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Preparation, and evaluation of polyimide sulfone resins, graphite-silica reinforced polyamide resins, and resin resistance to FLOX- methane, and fluorine-hydrogen fuels
Polyimide, phenolic, and other resins which develop volatiles during laminating or molding cure are studied using optimum cure cycles. The specimen is placed on a platen and sealed in a plastic bag, then heated and observed for gas evolution using a binocular microscope. A cover plate is added to sumulate an autoclave.
High pressure seals for rotating shafts are machined from a polyimide resin. It is more durable and cheaper than the older seals of plastic coated metal and works at temperatures between - 400 degrees and plus 900 degrees f.
Blocked polyimide precursor resistance to thermal imidization compared to polyamic acid
Radiation resistant material, made of polyimide polymers and S-glass cloth, is used in ball bearing retainers for extreme environments. Material displays satisfactory wear resistance, lubricity, and stability. Results of comparative tests with fluorocarbon materials are given.
Polyimide resin and resin reinforced composites
Noise reduction of Boeing 707 during landing approach by modifying turbofan nacelle with polyimide fiber glass acoustic sandwich materials
Fabrication and environmental tests of circuit boards with polyimide plastic dielectrics and pyrolyzed polyacrylonitrile conductors
Development of silicone polymers, polyimides, and polyisocyanurates for use as insulation, coatings, or adhesives under adverse environmental conditions is discussed. Chemical structure of the organic compounds is presented. Physical and mechanical properties of the compounds are analyzed.
Preformed, low cost, thin film thermocouples on adhesive tapes were fabricated. Metal strips of two dissimilar metals were laid on opposite edges of plastic substrate so that they overlap in center portion, forming thermocouple junction. Useful temperature range for polyimide films was 4 to 673 K.
Materials, processes and fabrication techniques have been investigated for the development of a high-temperature circuit-board laminate. High quality, void-free copper-clad laminates have been made using 7628/HS-1 style fiberglas reinforcements with filled polyimide matrices. The fabricating characteristics of P13N resin appear suitable for use as a filled matrix in this circuit board development. High-fired, ball-milled alumina appears to be necessary to obtain the desired effects in the circuit board system. Nickel-clad copper foil bonding surfaces appear to be another requirement for retention of good bond strengths after art work and plating sequences. The fabrication cycle for this circuit board system is very dependent on the heating profile. Very rapid heating with quick loading is recommended. A stack approach to lamination was successfully used.
The A-type polyimide adhesive resin P11B was modified by use of mixed diamines (thio-dianiline and meta phenylene diamine) which provided the desired autoclave processability. This new resin was termed P11BA. It was shown that copolymeric blends of P11BA and Amoco AI-1137 amide-imide resin provided improved adhesive properties when autoclave processed over the properties obtained previously by press bonding with P11B based copolymeric blended adhesives. Properties of bonded assemblies are presented for long-term aging at both elevated and low temperatures, and also stress-rupture tests at elevated temperature.
Composites were exposed in circulating and static air environments up to 589 K for a maximum of 1000 hours. Composites of HT-S, HM-S, Thornel 50S, and Fortafil 5-Y fiber and a new addition type polyimide resin were laminated in a matched-die mold. Flexural strengths, flexural modulus, and interlaminar shear strengths were determined at 297, 533, and 598 K after various durations of exposure. Composite and fiber weight loss characteristics were determined by isothermal gravimetric analysis in air. Properties of composites exposed and tested at the environment temperatures were compared with those determined under short-term exposure. A new short beam interlaminar shear fixture is described. Environmental effects of long-term ambient temperature exposure on the elevated temperature mechanical properties of graphite/polyimide composites are presented.
Emphasis on the consideration of glass formation on a kinetic process made it possible to think of glass compositions different from those normally employed in the manufacture of glass fibers. Approximately 450 new glass compositions were prepared and three dozen of these compositions have values for Young's modulus measured on bulk specimens greater than nineteen million pounds per square inch. Of the new glasses about a hundred could be drawn into fibers by mechanical methods at high speeds. The fiber which has a Young's modulus measured on the fiber of 18.6 million pounds per square inch and has been prepared in quantity as a monofilament (to date more than 150 million lineal feet of 0.2 to 0.4 mil fiber have been produced). This fiber has also been successfully incorporated both in epoxy and polyimide matrices. The epoxy resin composite has shown a modulus forty percent better than that achievable using the most common grade of competitive glass fiber, and twenty percent better than that obtainable with the best available grade of competitive glass fiber. Other glass fibers of even higher modulus have been developed.
Studies and experiments are presented on carbon, boron, aluminum oxide, zirconium silicate, aluminum, and titanium vapor-deposited on polyimide film substrates.
The materials selected for the production of extremely lightweight honeycomb sandwich panels are discussed. The resin selected for the first core and face sheet fabrication was Monsanto RS6234 polyimide. The fiber selected for core manufacture was Hercules HT-S, and for face sheets, Hercules HM-S; these selections are discussed.
An internal foam fabrication is one of the concepts being considered for cryogenic insulation on the hydrogen tanks of the shuttle vehicle. The three-dimensional polyurethane used on the S-4 B tanks failed to meet the higher temperature requirements of the shuttle vehicle, however, and other foams under consideration include polyisocyanurates, polyphenylene oxides, polyimides, and polybenzimidazoles. Improved adhesive systems for attaching the foams to the interior tank wall are under study.
The Apollo 12 astronauts brought the Surveyor III television camera back from the moon in November 1969. Chemical analyses of a portion of television cable revealed changes in the glass fabric sleeve and in the wire insulation as a result of exposure to the lunar environment. Loss of volatile constituents from the glass fabric and a discoloration of the glass occurred. The Teflon layer on the wire showed a slight discoloration and possibly a slight change in its infrared spectrum. Both the polyimide layer and the Teflon layer of the wire insulation showed changes in tensile strength and elongation.