fingers of one cover the slots of the other. The aft finger element fingers have axial extensions or "lift pads" at the seal id that are concentric to the rotor. The fingers act as cantilever beams and flex in response to rotor dynamic motion and radial growth of the rotor due to centrifugal or thermal forces.

Proctor, Margaret P.↗

Simplified fabrication of back surface electric field silicon cells and novel characteristics of such cells

An investigation of the characteristics and behavior of 10 ohm-cm silicon cells having abnormally high open-circuit voltages was made. The cells studied were made by a new, highly simplified, contact fabrication process which creates both a contact and a thin electric field region at the cell back surface without the need for phosphorus layer removal. These cells had open-circuit voltages of about 0.58 V and their performance as a function of thickness, temperature, and 1 MeV electron irradiation is detailed. The study showed that 10 ohm-cm back-surface-field cells can have the high initial efficiencies and desirable temperature behavior of low resistivity cells. Thin back-surface-field cells were made and showed, in addition, much greater radiation damage resistance. A mechanism is proposed to explain the results.

Mandelkorn, J.↗

Simplified fabrication of back surface electric field silicon cells and novel characteristics of such cells.

An investigation of the characteristics and behavior of 10 ohm-cm silicon cells having abnormally high open-circuit voltages was made. The cells studied were made by a new, highly simplified, contact fabrication process which creates both a contact and a thin electric field region at the cell back surface without the need for phosphorus layer removal. These cells had open-circuit voltages of about 0.58 V and their performance as a function of thickness, temperature, and 1 MeV electron irradiation is detailed. The study showed that 10 ohm-cm back-surface-field cells can have the high initial efficiencies and desirable temperature behavior of low resistivity cells. Thin back-surface-field cells were made and showed, in addition, much greater radiation damage resistance. A mechanism is proposed to explain the results.

Mandelkorn, J.↗

Tribometer for Lubrication Studies in Vacuum

The NASA Lewis Research Center has developed a new way to evaluate the liquid lubricants used in ball bearings in space mechanisms. For this evaluation, a liquid lubricant is exercised in the rolling contact vacuum tribometer shown in the photo. This tribometer, which is essentially a thrust bearing with three balls and flat races, has contact stresses similar to those in a typical preloaded, angular contact ball bearing. The rotating top plate drives the balls in an outward-winding spiral orbit instead of a circular path. Upon contact with the "guide plate," the balls are forced back to their initial smaller orbit radius; they then repeat this spiral orbit thousands of times. The orbit rate of the balls is low enough, 2 to 5 rpm, to allow the system to operate in the boundary lubrication regime that is most stressful to the liquid lubricant. This system can determine the friction coefficient, lubricant lifetime, and species evolved from the liquid lubricant by tribodegradation. The lifetime of the lubricant charge is only few micrograms, which is "used up" by degradation during rolling. The friction increases when the lubricant is exhausted. The species evolved by the degrading lubricant are determined by a quadrupole residual gas analyzer that directly views the rotating elements. The flat races (plates) and 0.5-in.-diameter balls are of a configuration and size that permit easy post-test examination by optical and electron microscopy and the full suite of modern surface and thin-film chemical analytical techniques, including infrared and Raman microspectroscopy and x-ray photoelectron spectroscopy. In addition, the simple sphere-on-a-flat-plate geometry allows an easy analysis of the contact stresses at all parts of the ball orbit and an understanding of the frictional energy losses to the lubricant. The analysis showed that when the ball contacts the guide plate, gross sliding occurs between the ball and rotating upper plate as the ball forced back to a smaller orbit radius. The friction force due to gross sliding is sensed by the piezoelectric force transducer behind the guide plate and furnishes the coefficient of friction for the system. This tribometer has been used to determine the relative lifetimes of Fomblin Z-25, a lubricant often used in space mechanisms, as a function of the material of the plates against which it was run. The balls were 440C steel in all cases; the plate materials were aluminum, chromium (Cr), 440C steel (17 wt % Cr), and 4150 steel (1 wt % Cr). As shown in the bar graph, the lifetime is greatest for the plate material with least chromium, thus implicating chromium as a tribochemically active element attacking Fomblin Z-25.

Pepper, Stephen V.↗

MOD silver metallization for photovoltaics

Photovoltaic cells require back side metallization and a collector grid system on the front surface. Both front and back surface metallizations should have good adhesion, low contact resistance, low sheet resistance, long term stability, and their deposition methods should not degrade the n-p junction. Advantages and disadvantages of different deposition methods are discussed.

Vest, G. M.↗

Mass spectra of neutral particles released during electrical breakdown of thin polymer films

A special type of time-of-flight mass spectrometer triggered from the breakdown event was developed to study the composition of the neutral particle flux released during the electrical breakdown of polymer films problem. Charge is fed onto a metal-backed polymer surface by a movable smooth platinum contact. A slowly increasing potential from a high-impedance source is applied to the contact until breakdown occurs. The breakdown characteristics is made similar to those produced by an electron beam charging system operating at similar potentials. The apparatus showed that intense instantaneous fluxes of neutral particles are released from the sites of breakdown events. For Teflon FEP films of 50 and 75 microns thickness the material released consists almost entirely of fluorocarbon fragments, some of them having masses greater than 350 atomic mass units amu, while the material released from a 50 micron Kapton film consists mainly of light hydrocarbons with masses at or below 44 amu, with additional carbon monoxide and carbon dioxide. The apparatus is modified to allow electron beam charging of the samples.

Kendall, B. R. F.↗

Connector contact-ring bus

Use of device eliminates crimp connectors and ferrules, resulting in compact termination assembly and efficient use of back-shell space. Pair of insulator rings, one at each end of assembly, provides spacing between disc caps and contact rings.

Ligon, J.↗

Results of the first 150 days of the NTS-1 solar cell experiments

Twelve solar cell experiments were on the Naval Research Laboratory NTS-1 satellite launched on 14 July 1974, into a 13,260 km circular orbit at an inclination of 125 deg. The experiment comprises: 2 ohm-cm n/p, lithium-diffused p/n, violet n/p, p(+) back surface field, and ultra-thin wrap around contact cells. The short-circuit current of the experiments ranged from 2 to 12 percent higher in space than under solar simulators. During the 5 year life of the satellite, the experiments will be exposed to radiation equivalent to 2 x 10 to the 15th power 1-MeV electron cm/2 and to nearly 5500 thermal cycles.

Statler, R. L.↗

Precise positioning and compliance synthesis for automatic assembly using Lorentz levitation

Many manufacturing assembly tasks require fine compliant motion and fast, accurate positioning. Conventional robots perform poorly in these tasks because of their large mass, friction and backlash in gears, cogging in drive motors and other deleterious effects. Even robots equipped with special control systems enabling compliant operation offer only partial solutions. It is difficult or impossible to automate many product assemblies requiring fine, compliant motion. This problem can be greatly alleviated by dividing the manipulation system into coarse and fine domains. In this scenario, a standard industrial robot can serve as a coarse positioner which in turn carries a six degrees of freedom fine motion wrist. Thus the robot can access a workspace measured in meters at low bandwidth and low resolution while the wrist can move over millimeters at high bandwidth and high resolution during the final phase of the assembly operation. Work indicates that fine motion wrists using Lorentz levitation can greatly augment the accuracy and dexterity of robots because they are frictionless, have high bandwidths and have a single back drivable moving part. Also, since there is no contact between the moving and stationary parts, wear and contamination can be eliminated. The use of six Lorentz force actuators in combination with real time position and orientation sensing offers several important advantages over magnetic bearing approaches.

Hollis, R. L.↗

Foam Core Shielding for Spacecraft

A foam core shield (FCS) system is now being developed to supplant multilayer insulation (MLI) systems heretofore installed on spacecraft for thermal management and protection against meteoroid impacts. A typical FCS system consists of a core sandwiched between a face sheet and a back sheet. The core can consist of any of a variety of low-to-medium-density polymeric or inorganic foams chosen to satisfy application-specific requirements regarding heat transfer and temperature. The face sheet serves to shock and thereby shatter incident meteoroids, and is coated on its outer surface to optimize its absorptance and emittance for regulation of temperature. The back sheet can be dimpled to minimize undesired thermal contact with the underlying spacecraft component and can be metallized on the surface facing the component to optimize its absorptance and emittance. The FCS systems can perform better than do MLI systems, at lower mass and lower cost and with greater volumetric efficiency.

Adams, Marc↗

Large area low-cost space solar cell development

A development program to produce 5.9 x 5.9 cm space quality silicon solar cells with a cost goal of 30 $/W is described. Cell types investigated include wraparound dielectric, mechanical wraparound and conventional contact configurations with combinations of 2 or 10 ohm/cm resistivity, back surface reflectors and/or fields, and diffused or ion implanted junctions. A single step process to cut cell and cover glass simultaneously is being developed. Results for cell and array tests are given. Large solar arrays that might use cells of this type are discussed.

Barona, C. R.↗