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At least 1,153 records · Page 64

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NASA NTRS2007

Auxiliary Components for Kilopixel Transition Edge Sensor Arrays

We have fabricated transition edge sensor bolometer focal plane arrays sensitive to mm-submillimeter (0.1-3 THz) radiation for the Atacama Cosmology Telescope (ACT), which will probe the cosmic microwave background at 0.147,0.215, and 0.279 GHz. Central to the performance of these bolometers is a set of auxiliary resistive components. Here we discuss shunt resistors, which allow for tight optimization of bolometer time constant and sensitivity. Our shunt resistors consist of AuPd strips grown atop of interdigitated superconducting MoN, wires. We can tailor the shunt resistance by altering the dimensions of the AuPd strips and the pitch and width of the MoN, wires and can fabricate over 1000 shunts on a single 4" wafer. By modeling the resistance dependence of these parameters, a variety of different 0.77 +I-0.13 mOhm shunt resistors have been fabricated. This variety includes different shunts possessing MoN, wires with wire width equal to 1.5 and 10 microns and pitch equal to 4.5 and 26 microns, respectively. Our ability to set the resistance of the shunts hints at the scalability of our design. We have also integrated a Si02 capping layer into our shunt resistor fabrication scheme, which inhibits metal corrosion and eventual degradation of the shunt. Consequently, their robustness coupled with their high packing density makes these resistive components attractive for future kilopixel detector arrays.

Brown, Ari-David↗

NASA NTRS2009

Lightweight electrical connector split backshell

An electrical connector split backshell is provided, comprising two substantially identical backshell halves. Each half includes a first side and a cam projecting therefrom along an axis perpendicular thereto, the cam having an alignment tooth with a constant radius and an engagement section with a radius that increases with angular distance from the alignment tooth. Each half further includes a second side parallel to the first side and a circular sector opening disposed in the second side, the circular sector opening including an inner surface configured as a ramp with a constant radius, the ramp being configured to engage with an engagement section of a cam of the other half, the circular sector opening further including a relieved pocket configured to receive an alignment tooth of the cam of the other half. Each half further includes a back side perpendicular to the first and second sides and a wire bundle notch disposed in the back side, the wire bundle notch configured to align with a wire bundle notch of the other half to form a wire bundle opening. The two substantially identical halves are rotatably coupled by engaging the engagement section of each half to the ramp of the other half.

Goldman, Elliot↗

NASA NTRS2009

Nanowire electron scattering spectroscopy

Methods and devices for spectroscopic identification of molecules using nanoscale wires are disclosed. According to one of the methods, nanoscale wires are provided, electrons are injected into the nanoscale wire; and inelastic electron scattering is measured via excitation of low-lying vibrational energy levels of molecules bound to the nanoscale wire.

Hunt, Brian D.↗

NASA NTRS2010

Magnesium Diboride Current Leads

A recently discovered superconductor, magnesium diboride (MgB2), can be used to fabricate conducting leads used in cryogenic applications. Dis covered to be superconducting in 2001, MgB2 has the advantage of remaining superconducting at higher temperatures than the previously used material, NbTi. The purpose of these leads is to provide 2 A of electricity to motors located in a 1.3 K environment. The providing environment is a relatively warm 17 K. Requirements for these leads are to survive temperature fluctuations in the 5 K and 11 K heat sinks, and not conduct excessive heat into the 1.3 K environment. Test data showed that each lead in the assembly could conduct 5 A at 4 K, which, when scaled to 17 K, still provided more than the required 2 A. The lead assembly consists of 12 steelclad MgB2 wires, a tensioned Kevlar support, a thermal heat sink interface at 4 K, and base plates. The wires are soldered to heavy copper leads at the 17 K end, and to thin copper-clad NbTi leads at the 1.3 K end. The leads were designed, fabricated, and tested at the Forschungszentrum Karlsruhe - Institut foer Technische Physik before inclusion in Goddard's XRS (X-Ray Spectrometer) instrument onboard the Astro-E2 spacecraft. A key factor is that MgB2 remains superconducting up to 30 K, which means that it does not introduce joule heating as a resistive wire would. Because the required temperature ranges are 1.3-17 K, this provides a large margin of safety. Previous designs lost superconductivity at around 8 K. The disadvantage to MgB2 is that it is a brittle ceramic, and making thin wires from it is challenging. The solution was to encase the leads in thin steel tubes for strength. Previous designs were so brittle as to risk instrument survival. MgB2 leads can be used in any cryogenic application where small currents need to be conducted at below 30 K. Because previous designs would superconduct only at up to 8 K, this new design would be ideal for the 8-30 K range.

Panek, John↗

NASA NTRS2004

Modular Rake of Pitot Probes

The figure presents selected views of a modular rake of 17 pitot probes for measuring both transient and steady-state pressures in a supersonic wind tunnel. In addition to pitot tubes visible in the figure, the probe modules contain (1) high-frequency dynamic-pressure transducers connected through wires to remote monitoring circuitry and (2) flow passages that lead to tubes that, in turn, lead to remote steady-state pressure transducers. Prior pitot-probe rakes were fabricated as unitary structures, into which the individual pitot probes were brazed. Repair or replacement of individual probes was difficult, costly, and time-consuming because (1) it was necessary to remove entire rakes in order to unbraze individual malfunctioning probes and (2) the heat of unbrazing a failed probe and of brazing a new probe in place could damage adjacent probes. In contrast, the modules in the present probe are designed to be relatively quickly and easily replaceable with no heating and, in many cases, without need for removal of the entire rake from the wind tunnel. To remove a malfunctioning probe, one first removes a screw-mounted V-cross-section cover that holds the probe and adjacent probes in place. Then one removes a screw-mounted cover plate to gain access to the steady-state pressure tubes and dynamicpressure wires. Next, one disconnects the tube and wires of the affected probe. Finally, one installs a new probe in the reverse of the aforementioned sequence. The wire connections can be made by soldering, but to facilitate removal and installation, they can be made via miniature plugs and sockets. The connections between the probe flow passages and the tubes leading to the remote pressure sensors can be made by use of any of a variety of readily available flexible tubes that can be easily pulled off and slid back on for removal and installation, respectively.

Dunlap, Timothy A.↗

NASA NTRS2004

Miniature Linear Actuator for Small Spacecraft

A report discusses the development of a kit of mechanisms intended for use aboard future spacecraft having masses between 10 and 100 kg. The report focuses mostly on two prototypes of one of the mechanisms: a miniature linear actuator based on a shape-memory-alloy (SMA) wire. In this actuator, as in SMA-wire actuators described previously in NASA Tech Briefs, a spring biases a moving part toward one limit of its stroke and is restrained or pulled toward the other limit of the stroke by an SMA wire, which assumes a slightly lesser or greater "remembered" length, depending on whether or not an electric current is applied to the wire to heat it above a transition temperature. Topics addressed in the report include the need to develop mechanisms like these, the general approach to be taken in designing SMA actuators, tests of the two prototypes of the miniature linear actuators, and improvements in the second prototype over the first prototype resulting in reduced mass and increased stroke. The report also presents recommendations for future development, briefly discusses problems of tolerances and working with small parts, states a need for better understanding of behaviors of SMAs, and presents conclusions.

Willey, Cliff E.↗

NASA NTRS2011

High precision electric gate for time-of-flight ion mass spectrometers

A time-of-flight mass spectrometer having a chamber with electrodes to generate an electric field in the chamber and electric gating for allowing ions with a predetermined mass and velocity into the electric field. The design uses a row of very thin parallel aligned wires that are pulsed in sequence so the ion can pass through the gap of two parallel plates, which are biased to prevent passage of the ion. This design by itself can provide a high mass resolution capability and a very precise start pulse for an ion mass spectrometer. Furthermore, the ion will only pass through the chamber if it is within a wire diameter of the first wire when it is pulsed and has the right speed so it is near all other wires when they are pulsed.

Sittler, Edward C.↗

NASA NTRS2012

Fabrication of a Cryogenic Bias Filter for Ultrasensitive Focal Plane

A fabrication process has been developed for cryogenic in-line filtering for the bias and readout of ultrasensitive cryogenic bolometers for millimeter and submillimeter wavelengths. The design is a microstripline filter that cuts out, or strongly attenuates, frequencies (10 50 GHz) that can be carried by wiring staged at cryogenic temperatures. The filter must have 100-percent transmission at DC and low frequencies where the bias and readout lines will carry signal. The fabrication requires the encapsulation of superconducting wiring in a dielectric-metal envelope with precise electrical characteristics. Sufficiently thick insulation layers with high-conductivity metal layers fully surrounding a patterned superconducting wire in arrayable formats have been demonstrated. A degenerately doped silicon wafer has been chosen to provide a metallic ground plane. A metallic seed layer is patterned to enable attachment to the ground plane. Thick silicon dioxide films are deposited at low temperatures to provide tunable dielectric isolation without degrading the metallic seed layer. Superconducting wiring is deposited and patterned using microstripline filtering techniques to cut out the relevant frequencies. A low Tc superconductor is used so that it will attenuate power strongly above the gap frequency. Thick dielectric is deposited on top of the circuit, and then vias are patterned through both dielectric layers. A thick conductive film is deposited conformally over the entire circuit, except for the contact pads for the signal and bias attachments to complete the encapsulating ground plane. Filters are high-aspect- ratio rectangles, allowing close packing in one direction, while enabling the chip to feed through the wall of a copper enclosure. The chip is secured in the copper wall using a soft metal seal to make good thermal and electrical contact to the outer shield.

Chervenak, James↗

NASA NTRS2012

Iridium Interfacial Stack - IrIS

Iridium Interfacial Stack (IrIS) is the sputter deposition of high-purity tantalum silicide (TaSi2-400 nm)/platinum (Pt-200 nm)/iridium (Ir-200 nm)/platinum (Pt-200 nm) in an ultra-high vacuum system followed by a 600 C anneal in nitrogen for 30 minutes. IrIS simultaneously acts as both a bond metal and a diffusion barrier. This bondable metallization that also acts as a diffusion barrier can prevent oxygen from air and gold from the wire-bond from infiltrating silicon carbide (SiC) monolithically integrated circuits (ICs) operating above 500 C in air for over 1,000 hours. This TaSi2/Pt/Ir/Pt metallization is easily bonded for electrical connection to off-chip circuitry and does not require extra anneals or masking steps. There are two ways that IrIS can be used in SiC ICs for applications above 500 C: it can be put directly on a SiC ohmic contact metal, such as Ti, or be used as a bond metal residing on top of an interconnect metal. For simplicity, only the use as a bond metal is discussed. The layer thickness ratio of TaSi2 to the first Pt layer deposited thereon should be 2:1. This will allow Si from the TaSi2 to react with the Pt to form Pt2Si during the 600 C anneal carried out after all layers have been deposited. The Ir layer does not readily form a silicide at 600 C, and thereby prevents the Si from migrating into the top-most Pt layer during future anneals and high-temperature IC operation. The second (i.e., top-most) deposited Pt layer needs to be about 200 nm to enable easy wire bonding. The thickness of 200 nm for Ir was chosen for initial experiments; further optimization of the Ir layer thickness may be possible via further experimentation. Ir itself is not easily wire-bonded because of its hardness and much higher melting point than Pt. Below the iridium layer, the TaSi2 and Pt react and form desired Pt2Si during the post-deposition anneal while above the iridium layer remains pure Pt as desired to facilitate easy and strong wire-bonding to the SiC chip circuitry.

Spry, David↗

NASA NTRS2012

Orion MPCV Service Module Avionics Ring Pallet Testing, Correlation, and Analysis

The NASA Orion Multi-Purpose Crew Vehicle (MPCV) is being designed to replace the Space Shuttle as the main manned spacecraft for the agency. Based on the predicted environments in the Service Module avionics ring, an isolation system was deemed necessary to protect the avionics packages carried by the spacecraft. Impact, sinusoidal, and random vibration testing were conducted on a prototype Orion Service Module avionics pallet in March 2010 at the NASA Glenn Research Center Structural Dynamics Laboratory (SDL). The pallet design utilized wire rope isolators to reduce the vibration levels seen by the avionics packages. The current pallet design utilizes the same wire rope isolators (M6-120-10) that were tested in March 2010. In an effort to save cost and schedule, the Finite Element Models of the prototype pallet tested in March 2010 were correlated. Frequency Response Function (FRF) comparisons, mode shape and frequency were all part of the correlation process. The non-linear behavior and the modeling the wire rope isolators proved to be the most difficult part of the correlation process. The correlated models of the wire rope isolators were taken from the prototype design and integrated into the current design for future frequency response analysis and component environment specification.

Staab, Lucas↗

NASA NTRS2012

Amplifier Module for 260-GHz Band Using Quartz Waveguide Transitions

Packaging of MMIC LNA (monolithic microwave integrated circuit low-noise amplifier) chips at frequencies over 200 GHz has always been problematic due to the high loss in the transition between the MMIC chip and the waveguide medium in which the chip will typically be used. In addition, above 200 GHz, wire-bond inductance between the LNA and the waveguide can severely limit the RF matching and bandwidth of the final waveguide amplifier module. This work resulted in the development of a low-loss quartz waveguide transition that includes a capacitive transmission line between the MMIC and the waveguide probe element. This capacitive transmission line tunes out the wirebond inductance (where the wire-bond is required to bond between the MMIC and the probe element). This inductance can severely limit the RF matching and bandwidth of the final waveguide amplifier module. The amplifier module consists of a quartz E-plane waveguide probe transition, a short capacitive tuning element, a short wire-bond to the MMIC, and the MMIC LNA. The output structure is similar, with a short wire-bond at the output of the MMIC, a quartz E-plane waveguide probe transition, and the output waveguide. The quartz probe element is made of 3-mil quartz, which is the thinnest commercially available material. The waveguide band used is WR4, from 170 to 260 GHz. This new transition and block design is an improvement over prior art because it provides for better RF matching, and will likely yield lower loss and better noise figure. The development of high-performance, low-noise amplifiers in the 180-to- 700-GHz range has applications for future earth science and planetary instruments with low power and volume, and astrophysics array instruments for molecular spectroscopy. This frequency band, while suitable for homeland security and commercial applications (such as millimeter-wave imaging, hidden weapons detection, crowd scanning, airport security, and communications), also has applications to future NASA missions. The Global Atmospheric Composition Mission (GACM) in the NRC Decadel Survey will need low-noise amplifiers with extremely low noise temperatures, either at room temperature or for cryogenic applications, for atmospheric remote sensing.

Padmanabhan, Sharmila↗

NASA NTRS2013

The Challenges of Integrating Instrumentation with Inflatable Aerodynamic Decelerators

To realize the National Aeronautics and Space Administration s (NASA) goal of landing humans on Mars, development of technologies to facilitate the landing of heavy payloads are being explored. Current entry, decent, and landing technologies are not practical when utilizing these heavy payloads due to mass and volume constraints dictated by limitations imposed by current launch vehicle fairings. Therefore, past and present technologies are now being considered to provide a mass and volume efficient solution, including Inflatable Aerodynamic Decelerators (IADs) [1]. IAD ground and flight tests are currently being conducted to develop and characterize their performance under flight-like conditions. The integrated instrumentation systems, which are key to the performance characterization in each of these tests, have proven to be a challenge compared to the instrumentation of traditional rigid aeroshells. To overcome these challenges, flexible and embedded sensing systems have been developed, along with improved instrumenting techniques. This development opportunity faces many difficult aspects specific to inflatable structures in extreme environments. These include but are not limited to: physical flexibility, packaging, temperature, structural integration and data acquisition [2]. To better define the instrumentation challenges posed by IAD technology development, a survey was conducted to identify valuable measurements for ground and flight testing. From this survey many sensing technologies were explored, resulting in a down-selection to the most viable prospects. These systems were then iterated upon in design to determine the best integration techniques specific to a 3m and 6m stacked torus IAD. Each sensing system was then integrated and employed to support the IAD testing in the National Full-Scale Aerodynamics Complex 40 x 80 wind tunnel at NASA Ames Research Center in the summer of 2012. Another challenge that has been explored is the data acquisition of IAD sensing technologies. Traditionally all space based sensing systems transmit their data through a wired interface. This limits the amount of sensors able to be integrated within the IAD due to volume and routing restrictions of the supporting signal and excitation wires. To alleviate this situation, multiple wireless data acquisition technologies have been researched and developed through rapid prototyping efforts. The final custom multi-nodal wireless system utilized during the summer 2012 IAD test series consisted of four remote nodes and one receiving base station. The system reliably conditioned and acquired 20+ sensors over the course of the wind tunnel test series. These developments in wireless data acquisition techniques can eliminate the need for structural feedthroughs and reduce system mass associated with wiring and wire harnesses. This makes the utilization of flight instrumentation more attractive to future missions, which would result in further improved characterization of IAD technology, and overall, increased scientific knowledge regarding the response of inflatable structures to extreme entry environments. [

Swanson, Gregory T.↗

NASA NTRS2007

High Temperature Wireless Communication And Electronics For Harsh Environment Applications

In order for future aerospace propulsion systems to meet the increasing requirements for decreased maintenance, improved capability, and increased safety, the inclusion of intelligence into the propulsion system design and operation becomes necessary. These propulsion systems will have to incorporate technology that will monitor propulsion component conditions, analyze the incoming data, and modify operating parameters to optimize propulsion system operations. This implies the development of sensors, actuators, and electronics, with associated packaging, that will be able to operate under the harsh environments present in an engine. However, given the harsh environments inherent in propulsion systems, the development of engine-compatible electronics and sensors is not straightforward. The ability of a sensor system to operate in a given environment often depends as much on the technologies supporting the sensor element as the element itself. If the supporting technology cannot handle the application, then no matter how good the sensor is itself, the sensor system will fail. An example is high temperature environments where supporting technologies are often not capable of operation in engine conditions. Further, for every sensor going into an engine environment, i.e., for every new piece of hardware that improves the in-situ intelligence of the components, communication wires almost always must follow. The communication wires may be within or between parts, or from the engine to the controller. As more hardware is added, more wires, weight, complexity, and potential for unreliability is also introduced. Thus, wireless communication combined with in-situ processing of data would significantly improve the ability to include sensors into high temperature systems and thus lead toward more intelligent engine systems. NASA Glenn Research Center (GRC) is presently leading the development of electronics, communication systems, and sensors capable of prolonged stable operation in harsh 500C environments. This has included world record operation of SiC-based transistor technology (including packaging) that has demonstrated continuous electrical operation at 500C for over 2000 hours. Based on SiC electronics, development of high temperature wireless communication has been on-going. This work has concentrated on maturing the SiC electronic devices for communication purposes as well as the passive components such as resistors and capacitors needed to enable a high temperature wireless system. The objective is to eliminate wires associated with high temperature sensors which add weight to a vehicle and can be a cause of sensor unreliability. This paper discusses the development of SiC based electronics and wireless communications technology for harsh environment applications such as propulsion health management systems and in Venus missions. A brief overview of the future directions in sensor technology is given including maturing of near-room temperature "Lick and Stick" leak sensor technology for possible implementation in the Crew Launch Vehicle program. Then an overview of high temperature electronics and the development of high temperature communication systems is presented. The maturity of related technologies such as sensor and packaging will also be discussed. It is concluded that a significant component of efforts to improve the intelligence of harsh environment operating systems is the development and implementation of high temperature wireless technology

Hunter, G. W.↗

NASA NTRS2013

A Comparative Study of Four Impedance Eduction Methodologies Using Several Test Liners

A comparative study of four commonly used impedance eduction methods is presented for a range of liner structures and test conditions. Two of the methods are restricted to uniform flow while the other two accommodate both uniform and boundary layer flows. Measurements on five liner structures (a rigid-wall insert, a ceramic tubular liner, a wire mesh liner, a low porosity conventional liner, and a high porosity conventional liner) are obtained using the NASA Langley Grazing Flow Impedance Tube. The educed impedance of each liner is presented for forty-two test conditions (three Mach numbers and fourteen frequencies). In addition, the effects of moving the acoustic source from upstream to downstream and the refractive effects of the mean boundary layer on the wire mesh liner are investigated. The primary conclusions of the study are that: (1) more accurate results are obtained for the upstream source, (2) the uniform flow methods produce nearly identical impedance spectra at and below Mach 0.3 but significant scatter in the educed impedance occurs at the higher Mach number, (3) there is better agreement in educed impedance among the methods for the conventional liners than for the rigid-wall insert, ceramic, or wire mesh liner, and (4) the refractive effects of the mean boundary layer on the educed impedance of the wire mesh liner are generally small except at Mach 0.5.

Watson, Willie R.↗

NASA NTRS2013

Conductive Carbon Nanotube Inks for Use with Desktop Inkjet Printing Technology

Inkjet printing is a common commercial process. In addition to the familiar use in printing documents from computers, it is also used in some industrial applications. For example, wire manufacturers are required by law to print the wire type, gauge, and safety information on the exterior of each foot of manufactured wire, and this is typically done with inkjet or laser printers. The goal of this work was the creation of conductive inks that can be applied to a wire or flexible substrates via inkjet printing methods. The use of inkjet printing technology to print conductive inks has been in testing for several years. While researchers have been able to get the printing system to mechanically work, the application of conductive inks on substrates has not consistently produced adequate low resistances in the kilohm range. Conductive materials can be applied using a printer in single or multiple passes onto a substrate including textiles, polymer films, and paper. The conductive materials are composed of electrical conductors such as carbon nanotubes (including functionalized carbon nanotubes and metal-coated carbon nanotubes); graphene, a polycyclic aromatic hydrocarbon (e.g., pentacene and bisperipentacene); metal nanoparticles; inherently conductive polymers (ICP); and combinations thereof. Once the conductive materials are applied, the materials are dried and sintered to form adherent conductive materials on the substrate. For certain formulations, increased conductivity can be achieved by printing on substrates supported by low levels of magnetic field alignment. The adherent conductive materials can be used in applications such as damage detection, dust particle removal, smart coating systems, and flexible electronic circuitry. By applying alternating layers of different electrical conductors to form a layered composite material, a single homogeneous layer can be produced with improved electrical properties. It is believed that patterning alternate layers of different conductors may improve electrical pathways through alignment of the conductors and band gap optimization. One feature of this innovation is that flexible conductive traces could be accomplished with a conductive ink having a surface resistivity of less than 10 ohms/square. Another result was that a composite material comprising a mixture of carbon nanotubes and metallic nanoparticles could be applied by inkjet printing to flexible substrates, and the resulting applied material was one to two orders of magnitude more conductive than a material made by printing inks containing carbon nanotubes alone.

Roberson, Luke↗

NASA NTRS2014

Ultrasonic Inspection to Quantify Failure Pathologies of Crimped Electrical Connections

Previous work has shown that ultrasonic inspection provides a means of assessing electrical crimp quality that ensures the electrical and mechanical integrity of an initial crimp before the installation process is completed. The amplitude change of a compressional ultrasonic wave propagating at right angles to the wire axis and through the junction of a crimp termination was shown to correlate with the results of destructive pull tests, which is a standard for assessing crimp wire junction quality. Of additional concern are crimps made at high speed assembly lines for wiring harnesses, which are used for critical applications, such as in aircraft. During high-speed assembly it is possible that many faulty crimps go undetected until long after assembly, and fail in service. The position and speed of the crimping jaw become factors as the high-speed crimp is formed. The work presented in this paper is designed to cover the more difficult and more subtle area of high-speed crimps by taking into account the rate change of the measurements. Building on the previous work, we present an analysis methodology, based on transmitted ultrasonic energy and timing of the first received pulse that is shown to correlate to the gauge of the crimp/ferrule combination and the position of the crimping jaw. Results demonstrating the detectability of a number of the crimp failure pathologies, such as missing strands, partially inserted wires and incomplete crimp compression, are presented. The ability of this technique to estimate crimp height, a mechanical measure of crimp quality, is discussed.

Cramer, K. Elliott↗

NASA NTRS2015

An Investigation of Transonic Resonance in a Mach 2.2 Round Convergent-Divergent Nozzle

Hot-wire and acoustic measurements were taken for a round convergent nozzle and a round convergent-divergent (C-D) nozzle at a jet Mach number of 0.61. The C-D nozzle had a design Mach number of 2.2. Compared to the convergent nozzle jet flow, the Mach 2.2 nozzle jet flow produced excess broadband noise (EBBN). It also produced a transonic resonance tone at 1200 Herz. Computational simulations were performed for both nozzle flows. A steady Reynolds-Averaged Navier-Stokes simulation was performed for the convergent nozzle jet flow. For the Mach 2.2 nozzle flow, a steady RANS simulation, an unsteady RANS (URANS) simulation, and an unsteady Detached Eddy Simulation (DES) were performed. The RANS simulation of the convergent nozzle showed good agreement with the hot-wire velocity and turbulence measurements, though the decay of the potential core was over-predicted. The RANS simulation of the Mach 2.2 nozzle showed poor agreement with the experimental data, and more closely resembled an ideally-expanded jet. The URANS simulation also showed qualitative agreement with the hot-wire data, but predicted a transonic resonance at 1145 Herz. The DES showed good agreement with the hot-wire velocity and turbulence data. The DES also produced a transonic tone at 1135 Herz. The DES solution showed that the destabilization of the shock-induced separation region inside the nozzle produced increased levels of turbulence intensity. This is likely the source of the EBBN.

DES↗

NASA NTRS2013

Motor for High Temperature Applications

A high temperature motor has a stator with poles formed by wire windings, and a rotor with magnetic poles on a rotor shaft positioned coaxially within the stator. The stator and rotor are built up from stacks of magnetic-alloy laminations. The stator windings are made of high temperature magnet wire insulated with a vitreous enamel film, and the wire windings are bonded together with ceramic binder. A thin-walled cylinder is positioned coaxially between the rotor and the stator to prevent debris from the stator windings from reaching the rotor. The stator windings are wound on wire spools made of ceramic, thereby avoiding need for mica insulation and epoxy/adhesive. The stator and rotor are encased in a stator housing with rear and front end caps, and rear and front bearings for the rotor shaft are mounted on external sides of the end caps to keep debris from the motor migrating into the bearings' races.

Roopnarine↗