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The radiation response of Metal Oxide Semiconductor (MOS) devices and Integrated Circuits (ICs) was studied theoretically. The case of short-term annealing and the rebound effect are modeled mathematically using the linear response theory.
Isotype heterojunctions of ZnS (lattice constant 5.41 A) were grown on silicon (lattice constant 5.43 A) p-n junctions to form a minority-carrier mirror. The deposition process was vacuum evaporation from a ZnS powder source onto a heated (450 C) substrate. Both planar (100) and textured (111) surfaces were used. A reduction of the minority-carrier recombination at the surface was seen from increased short-wavelength quantum response and increased illuminated open-circuit voltage. The minority-carrier diffusion length was not degraded by the process.
Through Goddard Space Flight Center and Jet Propulsion Laboratory Small Business Innovation Research contracts, Irvine Sensors developed a three-dimensional memory system for a spaceborne data recorder and other applications for NASA. From these contracts, the company created the Memory Short Stack product, a patented technology for stacking integrated circuits that offers higher processing speeds and levels of integration, and lower power requirements. The product is a three-dimensional semiconductor package in which dozens of integrated circuits are stacked upon each other to form a cube. The technology is being used in various computer and telecommunications applications.
Bulk metal foil and thin film resistors occasionally contain localized defects within the etched resistor pattern. Common defects of this type include in-line constrictions referred to as notches, unremoved resistor material bridges between adjacent pattern lines, and embedded non-conductive particles in the resistor material. Such defects are prone to fracture due to thermomechanical fatigue during powered operation, especially power cycling, resulting in positive resistance change and open circuit failure modes. Common screening methods of optical microscopy, short time overload power tests (e.g., 6.25x rated power for 5 seconds) and burn-in (e.g., 1.5x rated power for 100 hours) are useful, but they are not always effective at removing devices with such defects. An improved method has been developed to screen for localized resistor pattern defects. The method involves the application of brief, high power electrical pulses at a low duty cycle while inspecting the resistor with a high resolution, high speed infrared camera. The following test conditions were found to be suitable for this purpose: 6.25x rated power, 1 to 5 pulses, 50 ms pulse width and 10% duty cycle. During the power pulsing, localized constrictions in the resistor pattern are identifiable as hot spots via the infrared camera. Reject criteria can be established based on observations of hot spots. To assess its effectiveness, a total of two hundred eighty (280) surface mount foil resistors (40 each from 7 different lots) were screened using this infrared technique. The screening identified twenty-nine (29) resistors with significant hot spots in the resistor pattern. All 280 resistors were then subjected to an industry standard 10,000 hour life test at 1x rated power at 70°C with power cycled for 90 minutes on and 30 minutes off. During life testing, three resistors exhibited positive resistance change failure mode. All three failures were due to thermomechanical fatigue failure of localized bridge defects at the locations identified via infrared screening. The results of this evaluation illustrate the benefits of the pulsed-power infrared detection screening technique to identify reliability suspect foil or thin film resistors that may escape common screening methods.
Bulk metal foil and thin film resistors occasionally contain localized defects within the etched resistor pattern. Common defects of this type include in-line constrictions referred to as notches, unremoved resistor material bridges between adjacent pattern lines, and embedded non-conductive particles in the resistor material. Such defects are prone to fracture due to thermomechanical fatigue during powered operation, especially power cycling, resulting in positive resistance change and open circuit failure modes. Common screening methods of optical microscopy, short time overload power tests (e.g., 6.25x rated power for 5 seconds) and burn-in (e.g., 1.5x rated power for 100 hours) are useful, but they are not always effective at removing devices with such defects. An improved method has been developed to screen for localized resistor pattern defects. The method involves the application of brief, high power electrical pulses at a low duty cycle while inspecting the resistor with a high resolution, high speed infrared camera. The following test conditions were found to be suitable for this purpose: 6.25x rated power, 1 to 5 pulses, 50 ms pulse width and 10% duty cycle. During the power pulsing, localized constrictions in the resistor pattern are identifiable as hot spots via the infrared camera. Reject criteria can be established based on observations of hot spots. To assess its effectiveness, a total of two hundred eighty (280) surface mount foil resistors (40 each from 7 different lots) were screened using this infrared technique. The screening identified twenty-nine (29) resistors with significant hot spots in the resistor pattern. All 280 resistors were then subjected to an industry standard 10,000 hour life test at 1x rated power at 70°C with power cycled for 90 minutes on and 30 minutes off. During life testing, three resistors exhibited positive resistance change failure mode. All three failures were due to thermomechanical fatigue failure of localized bridge defects at the locations identified via infrared screening. The results of this evaluation illustrate the benefits of the pulsed-power infrared detection screening technique to identify reliability suspect foil or thin film resistors that may escape common screening methods.
We have combined analyses of over 1000 high altitude aircraft observations of electrified clouds with diurnal lightning statistics from the Lightning Imaging Sensor (LIS) and Optical Transient Detector (OTD) to produce an estimate of the diurnal variation in the global electric circuit. Using basic assumptions about the mean storm currents as a function of flash rate and location, and the global electric circuit, our estimate of the current in the global electric circuit matches the Carnegie curve diurnal variation to within 4% for all but two short periods of time. The agreement with the Carnegie curve was obtained without any tuning or adjustment of the satellite or aircraft data. Mean contributions to the global electric circuit from land and ocean thunderstorms are 1.1 kA (land) and 0.7 kA (ocean). Contributions to the global electric circuit from ESCs are 0.22 kA for ocean storms and 0.04 kA for land storms. Using our analysis, the mean total conduction current for the global electric circuit is 2.0 kA.
Circuit incorporates three-terminal current limiter (78M24) to increase overall reliability and to eliminate transistor burnouts resulting from shorted interconnection lines and other overloads. Fact-acting light emitting diodes across the limiters show status of transistor output circuits.
Standard dosimeter reader, modified by adding an electronic gating circuit to trigger the intensity level photomultiplier, increases readout sensitivity of photoluminescent dosimeter systems. The gating circuit is controlled by a second photomultiplier which senses a short ultraviolet pulse from a laser used to excite the dosimeter.
The Life Sciences Laboratory Equipment Echocardiograph, a commercial 77020AC Ultrasound Imaging System modified to meet NASA's spacecraft standards, is described. The assembly consists of four models: display and control, scanner, scan converter, and physioamplifiers. Four separate processors communicate over an IEE-488 bus, and the system has more than 6000 individual components on 35 printed circuit cards. Three levels of self test are provided: a short test during power up, a basic test initiated by a front panel switch, and interactive tests for specific routines. Default mode operation further enhances reliability. Modifications of the original system include the replacement of ac power supplies with dc to dc converters, a slide-out keyboard (to prevent accidental operation), Teflon insulated wire, and additional shielding for the ultrasound transducer cable.
IBM-compatible personal computer used instead of logic analyzer or other special instrument to monitor IEEE-488 interface data bus that interconnects various pieces of laboratory equipment. Needed is short program for computer, commercial general-purpose interface bus circuit card, and adapter cable to link card to bus. Software available in Ada or Quick Basic language.
In April 2004, the NASA Engineering and Safety Center (NESC) was commissioned by NASA's Chief Safety and Mission Assurance (S&MA) Officer to review and render a technical opinion on the probability of a catastrophic failure related to this scenario: The Space Shuttle Program (SSP) recognized a zero-fault-tolerant design related to an inadvertent firing of the primary reaction control system (RCS) jets on the Orbiter during mated operations with the International Space Station (ISS). It was determined that an un-commanded firing of an RCS jet could cause serious damage or loss of both the SSP Orbiter and the ISS. Several scenarios were suggested in which an un-commanded firing of the RCS jet is possible. These scenarios include an arc track event in the 28-volt heater circuits that could result in a wire-to-wire short to the adjacent reaction control jet wire. In this worst-case scenario, enough current and power could be applied to activate the reaction control jet valves and fire a thruster. The following report summarizes the work that was sponsored by the NESC as part of their assessment of the Orbiter inadvertent firing of a RCS thruster while attached to the ISS.
Dynamical decoupling (DD) is a noise-mitigating strategy in which sequences of pulses are applied to single qubits to average out their interaction with the environment. DD has been extensively studied and demonstrated for suppressing single-qubit decoherence and can be tailored for different noise spectrum. We report another important adaptation of DD where crosstalk between qubits are suppressed. We demonstrate the efficiency of this procedure on quantum circuits on superconducting transmon-based quantum devices. We designed a family of syncopated DD sequences that effectively suppress ZZ coupling between qubit pairs, which is the dominating crosstalk form on the device. We insert DD to a quantum circuit whenever single qubits are idle (often during two-qubits gates on other qubits). While standard periodic DD suppress crosstalk between these qubits and their neighbors, the syncopated DD further decouples crosstalk between these qubits. We further designed short sequences that maximize the application of DD without adding time to the quantum circuit execution. Such DD sequences yield significant improvement of the performance of the algorithm on the hardware. The performance is further boosted by combining DD with another mitigation strategy, randomized compilation. Our work demonstrated that syncopated DD is effective and practical way to suppress crosstalk in quantum circuits and serves as a great probe to characterize the crosstalk and inform hardware design.
Open circuit and bias degradation tests in copper and cadmium sulfide thin film solar cells
This paper describes the design and fabrication of a 5000 volt isolated hybrid switch developed by Hughes Aircraft Company under contract to NASA/Lewis. Hughes did the packaging design and NASA did the circuit design. This unique microcircuit is intended for use as a shorting switch for large extraterrestrial solar cell arrays. The packaging design for the 5 kV isolated hybrid switch is different from most hybrid microcircuits in that it utilizes a compartmentalized plastic case (a portion of which is encapsulated), is not hermetic, and is designed for high voltage operation.
The Launch Complex 37 lightning strike of July 27, 1967, was reviewed and compared to a similar incident on the Gemini Program. Available data indicate little likelihood of damaging currents having been present in SA-204 Launch Vehicle or the ground equipment during the July 27th incident. Based on the results of subsystem and system testing after the strike, anticipated results of future testing, the six months elapsed time between the strike-and launch, and the fact that much of the critical airborne electrical/electronic equipment has been removed since the strike for other reasons, no new actions are considered necessary at this time in the Gemini case, significant failures occurred in both airborne and ground circuits. Due to the resultant semi, condlictor uncertainty, and the relatively' short time prior to planned launch, all critical airborne components containing semiconduetors were replaced, and a sophisticated data comparison task was implemented.
A Cesium frequency standard that was developed for satellite applications is discussed. It weighs 23 lbs. and uses 23.5 watts of power, achieves a stability of 1 x ten to the minus 13th power/100,000 seconds, and is radiation hardened. To achieve the weight and reliability requirements, both thick and thin film hybrid circuits were utilized. A crystal oscillator is used to improve short-term stability and performance on a moving platform.
Circuit extracts clock signal from random non-return-to-zero data stream, locking onto clock within one bit period at 1-gigabitper-second data rate. Circuit used for synchronization in opticalfiber communications. Derives speed from very short response time of gallium arsenide metal/semiconductor field-effect transistors (MESFET's).
The goal of this technology is to provide improved calibration and measurement sensitivity to the Soil Moisture Active Passive Mission (SMAP) radiometer. While RF switches have been used in the past to calibrate microwave radiometers, the switch used on SMAP employs several techniques uniquely tailored to the instrument requirements and passive remote-sensing in general to improve radiometer performance. Measurement error and sensitivity are improved by employing techniques to reduce thermal gradients within the device, reduce insertion loss during antenna observations, increase insertion loss temporal stability, and increase rejection of radar and RFI (radio-frequency interference) signals during calibration. The two legs of the single-pole double-throw reference switch employ three PIN diodes per leg in a parallel-shunt configuration to minimize insertion loss and increase stability while exceeding rejection requirements at 1,413 MHz. The high-speed packaged diodes are selected to minimize junction capacitance and resistance while ensuring the parallel devices have very similar I-V curves. Switch rejection is improved by adding high-impedance quarter-wave tapers before and after the diodes, along with replacing the ground via of one diode per leg with an open circuit stub. Errors due to thermal gradients in the switch are reduced by embedding the 50-ohm reference load within the switch, along with using a 0.25-in. (approximately equal to 0.6-cm) aluminum prebacked substrate. Previous spaceflight microwave radiometers did not embed the reference load and thermocouple directly within the calibration switch. In doing so, the SMAP switch reduces error caused by thermal gradients between the load and switch. Thermal issues are further reduced by moving the custom, highspeed regulated driver circuit to a physically separate PWB (printed wiring board). Regarding RF performance, previous spaceflight reference switches have not employed high-impedance tapers to improve rejection. The use of open-circuit stubs instead of a via to provide an improved RF short is unique to this design. The stubs are easily tunable to provide high rejection at specific frequencies while maintaining very low insertion loss in-band.