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At least 127 records · Page 7

Investigation on Microstructure and Mechanical Properties of TA10–Q245R Composite Plate Formed by Explosive Welding

The titanium alloy TA10 and the carbon steel Q245R are welded by explosive welding, and post-weld heat treatment (PWHT) is carried out for the TA10–Q245R composite plate. Microstructure and mechanical properties of the composite plate are investigated both in as-welded (AW) condition and after PWHT, respectively. Results show that, in AW condition, the bonding interface of composite plate presents wavy morphology, and at both sides of the interface plastic deformation is generated to a certain degree. Near the interface interdiffusion zone of alloying elements exists, and no Fe-Ti intermetallic compound is produced at the interface. SEM images indicate that the tensile fracture of composite plate presents the characteristic of ductile fracture, and no defects such as gas pores or impurities are found on the surface of shear fracture. After PWHT, the interfacial microstructure of the composite plate is obviously changed. Compared with the mechanical properties of the composite plate in AW condition, both tensile strength and shear strength of the composite plate are decreased to a certain extent after PWHT. With various factors into consideration, the suitable heat treatment procedure of TA10–Q245R composite plate is determined as follows: 550 °C × 1.5 h.

36 MATERIALS SCIENCE↗

Sensitivity and reliability of key electrochemical markers for detecting lithium plating during extreme fast charging

Lithium plating is one of the key challenges for enabling extreme fast charging (XFC, ≤10 to 15 min charging at ≥6C) in graphite-based lithium-ion batteries. Significant R&D effort has been focused on how to mitigate Li plating. Parallel effort is also being devoted to developing methods to detect Li plating when and if it happens during fast charging. In that regard, electrochemical (EC) signature-based detection techniques are less resource intensive, more convenient, and more practical from an end-user application perspective. However, a comprehensive understanding of key plating related EC signatures for extreme fast charging is presently unavailable. In particular, there exist distinct issues of unreliability with key plating-related EC signatures—e.g., incremental capacity (dQ.dV -1 ), differential OCV (dOCV.dt -1 ), end of lithiation (EOL) rest voltage—at XFC conditions, and the underlying reasons have not been explored and identified methodically. Using a comprehensive test matrix and XFC conditions with Li/graphite half cells, this article highlights the unreliability issues associated with the EC Li plating diagnostics and explains the underlying root cause. This study finds distinct sensitivity and unreliability issues with plating related dQ.dV -1 , dOCV.dt -1 , and EOL rest voltage signatures with charging rates. Furthermore, the complex interaction between graphite and plated Li that happens through multiple competing mechanisms —Li stripping and chemical intercalation— at different charging rates is at the core of the sensitivity and unreliability issue.

25 ENERGY STORAGE↗

Ultra-low thermal resistance and pressure drop copper and copper-tungsten diamond-shaped pin fin cold plates for liquid cooling of electronics

Modern and future data centers face increasing cooling challenges due to increasing chip thermal design power and die size, along with the need to reduce energy consumption used for cooling. High performance cooling solutions that maintain a low chip junction temperature are needed to ensure electronics reliability. This work develops an ultra-low thermal resistance and low pressure drop 75 mm × 75 mm cold plate, intended for next-generation electronics cooling. The cold plate features an array of diamond-shaped pin fins and integrated copper tungsten heat spreader, selected for its low coefficient of thermal expansion which reduces thermomechanical deformation and allows for closer integration of the cold plate with silicon dies. Starting with 300 candidate designs, three-dimensional computational fluid dynamics simulations predict the thermal-hydraulic performance of cold plate subsections. The highest performing geometries are evaluated with high fidelity simulations. Four cold plates are manufactured for experiments: three with diamond-shaped pin fins and one with straights fins for comparison purposes. The cold plates are fabricated from copper-tungsten (CuW), copper (Cu), or aluminum-silicon-magnesium alloy (AlSi10Mg). The diamond-shaped pin fins achieve a roughly 15 % lower thermal resistance compared to the conventional straight fin microchannel. The highest performing design achieves a chip-to-coolant (including thermal interface material) thermal resistance of 9.0 K/kW in CuW and 6.9 K/kW in Cu under a 1 kW heat load with an inlet-to-outlet pressure drop of 9.0 kPa and water as the working fluid. This work demonstrates ultra-low thermal resistance and pressure drop cold plates for large die, high heat load applications, and shows that CuW is an attractive cold plate material for improved reliability in next generation data center cooling.

Coefficient of thermal expansion↗

Non-model-based damage identification of plates using principal, mean and Gaussian curvature mode shapes

Mode shapes (MSs) have been extensively used to identify structural damage. This paper presents a new non-model-based method that uses principal, mean and Gaussian curvature MSs (CMSs) to identify damage in plates; the method is applicable and robust to MSs associated with low and high elastic modes on dense and coarse measurement grids. A multi-scale discrete differential-geometry scheme is proposed to calculate principal, mean and Gaussian CMSs associated with a MS of a plate, which can alleviate adverse effects of measurement noise on calculating the CMSs. Principal, mean and Gaussian CMSs of a damaged plate and those of an undamaged one are used to yield four curvature damage indices (CDIs), including Maximum-CDIs, Minimum-CDIs, Mean-CDIs and Gaussian-CDIs. Damage can be identified near regions with consistently higher values of the CDIs. It is shown that a MS of an undamaged plate can be well approximated using a polynomial with a properly determined order that fits a MS of a damaged one, provided that the undamaged plate has a smooth geometry and is made of material that has no stiffness and mass discontinuities. New fitting and convergence indices are proposed to quantify the level of approximation of a MS from a polynomial fit to that of a damaged plate and to determine the proper order of the polynomial fit, respectively. A MS of an aluminum plate with damage in the form of a machined thickness reduction area was measured to experimentally investigate the effectiveness of the proposed CDIs in damage identification; the damage on the plate was successfully identified.

42 ENGINEERING↗

General analytical approach for sound transmission loss analysis through a thick metamaterial plate

We report theoretically and numerically on the sound transmission loss performance through a thick plate-type acoustic metamaterial made of spring-mass resonators attached to the surface of a homogeneous elastic plate. Two general analytical approaches based on plane wave expansion were developed to calculate both the sound transmission loss through the metamaterial plate (thick and thin) and its band structure. The first one can be applied to thick plate systems to study the sound transmission for any normal or oblique incident sound pressure. The second approach gives the metamaterial dispersion behavior to describe the vibrational motions of the plate, which helps to understand the physics behind sound radiation through air by the structure. Computed results show that high sound transmission loss up to 72 dB at 2 kHz is reached with a thick metamaterial plate while only 23 dB can be obtained for a simple homogeneous plate with the same thickness. Such plate-type acoustic metamaterial can be a very effective solution for high performance sound insulation and structural vibration shielding in the very low-frequency range.

71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSIC↗

Microstructure Scale Lithium-Ion Battery Modeling: Part III. When and Where Lithium Plating Occurs and its Correlation with the Electrode Microstructure

Li-ion battery performance and degradation are closely related to the cell’s underlying electrode microstructure. Electrode microstructures are typically characterized with volume-averaged properties that neglect the impact of local heterogeneities. However, local heterogeneities create hot spots that can trigger degradation onset. Herein, a microstructure scale electrochemical model is used to investigate the impact of microstructure heterogeneity on lithium plating. The model predicts lithium plating is not uniform, even when considering a relatively small portion of the electrode (a cross-sectional area of 154×144 µm 2 ), preferring to plate on larger particles as compared to smaller particles. While local heterogeneities control where plating occurs, the model predicts that volume-averaged properties control when plating occurs. Additionally, the model predicts that the active material specific surface area has a linear relationship with the plating onset. However, the linear relationship between increased active material surface area and delayed plating response appears to be sensitive to the microstructure feature used to increase the active interface area. Here, a comparative case-study is explored where the specific surface area is increased by either reducing the active material particle diameter, adding open-porosity cracks, or increasing the active material surface roughness. The model predicts that increasing the specific surface area by reducing the active material particle diameter is the most effective strategy for delaying lithium plating. At 6C, reducing particle size is shown to be 3 and 20 times more effective than, respectively, adding open-porosity cracks and increasing surface roughness. A dual-layer electrode architecture combining gradations both for average properties and uniformities is eventually proposed to improve homogeneous material utilization and reduce degradation at high charge rates.

25 ENERGY STORAGE↗

Investigation of Lithium Plating-Stripping Process in Li-Ion Batteries at Low Temperature Using an Electrochemical Model

Lithium plating leads to severe capacity fading and possible safety problems in lithium-ion batteries. Thus, non-destructive detection methods for lithium plating are critical for safe and reliable operation of lithium-ion batteries. In this paper, an electrochemical model incorporated with lithium plating and stripping reactions is established to investigate the lithium plating-stripping process at low temperature. The model is validated at different current rates and temperatures and can successfully predict the characteristic voltage plateau during the rest period after low temperature charging. Modeling analysis helps to develop detection method for lithium plating via differential analysis on the voltage plateau. Distinct local minima can be found in the differential voltage curves of the batteries with plated lithium. The time when the local minima occurs in the differential voltage curves exhibits a linear relationship with the amount of reversible lithium, and thus can be applied as a quantitative indicator for detection of lithium plating. The detection of lithium plating based on differential voltage analysis is further extended to the discharge voltage profiles of the batteries after low temperature charging, considering the effects of rest time.

25 ENERGY STORAGE↗

Mechano-growth factor protects against mechanical overload induced damage and promotes migration of growth plate chondrocytes through RhoA/YAP pathway

Highlights: • Cyclic mechanical stress induces MGF expression and MGF protects against mechanical overload induced apoptosis and inflammation. • MGF regulates YAP activation to induce chondrocytes migration via RhoA. • MGF promotes focal adhesion formation via RhoA-YAP pathway. Epiphyseal growth plate is highly dynamic tissue which is controlled by a variety of endocrine, paracrine hormones, and by complex local signaling loops and mechanical loading. Mechano growth factor (MGF), the splice variant of the IGF-I gene, has been discovered to play important roles in tissue growth and repair. However, the effect of MGF on the growth plate remains unclear. In the present study, we found that MGF mRNA expression of growth plate chondrocytes was upregulated in response to mechanical stimuli. Treatment of MGF had no effect on growth plate chondrocytes proliferation and differentiation. But it could inhibit growth plate chondrocytes apoptosis and inflammation under mechanical overload. Moreover, both wound healing and transwell assay indicated that MGF could significantly enhance growth plate chondrocytes migration which was accompanied with YAP activation and nucleus translocation. Knockdown of YAP with YAP siRNA suppressed migration induced by MGF, indicating the essential role of YAP in MGF promoting growth plate chondrocytes migration. Furthermore, MGF promoted YAP activation through RhoA GTPase mediated cytoskeleton reorganization, RhoA inhibition using C3 toxin abrogated MGF induced YAP activation. Importantly, we found that MGF promoted focal adhesion(FA) formation and knockdown of YAP with YAP siRNA partially suppressed the activation of FA kinase, implying that YAP is associated with FA formation. In conclusion, MGF is an autocrine growth factor which is regulated by mechanical stimuli. MGF could not only protect growth plate chondrocytes against damage by mechanical overload, but also promote migration through activation of RhoA/YAP signaling axis. Most importantly, our findings indicate that MGF promote cell migration through YAP mediated FA formation to determine the FA-cytoskeleton remodeling.

60 APPLIED LIFE SCIENCES↗

Quantification of heterogeneous, irreversible lithium plating in extreme fast charging of lithium-ion batteries

Realization of extreme fast charging (XFC, ≤15 minutes) of lithium-ion batteries is imperative for the widespread adoption of electric vehicles. However, dramatic capacity fading is associated with XFC, limiting its implementation. To quantitatively elucidate the effects of irreversible lithium plating and other degradation mechanisms on the cell capacity, it is important to understand the links between lithium plating and cell degradation at both the local and global (over the full cell) scales. Here, we study the nature of local lithium plating after hundreds of XFC cycles (charging C-rates ranging from 4C to 9C) in industrially-relevant pouch cells using spatially resolved X-ray diffraction. Our results reveal a spatial correlation at the mm scale between irreversible lithium plating on the anode, inactive lithiated graphite phases, and local state-of-charge of the cathode. In regions of plated lithium, additional lithium is locally and irreversibly trapped as lithiated graphite, contributing to the loss of lithium inventory (LLI) and to a local loss of active anode material. The total LLI in the cell from irreversibly plated lithium is linearly correlated to the capacity loss in the batteries after XFC cycling, with a non-zero offset originating from other parasitic side reactions. Finally, at the global (cell) scale, LLI drives the capacity fade, rather than electrode degradation. We anticipate that the understanding of lithium plating and other degradation mechanisms during XFC gained in this work will help lead to new approaches towards designing high-rate batteries in which irreversible lithium plating is minimized.

25 ENERGY STORAGE↗

Interplay of intercalation dynamics and lithium plating in monolithic and architectured graphite anodes during fast charging

Fast charging of high-capacity anodes is challenging due to lithium plating reactions, which lead to poor cycling performance and safety concerns. Thus, accurate predictions of plating onset and an understanding of this electrochemical process are crucial for robust battery design. However, the most commonly used models, based on porous electrode theory (e.g., the pseudo-2D model), are notoriously difficult to calibrate due to their complexity, limiting their predictive power. This work studies the process of lithium plating during fast charging of (small-particle) graphite half-cells by measuring local reaction progression and plating behavior using optical operando techniques. These experiments employ a realistic 1D graphite electrode geometry with commercially-relevant mass loading charged at fast charge rates. It is demonstrated that the local reaction progression and plating onset can not only be predicted accurately with a p2D numerical model, but that these processes follow a simple scaling law. Remarkably, the entire reaction histories of different electrodes charged at different rates (e.g., 160 μm thickness at 0.5C, 111 μm at 1C or 66 μm at 4C) were observed to have self-similar intercalation profiles. It is demonstrated that plating onset is in turn governed by the reaction profile which explains why both processes exhibit the same scaling behavior. Finally, operando measurements of local reaction dynamics are conducted for the first time in electrodes with channeled architectures, quantitatively determining how channels affect reaction uniformity and plating onset. Together, these results reveal underlying simplicity in the complex electrochemical environment of fast charging and lithium plating, improving understanding of this process. These fundamental insights are broadly applicable for design processes, modeling and experimental evaluation of lithium ion batteries.

25 ENERGY STORAGE↗

Flow resistance of phloem sieve plates revisited using an experimental model

Sieve plate resistance has been identified as the key to understanding the efficiency of phloem transport of carbohydrates in trees. These plates with small holes connecting sieve tubes are responsible for the largest resistance to flow in the phloem. Their structure determines how fast sugars can be transported through the phloem with certain pressure differences and what the limits for phloem transport in different plants are. Because experiments with the phloem are very challenging, our understanding of sieve plate resistance is mostly based on anatomical studies and hydrodynamic modeling of flow through sieve plates. These models calculate the resistance of the entire sieve tube–sieve plate system using the Hagen–Poiseuille flow resistance for the sieve cell lumen and a combination of the Hagen–Poiseuille resistance and Sampson flow resistance through the sieve pores. The resistance of the entire sieve plate is calculated by summing the Hagen–Poiseuille and Sampson flow resistances of each pore. To test the validity of this model formulation, an experimental model with aspect parameters similar to phloem sieve tubes was built using polyvinyl chloride (PVC) piping and plastic straws of different diameters and lengths. This system was used to measure flow rates and calculate flow resistance at Reynolds numbers 0.5–300. The results suggest that the current models may significantly overestimate the flow resistance caused by sieve plates and that the resistance might be better described by formulations used for perforated plates.

54 ENVIRONMENTAL SCIENCES↗

Crack Growth Rate and Large Plate Demonstration of Chloride-induced Stress Corrosion Cracking in Spent Nuclear Fuel Storage Canisters

This report describes the body of work involving testing and analyses performed in FY18 and FY19 at the Savannah River National Laboratory and at Korea University to determine chloride-induced stress corrosion crack (CISCC) growth rates in weldments of austenitic stainless steel plate material. The primary work involved: several separate crack growth rate test campaigns with new testing setups using laboratory-scale corrosion specimens; analyses to estimate the stress intensity factors for flaws postulated to be present in the residual stress fields of axial and circumferential weldments in a prototypic dry storage canister; and establishment of a “large plate” (approximately 51×46 cm with thickness 16 mm and weight about 30 kg) CISCC test that uses a plate with a circumferential weldment harvested from the Sandia National Laboratories’ full-size mockup dry storage canister. The tests for crack growth rate were conducted on ASTM E1861 bolt-load compact tension specimens in a setup designed to allow initially dried salt deposits to deliquesce and infuse the brine to the crack front under conditions relevant to the canister storage environments (e.g., temperature and humidity). The crack growth rate test results matched previous experimental data in the open literature. These literature data had been compiled by SNL and EPRI to develop a temperature-dependent (K-insensitive) crack growth rate model to support flaw disposition in the ASME Boiler and Pressure Vessel Section XI Code Case N-860, “Examination Requirements and Acceptance Standards for Spent Nuclear Fuel Storage and Transportation Containment Systems.” The knowledge of the salt, temperature, humidity conditions for CISCC including the threshold stress intensity factor, $K_{ISCC}$, were used to setup the large plate test in which a set of partthrough- wall and through-wall electrical discharge machined (EDM) defects were positioned in the weld residual stress field of the welded plate material from the mockup canister. A salt solution was applied to this plate specimen with an air-brush spray, then dried, and then exposed to a constant 75% RH condition at an ambient room temperature of 22 °C. The salt loading and environmental condition is expected to be aggressive to cause CISCC. The visual results at the surface of the plate show corrosion product staining (brown rust appearance) but with no CISCC emanating from the machined notches after approximately 5 months exposure to date. The plate test will continue in FY20 and phased-array ultrasonic testing and other NDE techniques will be applied to identify and characterize CISCC that may emanate from the machined defects. The notches and any CISCC from them will be sectioned at the conclusion of the test to verify NDE characterization, and to develop effective through-wall crack growth rates from cracks that would likely be branched.

12 MANAGEMENT OF RADIOACTIVE AND NON-RADIOACTIVE W↗

Involute Working Group – FSI Analysis of Fuel Plates Using Finite Volume and Finite Element Methods

The three involute plate research reactors RHF, HFIR, and FRM II have expressed an interest in using computational software to carry their steady-state safety analysis. Since these tools represent a significant departure from the methods used currently (one-dimensional), the acceptability of the new approach by regulators requires thorough verification and validation of these tools. Therefore, Argonne National Laboratory and the three involute-plate reactors formed an informal group called the Involute Working Group aiming at qualifying computational tools to perform steady-state safety analysis. The present report focuses on a comparison of finite volume and finite element methods to model solids in fluid-structure interaction problems with the goal to estimate the coolant flow-induced fuel plate deflections obtained with the two methods. The finite volume method will be obsoleted in STARCCM+ by the end of 2021, nevertheless, this evaluation is important because the method was used by ANL researchers to model the response of the fuel plates, despite its drawbacks, which are discussed in the report. It was essential to check how those estimates compare to the results obtained with the finite element method that is considered superior for structural analysis. Various geometries, i.e., flat, cylindrical and circle-involute fuel plates, as well as coolant flow speed, were considered. The comparison shows that, independently of the plate geometry, the finite volume method significantly underestimates the deflection as compared to finite element method for coarser meshes. When the discretization is developed as a result of a mesh sensitivity study using finite element method, the result obtained using finite volume method can be a few times smaller than the corresponding finite element method solution. A code-to-code comparison , between STAR-CCM+ and LS-DYNA was included in the analysis. Within the LS-DYNA models, two types of finite element formulations were used: solid and shell finite elements. Mesh sensitivity study showed that both approaches converge to a similar value that was obtained with STAR-CCM+ finite element solver. The evaluation of the computational solvers was extended by adding two benchmark cases from the STAR-CCM+ Verification Suite and presented in the Appendix A. The selected cases are: (1) bending of a cantilever beam under external load, and (2) cylindrical shell deformation analysis, known in the literature as ‘Scordelis-Lo roof’. The problems were solved with finite volume, and finite element methods, and the results confirmed the previously discussed findings. The analysis shows that the finite element solver is superior to the finite volume solver in terms of representation of model geometry and estimating the structural behavior of fuel plates. Depending on the ratio of the load to the flexibility of the plate, the finite volume solver can greatly under- or overestimate the structural response if a very carefully selected mesh is not used.

22 GENERAL STUDIES OF NUCLEAR REACTORS↗

Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component

Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

36 MATERIALS SCIENCE↗

Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component

Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗

Cold plate

A cold plate, an electronic assembly including a cold plate, and a method for forming a cold plate are provided. The cold plate includes an interface plate and an opposing plate that form a plenum. The cold plate includes a plurality of active areas arranged for alignment over respective heat generating portions of an electronic assembly, and non-active areas between the active areas. A cooling fluid flows through the plenum. The plenum, at the non-active areas, has a reduced width and/or reduced height relative to the plenum at the active areas. The reduced width and/or height of the plenum, and exterior dimensions of cold plate, at the non-active areas allow the non-active areas to flex to accommodate surface variations of the electronics assembly. The reduced width and/or height non-active areas can be specifically shaped to fit between physical features of the electronics assembly.

42 ENGINEERING↗

Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader

Methods are provided for facilitating cooling of an electronic component. The method includes providing a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

Chainer, Timothy J.↗

Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component

Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

Chainer, Timothy J.↗