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At least 127 records · Page 7
All sourcesNASA NTRSDOE OSTI
NASA NTRS2005

Step 1: C3 Flight Demo Data Analysis Plan

The Data Analysis Plan (DAP) describes the data analysis that the C3 Work Package (WP) will perform in support of the Access 5 Step 1 C3 flight demonstration objectives as well as the processes that will be used by the Flight IPT to gather and distribute the data collected to satisfy those objectives. In addition to C3 requirements, this document will encompass some Human Systems Interface (HSI) requirements in performing the C3 flight demonstrations. The C3 DAP will be used as the primary interface requirements document between the C3 Work Package and Flight Test organizations (Flight IPT and Non-Access 5 Flight Programs). In addition to providing data requirements for Access 5 flight test (piggyback technology demonstration flights, dedicated C3 technology demonstration flights, and Airspace Operations Demonstration flights), the C3 DAP will be used to request flight data from Non- Access 5 flight programs for C3 related data products

Source record↗
NASA NTRS1992

Quartz/fused silica chip carriers

The primary objective of this research and development effort was to develop monolithic microwave integrated circuit (MMIC) packaging which will operate efficiently at millimeter-wave frequencies. The packages incorporated fused silica as the substrate material which was selected due to its favorable electrical properties and potential performance improvement over more conventional materials for Ka-band operation. The first step towards meeting this objective is to develop a package that meets standard mechanical and thermal requirements using fused silica and to be compatible with semiconductor devices operating up to at least 44 GHz. The second step is to modify the package design and add multilayer and multicavity capacity to allow for application specific integrated circuits (ASIC's) to control multiple phase shifters. The final step is to adapt the package design to a phased array module with integral radiating elements. The first task was a continuation of the SBIR Phase 1 work. Phase 1 identified fused silica as a viable substrate material by demonstrating various plating, machining, and adhesion properties. In Phase 2 Task 1, a package was designed and fabricated to validate these findings. Task 2 was to take the next step in packaging and fabricate a multilayer, multichip module (MCM). This package is the predecessor to the phased array module and demonstrates the ability to via fill, circuit print, laminate, and to form vertical interconnects. The final task was to build a phased array module. The radiating elements were to be incorporated into the package instead of connecting to it with wire or ribbon bonds.

Source record↗
NASA NTRS1999

Development Unit Configuration and Current Status of the MIP/MTERC Experiment

The Mars In-Situ Propellant Production (ISPP) Precursor (MIP) experiment package is planned for inclusion on the Mars 2001 Lander. This experiment package consists of five experiments whose purpose is to demonstrate the performance of various ISPP processes in-situ on Mars. The demonstrated ability to produce propellant for Mars Return Vehicles (MRV) is considered to be a necessary precursor to any future manned mission to Mars. The Mars Thermal Environment/Radiator Characterization (MTERC) experiment is part of the MIP package and is intended to determine the Mars night sky temperature as well as to characterize the performance degradation of radiators caused by environmental exposure on Mars over time. Radiators are needed as part of the ISPP process to remove heat from the Mars Atmosphere Acquisition and Compression (MAAC) CO2 sorption compressor. MTERC will provide the data needed to optimize the design of radiators for ISPP and other processes. A MTERC Development Unit (DU) has been fabricated and tested at JPL. The MTERC DU consists of 1) a radiator subassembly, 2) a motor/cover subassembly, 3) a differential temperature control circuit and motor control electronics circuit board, and 4) a command and data handling electronics circuit board. This paper will describe the operational theory and the configuration of the MTERC DU and will discuss the current status of the MTERC experiment development including some selected results of performance testing that has been completed prior to the ISRU III meeting.

Juanero, K. J.↗
NASA NTRS1999

Development Unit Configuration and Current Status of the MIP/MTERC Experiment

The Mars In-Situ Propellant Production (ISPP) Precursor (MIP) experiment package is planned for inclusion on the Mars 2001 Lander. This experiment package consists of five experiments whose purpose is to demonstrate the performance of various ISPP processes in-situ on Mars. The demonstrated ability to produce propellant for Mars Return Vehicles (MRV) is considered to be a necessary precursor to any future manned mission to Mars. The Mars Thermal Environment/Radiator Characterization (MTERC) experiment is part of the MIP package and is intended to determine the Mars night sky temperature as well as to characterize the performance degradation of radiators caused by environmental exposure on Mars over time. Radiators are needed as part of the ISPP process to remove heat from the Mars Atmosphere Acquisition and Compression (MAAC) C02 sorption compressor. MTERC will provide the data needed to optimize the design of radiators for ISPP and other processes. A MTERC Development Unit (DU) has been fabricated and tested at JPL. The MTERC DU consists of: (1) a radiator subassembly, (2) a motor/cover subassembly, (3) a differential temperature control circuit and motor control electronics circuit board, and (4) a command and data handling electronics circuit board. This paper will describe the operational theory and the configuration of the MTERC DU and will discuss the current status of the MTERC experiment development including some selected results of performance testing that has been completed prior to the ISRU III meeting.

Juanero, K. J.↗
NASA NTRS1956

Free-Spinning and Recovery Characteristics of a 1/19-Scale Model of the North American T-28C Airplane, TED No. NACA AD 3127

An investigation has been conducted in the Langley 20-foot free-spinning tunnel on a l/19-scale model of the North American T-28C airplane to determine the spin and recovery characteristics. The T-28C airplane is similar to the T-28B airplane except for slight modifications for the arresting hook. The lower rear section of the fuselage was cut out and, consequently, the lower part of the rudder was removed to make a smooth fairing with the fuselage. The T-28B airplane had good recovery characteristics; but these modifications, along with the addition of gun packages on the wings, led to poor and unsatisfactory spin-recovery characteristics during demonstration spins of the T-28C airplane. Model test results indicated that without the gun packages installed, satisfactory recoveries could be obtained if the elevators were held full back while the rudder was fully reversed and the ailerons were held neutral. However, with the addition of gun packages to the wings and the corresponding change in loading, recoveries were considered unsatisfactory. Recoveries attempted by using a larger chord or larger span rudder were improved very slightly, but were still considered marginal or unsatisfactory. Strakes placed on the nose of the model were effective in slowing the spin rotation slightly and, in most instances, decreased the turns for recovery slightly. Recovery characteristics were slightly marginal for the full fuel loading when strakes and the extended-chord rudder were installed; but with the wing fuel partly used, recovery characteristics were again considered unsatisfactory or, at least, definitely on the marginal side. The optimum control technique for recovery is movement of the rudder to full against the spin with the stick held full back (elevators full up) and the ailerons held neutral, followed by forward movement of the stick only after the spin rotation ceases. Inverted-spin test results indicate that the airplane will spin steep and fast and that recovery by full rudder reversal will be satisfactory if the ailerons are held neutral.

Bowman, James S., Jr.↗
NASA NTRS2012

Alumina Based 500 C Electronic Packaging Systems and Future Development

NASA space and aeronautical missions for probing the inner solar planets as well as for in situ monitoring and control of next-generation aeronautical engines require high-temperature environment operable sensors and electronics. A 96% aluminum oxide and Au thick-film metallization based packaging system including chip-level packages, printed circuit board, and edge-connector is in development for high temperature SiC electronics. An electronic packaging system based on this material system was successfully tested and demonstrated with SiC electronics at 500 C for over 10,000 hours in laboratory conditions previously. In addition to the tests in laboratory environments, this packaging system has more recently been tested with a SiC junction field effect transistor (JFET) on low earth orbit through the NASA Materials on the International Space Station Experiment 7 (MISSE7). A SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE7 suite to International Space Station via a Shuttle mission and tested on the orbit for eighteen months. A summary of results of tests in both laboratory and space environments will be presented. The future development of alumina based high temperature packaging using co-fired material systems for improved performance at high temperature and more feasible mass production will also be discussed.

Chen, Liang-Yu↗
NASA NTRS2003

Packaging Technology Designed, Fabricated, and Assembled for High-Temperature SiC Microsystems

A series of ceramic substrates and thick-film metalization-based prototype microsystem packages designed for silicon carbide (SiC) high-temperature microsystems have been developed for operation in 500 C harsh environments. These prototype packages were designed, fabricated, and assembled at the NASA Glenn Research Center. Both the electrical interconnection system and the die-attach scheme for this packaging system have been tested extensively at high temperatures. Printed circuit boards used to interconnect these chip-level packages and passive components also are being fabricated and tested. NASA space and aeronautical missions need harsh-environment, especially high-temperature, operable microsystems for probing the inner solar planets and for in situ monitoring and control of next-generation aeronautical engines. Various SiC high-temperature-operable microelectromechanical system (MEMS) sensors, actuators, and electronics have been demonstrated at temperatures as high as 600 C, but most of these devices were demonstrated only in the laboratory environment partially because systematic packaging technology for supporting these devices at temperatures of 500 C and beyond was not available. Thus, the development of a systematic high-temperature packaging technology is essential for both in situ testing and the commercialization of high-temperature SiC MEMS. Researchers at Glenn developed new prototype packages for high-temperature microsystems using ceramic substrates (aluminum nitride and 96- and 90-wt% aluminum oxides) and gold (Au) thick-film metalization. Packaging components, which include a thick-film metalization-based wirebond interconnection system and a low-electrical-resistance SiC die-attachment scheme, have been tested at temperatures up to 500 C. The interconnection system composed of Au thick-film printed wire and 1-mil Au wire bond was tested in 500 C oxidizing air with and without 50-mA direct current for over 5000 hr. The Au thick-film metalization-based wirebond electrical interconnection system was also tested in an extremely dynamic thermal environment to assess thermal reliability. The I-V curve1 of a SiC high-temperature diode was measured in oxidizing air at 500 C for 1000 hr to electrically test the Au thick-film material-based die-attach assembly.

Chen, Liang-Yu↗
NASA NTRS1972

Maintainability design criteria for packaging of spacecraft replaceable electronic equipment.

Maintainability must be designed into long-duration spacecraft and equipment to provide the required high probability of mission success with the least cost and weight. The ability to perform repairs quickly and easily in a space environment can be achieved by imposing specific maintainability design criteria on spacecraft equipment design and installation. A study was funded to investigate and define design criteria for electronic equipment that would permit rapid removal and replacement in a space environment. The results of the study are discussed together with subsequent simulated zero-g demonstration tests of a mockup with new concepts for packaging.

Kappler, J. R.↗
NASA NTRS2001

Experimental Verification of the Use of Metal Filled Via Hole Fences for Crosstalk Control of Microstrip Lines in LTCC Packages

Coupling between microstrip lines in dense RF packages is a common problem that degrades circuit performance. Prior three-dimensional-finite element method (3-D-FEM) electromagnetic simulations have shown that metal filled via hole fences between two adjacent microstrip lines actually Increases coupling between the lines: however, if the top of the via posts are connected by a metal strip, coupling is reduced. In this paper, experimental verification of the 3-D-FEM simulations is demonstrated for commercially fabricated low temperature cofired ceramic (LTCC) packages. In addition, measured attenuation of microstrip lines surrounded by the shielding structures is presented and shows that shielding structures do not change the attenuation characteristics of the line.

Ponchak, George E.↗
NASA NTRS1973

Small, high pressure ratio compressor: Aerodynamic and mechanical design

The Small, High-Pressure-Ratio Compressor Program was directed toward the analysis, design, and fabrication of a centrifugal compressor providing a 6:1 pressure ratio and an airflow rate of 2.0 pounds per second. The program consists of preliminary design, detailed areodynamic design, mechanical design, and mechanical acceptance tests. The preliminary design evaluate radial- and backward-curved blades, tandem bladed impellers, impeller-and diffuser-passage boundary-layer control, and vane, pipe, and multiple-stage diffusers. Based on this evaluation, a configuration was selected for detailed aerodynamic and mechanical design. Mechanical acceptance test was performed to demonstrate that mechanical design objectives of the research package were met.

Bryce, C. A.↗
NASA NTRS1978

Electrical Prototype Power Processor for the 30-cm Mercury electric propulsion engine

An Electrical Prototpye Power Processor has been designed to the latest electrical and performance requirements for a flight-type 30-cm ion engine and includes all the necessary power, command, telemetry and control interfaces for a typical electric propulsion subsystem. The power processor was configured into seven separate mechanical modules that would allow subassembly fabrication, test and integration into a complete power processor unit assembly. The conceptual mechanical packaging of the electrical prototype power processor unit demonstrated the relative location of power, high voltage and control electronic components to minimize electrical interactions and to provide adequate thermal control in a vacuum environment. Thermal control was accomplished with a heat pipe simulator attached to the base of the modules.

Biess, J. J.↗
NASA NTRS1990

Decentralized control experiments on the JPL flexible spacecraft

Decentralized control experiments were successfully demonstrated for the JPL/AFAL Flexible Structure. A simulation package using MATRIXx showed strong correlation between the simulations and experimental result, while providing a means for test and debug of the various control strategies. Implementation was simplified by a modular software design that was easily transported from the simulation environment to the experimental environment. Control designs worked well for suppression of the dominant modes of the structure. Static decentralized output feedback dampened the excited modes of the structure, but sometimes excited higher order modes upon startup of the controller. A second-order frequency shaping controller helped to eliminate excitation of the higher order modes by attenuating high frequencies in the control effort. However, it also resulted in slightly longer settling times.

Ozguner, U.↗
NASA NTRS1992

The 10 kW power electronics for hydrogen arcjets

A combination of emerging mission considerations such as 'launch on schedule', resource limitations, and the development of higher power spacecraft busses has resulted in renewed interest in high power hydrogen arcjet systems with specific impulses greater than 1000 s for Earth-space orbit transfer and maneuver applications. Solar electric propulsion systems with about 10 kW of power appear to offer payload benefits at acceptable trip times. This work outlines the design and development of 10 kW hydrogen arcjet power electronics and results of arcjet integration testing. The power electronics incorporated a full bridge switching topology similar to that employed in state of the art 5 kW power electronics, and the output filter included an output current averaging inductor with an integral pulse generation winding for arcjet ignition. Phase shifted, pulse width modulation with current mode control was used to regulate the current delivered to arcjet, and a low inductance power stage minimized switching transients. Hybrid power Metal Oxide Semiconductor Field Effect Transistors were used to minimize conduction losses. Switching losses were minimized using a fast response, optically isolated, totem-pole gate drive circuit. The input bus voltage for the unit was 150 V, with a maximum output voltage of 225 V. The switching frequency of 20 kHz was a compromise between mass savings and higher efficiency. Power conversion efficiencies in excess of 0.94 were demonstrated, along with steady state load current regulation of 1 percent. The power electronics were successfully integrated with a 10 kW laboratory hydrogen arcjet, and reliable, nondestructive starts and transitions to steady state operation were demonstrated. The estimated specific mass for a flight packaged unit was 2 kg/kW.

Hamley, John A.↗
NASA NTRSDate not supplied

Development of Aluminum Feedstock for Additive Manufacturing

The rapid evolution of materials science and manufacturing technologies in recent years has offered new pathways to manipulate materials for bespoke manufacturing. Here we aim to develop feedstocks for applications such as radiator panels, fuel tanks, and structural components for outfitting. As a strong, light weight and thermally conductive material aluminum is ideal for these applications. An often-overlooked source of aluminum waste is food packaging used on the International Space Station. Reusing this waste stream will reduce the cost and logistics of regular sparing. In Space Manufacturing (ISM) will utilize this technology is such areas as sparing and outfitting. However, processing aluminum can present challenges, especially in the context of additive manufacturing and sintering, due to its high reactivity and tendency to form a tenacious oxide layer. Identifying appropriate binders and sintering profiles can overcome these challenges. Herein we present our work on obtaining aluminum powder derived from food packaging, binder selection for aluminum feedstock, and a demonstration of bound metal deposition printing.

aluminum↗
NASA NTRS2004

MGGPOD: a Monte Carlo Suite for Modeling Instrumental Line and Continuum Backgrounds in Gamma-Ray Astronomy

Intense and complex instrumental backgrounds, against which the much smaller signals from celestial sources have to be discerned, are a notorious problem for low and intermediate energy gamma-ray astronomy (approximately 50 keV - 10 MeV). Therefore a detailed qualitative and quantitative understanding of instrumental line and continuum backgrounds is crucial for most stages of gamma-ray astronomy missions, ranging from the design and development of new instrumentation through performance prediction to data reduction. We have developed MGGPOD, a user-friendly suite of Monte Carlo codes built around the widely used GEANT (Version 3.21) package, to simulate ab initio the physical processes relevant for the production of instrumental backgrounds. These include the build-up and delayed decay of radioactive isotopes as well as the prompt de-excitation of excited nuclei, both of which give rise to a plethora of instrumental gamma-ray background lines in addition t o continuum backgrounds. The MGGPOD package and documentation are publicly available for download. We demonstrate the capabilities of the MGGPOD suite by modeling high resolution gamma-ray spectra recorded by the Transient Gamma-Ray Spectrometer (TGRS) on board Wind during 1995. The TGRS is a Ge spectrometer operating in the 40 keV to 8 MeV range. Due to its fine energy resolution, these spectra reveal the complex instrumental background in formidable detail, particularly the many prompt and delayed gamma-ray lines. We evaluate the successes and failures of the MGGPOD package in reproducing TGRS data, and provide identifications for the numerous instrumental lines.

Weidenspointner, G.↗
NASA NTRS1997

Construction of Prototype Lightweight Mirrors

This contract and the work described was in support of a Seven Segment Demonstrator (SSD) and demonstration of a different technology for construction of lightweight mirrors. The objectives of the SSD were to demonstrate functionality and performance of a seven segment prototype array of hexagonal mirrors and supporting electromechanical components which address design issues critical to space optics deployed in large space based telescopes for astronomy and for optics used in spaced based optical communications systems. The SSD was intended to demonstrate technologies which can support the following capabilities; Transportation in dense packaging to existing launcher payload envelopes, then deployable on orbit to form space telescope with large aperture. Provide very large (less than 10 meters) primary reflectors of low mass and cost. Demonstrate the capability to form a segmented primary or quaternary mirror into a quasi-continuous surface with individual subapertures phased so that near diffraction limited imaging in the visible wavelength region is achieved. Continuous compensation of optical wavefront due to perturbations caused by imperfections, natural disturbances, and equipment induced vibrations/deflections to provide near diffraction limited imaging performance in the visible wavelength region. Demonstrate the feasibility of fabricating such systems with reduced mass and cost compared to past approaches. While the SSD could not be expected to satisfy all of the above capabilities, the intent was to start identifying and understanding new technologies that might be applicable to these goals.

Robinson, William G.↗
NASA NTRS1997

Adaptive Full Aperture Wavefront Sensor Study

This grant and the work described was in support of a Seven Segment Demonstrator (SSD) and review of wavefront sensing techniques proposed by the Government and Contractors for the Next Generation Space Telescope (NGST) Program. A team developed the SSD concept. For completeness, some of the information included in this report has also been included in the final report of a follow-on contract (H-27657D) entitled "Construction of Prototype Lightweight Mirrors". The original purpose of this GTRI study was to investigate how various wavefront sensing techniques might be most effectively employed with large (greater than 10 meter) aperture space based telescopes used for commercial and scientific purposes. However, due to changes in the scope of the work performed on this grant and in light of the initial studies completed for the NGST program, only a portion of this report addresses wavefront sensing techniques. The wavefront sensing techniques proposed by the Government and Contractors for the NGST were summarized in proposals and briefing materials developed by three study teams including NASA Goddard Space Flight Center, TRW, and Lockheed-Martin. In this report, GTRI reviews these approaches and makes recommendations concerning the approaches. The objectives of the SSD were to demonstrate functionality and performance of a seven segment prototype array of hexagonal mirrors and supporting electromechanical components which address design issues critical to space optics deployed in large space based telescopes for astronomy and for optics used in spaced based optical communications systems. The SSD was intended to demonstrate technologies which can support the following capabilities: Transportation in dense packaging to existing launcher payload envelopes, then deployable on orbit to form a space telescope with large aperture. Provide very large (greater than 10 meters) primary reflectors of low mass and cost. Demonstrate the capability to form a segmented primary or quaternary mirror into a quasi-continuous surface with individual subapertures phased so that near diffraction limited imaging in the visible wavelength region is achieved. Continuous compensation of optical wavefront due to perturbations caused by imperfections, natural disturbances, and equipment induced vibrations/deflections to provide near diffraction limited imaging performance in the visible wavelength region. Demonstrate the feasibility of fabricating such systems with reduced mass and cost compared to past approaches.

Robinson, William G.↗
NASA NTRS2016

Experimental Durability Testing of 4H SiC JFET Integrated Circuit Technology at 727 Degrees Centigrade

We have reported SiC integrated circuits (ICs) with two levels of metal interconnect that have demonstrated prolonged operation for thousands of hours at their intended peak ambient operational temperature of 500 degrees Centigrade. However, it is recognized that testing of semiconductor microelectronics at temperatures above their designed operating envelope is vital to qualification. Towards this end, we previously reported operation of a 4H-SiC JFET IC ring oscillator on an initial fast thermal ramp test through 727 degrees Centigrade. However, this thermal ramp was not ended until a peak temperature of 880 degrees Centigrade (well beyond failure) was attained. Further experiments are necessary to better understand failure mechanisms and upper temperature limit of this extreme-temperature capable 4H-SiC IC technology.Here we report on additional experimental testing of custom-packaged 4H-SiC JFET IC devices at temperatures above 500 degrees Centigrade. In one test, the temperature was ramped and then held at 727 degrees Centigrade, and the devices were periodically measured until electrical failure was observed. A 4H-SiC JFET on this chip electrically functioned with little change for around 25 hours at 727 degrees Centigrade before rapid increases in device resistance caused failure. In a second test, devices from our next generation 4H-SiC JFET ICs were ramped up and then held at 700 degrees Centigrade (which is below the maximum deposition temperature of the dielectrics). Three ring oscillators functioned for 8 hours at this temperature before degradation. In a third experiment, an alternative die attach of gold paste and package lid was used, and logic circuit operation was demonstrated for 143.5 hours at 700 degrees Centigrade.

Silicon Carbide↗