NGST phase retrieval camera design and calibration details
This presentation will detail the packaging and hardware chosen for the PRC, the PRC software, and calibration of the instrument.
wavefront↗
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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Results from the last DD and DT JET campaigns in the framework of the EUROfusion Tokamak Exploitation Work Package activity
JET, the only tokamak capable of operating with deuterium–tritium (D–T) fuel (since TFTR was shutdown in 1999), has provided essential experimental data to support ITER and DEMO design and operation. Within the EUROfusion Tokamak Exploitation Work Package, JET completed its final campaigns (2022–2023), culminating in the third D–T campaign (DTE3). These experiments addressed key challenges in plasma scenarios, exhaust control, and tritium management under reactor-relevant conditions. Significant progress was achieved in demonstrating ITER-like integrated scenarios with impurity seeding, achieving partial divertor detachment and high confinement ($H_{98}(y,2)$ ≈ 0.85) at 3 MA in D–T plasmas. Advanced exhaust regimes such as quasi-continuous exhaust (QCE) and X-point radiator (XPR) were successfully achieved first in D–D and then extended to D–T operation, confirming their relevance for mixed isotope operation. Operational milestones included a new world record of 69 MJ fusion energy in tritium-rich hybrid plasmas and long-pulse H-mode operation up to 60 s, contributing with unique data to the CICLOP database. Physics studies focused on peeling-limited pedestals in support of ITER and improved understanding of edge stability and impurity screening in metallic environments. Extensive usage of the shattered pellet injector (SPI) on JET provided critical information for the design of the ITER disruption mitigation system (DMS). Real-time control systems for D/T ratio control and plasma exhaust were deployed and demonstrated in D–D and D–T, while energetic particle physics investigations unfolded the role of fast ions in turbulence suppression mechanisms. Comprehensive tritium retention studies using gas balance method, post-mortem analysis, and ITER-relevant laser induced desorption spectroscopy (LIDS) diagnostics provided essential input for tritium accountancy strategies. These results are validating the ITER operational concepts, inform DEMO design, and deliver critical experience in nuclear operation and scenario integration.
disruptions↗
VAN-DAMME: GPU-accelerated and symmetry-assisted quantum optimal control of multi-qubit systems
We present an open-source software package, VAN-DAMME (Versatile Approaches to Numerically Design, Accelerate, and Manipulate Magnetic Excitations), for massively-parallelized quantum optimal control (QOC) calculations of multi-qubit systems. To enable large QOC calculations, the VAN-DAMME software package utilizes symmetry-based techniques with custom GPU-enhanced algorithms. This combined approach allows for the simultaneous computation of hundreds of matrix exponential propagators that efficiently leverage the intra-GPU parallelism found in high-performance GPUs. In addition, to maximize the computational efficiency of the VAN-DAMME code, we carried out several extensive tests on data layout, computational complexity, memory requirements, and performance. These extensive analyses allowed us to develop computationally efficient approaches for evaluating complex-valued matrix exponential propagators based on Padé approximants. To assess the computational performance of our GPU-accelerated VAN-DAMME code, we carried out QOC calculations of systems containing 10 - 15 qubits, which showed that our GPU implementation is 18.4× faster than the corresponding CPU implementation. Our GPU-accelerated enhancements allow efficient calculations of multi-qubit systems, which can be used for the efficient implementation of QOC applications across multiple domains.
97 MATHEMATICS AND COMPUTING↗
Common Graphics Library (CGL). Volume 2: Low-level user's guide
The intent is to instruct the users of the Low-Level routines of the Common Graphics Library (CGL). The Low-Level routines form an application-independent graphics package enabling the user community to construct and design scientific charts conforming to the publication and/or viewgraph process. The Low-Level routines allow the user to design unique or unusual report-quality charts from a set of graphics utilities. The features of these routines can be used stand-alone or in conjunction with other packages to enhance or augment their capabilities. This library is written in ANSI FORTRAN 77, and currently uses a CORE-based underlying graphics package, and is therefore machine-independent, providing support for centralized and/or distributed computer systems.
Taylor, Nancy L.↗
Reactor design and integration into a nuclear electric spacecraft
One of the well-defined applications for nuclear power in space is nuclear electric propulsion (NEP). Mission studies have identified the optimum power level (400 kWe). A single Shuttle launch requirement and science-package integration have added additional constraints to the design. A reactor design which will meet these constraints has been studied. The reactor employs 90 fuel elements, each heat pipe cooled. Reactor control is obtained with BeO/B4C drums in a BeO reflector. The balance of the spacecraft is shielded from the reactor with LiH. Power conditioning and reactor control drum drives are located behind the LiH with the power conditioning. Launch safety, mechanical design and integration with the power conversion subsystem are discussed.
Phillips, W. M.↗
Cracking the code of multi-layer films to promote circularity in single-use plastic packaging
Multi-layer film packaging (MLF) revolutionized food preservation by combining diverse material layers to optimize barrier properties, mechanical strength, and shelf-life. These materials are essential for transporting perishables across various climates and allow for access to fresh goods in “food deserts”, but they pose significant recycling challenges due to their structural complexity. This perspective examines key structure-property relationships governing barrier performance and highlights innovations in material design. We explore how machine learning can predict performance metrics and propose recyclable alternatives, integrating data-driven approaches with material science insights. By challenging the status quo of MLF design, we advocate for circularity in food packaging, inspiring innovation at the intersection of sustainability, material science, and artificial intelligence.
36 MATERIALS SCIENCE↗
Proposal for beta-test of GIFCORCODE
This year's effort produced very significant progress in the development of the software package heretofore known as GIFCORCODE. One important change has been in the name. The package is now named CONDUIT for CONtrol Designer's Unified InTerface. There have also been some more significant changes in the way CONDUIT is used. These changes caused some modifications in the work accomplished. Both the original goals for the year and the modifications will be described in the next section of this report. The major goal for this year was to bring CONDUIT to beta-test. This has been accomplished. The software package is in beta-test at Bell Helicopters and has been since September 1996. This and the other achievements during the past year are described in the third section of this report. Some discussion of the scaling issue is also included here. This is in answer to a question that arose at one of the CONDUIT briefings. The report concludes with a brief set of suggestions for further work. An appendix describing the issues involved in dynamic linking is also included.
Levine, William S.↗
Core Recursive Hierarchical Image Segmentation
The Recursive Hierarchical Image Segmentation (RHSEG) software has been repackaged to provide a version of the RHSEG software that is not subject to patent restrictions and that can be released to the general public through NASA GSFC's Open Source release process. Like the Core HSEG Software Package, this Core RHSEG Software Package also includes a visualization program called HSEGViewer along with a utility program HSEGReader. It also includes an additional utility program called HSEGExtract. The unique feature of the Core RHSEG package is that it is a repackaging of the RHSEG technology designed to specifically avoid the inclusion of the certain software technology. Unlike the Core HSEG package, it includes the recursive portions of the technology, but does not include processing window artifact elimination technology.
Tilton, James↗
Column Grid Array Rework for High Reliability
Due to requirements for reduced size and weight, use of grid array packages in space applications has become common place. To meet the requirement of high reliability and high number of I/Os, ceramic column grid array packages (CCGA) were selected for major electronic components used in next MARS Rover mission (specifically high density Field Programmable Gate Arrays). ABSTRACT The probability of removal and replacement of these devices on the actual flight printed wiring board assemblies is deemed to be very high because of last minute discoveries in final test which will dictate changes in the firmware. The questions and challenges presented to the manufacturing organizations engaged in the production of high reliability electronic assemblies are, Is the reliability of the PWBA adversely affected by rework (removal and replacement) of the CGA package? and How many times can we rework the same board without destroying a pad or degrading the lifetime of the assembly? To answer these questions, the most complex printed wiring board assembly used by the project was chosen to be used as the test vehicle, the PWB was modified to provide a daisy chain pattern, and a number of bare PWB s were acquired to this modified design. Non-functional 624 pin CGA packages with internal daisy chained matching the pattern on the PWB were procured. The combination of the modified PWB and the daisy chained packages enables continuity measurements of every soldered contact during subsequent testing and thermal cycling. Several test vehicles boards were assembled, reworked and then thermal cycled to assess the reliability of the solder joints and board material including pads and traces near the CGA. The details of rework process and results of thermal cycling are presented in this paper.
high reliability↗
Fatigue and Creep-Fatigue Evaluation of Alloy 709 at 760 and 816°C
A significant research and development effort is underway to support the qualification of Alloy 709 as a Class A construction material in the American Society of Mechanical Engineers (ASME) Boiler and Pressure Vessel Code, Section III, Division 5, High Temperature Reactors. This initiative includes a comprehensive Alloy 709 code qualification plan aimed at generating extensive material testing data crucial for compiling the code case data package. The data package is essential in establishing material-specific design parameters for Alloy 709 to be used as Section III, Division 5 Class A construction material for fast reactors, molten salt reactors and gas-cooled reactors. An ASME Section III, Division 5 material code case requires the evaluation of mechanical properties from a minimum of three commercial heats, covering anticipated compositional ranges. A key part of the data package involves fatigue and creep-fatigue testing at elevated temperatures, needed for developing the fatigue design curves and the damage envelope of the creep-fatigue interaction diagram (D-diagram). This paper summarizes the strain-controlled fatigue testing on three commercial heats of Alloy 709 at 760 and 816°C with strain ranges between 0.25% and 3%. The fatigue failure data are used to generate a preliminary fatigue design curve. Additionally, the creep-fatigue testing results at 816°C with tensile hold times of 10, 30, and 60 minutes are presented in support of developing the D-diagram for Alloy 709.
Wang, Yanli↗
Reliability of PWB Microvias for High Density Package Assembly
High density PWB (printed wiring board) with microvia technology is required for implementation of high density and high I/O area array packages (AAP). COTS (commercial off-the-shelf) AAP packaging technologies in high reliability versions with 1.27 mm pitch are now being considered for use in a number of NASA systems including Space Shuttle and Mars Rovers. NASA functional system designs are requiring more and more dense AAP packages and board space, which makes board microvia technology very attractive for effectively routing a large number of package inputs/outputs. However, the reliability of the fine feature microvias including via in pads is unknown for space applications. Understanding process and QA (quality assurance) indicators for reliability are important for low risk insertion of these newly available packages and PWBs. This paper presents literature search as well as test results for a high density board subjected to various thermal cycle and reflow profiles representative of tin-lead and lead-free solder reflow. Microvias sizes ranged from two to six mil with and without filling. Daisy chain microvias monitored during the test and PWBs were cross-sectioned to determine failure and locations. Optical and SEM photographs as well as resistance changes during cycling and Tg/Td (glass transition/decomposition temperature) characterisations are presented.
fill via↗
Performance of High Temperature Operational Amplifier, Type LM2904WH, under Extreme Temperatures
Operation of electronic parts and circuits under extreme temperatures is anticipated in NASA space exploration missions as well as terrestrial applications. Exposure of electronics to extreme temperatures and wide-range thermal swings greatly affects their performance via induced changes in the semiconductor material properties, packaging and interconnects, or due to incompatibility issues between interfaces that result from thermal expansion/contraction mismatch. Electronics that are designed to withstand operation and perform efficiently in extreme temperatures would mitigate risks for failure due to thermal stresses and, therefore, improve system reliability. In addition, they contribute to reducing system size and weight, simplifying its design, and reducing development cost through the elimination of otherwise required thermal control elements for proper ambient operation. A large DC voltage gain (100 dB) operational amplifier with a maximum junction temperature of 150 C was recently introduced by STMicroelectronics [1]. This LM2904WH chip comes in a plastic package and is designed specifically for automotive and industrial control systems. It operates from a single power supply over a wide range of voltages, and it consists of two independent, high gain, internally frequency compensated operational amplifiers. Table I shows some of the device manufacturer s specifications.
Patterson, Richard↗
ASME Section III, Division 5, Class A 100,000-hour design data for Alloy 709
This report documents the 100,000 hour, Class A ASME design material data for Alloy 709 based on the extensive Department of Energy, Office of Nuclear Energy, Advanced Reactor Technologies qualification test campaign. This report includes design tensile properties, creep rupture data, allowable stresses, isochronous stress-strain curves, buckling charts, and a few additional miscellaneous pieces of design data. Companion work at Oak Ridge National Laboratory and Argonne National Laboratory provide design cyclic data --- fatigue charts and creep-fatigue diagrams --- and an inelastic constitutive model. This work substantially completes the ASME data package for the Alloy 709 Code Case, though the design data will continue to updated as the final tests finish. This report also compares the design performance of Alloy 709 against that of 316H stainless steel to provide a reference for the improved high temperature strength of 709 compared to a reference material for sodium fast reactor construction.
36 MATERIALS SCIENCE↗
Local Debonding and Fiber Breakage in Composite Materials Modeled Accurately
A prerequisite for full utilization of composite materials in aerospace components is accurate design and life prediction tools that enable the assessment of component performance and reliability. Such tools assist both structural analysts, who design and optimize structures composed of composite materials, and materials scientists who design and optimize the composite materials themselves. NASA Glenn Research Center's Micromechanics Analysis Code with Generalized Method of Cells (MAC/GMC) software package (http://www.grc.nasa.gov/WWW/LPB/mac) addresses this need for composite design and life prediction tools by providing a widely applicable and accurate approach to modeling composite materials. Furthermore, MAC/GMC serves as a platform for incorporating new local models and capabilities that are under development at NASA, thus enabling these new capabilities to progress rapidly to a stage in which they can be employed by the code's end users.
Bednarcyk, Brett A.↗
The Assurance Challenges of Advanced Packaging Technologies for Electronics
Advances in microelectronic parts performance are driving towards finer feature sizes, three-dimensional geometries and ever-increasing number of transistor equivalents that are resulting in increased die sizes and interconnection (I/O) counts. The resultant packaging necessary to provide assemble-ability, environmental protection, testability and interconnection to the circuit board for the active die creates major challenges, particularly for space applications, Traditionally, NASA has used hermetically packaged microcircuits whenever available but the new demands make hermetic packaging less and less practical at the same time as more and more expensive, Some part types of great interest to NASA designers are currently only available in non-hermetic packaging. It is a far more complex quality and reliability assurance challenge to gain confidence in the long-term survivability and effectiveness of nonhermetic packages than for hermetic ones. Although they may provide more rugged environmental protection than the familiar Plastic Encapsulated Microcircuits (PEMs), the non-hermetic Ceramic Column Grid Array (CCGA) packages that are the focus of this presentation present a unique combination of challenges to assessing their suitability for spaceflight use. The presentation will discuss the bases for these challenges, some examples of the techniques proposed to mitigate them and a proposed approach to a US MIL specification Class for non-hermetic microcircuits suitable for space application, Class Y, to be incorporated into M. IL-PRF-38535. It has recently emerged that some major packaging suppliers are offering hermetic area array packages that may offer alternatives to the nonhermetic CCGA styles but have also got their own inspectability and testability issues which will be briefly discussed in the presentation,
Sampson, Michael J.↗
ADDITIVE MANUFACTURING AND REGULATORY TESTING OF CANISTERS FOR SPENT NUCLEAR FUEL MANAGEMENT
The back end of the fuel cycle focuses on the interim storage, transportation, and final disposition of the spent nuclear fuel from nuclear reactors. Commercial light water nuclear power stations across the United States operate with fuel assemblies being irradiated for up to 6 years (planned) in the reactor pressure vessel. After their planned irradiation, the fuel assemblies are moved to a spent fuel pool within the facility complex. After the spent nuclear fuel is removed from the fuel pool, it is typically inserted into a welded metal canister that can be transferred between overpacks for storage, transportation and possibly disposal. Most dry storage systems being used by industry today use dual purpose canisters (DPCs), designed for use in storage and transportation overpacks, but not specifically designed for disposal. Triple purpose-canisters, designed for disposal in addition to storage and transportation, have also been researched. Traditional manufacturing methods for spent fuel canisters involve fusion welding along the length or circumference of the canister which results in high tensile residual stresses in the joint weld zone (WZ) and heat affected zone (HAZ). In this paper, spent fuel canister designs were printed by wire arc additive manufacturing (AM) using the 316L SS welding wire to demonstrate: 1. Feasibility of spent nuclear fuel canister fabrication using this advanced manufacturing method, 2. Dynamic response of the additive manufacture canister design when subjected to the federally mandated Normal Conditions of Transport (NCT) and Hypothetical Accident Conditions (HAC) physical tests for Type B packages. This paper will focus on the canister printing design and structural tests. The AM 3D printed design, regulatory testing, and post-test evaluation of the canister tested to the 10 CFR 71.71 and 10 CFR 71.73 requirements will be presented. One AM canister design was subjected to the penetration, free drop, and puncture test. Before and after the dynamic structural tests, the AM canister design was scanned with a handheld scanner to capture a 3D CAD geometry to compare to the 3D printed canister design in the deformed shape. The scanned geometry was sectioned in areas with deformation and the cross-section profile was measured to determine accurate and repeated results of the deformed shape of the AM canister design.
Martinez, Oscar↗
Additively Manufactured Ink-based Cell Batteries for Flexible Conformational Applications
With the rise of additively manufactured electronics, the importance of thin, flexible printed batteries has increased for shape-conformal electronics. Traditionally, battery cells such as industry-standard lithium-ion batteries, have been rigid and therefore unable to conform to time-variant surfaces such as smart cards/RFID devices, disposable battery-powered skin patches, foldable electronic devices, and IoT nodes. Aligned with the effort to advance technologies on printed electronics for habitat systems and advanced manufacturing, this proof-of-concept will focus on printing a 50 mAh Zn-Ag battery implementing a DIW Technique. After prototype manufacturing, electrical and environmental testing on the flexible battery cell will be conducted to the evaluate energy and power density over 50 charge cycles under standard atmosphere conditions. The project aims to provide PCB designers, fabricators, and assemblers an integrated battery package to eliminate external batteries, external wiring and connectors, and conformational complexity. Potential end uses of the printed battery process will be within Martian and lunar habitat systems, Gateway, and surface vehicles, or aerial robots where space and geometry is a restriction.
Printed Electronics↗
Near Earth Asteroid Scout Solar Sail Engineering Development Unit Test Suite
The Near Earth Asteroid (NEA) Scout project is a 6U reconnaissance mission to investigate a near Earth asteroid utilizing an 86m(sub 2) solar sail as the primary propulsion system. This will be the largest solar sail NASA has launched to date. NEA Scout is currently manifested on the maiden voyage of the Space Launch System in 2018. In development of the solar sail subsystem, design challenges were identified and investigated for packaging within a 6U form factor and deployment in cis-lunar space. Analysis was able to capture understanding of thermal, stress, and dynamics of the stowed system as well as mature an integrated sail membrane model for deployed flight dynamics. Full scale system testing on the ground is the optimal way to demonstrate system robustness, repeatability, and overall performance on a compressed flight schedule. To physically test the system, the team developed a flight sized engineering development unit with design features as close to flight as possible. The test suite included ascent vent, random vibration, functional deployments, thermal vacuum, and full sail deployments. All of these tests contributed towards development of the final flight unit. This paper will address several of the design challenges and lessons learned from the NEA Scout solar sail subsystem engineering development unit. Testing on the component level all the way to the integrated subsystem level. From optical properties of the sail material to fold and spooling the single sail, the team has developed a robust deployment system for the solar sail. The team completed several deployments of the sail system in preparation for flight at half scale (4m) and full scale (6.8m): boom only, half scale sail deployment, and full scale sail deployment. This paper will also address expected and received test results from ascent vent, random vibration, and deployment tests.
Lockett, Tiffany Russell↗