Low temperature electrical resistivity of some engineering alloys.
Engineering alloys electrical resistivities measurement at various temperatures, noting temperature and heat treatment effects
SEARCH · Engineering Papers
Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.
Engineering alloys electrical resistivities measurement at various temperatures, noting temperature and heat treatment effects
Cold work and heat treatment effects on Hastelloy X grain size and properties
Trapped charging and photovoltaic performance of Cu2S-CdS cell including heat treatment effects
Saturn booster Ti alloy pressure vessel forging, heat treatment and welding, discussing machining, cleaning and tooling
Electron paramagnetic resonance of Mn ions in single crystal and powder forsterite, testing heat treatment and proton irradiation effect on ordering
Rene 41 resistance to strain-age cracking during postweld heat treatment
Lithium-diffused silicon, investigating heat treatment and electron irradiation effects on electrical resistivity at high temperatures
Apollo 11 fines gas evolution and physical changes via heat treatment, discussing Ar 40 anomaly, lava structure origin and oxidation rate
Heat treatment and photovoltaic properties of copper disulfide-cadmium sulfide heterojunctions, measuring I-V characteristics, capacitance and spectral response
Diffusion and structural changes in microcircuit interconnections subjected to heat treatment
Heat treatment and stress corrosion analyses on aluminum alloy single- and bicrystal- microstructures
Heat treatment of carbide and boride strengthened chromium alloys to improve tensile and creep rupture strength
Vacuum evaporated films of Au, Pt, and Au-on-Pt on glass substrates after heat treatment
Rapidly quenched CuAu ordered state development on low temperature annealing, presenting Young modulus variation as function of heat treatment time
Impact strength of Cu, Cu-Ni alloy and superalloy matrices reinforced with W fibers, studying temperature, heat treatment and fiber content and toughness effects
Method utilizes an RF excited plasma to surface deactivate thermally stable powders at high temperatures. Utilization of this plasma heat treatment at high temperatures can be carried out without grain growth, calcination, or agglomeration.
Creep tests were conducted on two tantalum alloys (ASTAR 811C and T-111 alloy), on a molybdenum alloy (TZM), and on CVD tungsten. The T-111 alloy 1% creep life data have been subjected to Manson's station function analysis, and the progress on this analysis is described. In another test program, the behavior of T-111 alloy with continuously varying temperatures and stresses has been studied. The results indicated that the previously described analysis predicts the observed creep behavior with reasonable accuracy. In addition to the T-111 test program, conventional 1% creep life data have been obtained for ASTAR 811C alloy. Previously observed effects of heat treatment on the creep strength of this material have been discussed and a model involving carbide strengthening primarily at the grain boundaries, rather than in a classical dispersion hardening mechanism, has been proposed to explain the observed results.
An analog tree-organized multiplexer (ATOM) which is intended for use in the telemetry system of an interplanetary spacecraft is designed. The ATOM will be fabricated by a monolithic, dielectric isolation process, and will contain silicon junction field effect transistors (JFET) as the active elements. The effect of the radiation environment on the performance of the ATOM is analyzed. The result indicates that the expected radiation environment will cause only minor changes in the preradiation characteristics of ATOM. The JFET in the ATOM is designed to meet the electrical requirements when fabricated by either the double poly-dielectric isolation process or the raised dielectric isolation process. The effect of the heat treatment required for the dielectric isolation process on the diffusion profile of the JFET is described. The layout of the ATOM circuit for fabrication by either the double poly or raised dielectric isolation process is also given.