Crystal structure of some ternary intermetallic titanium compounds
Crystal structure of some ternary intermetallic titanium compounds
TITANIUM COMPOUND↗
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Diffusion Bonding of TiAl to Ti6Al4V Using Nanolayers
Microstructural characterization of TiAl to Ti6Al4V dissimilar diffusion bonds assisted by reactive Ni/Al nanolayers was performed in this study. The nanolayers (alternated Al and Ni) were deposited onto the base material surfaces. Diffusion bonding was performed at 700 and 800 °C under pressures from 5 to 40 MPa and dwell times between 60 and 180 min. Microstructural characterization was performed using high-resolution transmission and scanning electron microscopies. The observations revealed that dissimilar TiAl to Ti6Al4V joints assisted by Ni/Al reactive nanolayers can be obtained successfully at 800 °C during 60 min using a pressure of 20 MPa. The bond interface is thin (less than 10 µm) and is mainly composed of NiAl grains. Thin layers of Al-Ni-Ti intermetallic compounds were formed adjacent to the base materials.
36 MATERIALS SCIENCE↗
Microstructures, Martensitic Transformation, and Mechanical Behavior of Rapidly Solidified Ti-Ni-Hf and Ti-Ni-Si Shape Memory Alloys
In this work, the microstructure and mechanical properties of rapidly solidified Ti{sub 50−x/2}Ni{sub 50−x/2}Hf{sub x} (x = 0, 2, 4, 6, 8, 10, and 12 at.%) and Ti{sub 50−y/2}Ni{sub 50−y/2}Si{sub y} (y = 1, 2, 3, 5, 7, and 10 at.%) shape memory alloys (SMAs) were investigated. The sequence of the phase formation and transformations in dependence on the chemical composition is established. Rapidly solidified Ti-Ni-Hf or Ti-Ni-Si SMAs are found to show relatively high yield strength and large ductility for specific Hf or Si concentrations, which is due to the gradual disappearance of the phase transformation from austenite to twinned martensite and the predominance of the phase transformation from twinned martensite to detwinned martensite during deformation as well as to the refinement of dendrites and the precipitation of brittle intermetallic compounds.
36 MATERIALS SCIENCE↗
Crystal and Magnetic Structures of the Ternary Ho 2 Ni 0.8 Si 1.2 and Ho 2 Ni 0.8 Ge 1.2 Compounds: An Example of Intermetallics Crystallizing with the Zr 2 Ni 1–x P Prototype
We report two new rare-earth (R) ternary intermetallic compounds—Ho 2 Ni 0.8 T 1.2 with T = Si and Ge—that correspond to the R 5 Ni 2 T 3 phase earlier reported to form in Dy–Ni–T and Ho–Ni–T ternary systems. The compounds crystallize in a filled version of the orthorhombic Zr 2 Ni 1–x P-type structure with x = 0.52; their stoichiometry, determined from both single-crystal and powder X-ray diffraction data, is centered on Ho 2 Ni 0.8 T 1.2 with a narrow solid solubility range for the silicide, while the germanide appears to be a line phase. In addition to R = Dy and Ho, R 2 Ni 0.8 T 1.2 compounds also form for R = Y and Tb, representing the first examples of rare-earth-based compounds adopting the Zr 2 Ni 1–x P structural prototype. Bulk magnetization data reveal the main transitions of the ferrimagnetic or ferromagnetic type at TC = 38 K for Ho 2 Ni 0.8 Si 1.2 and TC = 37 K for Ho 2 Ni 0.8 Ge 1.2 , which are followed by subsequent magnetic reordering at lower temperatures. Neutron diffraction shows complex magnetic structures below T C with both ferromagnetic and antiferromagnetic components and magnetic propagation vector κ 1 = [0, 0, 0]. Below T N ≅ 24 K (22 K) for the silicide (germanide), an additional antiferromagnetic coupling following an incommensurate magnetic propagation vector κ 2 = [κ x , 0, 0] appears to coexist with the first magnetic structure.
37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗
Microstructural Characteristics and Mechanical Properties of an Electron Beam-Welded Ti/Cu/Ni Joint
Electron beam welding experiments of TA15 titanium alloy to GH600 nickel superalloy with and without a copper sheet interlayer were carried out. Surface appearance, microstructure and phase constitution of the joint were examined by optical microscopy, scanning electron microscopy and x-ray diffraction analysis. Mechanical properties of Ti/Ni and Ti/Cu/Ni joint were evaluated based on tensile strength and microhardness tests. The results showed that cracking occurred in Ti/Ni electron beam weldment for the formation of brittle Ni-Ti intermetallics, while a crack-free electron beam-welded Ti/Ni joint can be obtained by using a copper sheet as filler metal. The addition of copper into the weld affected the welding metallurgical process of the electron beam-welded Ti/Ni joint significantly and was helpful for restraining the formation of Ti-Ni intermetallics in Ti/Ni joint. The microstructure of the weld was mainly characterized by a copper-based solid solution and Ti-Cu interfacial intermetallic compounds. Ti-Ni intermetallic compounds were almost entirely suppressed. The hardness of the weld zone was significantly lower than that of Ti/Ni joint, and the tensile strength of the joint can be up to 282 MPa.
36 MATERIALS SCIENCE↗
A novel interface strengthening layer: Nanoscale AuCu super-structure formed during Au80Sn20/Cu rapid solidification soldering process
Highlights: • The nanoscale AuCu super-structure formed in Au80Sn20/Cu soldering joint. • The phase-transformation diffusion mechanism of Au80Sn20/Cu soldering process was studied. • The orientation relationship of Au80Sn20/Cu intermetallic compounds was investigated. • The interfacial strengthening mechanism of nanoscale AuCu layer was discussed. - Abstract: Phase composition and orientation of intermetallic compounds layers determine the functional and mechanical properties of solder joints. In this paper, interfacial reaction and strengthening mechanism of Au80Sn20/Cu joint by rapid solidification reflow soldering were studied. The Au80Sn20/Cu solder joint by rapid solidification reflow soldering exhibit a superior shear property, and the shear strength reaches up to 90 MPa. It is found that a new nanoscale AuCu super-structure formed in the interfacial intermetallic compounds layer, which is coherent with the [001] Cu substrate. The orientation relationship of Cu matrix/interfacial intermetallic compounds is determined to be [001]{sub Cu}∥[001]{sub AuCu}∥[ 2-bar 4 2-bar 3]{sub (AuCu){sub 5Sn}} and (200){sub Cu}∥(200){sub AuCu}∥(10 1-bar 0){sub (AuCu){sub 5Sn}}. Nanoscale AuCu super-structure influences the interface slip direction and provides interface misfit dislocation, hinder the dislocation movement, lead to the interface strengthening effect. Our finding on nanoscale AuCu super-structure formed during Au80Sn20/Cu soldering process not only sheds light on future research direction but also provides practical guidance to the engineers in solder industry.
77 NANOSCIENCE AND NANOTECHNOLOGY↗
Catalytic properties of intermetallic platinum-tin nanoparticles with non-stoichiometric compositions
Abstract not provided
Pei, Yuchen (ORCID:0000000185176686)↗
Cooling rate dependence of simulated Cu{sub 64.5}Zr{sub 35.5} metallic glass structure
Using molecular dynamics simulations with embedded atom model potential, we study structural evolution of Cu{sub 64.5}Zr{sub 35.5} alloy during the cooling in a wide range of cooling rates γ ∈ (1.5 ⋅ 10{sup 9}, 10{sup 13}) K/s. Investigating short- and medium-range orders, we show that the structure of Cu{sub 64.5}Zr{sub 35.5} metallic glass essentially depends on cooling rate. In particular, a decrease of the cooling rate leads to an increase of abundances of both the icosahedral-like clusters and Frank-Kasper Z16 polyhedra. The amounts of these clusters in the glassy state drastically increase at the γ{sub min} = 1.5 ⋅ 10{sup 9} K/s. Analysing the structure of the glass at γ{sub min}, we observe the formation of nano-sized crystalline grain of Cu{sub 2}Zr intermetallic compound with the structure of Cu{sub 2}Mg Laves phase. The structure of this compound is isomorphous with that for Cu{sub 5}Zr intermetallic compound. Both crystal lattices consist of two types of clusters: Cu-centered 13-atom icosahedral-like cluster and Zr-centered 17-atom Frank-Kasper polyhedron Z16. That suggests the same structural motifs for the metallic glass and intermetallic compounds of Cu–Zr system and explains the drastic increase of the abundances of these clusters observed at γ{sub min}.
36 MATERIALS SCIENCE↗
Hydrogen reduction and metal-support interaction in a metastable metal-oxide system: Pd on rhombohedral In{sub 2}O{sub 3}
Highlights: • Metal-Support interaction in a metastable Pd/rh-In{sub 2}O{sub 3} material. • No influence of metal-support interaction on phase transformation rh-In{sub 2}O{sub 3}→c-In{sub 2}O{sub 3}. • Sequence of hydride, intermetallic compound formation and phase transformation. • High structural stability of reduced rh-In{sub 2}O{sub 3} and associated oxygen vacancies. • Metastable rh-In{sub 2}O{sub 3} more effective in initial intermetallic formation than c-In{sub 2}O{sub 3}. - Abstract: Structural and chemical consequences of reactive metal-support interaction (RMSI) effects occurring under hydrogen reduction in a metastable metal-oxide system have been exemplified for small PdO particles loaded onto rhombohedral In{sub 2}O{sub 3} (PdO/rh-In{sub 2}O{sub 3}) using synchrotron-based in situ X-ray diffraction experiments at temperatures up to 500 °C. rh-In{sub 2}O{sub 3} is a meta-stable In{sub 2}O{sub 3} polymorph that is prone to gas-phase dependent phase transformation to cubic In{sub 2}O{sub 3} (c-In{sub 2}O{sub 3}). Cross-influence of metal-support interaction and phase transformation can therefore be expected in similar temperature regimes. To separate both effects, comparable experiments have also been conducted on pure rh-In{sub 2}O{sub 3}. Phase transformation of pure rh-In{sub 2}O{sub 3} to cubic In{sub 2}O{sub 3} in hydrogen occurs between 415 °C and 450 °C. On Pd/rh-In{sub 2}O{sub 3}, a sequence of PdO reduction to Pd metal, followed by PdH{sub 0.706} hydride formation and subsequently, InPd and In{sub 3}Pd{sub 2} intermetallic compound formation have been observed between 30 °C and 500 °C. After the intermetallic compound formation is finished at around 400 °C, the phase transformation to c-In{sub 2}O{sub 3} sets in at exactly the same temperature as on pure rh-In{sub 2}O{sub 3} and extends over the same temperature range. This proves that the phase transformation of rh-In{sub 2}O{sub 3} to c-In{sub 2}O{sub 3} is not influenced by the reduction and the intermetallic compound formation. In contrast to Pd on c-In{sub 2}O{sub 3}, In-Pd compound formation from rh-In{sub 2}O{sub 3} occurs at much lower temperatures (230 °C vs. 300 °C), despite finally approaching the same compound stoichiometries (InPd and In{sub 3}Pd{sub 2}). This points to a high structural stability of reduced rh-In{sub 2}O{sub 3}/stability of oxygen vacancies (compared to c-In{sub 2}O{sub 3}) as well as to facilitated diffusion of reduced In(-O) species at low temperatures.
36 MATERIALS SCIENCE↗
Friction stir welding joint of dissimilar materials between AZ31B magnesium and 6061 aluminum alloys: Microstructure studies and mechanical characterizations
Friction stir welding is an efficient manufacturing method for joining dissimilar alloys, which can dramatically reduce grain sizes and offer high mechanical joint efficiency. Lap FSW joints between dissimilar AZ31B and Al 6061 alloy sheets were made at various tool rotation and travel speeds. Rotation and travel speeds varied between 560–1400 r/min and 16–40 mm/min respectively, where the ratio between these parameters was such that nearly constant pitch distances were applied during welding. X-ray diffraction pattern (XRD), optical microscopy images (OM), electron probe microanalysis (EPMA) and scanning electron microscopy equipped with an energy-dispersive X-ray spectroscopy (SEM-EDS) were used to investigate the microstructures of the joints welded. Intermetallic phases including Al{sub 12}Mg{sub 17} (γ) and Al{sub 3}Mg{sub 2} (β) were detected in the weld zone (WZ). For different tool rotation speeds, the morphology of the microstructure in the stir zone changed significantly with travel speed. Lap shear tensile test results indicated that by simultaneously increasing the tool rotation and travel speeds to 1400 r/min and 40 mm/min, the joint tensile strength and ductility reached a maximum. Microhardness measurements and tensile stress–strain curves indicated that mechanical properties were affected by FSW parameters and mainly depended on the formation of intermetallic compounds in the weld zone. In addition, a debonding failure mode in the Al/Mg dissimilar weld nugget was investigated by SEM and surface fracture studies indicated that the presence of intermetallic compounds in the weld zone controlled the failure mode. XRD analysis of the fracture surface indicated the presence of brittle intermetallic compounds including Al{sub 12}Mg{sub 17} (γ) and Al{sub 3}Mg{sub 2} (β). - Highlights: • Dissimilar Al/Mg joint was obtained by lap friction stir welding technique. • Effect of rotation and travel speeds on the formation of intermetallic compounds • Microstructure and chemical studies including metallography, XRD, SEM-EDS, and EPMA • Mechanical property tests such as stress–strain curves, failure load and hardness • IMCs as Al{sub 3}Mg{sub 2} and Al{sub 12}Mg{sub 17} were identified in weld nugget and at Al/Mg interface.
36 MATERIALS SCIENCE↗
Overview of Liquid-Solid Reaction Mechanisms and Kinetics of MBe13 Formation for Lanthanide-Beryllium and Actinide-Beryllium Systems
Molten rare-earth elements form intermetallic compounds with solid beryllium of the form MBe13, where M represents any of the rare-earth metals (lanthanides). Importantly, an intermetallic compound with the same stoichiometry is formed between liquid plutonium and solid beryllium. These lanthanide and actinide intermetallic compounds are of interest because of their high melting points (in excess of 1500 °C) and simple (cubic) crystallographic lattice. Despite the possible useful properties of these intermetallic compounds, the kinetics and thermodynamics of their formation have not been well quantified. A series of experiments was performed at Los Alamos National Laboratory in the 1990s in an attempt to ascertain the mechanism responsible for intermetallic formation in a variety of lanthanide-beryllium and actinide-beryllium combinations. These data are reviewed and analyzed in the present report. A kinetic analysis is applied where possible to compare interactions between solid beryllium and molten lanthanum, cerium, praseodymium, samarium, and ytterbium; these results are further compared with data collected for the plutonium-beryllium system.
36 MATERIALS SCIENCE↗
Designed metal-insulator transition in low-symmetry magnetic intermetallics
Compounds exhibiting half-metallic character and metal-insulator transitions draw considerable attention in condensed-matter and materials physics due to their potential use in spintronics. Here we show that specific electron doping plays a crucial role in tailoring thermodynamic, structural, electronic, and magnetic properties of materials derived from low-symmetry magnetic intermetallics, exemplified on triclinic Mn 4 Al 11 . Upon chemical doping of Al by Ge, we predict improved phase stability and adherence to a generalized “18-n rule” governing closed-shell configurations in intermetallic with narrow bandgaps. Validating experiments include measurements of phase stability and electronic transport properties of electron-doped Mn 4 Al 10 Ge that crystallizes in the Mn 4 Al 11 -type structure, confirming the bandgap opening as predicted by chemical analysis and density-functional theory. Here we also demonstrate theoretically that hydrostatic pressure enhances the predicted half-metallic gap in the up-spin channel, which leads to a ferrimagnetic-to-ferromagnetic transition driven by Mn-Mn charge ordering in the Mn 4 Al 11 parent. We have also discussed the generality of our approach in predicting the design of other classes of intermetallics including half and full Heusler compounds.
75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗
Correction: Anharmonic effects on the dynamical stability of Ce–Co–Cu intermetallic ternary compounds
Correction for ‘Anharmonic effects on the dynamical stability of Ce–Co–Cu intermetallic ternary compounds’ by Wei-Shen Tee et al., RSC Adv., 2026, 16, 14395–14405, https://doi.org/10.1039/D5RA09680D. In the original article, the Acknowledgements section was omitted. The Acknowledgements section for this article is given below.
Tee, Wei-Shen [Ames Laboratory (AMES), Ames, IA (U↗
Flow Patterns, Microstructure and Mechanical Properties of AZ31/Al6061 Dissimilar Friction Stir-Welded Joints
Dissimilar joints between die-cast AZ31 and extruded Al6061-T6 were joined using friction stir welding technology at a constant transverse speed (50 mm/min) and rotation rate of 800 or 1000 rpm. The flow patterns, microstructure evolution and intermetallic compounds in dissimilar joints were studied by optical and scanning electron microscopy. The relationship between microstructure and tensile properties was analyzed. The microhardness distribution along the horizontal centerline in cross section was investigated. Local flow without obvious mixing existed between Mg and Al metals in the tool shoulder-affected zone. For the tool-pin-affected zone, two typical zones, namely, the “extrusion zone” and “flow zone” existed because of the different flow modes of the plastic metals. The phase analysis showed that intermetallic compounds, including Al{sub 12}Mg{sub 17} and Al{sub 3}Mg{sub 2} formed in banded structures. Phase analysis showed that a joint with welding parameters of 800 rpm and 50 mm/min (Joint-500) had good mechanical properties because of the more uniform microstructure distribution and fewer intermetallic compounds. Fracture analysis indicated some microvoids and lamellate intermetallic compounds in the fracture surface of the joint with welding parameters of 1000 rpm and 50 mm/min (Joint-1000), which deteriorated its tensile strength significantly.
36 MATERIALS SCIENCE↗
Alternative Process for Manufacturing of Thin Layers of Boron for Neutron Measurement
Due to the worldwide shortage of helium 3, Boron-lined proportional counters are developed intensively by several groups. Up to now, thin boron containing layers for neutron detectors are essentially produced by sputtering of boron carbide (B{sub 4}C). This technology provides high quality films but it is slow and expensive. Our paper describes a novel and inexpensive technology for producing boron layers. This technology is based on chemical synthesis of boron 10 nanoparticles, and on electrophoretic deposition of these particles on metallic plates, or on metallic pieces with more complex shapes. The chemical synthesis consists in: - Heating boron 10 with lithium up to 700 deg. C under inert atmosphere: an intermetallic compound, LiB, is produced; - Hydrolysing this intermetallic compound: LiB + H{sub 2}O → B + Li{sup +} + OH{sup -} + 1/2H{sub 2}, where B is under the form of nanoparticles; - Purifying the suspension of boron nanoparticles in water, from lithium hydroxide, by successive membrane filtrations; - Evaporating the purified suspension, in order to get a powder of nanoparticles. The obtained nanoparticles have size around 300 nm, with a high porosity, of about 50%. This particle size is equivalent to about 150 nm massive particles. The nanoparticles are then put into suspension in a specific solvent, in order to perform deposition on metallic surfaces, by electrophoretic method. The solvent is chosen so that it is not electrolysed even under voltages of several tens of volts. An acid is dissolved into the solvent, so that the nanoparticles are positively charged. Deposition is performed on the cathode within about 10 min. The cathode could be an aluminium plate, or a nickel coated aluminium plate. Homogeneous deposition may also be performed on complex shapes, like grids in a Multigrid detector. A large volume of pieces, can be coated with a Boron-10 film in a few hours. The thickness of the layer can be adjusted according to the required neutron detection characteristics, between 0,5 to 5 μm (equivalent to 0,25 to 2.5 massive layer). The thickness is homogenous within a ±20% range. The layer is an almost pure {sup 10}B layer (90%). The ratio of the amount of deposed boron 10 to the amount of raw boron 10 used is more than 80%. Hence, another advantage of this technique is that Boron 10 will be deposited on the cathodes only, without loss of this expensive material. 2 grids of a Multi-Grid detector have been coated with pure Boron by using this technique. The film structure has been analysed with a microscope and the detector has been tested on a monochromatic neutron beam line. Preliminary results will be shown. (authors)
36 MATERIALS SCIENCE↗
Relationship between morphologies and orientations of Cu{sub 6}Sn{sub 5} grains in Sn3.0Ag0.5Cu solder joints on different Cu pads
The morphologies and orientations of Cu{sub 6}Sn{sub 5} intermetallic compounds in the Sn3.0Ag0.5Cu solder joints both on polycrystalline and single crystal Cu pads under different peak reflow temperatures and times above liquids were investigated. The relationship between Cu{sub 6}Sn{sub 5} grain orientations and morphologies was clarified. At the interface of Sn3.0Ag0.5Cu/polycrystalline Cu pad, scalloped Cu{sub 6}Sn{sub 5} intermetallic compounds formed at 250 °C and roof shape Cu{sub 6}Sn{sub 5} formed at 300 °C. Both scalloped Cu{sub 6}Sn{sub 5} and roof shape Cu{sub 6}Sn{sub 5} had a preferred orientation of (0001) plane being parallel to polycrystalline Cu pad surface. Besides, the percentage of large angle grain boundaries increased as the peak reflow temperature rose. At the interface of Sn3.0Ag0.5Cu/(111) single crystal Cu pad, the Cu{sub 6}Sn{sub 5} intermetallic compounds were mainly scallop-type at 250 °C and were prism type at 300 °C. The prismatic Cu{sub 6}Sn{sub 5} grains grew along the three preferred directions with the inter-angles of 60° on (111) single crystal Cu pad while along two perpendicular directions on (100) single crystal Cu pad. The orientation relationship between Cu{sub 6}Sn{sub 5} grains and the single crystal Cu pads was investigated by electron backscatter diffraction technology. In addition, two types of hollowed Cu{sub 6}Sn{sub 5} intermetallic compounds were found inside the joints of polycrystalline Cu pads. The long hexagonal Cu{sub 6}Sn{sub 5} strips were observed in the joints reflowing at 250 °C while the hollowed Cu{sub 6}Sn{sub 5} strips with the ‘▪’ shape cross-sections appeared at 300 °C, which was attributed to the different grain growth rates of different Cu{sub 6}Sn{sub 5} crystal faces. - Highlights: • The orientation of interfacial Cu{sub 6}Sn{sub 5} grains was obtained by EBSD technology. • Two types of hollowed Cu{sub 6}Sn{sub 5} strips were found at different temperatures. • The formation mechanism of hollowed Cu{sub 6}Sn{sub 5} was elaborated based on Bravais law. • The relationship between Cu{sub 6}Sn{sub 5} grain orientations and morphologies was clarified.
36 MATERIALS SCIENCE↗
Processing and Characterization of Ag-Cu-Sn Brazing Alloy Prepared by a Mechanical Alloying Method
Mechanical alloying was used to prepare an Ag-Cu-Sn brazing alloy with the low amounts of intermetallic compounds. X-ray diffraction and differential scanning calorimetry were carried out to investigate the phase transformation of the as-milled samples. It seemed that the intermetallic compounds experienced the stage of synthesis-decomposition-resynthesis in the ball milling process. By controlling the ball milling time and tin contents, the solid solution phases of Ag (Cu, Sn) and Ag (Cu) were achieved in the 60Ag30Cu10Sn sample after milling for 40 h. Although the intermetallic compound will be generated during the brazing process, the improvement of their distributed morphology is beneficial for the good bonding interface of the joint with stainless steel substrate.
36 MATERIALS SCIENCE↗
Fiber Laser Welding–Brazing Characteristics of Dissimilar Metals AZ31B Mg Alloys to Copper with Mg-Based Filler
Fiber laser welding–brazing of 1-mm-thick AZ31B Mg alloys to 1.5-mm-thick copper (T2) with Mg-based filler was performed in a lap configuration. The weld appearance, interfacial microstructure and mechanical properties were investigated with different heat inputs. The results indicated that processing windows for optimizing appropriate welding parameters were relatively narrow in this case. Visually acceptable joints with certain strength were achieved at appropriate welding parameters. The maximum tensile-shear fracture load of laser-welded-brazed Mg/Cu joint could reach 1730 N at the laser power of 1200 W, representing 64.1% joint efficiency relative to AZ31Mg base metal. The eutectic structure (α-Mg + Mg{sub 2}Cu) and Mg-Cu intermetallic compound was observed at the Mg/Cu interface, and Mg-Al-Cu ternary intermetallic compound were identified between intermetallics and eutectic structure at high heat input. All the joints fractured at the Mg-Cu interface. However, the fracture mode was found to differ. For laser power of 1200 W, the surface was characterized by tearing edge, while that with poor joint strength was almost dominated by smooth surface or flat tear pattern.
36 MATERIALS SCIENCE↗