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At least 127 records · Page 7

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NASA NTRS2017

Contamination and Surface Preparation Effects on Composite Bonding

Results presented here demonstrate the effect of several prebond surface contaminants (hydrocarbon, machining fluid, latex, silicone, peel ply residue, release film) on bond quality, as measured by fracture toughness and failure modes of carbon fiber reinforced epoxy substrates bonded in secondary and co-bond configurations with paste and film adhesives. Additionally, the capability of various prebond surface property measurement tools to detect contaminants and potentially predict subsequent bond performance of three different adhesives is also shown. Surface measurement methods included water contact angle, Dyne solution wettability, optically stimulated electron emission spectroscopy, surface free energy, inverse gas chromatography, and Fourier transform infrared spectroscopy with chemometrics analysis. Information will also be provided on the effectiveness of mechanical and energetic surface treatments to recover a bondable surface after contamination. The benefits and drawbacks of the various surface analysis tools to detect contaminants and evaluate prebond surfaces after surface treatment were assessed as well as their ability to correlate to bond performance. Surface analysis tools were also evaluated for their potential use as in-line quality control of adhesive bonding parameters in the manufacturing environment.

Kutscha, Eileen O.↗

NASA NTRS2018

Demonstration of Subscale Cermet Fuel Specimen Fabrication Approach Using Spark Plasma Sintering and Diffusion Bonding

Nuclear thermal propulsion (NTP) has the potential to expand the limits of human space exploration by enabling crewed missions to Mars and beyond. The viability of NTP hinges on the development of a robust nuclear fuel material that can perform in the harsh operating environment (> or = 2500K, reactive hydrogen) of a nuclear thermal rocket (NTR) engine. Efforts are ongoing to develop fuel material and to assemble fuel elements that will be stable during the service life of an NTR. Ceramic-metal (cermet) fuels are being actively pursued by NASA Marshall Space Flight Center (MSFC) due to their demonstrated high-temperature stability and hydrogen compatibility. Building on past cermet fuel development research, experiments were conducted to investigate a modern fabrication approach for cermet fuel elements. The experiments used consolidated tungsten (W)-60vol%zirconia (ZrO2) compacts that were formed via spark plasma sintering (SPS). The consolidated compacts were stacked and diffusion bonded to assess the integrity of the bond lines and internal cooling channel cladding. The assessment included hot hydrogen testing of the manufactured surrogate fuel and pure W for 45 minutes at 2500 K in the compact fuel element environmental test (CFEET) system. Performance of bonded W-ZrO2 rods was compared to bonded pure W rods to access bond line integrity and composite stability. Bonded surrogate fuels retained structural integrity throughout testing and incurred minimal mass loss.

Barnes, Marvin W.↗

NASA NTRS2018

Simulating the Effects of Carbon Nanotube Continuity and Interfacial Bonding on Composite Strength and Stiffness

Molecular dynamics simulations of carbon nanotube (CNT) composites, in which the CNTs are continuous across the periodic boundary, overestimate the experimentally measured mechanical properties of CNT composites along the fiber direction. Since the CNTs in these composites are much shorter than the composite dimensions, load must be transferred either directly between CNTs or through the matrix, a mechanism that is absent in simulations of effectively continuous CNTs. In this study, the elastic and fracture properties of high volume fraction discontinuous carbon nanotube/amorphous carbon composite systems were compared to those of otherwise equivalent continuous CNT composites using ReaxFF reactive molecular dynamics simulations. These simulations were used to show how the number of nanotube-matrix interfacial covalent bonds affect composite mechanical properties. Furthermore, the mechanical impact of interfacial bonding was decomposed to reveal its effect on the properties of the CNTs, the interfacial layer of matrix, and the bulk matrix. For the composites with continuous reinforcement, it was found that any degree of interfacial bonding has a negative impact on axial tensile strength and stiffness. This is due to disruption of the structure of the CNTs and interfacial matrix layer by the interfacial bonds. For the discontinuous composites, the modulus was maximized between 4%-7% interfacial bonding and the strength continues to increase up to the highest levels of interfacial bonding studied. Areas of low stress and voids were observed in the simulated discontinuous composites at the ends of the tubes, from which fracture was observed to initiate. Experimental carbon nanotube yarn composites were fabricated and tested. The results were used to illustrate knockdown factors relative to the mechanical performance of the tubes themselves.

Benjamin D Jensen↗

NASA NTRS2019

Manufacturing Process Development for Adhesively Bonded Joints in Large-Scale Space Structures

In order to take full advantage of the weight savings and performance gains offered by the use of composite materials in large-scale space structures, adhesively bonded joints must be considered. While bonded joint manufacturing at laboratory scale can be straightforward, the same manufacturing processes are not trivial at full scale. Surface preparation becomes particularly challenging (a viable process must yield consistent results over a large application area and be repeatable for multiple application sites), as does the application of heat to cure the doublers and/or bond them to the primary structure (the nature and scale of assembled or partially assembled aerospace structures often necessitates an out-of-oven/out-of-autoclave approach). In this work, bonded joint manufacturing processes are adapted for a full-scale (approximately 30 feet in diameter at the aft end) composite payload adapter at the NASA Marshall Space Flight Center. By iterating across a range of variables, process parameters for adhesively bonded joints on a large-scale composite structure have been developed. Primary findings are presented with respect to overarching bonded joint manufacturing concepts so as to maximize the applicability of this work to similar material systems and structures.

Guin, William E.↗

NASA NTRS2019

Development of Composite Sandwich Bonded Longitudinal Joints for Space Launch Vehicle Structures

The NASA Composite Technology for Exploration (CTE) Project is developing and demonstrating critical composite technologies with a focus on composite bonded joints; incorporating materials, design/analysis, manufacturing, and tests that utilize NASA’s expertise and capabilities. The project has goals of advancing composite technologies and providing lightweight structures to support future NASA exploration missions. In particular, the CTE project will demonstrate weight-saving, performance-enhancing composite bonded joint technology for Space Launch System (SLS)-scale composite hardware. Advancements from the CTE project may be incorporated as future block upgrades for SLS structural components. This paper discusses the details of the development of a composite sandwich bonded longitudinal joint for a generic space launch vehicle structure called the CTE Point Design. The paper includes details of the design, analysis, materials, manufacturing, and testing of sub-element joint test articles to test the capability of the joint design. The test results show that the composite longitudinal bonded joint design significantly exceeds the design loads with a 2.0 factor of safety. Analysis pre-test failure predictions for all sub-element bonded joint test coupons were all within 10% of the average test coupon failure load. This testing and analysis provides confidence in the potential use of composite bonded joints for future launch vehicle structures.

Segal, Kenneth N.↗

NASA NTRSDate not supplied

Fracture Prediction of Epoxy Resin using Morse Bond Potential Embedded in GAFF using Molecular Dynamics Simulations

A generic method is developed to investigate the fracture behavior of an epoxy resin using atomistic molecular (MD) dynamics simulations. The epoxy system consisted of the stoichiometric mixture of tetra-/tri-functional epoxies and di-functional hardener molecules and was cured with a step-growth crosslinking algorithm. A hybrid force field (hFF) in which Morse bond function were added in second generation-general Amber Force Field (GAFF2) was used to capture bond breaking of the crosslinked epoxy system under uniaxial deformation. The Morse bond parameters for covalent bonds in the crosslinked backbone were fit to dissociation curves computed by CASPT2/6-311+G**. After the systems in various crosslink densities were obtained and equilibrated, the full length of stress-strain (𝜎-𝜀) curve was produced including initial elastic regime, yielding, plastic flow, strain hardening, and progressive failure. We found that the hFF was effective in studying the dissociation of crosslinked polymers and understanding the failure mechanism. In the results, the hFF delivered the same elastic property obtained from the unmodified force field GAFF. The stress-strain curve, however, began to be distinct in the plastic regime due to broken covalent bonds capable of altering the tensile behavior. Once the stress reached maximum, it progressively decreased until the ultimate failure (𝜎=0). Since hFF employed the existing GAFF functions with including a minimal change of its bond potential, this approach is easier to perform and computationally more efficient for unveiling the fracture behavior of polymer materials at the molecular level than other approaches with reactive force fields. We expect this approach will be utilized to accelerate the material-by-design process for thermosets by incorporate data from molecular models.

Changwoon Jang↗

NASA NTRSDate not supplied

Modified Epoxy Matrix Resins for Reduced Dependence on Redundant Fasteners in Secondary-Bonded Composite Structures

In structural bonds, the interface between adherend and adhesive is nearly two-dimensional making it susceptible to minute quantities of contamination that can lead to weak bonds. No methods currently exist to measure the strength of an adhesive bond nondestructively. For these reasons, regulating organizations such as the Federal Aviation Administration (FAA) often require redundant load paths in secondary-bonded, primary-structures to achieve certification for civil transport aircraft. To meet this requirement, manufacturers commonly install redundant fasteners (~105 fasteners in a twin-aisle airframe with composite fuselage and wings), which add tremendous complexity, time and cost, and significantly reduce performance of the airframe. Under NASA’s Convergent Aeronautics Solutions (CAS) Program, the Adhesive Free Bonding of Composites (AERoBOND) project is investigating reformulated aerospace epoxy matrix resins to enable reflow and diffusion of the resin at the interface during a secondary bonding/cure process. The mixing process eliminates the material discontinuity at the interface, thereby removing the dependence of bond performance on adhesion across a nearly two-dimensional boundary. The AERoBOND interface is similar to the interlaminar region formed during a co-cure process, so joint performance depends on the cohesive properties of the matrix resin, which can be measured, inspected non-destructively, and certified for flight with fewer redundant fasteners. This presentation describes the ongoing development of stoichiometrically-offset epoxy resins to control the degree of cure in composite joints and enable interfacial mixing during secondary bonding/curing. Details on the resin formulation, laminate fabrication, and mechanical testing will also be presented. The precracked mode-II fracture toughness measured from preliminary AERoBOND joints was similar for joints fabricated with conventional epoxy matrix materials.

thermoset, hardener, prepreg, assembly↗

NASA NTRS2021

Latent Cure Epoxy Resins for Reliable Joints in Secondary-Bonded Composite Structures

In high-performance polymer matrix composite assemblies, adhesive bonding is generally superior to mechanical fastening in structural performance and manufacturing efficiency. However, adhesive bonds are susceptible to minute levels of contamination accumulated during assembly that can lead to unpredictable, weak bonds. Current methods of measuring bond strength are all destructive mechanical tests. To overcome these challenges, redundant load paths (e.g., mechanical fasteners) are often implemented in secondary-bonded, primary-structures, which can greatly reduce structural performance. This study investigated reformulated aerospace epoxy matrix resins with stoichiometric offset to inhibit cure of the matrix resin prior to assembly. Inhibited resins can reflow and mix across the joint interface, which eliminates the material discontinuity and forms a homogenous joint with reliable fracture properties. The goal of this study was to develop and demonstrate secondary composite assemblies that are mechanically and microscopically indistinguishable from a co-cured composite joint. This article describes the development of latent epoxy resins, the fabrication of test articles, and the mechanical properties measured from experimental joints compared with conventional, co-cured laminates. Methods of in-line quality control using and infrared spectroscopy and post-assembly forensics are also described. The final mode-II fracture toughness measured from precracked AERoBOND specimens was similar to that measured from co-cured laminates indicating that later cure epoxy materials could be a suitable replacement for secondary bonding.

Polymer-matrix composites (PMCs)↗

NASA NTRS2020

Bonding to Bulk Metallic Glass using Aerospace-Grade Structural Adhesive

Bulk metallic glasses (BMGs) are non-crystalline metals with growing applications in aerospace. Due to their amorphous nature, BMGs generally exhibit stronger mechanical properties than most crystalline alloys and are more corrosion resistant. The limited reactivity of a corrosion resistant surface may explain the difficulty in establishing robust bonds to certain adhesives, especially commonly used structural adhesives for aerospace applications. Here, an amine cured aerospace adhesive was used for bonding an iron-nickel based BMG satellite component. Various types of processes were explored to avoid adhesive failure and increase bond strength. It was found that the BMG required specific chemical derivatization of the metal surface in order to achieve cohesive failure. Surface analysis was used to determine the mechanisms of adhesion enhancement. The process was optimized to maximize bond strength. This work helps explain the difficulties in bonding BMG materials and provides strategies for design of future bonded BMG components.

Roberts, Rose↗

NASA NTRSDate not supplied

Composite Bond Line Measurements Based on A Bayesian Analysis of Flash Thermography Data

For bonded composite materials, an accurate characterization of the adhesive bond line is needed to predict failure modes and fracture toughness. In this paper, bond line thickness was estimated from data obtained using through transmission flash thermography. The forward model that predicts back surface temperature is based on a three layer heat diffusion equation with varying diffusivity and flux boundary conditions. The corresponding inverse problem of estimating bond line thickness from measurement data was solved using a Bayesian approach that assumed Gaussian priors for the bond line thickness and thermal diffusivity of the adherends. Finally, the outputs of the thermography based method were compared to measurements that were collected using a micrometer and ultrasound testing.

Flash thermography↗

NASA NTRSDate not supplied

Composite Bond Line Measurements Based on a Bayesian Analysis of Flash Thermography Data

Flash thermography↗

NASA NTRS2015

Aligning, Bonding, and Testing Mirrors for Lightweight X-ray Telescopes

High-resolution, high throughput optics for x-ray astronomy entails fabrication of well-formed mirror segments and their integration with arc-second precision. In this paper, we address issues of aligning and bonding thin glass mirrors with negligible additional distortion. Stability of the bonded mirrors and the curing of epoxy used in bonding them were tested extensively. We present results from tests of bonding mirrors onto experimental modules, and on the stability of the bonded mirrors tested in x-ray. These results demonstrate the fundamental validity of the methods used in integrating mirrors into telescope module, and reveal the areas for further investigation. The alignment and integration methods are applicable to the astronomical mission concept such as STAR-X, the Survey and Time-domain Astronomical Research Explorer.

mirror alignment↗

NASA NTRS2023

Assessment of Electrical, Electronic, and Electromechanical (EEE) Parts Copper Wire Bonds for Space Programs

The NASA Electronic Parts and Packaging Program co-manager, requested the NASA Engineering and Safety Center (NESC) to compile a body of publicly available knowledge on copper (Cu) wire bonds and perform reliability testing and analysis on these bonds, including environment tests, sample destructive physical analysis, and bond pull/shear tests during environment test intervals. The goal was to understand the risks of using Cu wire bonds for space applications and develop guidelines on Cu bond pull/shear limits for NASA applications. This document contains the results of the NESC assessment.

Electrical, Electronic, and Electromechanical↗

NASA NTRS1972

Reliability improvement of wire bonds subjected to fatigue stresses.

The failure of wire bonds due to repeated flexure when semiconductor devices are operated in an on-off mode has been investigated. An accelerated fatigue testing apparatus was constructed and the major fatigue variables, aluminum alloy composition, and bonding mechanism, were tested. The data showed Al-1% Mg wires to exhibit superior fatigue characteristics compared to Al-1% Cu or Al-1% Si and ultrasonic bonding to be better than thermocompression bonding for fatigue resistance. Based on these results highly reliable devices were fabricated using Al-1% Mg wire with ultrasonic bonding which withstood 120,000 power cycles with no failures.

Ravi, K. V.↗

NASA NTRS1974

Semiconductor measurement technology: Microelectronic ultrasonic bonding

Information for making high quality ultrasonic wire bonds is presented as well as data to provide a basic understanding of the ultrasonic systems used. The work emphasizes problems and methods of solving them. The required measurement equipment is first introduced. This is followed by procedures and techniques used in setting up a bonding machine, and then various machine- or operator-induced reliability problems are discussed. The characterization of the ultrasonic system and its problems are followed by in-process bonding studies and work on the ultrasonic bonding (welding) mechanism. The report concludes with a discussion of various effects of bond geometry and wire metallurgical characteristics. Where appropriate, the latest, most accurate value of a particular measurement has been substituted for an earlier reported one.

Harman, G. G.↗

NASA NTRS1972

Diffusion bonding and its application to manufacturing

In its simplest form diffusion bonding is accomplished by placing clean metal surfaces together under a sufficient load and heating. The natural interatomic attractive force between atoms transforms the interface into a natural grain boundary. Therefore, in principle, the properties of the bond area are identical to those of the parent metal. Other advantages of diffusion bonding over conventional methods of bonding include freedom from residual stresses, excessive deformation, foreign metals, or changed crystal structures. Stainless steels, nickel-base superalloys, and aluminum alloys have all been successfully joined. Complex hardware, including integrated flueric devices, jet engine servovalves, and porous woven structures have been fabricated. The processing involved is discussed, along with such theoretical considerations as the role of metal surfaces, the formation of metal contact junctions, and the mechanisms of material transport in diffusion bonding.

Spurgeon, W. M.↗

NASA NTRS1975

Analysis of bonded joints

A refined elastic analysis of bonded joints which accounts for transverse shear deformation and transverse normal stress was developed to obtain the stresses and displacements in the adherends and in the bond. The displacements were expanded in terms of polynomials in the thicknesswise coordinate; the coefficients of these polynomials were functions of the axial coordinate. The stress distribution was obtained in terms of these coefficients by using strain-displacement and stress-strain relations. The governing differential equations were obtained by integrating the equations of equilibrium, and were solved. The boundary conditions (interface or support) were satisfied to complete the analysis. Single-lap, flush, and double-lap joints were analyzed, along with the effects of adhesive properties, plate thicknesses, material properties, and plate taper on maximum peel and shear stresses in the bond. The results obtained by using the thin-beam analysis available in the literature were compared with the results obtained by using the refined analysis. In general, thin-beam analysis yielded reasonably accurate results, but in certain cases the errors were high. Numerical investigations showed that the maximum peel and shear stresses in the bond can be reduced by (1) using a combination of flexible and stiff bonds, (2) using stiffer lap plates, and (3) tapering the plates.

Srinivas, S.↗

NASA NTRS1975

Ultrasonically bonded value assembly

A valve apparatus capable of maintaining a fluid-tight seal over a relatively long period of time by releasably bonding a valve member to its seat is described. The valve member is bonded or welded to the seat and then released by the application of the same energy to the bond joint. The valve member is held in place during the bonding by a clamping device. An appropriate force device can activate the opening and closing of the valve member. Various combinations of material for the valve member and valve seat can be utilized to provide an adequate sealing bond. Aluminum oxide, stainless steel, inconel, tungsten carbide as hard materials and copper, aluminum, titanium, silver, and gold as soft materials are suggested.

Salvinski, R. J.↗