Reliable, laser-welded packaging of a Nd:YAG laser for space application
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laser laser-welded packaging space↗
SEARCH · Engineering Papers
Results for “Package”
Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Rugged, laser-welded packaging of a fiber-pigtailed Nd:YAG laser
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laser packaging laser-welded fiber-pigtail↗
2003 high density microelectronics packaging roadmap for space applications
This roadmap introduces current technologies, related strategic issues, and research reccomendations for space applications.
roadmap packaging materials components predictions↗
High density microelectronics packaging roadmap for space applications
This roadmap introduces current technologies in use, related strategic issues and trends, and research recommendations for space applications.
microelectronic packaging forecasting↗
High frequency electromagnetic techniques: a new tool for electronic packaging
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high frequency electronic packaging reliability↗
Making electronic parts and packaging technology viable for flight projects
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packaging flight projects electronics viability↗
Packaging and reliability of electronic nose for space applications
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electronic nose reliability packaging↗
Packaging for Miniature Immersible Diagnostic Systems
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Packaging MEMS polymer↗
High Density Microelectronics Packaging Roadmap for Space Applications
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microelectronics packaging roadmap space↗
A Repeat Orbit Interferometry Package
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Orbit interferometry package ROLPAC↗
Getters for Reliable Hermetic Packages
A variety of sealed-off devices such as cathode ray tubes (CRT's) electron tubes, plasma displays, particle accelarators and colliders vacuum thermal insulation, ultra-high vacuum (UHV), extreme high vacuum (XHV) systems for semiconductor processing, X-ray tubes, lamps, field-emission displays (FEDs) flat panel displays (FPDs), some microelectromechanical systems (MEMS) and science instruments for space applications, nuclear systems require a vacuum for their successful operation.
getters hermetic packaging electronic↗
MEMS Packaging and Reliability Challenges
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microelectromechanical systems MEMS COTS reliabili↗
Interconnection and packaging isses of microelectromechanical systems (MEMS) and COTS MEMS
MEMS quality and reliability challenges are discussed and needs for study in these areas are identified.
MEMS packaging interconnection failure mechanisms↗
Packaging and reliability of electronic nose for space applications
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electronic nose reliability packaging↗
Packaging and reliability of electronic nose for space applications
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electronic nose reliability packaging↗
Advanced Packaging Technologies Used in NASA's 3D Space Flight Computer
During 1995-1997, NASA's New Millenium Program developed the 3D Space Flight Computer technology for validation on its first Deep-Space 1 mission launced in October 1998.
3D Packaging Technologies Flight Computer Avionics↗
3D Chip Scale Package (CSP)
Package/die stacking technology enhances most aspects of electronic systems such as size, weight, speed, yield, and power consumption.
Chip Scale Packaging (CSP) 3D CSP Stack TSOP D2CSP↗
NDE of Microelectronic Packaging by Real Time X-ray Imaging
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JPL NDE CCD X-ray Imaging Microelectronic Packagin↗