SEARCH · Engineering Papers

Results for “READOUT”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

SourceResearch connectionFrom yearThrough year

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 1,189 records · Page 66

All sources NASA NTRS DOE OSTI

NASA NTRS2007

Increasing Linear Dynamic Range of a CMOS Image Sensor

A generic design and a corresponding operating sequence have been developed for increasing the linear-response dynamic range of a complementary metal oxide/semiconductor (CMOS) image sensor. The design provides for linear calibrated dual-gain pixels that operate at high gain at a low signal level and at low gain at a signal level above a preset threshold. Unlike most prior designs for increasing dynamic range of an image sensor, this design does not entail any increase in noise (including fixed-pattern noise), decrease in responsivity or linearity, or degradation of photometric calibration. The figure is a simplified schematic diagram showing the circuit of one pixel and pertinent parts of its column readout circuitry. The conventional part of the pixel circuit includes a photodiode having a small capacitance, CD. The unconventional part includes an additional larger capacitance, CL, that can be connected to the photodiode via a transfer gate controlled in part by a latch. In the high-gain mode, the signal labeled TSR in the figure is held low through the latch, which also helps to adapt the gain on a pixel-by-pixel basis. Light must be coupled to the pixel through a microlens or by back illumination in order to obtain a high effective fill factor; this is necessary to ensure high quantum efficiency, a loss of which would minimize the efficacy of the dynamic- range-enhancement scheme. Once the level of illumination of the pixel exceeds the threshold, TSR is turned on, causing the transfer gate to conduct, thereby adding CL to the pixel capacitance. The added capacitance reduces the conversion gain, and increases the pixel electron-handling capacity, thereby providing an extension of the dynamic range. By use of an array of comparators also at the bottom of the column, photocharge voltages on sampling capacitors in each column are compared with a reference voltage to determine whether it is necessary to switch from the high-gain to the low-gain mode. Depending upon the built-in offset in each pixel and in each comparator, the point at which the gain change occurs will be different, adding gain-dependent fixed pattern noise in each pixel. The offset, and hence the fixed pattern noise, is eliminated by sampling the pixel readout charge four times by use of four capacitors (instead of two such capacitors as in conventional design) connected to the bottom of the column via electronic switches SHS1, SHR1, SHS2, and SHR2, respectively, corresponding to high and low values of the signals TSR and RST. The samples are combined in an appropriate fashion to cancel offset-induced errors, and provide spurious-free imaging with extended dynamic range.

Pain, Bedabrata↗

NASA NTRS2007

Flight Qualified Micro Sun Sensor

A prototype small, lightweight micro Sun sensor (MSS) has been flight qualified as part of the attitude-determination system of a spacecraft or for Mars surface operations. The MSS has previously been reported at a very early stage of development in NASA Tech Briefs, Vol. 28, No. 1 (January 2004). An MSS is essentially a miniature multiple-pinhole electronic camera combined with digital processing electronics that functions analogously to a sundial. A micromachined mask containing a number of microscopic pinholes is mounted in front of an active-pixel sensor (APS). Electronic circuits for controlling the operation of the APS, readout from the pixel photodetectors, and analog-to-digital conversion are all integrated onto the same chip along with the APS. The digital processing includes computation of the centroids of the pinhole Sun images on the APS. The spacecraft computer has the task of converting the Sun centroids into Sun angles utilizing a calibration polynomial. The micromachined mask comprises a 500-micron-thick silicon wafer, onto which is deposited a 57-nm-thick chromium adhesion- promotion layer followed by a 200-nm-thick gold light-absorption layer. The pinholes, 50 microns in diameter, are formed in the gold layer by photolithography. The chromium layer is thin enough to be penetrable by an amount of Sunlight adequate to form measurable pinhole images. A spacer frame between the mask and the APS maintains a gap of .1 mm between the pinhole plane and the photodetector plane of the APS. To minimize data volume, mass, and power consumption, the digital processing of the APS readouts takes place in a single field-programmable gate array (FPGA). The particular FPGA is a radiation- tolerant unit that contains .32,000 gates. No external memory is used so the FPGA calculates the centroids in real time as pixels are read off the APS with minimal internal memory. To enable the MSS to fit into a small package, the APS, the FPGA, and other components are mounted on a single two-sided board following chip-on-board design practices

Liebe, Carl Christian↗

NASA NTRS2007

"Smart" Sensor Module

An assembly that contains a sensor, sensor-signal-conditioning circuitry, a sensor-readout analog-to-digital converter (ADC), data-storage circuitry, and a microprocessor that runs special-purpose software and communicates with one or more external computer(s) has been developed as a prototype of "smart" sensor modules for monitoring the integrity and functionality (the "health") of engineering systems. Although these modules are now being designed specifically for use on rocket-engine test stands, it is anticipated that they could also readily be designed to be incorporated into health-monitoring subsystems of such diverse engineering systems as spacecraft, aircraft, land vehicles, bridges, buildings, power plants, oilrigs, and defense installations. The figure is a simplified block diagram of the "smart" sensor module. The analog sensor readout signal is processed by the ADC, the digital output of which is fed to the microprocessor. By means of a standard RS-232 cable, the microprocessor is connected to a local personal computer (PC), from which software is downloaded into a randomaccess memory in the microprocessor. The local PC is also used to debug the software. Once the software is running, the local PC is disconnected and the module is controlled by, and all output data from the module are collected by, a remote PC via an Ethernet bus. Several smart sensor modules like this one could be connected to the same Ethernet bus and controlled by the single remote PC. The software running in the microprocessor includes driver programs for operation of the sensor, programs that implement self-assessment algorithms, programs that implement protocols for communication with the external computer( s), and programs that implement evolutionary methodologies to enable the module to improve its performance over time. The design of the module and of the health-monitoring system of which it is a part reflects the understanding that the main purpose of a health-monitoring system is to detect damage and, therefore, the health-monitoring system must be able to function effectively in the presence of damage and should be capable of distinguishing between damage to itself and damage to the system being monitored. A major benefit afforded by the self-assessment algorithms is that in the output of the module, the sensor data indicative of the health of the engineering system being monitored are coupled with a confidence factor that quantifies the degree of reliability of the data. Hence, the output includes information on the health of the sensor module itself in addition to information on the health of the engineering system being monitored.

Mahajan, Ajay↗

NASA NTRS2011

Cycle Time Reduction in Trapped Mercury Ion Atomic Frequency Standards

The use of the mercury ion isotope (201)Hg(+) was examined for an atomic clock. Taking advantage of the faster optical pumping time in (201)Hg(+) reduces both the state preparation and the state readout times, thereby decreasing the overall cycle time of the clock and reducing the impact of medium-term LO noise on the performance of the frequency standard. The spectral overlap between the plasma discharge lamp used for (201)Hg(+) state preparation and readout is much larger than that of the lamp used for the more conventional (199)Hg(+). There has been little study of (201)Hg(+) for clock applications (in fact, all trapped ion clock work in mercury has been with (199)Hg(+); however, recently the optical pumping time in (201)Hg(+) has been measured and found to be 0.45 second, or about three times faster than in (199)Hg(+) due largely to the better spectral overlap. This can be used to reduce the overall clock cycle time by over 2 seconds, or up to a factor of 2 improvement. The use of the (201)Hg(+) for an atomic clock is totally new. Most attempts to reduce the impact of LO noise have focused on reducing the interrogation time. In the trapped ion frequency standards built so far at JPL, the optical pumping time is already at its minimum so that no enhancement can be had by shortening it. However, by using (201)Hg(+), this is no longer the case. Furthermore, integrity monitoring, the mechanism that determines whether the clock is functioning normally, cannot happen faster than the clock cycle time. Therefore, a shorter cycle time will enable quicker detection of failure modes and recovery from them.

Burt, Eric A.↗

NASA NTRS2011

Correction for Self-Heating When Using Thermometers as Heaters in Precision Control Applications

In precision control applications, thermometers have temperature-dependent electrical resistance with germanium or other semiconductor material thermistors, diodes, metal film and wire, or carbon film resistors. Because resistance readout requires excitation current flowing through the sensor, there is always ohmic heating that leads to a temperature difference between the sensing element and the monitored object. In this work, a thermistor can be operated as a thermometer and a heater, simultaneously, by continuously measuring the excitation current and the corresponding voltage. This work involves a method of temperature readout where the temperature offset due to self-heating is subtracted exactly.

Ressler, Michael E.↗

NASA NTRS2011

Simulation and Measurement of Absorbed Dose from 137 Cs Gammas Using a Si Timepix Detector

The TimePix readout chip is a hybrid pixel detector with over 65k independent pixel elements. Each pixel contains its own circuitry for charge collection, counting logic, and readout. When coupled with a Silicon detector layer, the Timepix chip is capable of measuring the charge, and thus energy, deposited in the Silicon. Measurements using a NIST traceable 137Cs gamma source have been made at Johnson Space Center using such a Si Timepix detector, and this data is compared to simulations of energy deposition in the Si layer carried out using FLUKA.

Stoffle, Nicholas↗

NASA NTRS2006

Dual Common Planes for Time Multiplexing of Dual-Color QWIPs

A proposed improved method of externally controlled time multiplexing of the readouts of focal-plane arrays of pairs of stacked quantum-well infrared photodetectors (QWIPs) that operate in different wavelength bands is based on a dual-detector-common-plane circuit configuration. The method would be implemented in a QWIP integrated-circuit chip hybridized with a readout integrated-circuit (ROIC) chip.

Rafol, Sir B.↗

NASA NTRS2011

Small, Fast TES Microcalorimeters with Unprecedented X-ray Spectral Performance

Driven initially by the desire for X-ray microcalorimeter arrays suitable for imaging the dynamic solar corona, we have developed a transition-edge-sensor (TES) microcalorimeter optimization that exhibits a unique combination of high spectral resolving power and a wide X-ray bandpass. These devices have achieved spectral performance of dE approximately 1.3 eV FWHM at 1.5 keV, 1.6 eV at 6 keV, and 2.0 eV at 8 keV, using small TESs (e.g., approximately 35 micron x 35 micron) that operate in a regime in which the superconducting transition is highly current dependent. In order to accommodate high X-ray count rates, the devices sit directly on a solid substrate instead of on membranes, and we use an embedded heatsinking layer to reduce pixel-to-pixel crosstalk. We will present results from devices with a range of TES and absorber sizes, and from device wafers with varied embedded heatsink materials. This contribution will focus on count-rate capabilities, including a discussion of the trade-off between count rate and energy resolution, and the heatsinking design. We will also present preliminary tests of array readout using a code-division multiplexed SQUID readout scheme, which may be necessary to enable large arrays of these fast devices.

Eckart, M. E.↗

NASA NTRS2004

Ambient-Light-Canceling Camera Using Subtraction of Frames

The ambient-light-canceling camera (ALCC) is a proposed near-infrared electronic camera that would utilize a combination of (1) synchronized illumination during alternate frame periods and (2) subtraction of readouts from consecutive frames to obtain images without a background component of ambient light. The ALCC is intended especially for use in tracking the motion of an eye by the pupil center corneal reflection (PCCR) method. Eye tracking by the PCCR method has shown potential for application in human-computer interaction for people with and without disabilities, and for noninvasive monitoring, detection, and even diagnosis of physiological and neurological deficiencies. In the PCCR method, an eye is illuminated by near-infrared light from a lightemitting diode (LED). Some of the infrared light is reflected from the surface of the cornea. Some of the infrared light enters the eye through the pupil and is reflected from back of the eye out through the pupil a phenomenon commonly observed as the red-eye effect in flash photography. An electronic camera is oriented to image the user's eye. The output of the camera is digitized and processed by algorithms that locate the two reflections. Then from the locations of the centers of the two reflections, the direction of gaze is computed. As described thus far, the PCCR method is susceptible to errors caused by reflections of ambient light. Although a near-infrared band-pass optical filter can be used to discriminate against ambient light, some sources of ambient light have enough in-band power to compete with the LED signal. The mode of operation of the ALCC would complement or supplant spectral filtering by providing more nearly complete cancellation of the effect of ambient light. In the operation of the ALCC, a near-infrared LED would be pulsed on during one camera frame period and off during the next frame period. Thus, the scene would be illuminated by both the LED (signal) light and the ambient (background) light during one frame period, and would be illuminated with only ambient (background) light during the next frame period. The camera output would be digitized and sent to a computer, wherein the pixel values of the background-only frame would be subtracted from the pixel values of the signal-plus-background frame to obtain signal-only pixel values (see figure). To prevent artifacts of motion from entering the images, it would be necessary to acquire image data at a rate greater than the standard video rate of 30 frames per second. For this purpose, the ALCC would exploit a novel control technique developed at NASA s Jet Propulsion Laboratory for advanced charge-coupled-device (CCD) cameras. This technique provides for readout from a subwindow [region of interest (ROI)] within the image frame. Because the desired reflections from the eye would typically occupy a small fraction of the area within the image frame, the ROI capability would make it possible to acquire and subtract pixel values at rates of several hundred frames per second considerably greater than the standard video rate and sufficient to both (1) suppress motion artifacts and (2) track the motion of the eye between consecutive subtractive frame pairs.

Morookian, John Michael↗

NASA NTRS2004

Improving Control of Two Motor Controllers

A computer program controls motors that drive translation stages in a metrology system that consists of a pair of two-axis cathetometers. This program is specific to Compumotor Gemini (or equivalent) motors and the Compumotor 6K-series (or equivalent) motor controller. Relative to the software supplied with the controller, this program affords more capabilities and is easier to use. Written as a Virtual Instrument in the LabVIEW software system, the program presents an imitation control panel that the user can manipulate by use of a keyboard and mouse. There are three modes of operation: command, movement, and joystick. In command mode, single commands are sent to the controller for troubleshooting. In movement mode, distance, speed, and/or acceleration commands are sent to the controller. Position readouts from the motors and from position encoders on the translation stages are displayed in marked fields. At any time, the position readouts can be recorded in a file named by the user. In joystick mode, the program yields control of the motors to a joystick. The program sends commands to, and receives data from, the controller via a serial cable connection, using the serial-communication portion of the software supplied with the controller.

Toland, Ronald W.↗

NASA NTRS2003

Surface-Micromachined Planar Arrays of Thermopiles

Planar two-dimensional arrays of thermopiles intended for use as thermal-imaging detectors are to be fabricated by a process that includes surface micromachining. These thermopile arrays are designed to perform better than do prior two-dimensional thermopile arrays. The lower performance of prior two-dimensional thermopile arrays is attributed to the following causes: The thermopiles are made from low-performance thermoelectric materials. The devices contain dielectric supporting structures, the thermal conductances of which give rise to parasitic losses of heat from detectors to substrates. The bulk-micromachining processes sometimes used to remove substrate material under the pixels, making it difficult to incorporate low-noise readout electronic circuitry. The thermoelectric lines are on the same level as the infrared absorbers, thereby reducing fill factor. The improved pixel design of a thermopile array of the type under development is expected to afford enhanced performance by virtue of the following combination of features: Surface-micromachined detectors are thermally isolated through suspension above readout circuitry. The thermopiles are made of such high-performance thermoelectric materials as Bi-Te and Bi-Sb-Te alloys. Pixel structures are supported only by the thermoelectric materials: there are no supporting dielectric structures that could leak heat by conduction to the substrate.

Foote, Marc C.↗

NASA NTRS2011

Optimization of Indium Bump Morphology for Improved Flip Chip Devices

Flip-chip hybridization, also known as bump bonding, is a packaging technique for microelectronic devices that directly connects an active element or detector to a substrate readout face-to-face, eliminating the need for wire bonding. In order to make conductive links between the two parts, a solder material is used between the bond pads on each side. Solder bumps, composed of indium metal, are typically deposited by thermal evaporation onto the active regions of the device and substrate. While indium bump technology has been a part of the electronic interconnect process field for many years and has been extensively employed in the infrared imager industry, obtaining a reliable, high-yield process for high-density patterns of bumps can be quite difficult. Under the right conditions, a moderate hydrogen plasma exposure can raise the temperature of the indium bump to the point where it can flow. This flow can result in a desirable shape where indium will efficiently wet the metal contact pad to provide good electrical contact to the underlying readout or imager circuit. However, it is extremely important to carefully control this process as the intensity of the hydrogen plasma treatment dramatically affects the indium bump morphology. To ensure the fine-tuning of this reflow process, it is necessary to have realtime feedback on the status of the bumps. With an appropriately placed viewport in a plasma chamber, one can image a small field (a square of approximately 5 millimeters on each side) of the bumps (10-20 microns in size) during the hydrogen plasma reflow process. By monitoring the shape of the bumps in real time using a video camera mounted to a telescoping 12 magnifying zoom lens and associated optical elements, an engineer can precisely determine when the reflow of the bumps has occurred, and can shut off the plasma before evaporation or de-wetting takes place.

Jones, Todd J.↗

NASA NTRS2012

Science from Kepler Collateral Data: 50 Kilosecond per Year from 13 Million Stars

As each Kepler frame is read out, light from each star in a CCD column accumulates in successive pixels as they wait for the next row to be read out. This accumulation is the same in the masked rows at the start of the readout and virtual rows at the end of the readout as it is in the science data. A range of these "smear" rows are added together for each long cadence and sent to the ground for calibration purposes. We will introduce and describe this smear collateral data, discuss and demonstrate its potential use for scientific studies exclusive of Kepler calibration,[1,2] including global characteristics of stellar variability, which are influenced by parameters of galactic evolution.

Kolodziejczak, J. J.↗

NASA NTRS2011

Science from Kepler Collateral Data: 50 Kilosecond per Year from 13 Million Star?

Kolodziejczak, J. J.↗

NASA NTRS2011

Multiple-Event, Single-Photon Counting Imaging Sensor

The single-photon counting imaging sensor is typically an array of silicon Geiger-mode avalanche photodiodes that are monolithically integrated with CMOS (complementary metal oxide semiconductor) readout, signal processing, and addressing circuits located in each pixel and the peripheral area of the chip. The major problem is its single-event method for photon count number registration. A single-event single-photon counting imaging array only allows registration of up to one photon count in each of its pixels during a frame time, i.e., the interval between two successive pixel reset operations. Since the frame time can t be too short, this will lead to very low dynamic range and make the sensor merely useful for very low flux environments. The second problem of the prior technique is a limited fill factor resulting from consumption of chip area by the monolithically integrated CMOS readout in pixels. The resulting low photon collection efficiency will substantially ruin any benefit gained from the very sensitive single-photon counting detection. The single-photon counting imaging sensor developed in this work has a novel multiple-event architecture, which allows each of its pixels to register as more than one million (or more) photon-counting events during a frame time. Because of a consequently boosted dynamic range, the imaging array of the invention is capable of performing single-photon counting under ultra-low light through high-flux environments. On the other hand, since the multiple-event architecture is implemented in a hybrid structure, back-illumination and close-to-unity fill factor can be realized, and maximized quantum efficiency can also be achieved in the detector array.

Zheng, Xinyu↗

NASA NTRS2012

Fabrication of a Cryogenic Bias Filter for Ultrasensitive Focal Plane

A fabrication process has been developed for cryogenic in-line filtering for the bias and readout of ultrasensitive cryogenic bolometers for millimeter and submillimeter wavelengths. The design is a microstripline filter that cuts out, or strongly attenuates, frequencies (10 50 GHz) that can be carried by wiring staged at cryogenic temperatures. The filter must have 100-percent transmission at DC and low frequencies where the bias and readout lines will carry signal. The fabrication requires the encapsulation of superconducting wiring in a dielectric-metal envelope with precise electrical characteristics. Sufficiently thick insulation layers with high-conductivity metal layers fully surrounding a patterned superconducting wire in arrayable formats have been demonstrated. A degenerately doped silicon wafer has been chosen to provide a metallic ground plane. A metallic seed layer is patterned to enable attachment to the ground plane. Thick silicon dioxide films are deposited at low temperatures to provide tunable dielectric isolation without degrading the metallic seed layer. Superconducting wiring is deposited and patterned using microstripline filtering techniques to cut out the relevant frequencies. A low Tc superconductor is used so that it will attenuate power strongly above the gap frequency. Thick dielectric is deposited on top of the circuit, and then vias are patterned through both dielectric layers. A thick conductive film is deposited conformally over the entire circuit, except for the contact pads for the signal and bias attachments to complete the encapsulating ground plane. Filters are high-aspect- ratio rectangles, allowing close packing in one direction, while enabling the chip to feed through the wall of a copper enclosure. The chip is secured in the copper wall using a soft metal seal to make good thermal and electrical contact to the outer shield.

Chervenak, James↗

NASA NTRS2012

Multicolor Detectors for Ultrasensitive Long-Wave Imaging Cameras

A document describes a zeptobolometer for ultrasensitive, long-wavelength sensors. GSFC is developing pixels based on the zeptobolometer design that sense three THz wavelengths simultaneously. Two innovations are described in the document: (1) a quasiparticle (QO) filter arrangement that enables a compact multicolor spectrum at the focal plane, and (2) a THz antenna readout by up to three bolometers. The innovations enable high efficiency by greatly reducing high, frequency-dependent microstrip losses, and pixel compactness by eliminating the need for bulky filters in the focal plane. The zeptobolometer is a small TES bolometer, on the scale of a few microns, which can be readily coupled through an impedance-matching resistor to a metal or dielectric antenna. The bolometer is voltage-biased in its superconducting transition, allowing the use of superconducting RF multiplexers to read out large arrays. The antenna is geometrically tapped at three locations so as to efficiently couple radiation of three distinct wavelengths to the individual TESs. The transition edge hot electrons in metals offer a simple, compact arrangement for antenna readout, which can be crucial in the THz where line losses at high frequencies can be substantial. A metallic grill filter acts as a high-pass filter and directs the low-frequency components to a location where they will be absorbed. The absorption spectrum shows that three well-separated THz bands are feasible. The filters can be made from high-purity dielectrics such as float zone silicon or sapphire.

Brown, Ari↗

NASA NTRS2012

Development of Kilo-Pixel Arrays of Transition-Edge Sensors for X-Ray Spectroscopy

We are developing kilo-pixel arrays of transition-edge sensor (TES) microcalorimeters for future X-ray astronomy observatories or for use in laboratory astrophysics applications. For example, Athena/XMS (currently under study by the european space agency) would require a close-packed 32x32 pixel array on a 250-micron pitch with < 3.0 eV full-width-half-maximum energy resolution at 6 keV and at count-rates of up to 50 counts/pixel/second. We present characterization of 32x32 arrays. These detectors will be readout using state of the art SQUID based time-domain multiplexing (TDM). We will also present the latest results in integrating these detectors and the TDM readout technology into a 16 row x N column field-able instrument.

Adams, J. S.↗