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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 1,189 records · Page 66
All sourcesNASA NTRSDOE OSTI
NASA NTRS1995

Effects of thermal and electrical stressing on the breakdown behavior of space wiring

Several failures in the electrical wiring systems of many aircraft and space vehicles have been attributed to arc tracking and damaged insulation. In some instances, these failures proved to be very costly as they have led to the loss of many aircraft and imperilment of space missions. Efforts are currently underway to develop lightweight, reliable, and arc track resistant wiring for aerospace applications. In this work, six wiring constructions were evaluated in terms of their breakdown behavior as a function of temperature. These hybrid constructions employed insulation consisting of Kapton, Teflon, and cross-linked Tefzel. The properties investigated included the 400 Hz AC dielectric strength at ambient and 200 C, and the lifetime at high temperature with an applied bias of 40, 60, and 80% of breakdown voltage level. The results obtained are discussed, and conclusions are made concerning the suitability of the wiring constructions investigated for aerospace applications.

Hammoud, Ahmad↗
NASA NTRSDate not supplied

Toughening of Boron Carbide Composites by Hierarchical Microstructuring

Due to a unique combination of properties including high hardness, low density, chemical and thermal stability, semi-conductivity, and high neutron absorption, boron carbide (B4C) is a potential candidate for various applications involving extreme environment. However, B4C’s current application is limited because of its low fracture toughness. In this study, a hierarchical microstructure design with features including TiB2 grains and graphite platelets was used to toughen B4C by simultaneously utilizing multiple toughening mechanisms including crack deflection, bridging, and micro-crack toughening. Using field-assisted sintering technology (FAST), B4C composites with dense and hierarchical microstructure were fabricated. Previously, the fracture toughness of fabricated B4C composites was measured at micro-scale using micro-indentation to have up to 56% improvement. In this work, the B4C composites’ fracture toughness was characterized at macro-scale using four-point bending methods and compared with previous results obtained at micro-scale. Micromechanics modeling of fracture behaviors for B4C-TiB2 composites was also performed to evaluate the contributions from experimentally observed toughening mechanisms. From four-point bending tests, B4C composites reinforced with both TiB2 grains (~15 vol%) and graphite platelets (~8.7 vol%) exhibited the highest fracture toughness enhancement from 2.38 to 3.65 MPa∙m^(1/2). The measured values were lower than those obtained using micro-indentation but maintained the general trends. The discrepancy between the indentation and four-point bending test results originated from the complex deformation behaviors triggered by the high contact load during indentation tests. Through micromechanics modeling, introduced thermal residual stress due to thermal expansion mismatch between B4C and TiB2, and weak interphases at B4C-TiB2 boundaries were identified as the main causes for experimentally observed toughness enhancement. These results proved the effectiveness of hierarchical microstructure designs for B4C toughening and can provide reference for the future design of B4C composites with optimized microstructures for further fracture toughness enhancement.

composites↗
NASA NTRS1989

Evaluation of thermally induced non-Fourier stress wave disturbances via tailored hybrid transfinite element formulations

Accurate solutions have been obtained for a class of non-Fourier models in dynamic thermoelasticity which are relevant to the understanding of thermally-induced stress wave disturbances. The method employs tailored hybrid formulations based on the transfinite element approach. The results show that significant thermal stresses may arise due to non-Fourier effects, especially when the speeds of propagation of the thermal and stress waves are equal.

Tamma, Kumar K.↗
DOE OSTI2015

High-Temperature Deformation Constitutive Law for Dissimilar Weld Residual Stress Modeling: Effect of Thermal Load on Strain Hardening

Weld residual stress is one of the primary driving forces for primary water stress corrosion cracking in dissimilar metal welds (DMWs). To mitigate tensile residual stress in DMWs, it is critical to understand residual stress distribution by modeling techniques. Recent studies have shown that weld residual stress prediction using today s DMW residual stress models strongly depends on the strain-hardening constitutive model chosen. The commonly used strain-hardening models (isotropic, kinematic, and mixed) are all time-independent and inadequate to account for the time-dependent (viscous) plastic deformation at the elevated temperatures experienced during welding. For materials with profound strain-hardening, such as stainless steels and nickel-based alloys that are widely used in nuclear reactor and piping systems, the equivalent plastic strain the determinate factor of the flow stress can be highly dependent on the recovery and recrystallization processes. These processes are in turn a strong function of temperature, time, and deformation rate. Recently, the authors proposed a new temperature- and time-dependent strain-hardening constitutive model: the dynamic strain-hardening constitutive model. The application of such a model has resulted in improved weld residual stress prediction compared to the residual stress measurement results from the contour and deep-hole drilling methods. In this study, the dynamic strain-hardening behavior of Type 304 stainless steel and Alloy 82 used in pressure vessel nozzle DMWs is experimentally determined. The kinetics of the recovery and recrystallization of flow stress are derived from experiments, resulting in a semi-empirical equation as a function of pre-strain, time, and temperature that can be used for weld residual stress modeling. The method used in this work also provides an approach to study the kinetics of recovery and recrystallization of other materials with significant strain-hardening.

Yu, Xinghua↗
DOE OSTI2020

Design and Analysis of a Double Wall, Water Cooled Window for Accelerator Based Mo-99 Production

The electron accelerator based Mo-99 production technique requires the use of Rhodotrons to generate 38 MeV, 6.32 mA pulsed electron beams. The introduction of the pulsed beam structure has introduced fatigue concerns in the vacuum-helium windows that did not exist previously for electron beam production via linear accelerators. Previous analysis has shown that temperature fluctuations of approximately 100°C above and below the steady state operating temperature of ~500°C will occur within the windows. A water cooled window will eliminate this concern by reducing the primary mechanical stress due to the 300-psig helium pressure load as well as the secondary thermally induced stress. Although a water cooled window was considered years ago, the complexities of adding an additional water line was unattractive until now. A double wall, water cooled window has been designed and analyzed for this reason. The water cooled window design is shown to decrease the helium-side window temperature to as low as 125°C, while the vacuum-side window is maintained at 161°C at a water flow rate of 3.2 GPM. These low steady state temperatures reduce the thermal stress of the helium-side window significantly. Also, the primary mechanical stress has been reduced by roughly 50% due to the reduced pressure gradient across the helium-side window (150-psig water and 300-psig helium). Considering a Mo-99 production loss of roughly 1%, the water cooled window is a drastic improvement over the previous helium cooled designs and should be greatly considered for future upgrades and redesign.

43 PARTICLE ACCELERATORS↗
DOE OSTI2019

Neutron radiation hardness testing of 650V / 7.5 A GaN power HEMT

In this work, we have performed neutron radiation hardness testing for commercially available 650 V/7.5 A GaN power HEMT. The devices were tested at Los Alamos Neutron Science Center (LANSCE) inside Irradiation of Chips Electronics, ICE house-1 at a flux density of 10(6) n/cm(2) -s and energy level above 1 MeV, which is approximately 10(6) times higher than neutron radiation at airliner flight height (30,000 ft). During the experiments, the devices were stressed electrically, thermally and irradiated with neutron radiation. We have observed degradation of AlGaN layer due to accelerated neutron radiation (1.54 x 10(10) n/cm(2) above 1.5 MeV neutron energy) under electrical stress condition. We have performed parametric defect analysis through step-by-step application of neutron irradiation, thermal stress and electrical bias, and observed highest degradation of threshold voltage (0.14 V) for combined electrical stress and neutron irradiation.

36 MATERIALS SCIENCE↗
DOE OSTI2017

Statistical study of ductility-dip cracking induced plastic deformation in polycrystalline laser 3D printed Ni-based superalloy

Ductility-dip cracking in Ni-based superalloy, resulting from heat treatment, is known to cause disastrous failure, but its mechanism is still not completely clear. A statistical study of the cracking behavior as a function of crystal orientation in a laser 3D-printed DL125L Ni-based superalloy polycrystal is investigated here using the synchrotron X-ray microdiffraction. The dislocation slip system in each of the forty crystal grains adjacent to the 300 μm long crack has been analyzed through Laue diffraction peak shapes. In all these grains, edge-type geometrically necessary dislocations (GNDs) dominate, and their dislocation line directions are almost parallel to the crack plane. Based on Schmid's law, the equivalent uniaxial tensile force direction is revealed normal to the trace of the crack. A qualitative mechanism is thus proposed. Thermal tensile stress perpendicular to the laser scanning direction is elevated due to a significant temperature gradient, and thus locations in the materials where the thermal stress exceeds the yield stress undergo plastic deformation mediated by GND activations. As the dislocations slip inside the crystal grains and pile up at the grain boundaries, local strain/stress keeps increasing, until the materials in these regions fail to sustain further deformation, leading to voids formation and cracks propagation.

36 MATERIALS SCIENCE↗
NASA NTRS1984

Effects of thermal cycling on magnetic properties of lunar analogs

An experimental study has been performed to determine whether stresses associated with thermal cycling cracks can affect the coercivity of remanence carried by iron in lunar samples. Initially, samples were cycled up to 100 times in a refrigerator over a period of about 30 min per cycle. In a second set of experiments, samples were dipped directly into liquid nitrogen up to 100 times at about 1 min per cycle. Comparison of AF demagnetization curves of weak field anhysteretic remanent magnetization before and after cycling revealed no systematic differences. Calculations based on a model of spherical iron grains within olivine or troilite indicate that it is unlikely that the iron will crack under thermal stress. Thus, thermal cycling does not appear to provide an explanation for increasing the stability of remanence in samples from the lunar surface.

Barron, A. M.↗
NASA NTRS1980

Application of fully stressed design procedures to redundant and non-isotropic structures

An evaluation is presented of fully stressed design procedures for sizing highly redundant structures including structures made of composite materials. The evaluation is carried out by sizing three structures: a simple box beam of either composite or metal construction; a low aspect ratio titanium wing; and a titanium arrow wing for a conceptual supersonic cruise aircraft. All three structures are sized by ordinary fully-stressed design (FSD) and thermal fully stressed design (TFSD) for combined mechanical and thermal loads. Where possible, designs are checked by applying rigorous mathematical programming techniques to the structures. It is found that FSD and TFSD produce optimum designs for the metal box beam, but produce highly non-optimum designs for the composite box beam. Results from the delta wing and arrow wing indicate that FSD and TFSD exhibits slow convergence for highly redundant metal structures. Further, TFSD exhibits slow oscillatory convergence behavior for the arrow wing for very high temperatures. In all cases where FSD and TFSD perform poorly either in obtaining nonoptimum designs or in converging slowly, the assumptions on which the algorithms are based are grossly violated. The use of scaling, however, is found to be very effective in obtaining fast convergence and efficiently produces safe designs even for those cases when FSD and TFSD alone are ineffective.

Adelman, H. M.↗
DOE OSTI2018

Correlations of Interlayer Time with Distortion of Large Ti-6Al-4V Components in Laser Metal Deposition with Wire

Laser metal deposition with wire (LMD-w) is one of the emerging additive manufacturing (AM) technologies for large-scale aerospace components due to high deposition rates and material efficiency. However, it often results in undesired stresses and distortions due to non-uniform expansion and contraction of material during the printing. Controlling of inter-layer time, preheating and clamping is the effective method to mitigate the thermally induced stress and deformation. In this study, the effect of inter-layer time on the part distortion is investigated using finite element method (FEM). The model accounts for actual tool path, power and cooling conditions. The results show that the model effectively captures the fluctuation of the Ti-6Al-4V plate during printing. Also, it shows an asymmetric distortion on the plate edges. Ultimately, the sequentially coupled thermal-stress simulation provided a quantitative understanding of the inter-layer cooling time on the Ti plate distortion for the large-scale LMD-w process.

Lee, Yousub↗
DOE OSTI2019

Residual Stress and Opening-Mode Fracture Analysis of Multilayered Structures Subjected to Thermal Loading

Temperature change after formation commonly results in thermal residual stress in multilayered structures due to the different thermal and mechanical properties of each layer. In this paper, a three-dimensional (3D) elastic model is developed to study the residual stress and opening-mode fractures (OMFs) in a multilayered structure consisting of arbitrary number of layers under temperature change. The general solution of displacement field in the multilayered structure is derived by solving the elastic boundary value problem. In order to verify the proposed model, the elastic field in the advanced polymeric solar reflectors that consist of four layers is solved by applying the present model and compared with the finite-element (FE) simulation. In addition, parametric studies are conducted to investigate the effect of the thickness ratio between each layer on the accuracy of the developed model. As a result, based on the obtained elastic field, the fracture energy release rate (ERR) in the surface layer of the advanced polymeric reflector is obtained and used to study the fracture initiation, infilling, and saturation successfully.

36 MATERIALS SCIENCE↗
NASA NTRS1980

Substructure procedure for including tile flexibility in stress analysis of shuttle thermal protection system

A substructure procedure to include the flexibility of the tile in the stress analysis of the shuttle thermal protection system (TPS) is described. In this procedure, the TPS is divided into substructures of (1) the tile which is modeled by linear finite elements and (2) the SIP which is modeled as a nonlinear continuum. This procedure was applied for loading cases of uniform pressure, uniform moment, and an aerodynamic shock on various tile thicknesses. The ratios of through-the-thickness stresses in the SIP which were calculated using a flexible tile compared to using a rigid tile were found to be less than 1.05 for the cases considered.

Giles, G. L.↗
NASA NTRS1982

Integrated finite element thermal-structural analysis with radiation heat transfer

An integrated approach for efficiently coupling thermal and stress analyses of structures with radiation heat transfer is presented. A new integrated one dimensional element based on a nodeless variable formulation is introduced. Lumped and consistent formulations of the nonlinear radiation heat transfer matrix are presented. The accuracy of the integrated approach is assessed by comparisons with analytical solutions and conventional finite element thermal-structural analyses. Results show that the nodeless variable thermal element yields accuracy equivalent to a higher order element but permits a common discretization with a lower order congruent structural element. The integrated element thus provides improved accuracy and efficiency of thermal stress analysis for structures with complex temperature distributions.

Thornton, E. A.↗
DOE OSTI2024

Thermal Transport and Mechanical Stress Mapping of a Compression Bonded GaN/Diamond Interface for Vertical Power Devices

Bonding diamond to the back side of gallium nitride (GaN) electronics has been shown to improve thermal management in lateral devices; however, engineering challenges remain with the bonding process and characterizing the bond quality for vertical device architectures. Here, in this study, integration of these two materials is achieved by room-temperature compression bonding centimeter-scale GaN and a diamond die via an intermetallic bonding layer of Ti/Au. Recent attempts at GaN/diamond bonding have utilized a modified surface activation bonding (SAB) method, which requires Ar fast atom bombardment immediately followed by bonding within the same tool under ultrahigh vacuum (UHV) conditions. The method presented here does not require a dedicated SAB tool yet still achieves bonding via a room-temperature metal–metal compression process. Imaging of the buried interface and the total bonding area is achieved via transmission electron microscopy (TEM) and confocal acoustic scanning microscopy (C-SAM), respectively. The thermal transport quality of the bond is extracted from spatially resolved frequency-domain thermoreflectance (FDTR) with the bonded areas boasting a thermal boundary conductance of >100 MW/m 2 ·K. Additionally, Raman maps of GaN near the GaN–diamond interface reveal a low level of compressive stress, <80 MPa, in well-bonded regions. FDTR and Raman were coutilized to map these buried interfaces and revealed some poor thermally bonded areas bordered by high-stress regions, highlighting the importance of spatial sampling for a complete picture of bond quality. Overall, this work demonstrates a novel method for thermal management in vertical GaN devices that maintains low intrinsic stresses while boasting high thermal boundary conductances.

Raman↗
DOE OSTI2015

Residual stress within nanoscale metallic multilayer systems during thermal cycling

Projected applications for nanoscale metallic multilayers will include wide temperature ranges. Since film residual stress has been known to alter system reliability, stress development within new film structures with high interfacial densities should be characterized to identify potential long-term performance barriers. To understand factors contributing to thermal stress evolution within nanoscale metallic multilayers, stress in Cu/Nb systems adhered to Si substrates was calculated from curvature measurements collected during cycling between 25 °C and 400 °C. Additionally, stress within each type of component layers was calculated from shifts in the primary peak position from in-situ heated X-ray diffraction. The effects of both film architecture (layer thickness) and layer order in metallic multilayers were tracked and compared with monolithic Cu and Nb films. Analysis indicated that the thermoelastic slope of nanoscale metallic multilayer films depends on thermal expansion mismatch, elastic modulus of the components, and also interfacial density. The layer thickness (i.e. interfacial density) affected thermoelastic slope magnitude while layer order had minimal impact on stress responses after the initial thermal cycle. When comparing stress responses of monolithic Cu and Nb films to those of the Cu/Nb systems, the nanoscale metallic multilayers show a similar increase in stress above 200 °C to the Nb monolithic films, indicating that Nb components play a larger role in stress development than Cu. Local stress calculations from X-ray diffraction peak shifts collected during heating reveal that the component layers within a multilayer film respond similarly to their monolithic counterparts.

36 MATERIALS SCIENCE↗
DOE OSTI2019

Hillock formation in co-deposited thin films of immiscible metal alloy systems

Hillocks are protruding sections of a surface that can influence the electronic and mechanical properties of a thin film. In monolithic films, these hillocks are formed due to thermally induced stress gradients during deposition. In this study, the surface morphology of co-sputtered immiscible Cu-X (X is a body centered cubic (BCC) group V or VI metal) thin films is characterized to elucidate the conditions that lead to hillock formation. Cu-Ta and Cu-Mo-Ag films were co-deposited with physical vapor deposition (PVD) magnetron sputtering at 25, 400, 600, and 800°C. A significant number of homogeneously distributed surface hillocks were observed only in the 600 and 800°C films. High-angle annular dark field (HAADF) cross-sectional imaging revealed significant Cu agglomerations underneath the protruding features. For the Cu-Ta films, the Cu was enveloped in a Cu-Ta nanocrystalline matrix. For Cu-Mo-Ag, the Cu was surrounded by Mo-Ag concentration modulations. While thermal stress gradients arise during deposition of immiscible metal films, biaxial stress calculations and literature cases reveal that they are not solely responsible for hillock formation. The observed morphologies align with a surface diffusion kinetic model that evaluates diffusion length of adatoms during deposition as a function of deposition temperature. Finally, this indicates a phase separation driving force paired with the constituent elements’ dissimilar mobilities at elevated deposition temperatures contribute to the presence of hillocks.

36 MATERIALS SCIENCE↗
DOE OSTI2022

DCIF (Directional Cooling-Induced Fracturing) Westerly Granite AE Borehole Damage Effect Test (Task 3-0)

Directional Cooling-Induced Fracturing (DCIF) experiments were conducted on three rectangular Westerly granite blocks (width=depth=4.0", height=2.0") which were preheated to 200, 400, and 600 degree C to induce damage (microcracks) with varying degrees. Liquid nitrogen was poured in a small, 1"-diameter copper cup attached to the top of the sample, and the resulting acoustic emissions (AEs) and temperature changes on the surface of the sample were monitored. The experiments were conducted under one selected biaxial stress (5.8MPa). The obtained AEs were used to determine the microcracking source locations and amplitude, and the associated moment tensors. The onset time of the AEs was correlated with the cooling temperature, which was used to show that the temperature at the onset of microcracking is not affected significantly by the preexisting damage, compared to the impact of the stress in the sample. Included in this submission are the animations of the AE locations and graphics displaying the measured temperature-AE activity changes for samples with different degrees of microcrack damage.

15 GEOTHERMAL ENERGY↗