On the existence of minima and maxima in the composition dependence of the thermal diffusion factor and thermal conductivity
Minima and maxima in composition dependence of thermal diffusion factor and conductivity of gas mixtures
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Minima and maxima in composition dependence of thermal diffusion factor and conductivity of gas mixtures
Steady state and transient response of heat source with temperature regulated by electrical feedback controlled variable conductance heat pipe
Gas controlled variable conductance heat pipe for OAO-C onboard processor temperature stabilization, describing thermal performance tests under simulated flight conditions
Metals and alloys thermal conductivity prediction using Lorentz ratio and electrical resistivity measurements
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Lunar electrical conductivity profile from joint power spectral density analysis of Apollo 12 and Explorer 35 magnetometer data
Point source average signal reflection from conductive plane in random oscillation
Repeatable nondestructive method prepares multilayer cryo-insulation material for thermal conductivity measurements. Data acquired are volume of boil-off gas, barometric pressure, gas temperature, chamber pressure, and differential pressure between extremities.
Process for determining thermal conductivity and electrical resistivity of porous materials is described. Characteristics of materials are identified and used in development of mathematical models. Limitations of method are examined.
Thermal contact conductance test data at high vacuum were obtained from two Armco iron specimens having smooth, large radii of curvature, convex, one-half wave length surfaces. The data are compared with calculations based on two macroscopic elastic deformation theories and an empirical expression. Major disagreement with the theories and fair agreement with the empirical expression resulted. Plastic deformation of all the contacting surfaces was verified from surface analyzer statistics. These results indicate that the theoretical assumption of macroscopic elastic deformation is inadequate for accurate prediction of heat transfer with light loads for Armco iron specimens similar to those used in this investigation.
A thermally conductive polymer is provided having physical and chemical properties suited to use as a medium for potting electrical components. The polymer is prepared from hydroquinone, phenol, and formaldehyde, by conventional procedures employed for the preparation of phenol-formaldehyde resins. While the proportions of the monomers can be varied, a preferred polymer is formed from the monomers in a 1:1:2.4 molar or ratio of hydroquinone:phenol:formaldehyde.
The influence of multipole interactions on exchanges of rotational energy in molecular collisions was investigated by means of a simple two-state impact parameter approximation. The calculations are restricted to linear molecules and to dipole and quadrupole fields. The effects of such exchanges on the thermal conductivity of gases and of gaseous mixtures was investigated, after correcting the kinetic theory of mixtures to include exchanges between unlike molecules. It was found that dipole-quadrupole and quadrupole-quadrupole interactions may have a significant effect for molecules with low moments of inertia. In particular, quadrupole interactions are important in the hydrogen isotopes, and the calculated corrections for H2 are consistent with recent experimental work by Harris. The theory seems capable of accounting for the anomalies observed in HF + DF and HCl + DCl mixtures in terms of multipolar accidental resonances.
Ten different conductive inks used in the fabrication of thick-film circuits were evaluated for their physical and handling properties. Viscosity, solid contents, and spectrographic analysis of the unfired inks were determined. Inks were screened on ceramic substrates and fired for varying times at specified temperatures. Selected substrates were given additional firings to simulate the heat exposure received if thick-film resistors were to be added to the same substrate. Data are presented covering the (1) printing characteristics, (2) solderability using Sn-63 and also a 4 percent silver solder, (3) leach resistance, (4) solder adhesion, and (5) wire bonding properties. Results obtained using different firing schedules were compared. A comparison was made between the various inks showing general results obtained for each ink. The changes in firing time or the application of a simulated resistor firing had little effect on the properties of most inks.
The equipment and techniques for determining the thermal conductivity, electrical resistivity Lorenz ratio, and thermopower characteristics of Fe-22Cr-13Ni-5Mn stainless steel are discussed. The dimensions of the specimen and its preparation are described. The experimental data are represented by arbitrary functions over the entire range and smooth tables are generated from these functions.