Engineering Papers⌕ Search

SEARCH · Engineering Papers

Results for “reliablity”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 1,117 records · Page 62

Sensor Selection and Data Validation for Reliable Integrated System Health Management

For new access to space systems with challenging mission requirements, effective implementation of integrated system health management (ISHM) must be available early in the program to support the design of systems that are safe, reliable, highly autonomous. Early ISHM availability is also needed to promote design for affordable operations; increased knowledge of functional health provided by ISHM supports construction of more efficient operations infrastructure. Lack of early ISHM inclusion in the system design process could result in retrofitting health management systems to augment and expand operational and safety requirements; thereby increasing program cost and risk due to increased instrumentation and computational complexity. Having the right sensors generating the required data to perform condition assessment, such as fault detection and isolation, with a high degree of confidence is critical to reliable operation of ISHM. Also, the data being generated by the sensors needs to be qualified to ensure that the assessments made by the ISHM is not based on faulty data. NASA Glenn Research Center has been developing technologies for sensor selection and data validation as part of the FDDR (Fault Detection, Diagnosis, and Response) element of the Upper Stage project of the Ares 1 launch vehicle development. This presentation will provide an overview of the GRC approach to sensor selection and data quality validation and will present recent results from applications that are representative of the complexity of propulsion systems for access to space vehicles. A brief overview of the sensor selection and data quality validation approaches is provided below. The NASA GRC developed Systematic Sensor Selection Strategy (S4) is a model-based procedure for systematically and quantitatively selecting an optimal sensor suite to provide overall health assessment of a host system. S4 can be logically partitioned into three major subdivisions: the knowledge base, the down-select iteration, and the final selection analysis. The knowledge base required for productive use of S4 consists of system design information and heritage experience together with a focus on components with health implications. The sensor suite down-selection is an iterative process for identifying a group of sensors that provide good fault detection and isolation for targeted fault scenarios. In the final selection analysis, a statistical evaluation algorithm provides the final robustness test for each down-selected sensor suite. NASA GRC has developed an approach to sensor data qualification that applies empirical relationships, threshold detection techniques, and Bayesian belief theory to a network of sensors related by physics (i.e., analytical redundancy) in order to identify the failure of a given sensor within the network. This data quality validation approach extends the state-of-the-art, from red-lines and reasonableness checks that flag a sensor after it fails, to include analytical redundancy-based methods that can identify a sensor in the process of failing. The focus of this effort is on understanding the proper application of analytical redundancy-based data qualification methods for onboard use in monitoring Upper Stage sensors.

Garg, Sanjay↗

Reliability Block Diagram (RBD) Analysis of NASA Dryden Flight Research Center (DFRC) Flight Termination System and Power Supply

In order to perform public risk analyses for vehicles containing Flight Termination Systems (FTS), it is necessary for the analyst to know the reliability of each of the components of the FTS. These systems are typically divided into two segments; a transmitter system and associated equipment, typically in a ground station or on a support aircraft, and a receiver system and associated equipment on the target vehicle. This analysis attempts to analyze the reliability of the NASA DFRC flight termination system ground transmitter segment for use in the larger risk analysis and to compare the results against two established Department of Defense availability standards for such equipment.

Morehouse, Dennis V.↗

Product Reliability Trends, Derating Considerations and Failure Mechanisms with Scaled CMOS

As microelectronics is scaled into the deep sub-micron regime, space and aerospace users of advanced technology CMOS are reassessing how scaling effects impact long-term product reliability. The effects of electromigration (EM), time-dependent-dielectric-breakdown (TDDB) and hot carrier degradation (HCI and NBTI) wearout mechanisms on scaled technologies and product reliability are investigated, accelerated stress testing across several technology nodes is performed, and FA is conducted to confirm the failure mechanism(s).

CMOS integrated circuits↗

Reliability Assessment of Advanced Flip-clip Interconnect Electronic Package Assemblies under Extreme Cold Temperatures (-190 and -120 C)

Flip-chip interconnect electronic package boards have been assembled, underfilled, non-destructively evaluated and subsequently subjected to extreme temperature thermal cycling to assess the reliability of this advanced packaging interconnect technology for future deep space, long-term, extreme temperature missions. In this very preliminary study, the employed temperature range covers military specifications (-55 C to 100 C), extreme cold Martian (-120 C to 115 C) and asteroid Nereus (-180 C to 25 C) environments. The resistance of daisy-chained, flip-chip interconnects were measured at room temperature and at various intervals as a function of extreme temperature thermal cycling. Electrical resistance measurements are reported and the tests to date have not shown significant change in resistance as a function of extreme temperature thermal cycling. However, the change in interconnect resistance becomes more noticeable with increasing number of thermal cycles. Further research work has been carried out to understand the reliability of flip-chip interconnect packages under extreme temperature applications (-190 C to 85 C) via continuously monitoring the daisy chain resistance. Adaptation of suitable diagnostic techniques to identify the failure mechanisms is in progress. This presentation will describe the experimental test results of flip-chip testing under extreme temperatures.

thermal cycling↗

Thermal Cycle Reliability and Failure Mechanisms of CCGA and PBGA Assemblies with and without Corner Staking

Area array packages (AAPs) with 1.27 mm pitch have been the packages of choice for commercial applications; they are now starting to be implemented for use in military and aerospace applications. Thermal cycling characteristics of plastic ball grid array (PBGA) and chip scale package assemblies, because of their wide usage for commercial applications, have been extensively reported on in literature. Thermal cycling represents the on-off environmental condition for most electronic products and therefore is a key factor that defines reliability.However, very limited data is available for thermal cycling behavior of ceramic packages commonly used for the aerospace applications. For high reliability applications, numerous AAPs are available with an identical design pattern both in ceramic and plastic packages. This paper compares assembly reliability of ceramic and plastic packages with the identical inputs/outputs(I/Os) and pattern. The ceramic package was in the form of ceramic column grid array (CCGA) with 560 I/Os peripheral array with the identical pad design as its plastic counterpart.

plastic ball grid array (PBGA)↗

Model-Driven Development of Reliable Avionics Architectures for Lunar Surface Systems

This paper discusses a method used for the systematic improvement of NASA s Lunar Surface Systems avionics architectures in the area of reliability and fault-tolerance. This approach utilizes an integrated system model to determine the effects of component failure on the system s ability to provide critical functions. A Markov model of the potential degraded system modes is created to characterize the probability of these degraded modes, and the system model is run for each Markov state to determine its status (operational or system loss). The probabilistic results from the Markov model are first produced from state transition rates based on NASA data for heritage failure rate data of similar components. An additional set of probabilistic results are created from a representative set of failure rates developed for this study, for a variety of component quality grades (space-rated, mil-spec, ruggedized, and commercial). The results show that careful application of redundancy and selected component improvement should result in Lunar Surface Systems architectures that exhibit an appropriate degree of fault-tolerance, reliability, performance, and affordability.

Borer, Nicholas↗

Investing American Recovery and Reinvestment Act Funds to Advance Capability, Reliability, and Performance in NASA Wind Tunnels

The National Aeronautics and Space Administration's (NASA) Aeronautics Test Program (ATP) is implementing five significant ground-based test facility projects across the nation with funding provided by the American Recovery and Reinvestment Act (ARRA). The projects were selected as the best candidates within the constraints of the ARRA and the strategic plan of ATP. They are a combination of much-needed large scale maintenance, reliability, and system upgrades plus creating new test beds for upcoming research programs. The projects are: 1.) Re-activation of a large compressor to provide a second source for compressed air and vacuum to the Unitary Plan Wind Tunnel at the Ames Research Center (ARC) 2.) Addition of high-altitude ice crystal generation at the Glenn Research Center Propulsion Systems Laboratory Test Cell 3, 3.) New refrigeration system and tunnel heat exchanger for the Icing Research Tunnel at the Glenn Research Center, 4.) Technical viability improvements for the National Transonic Facility at the Langley Research Center, and 5.) Modifications to conduct Environmentally Responsible Aviation and Rotorcraft research at the 14 x 22 Subsonic Tunnel at Langley Research Center. The selection rationale, problem statement, and technical solution summary for each project is given here. The benefits and challenges of the ARRA funded projects are discussed. Indirectly, this opportunity provides the advantages of developing experience in NASA's workforce in large projects and maintaining corporate knowledge in that very unique capability. It is envisioned that improved facilities will attract a larger user base and capabilities that are needed for current and future research efforts will offer revenue growth and future operations stability. Several of the chosen projects will maximize wind tunnel reliability and maintainability by using newer, proven technologies in place of older and obsolete equipment and processes. The projects will meet NASA's goal of integrating more efficient, environmentally safer, and less energy consuming hardware and processes into existing tunnel systems. These include Environmental Protection Agency-approved refrigerants, energy efficient motors, and faster, flexible tunnel data systems.

Sydnor, Goerge H.↗

Working with Consortia - Advanced Packaging Reliability

Description: Support the responsible NASA official for lead-free solder evaluation. Serve as the NASA technical liaison to the NASA/DoD Pb-free Project. Assure NASA areas of interest are included in JG-PP follow-on work. Support NASA/DoD telcons and face-to-face meetings. Update MSFC lead-free solder lessons learned report. FY10 plans: - Reliability data on lead-free solder applications for various part lead finishes and board finishes. - Update lead-free solder risks and risk mitigation strategies for NASA. - Evaluate lead-free alloy/lead-free finish reliability in design application. - Status CAVE project on Pb-free solder aging effects. - Compile the LTESE flight and bench data.

Blanche, Jim↗

Shuttle Risk Progression: Use of the Shuttle Probabilistic Risk Assessment (PRA) to Show Reliability Growth

It is important to the Space Shuttle Program (SSP), as well as future manned spaceflight programs, to understand the early mission risk and progression of risk as the program gains insights into the integrated vehicle through flight. The risk progression is important to the SSP as part of the documentation of lessons learned. The risk progression is important to future programs to understand reliability growth and the first flight risk. This analysis uses the knowledge gained from 30 years of operational flights and the current Shuttle PRA to calculate the risk of Loss of Crew and Vehicle (LOCV) at significant milestones beginning with the first flight. Key flights were evaluated based upon historical events and significant re-designs. The results indicated that the Shuttle risk tends to follow a step function as opposed to following a traditional reliability growth pattern where risk exponentially improves with each flight. In addition, it shows that risk can increase due to trading safety margin for increased performance or due to external events. Due to the risk drivers not being addressed, the risk did not improve appreciably during the first 25 flights. It was only after significant events occurred such as Challenger and Columbia, where the risk drivers were apparent, that risk was significantly improved. In addition, this paper will show that the SSP has reduced the risk of LOCV by almost an order of magnitude. It is easy to look back afte r 30 years and point to risks that are now obvious, however; the key is to use this knowledge to benefit other programs which are in their infancy stages. One lesson learned from the SSP is understanding risk drivers are essential in order to considerably reduce risk. This will enable the new program to focus time and resources on identifying and reducing the significant risks. A comprehensive PRA, similar to that of the Shuttle PRA, is an effective tool quantifying risk drivers if support from all of the stakeholders is given.

Hamlin, Teri L.↗

Reliable Multicore Processors for NASA Space Missions

The current trend in commercial processors of moving to many cores (30 to100 and beyond) on a single die poses both an opportunity and a challenge for space based processing. 1 2 The opportunity is to leverage this trend for space application and thus provide an order of magnitude increase in onboard processing capability. The challenge is to provide the requisite reliability in an extremely challenging environment. In this paper, we will discuss the requirements for reliable space based multicore computing and approaches being explored to deliver this capability within NASA's extremely tight power, mass, and cost constraints.

radiation hardening↗

History of Reliability and Quality Assurance at Kennedy Space Center

This Kennedy Historical Document (KHD) provides a unique historical perspective of the organizational and functional responsibilities for the manned and un-manned programs at Kennedy Space Center, Florida. As systems become more complex and hazardous, the attention to detailed planning and execution continues to be a challenge. The need for a robust reliability and quality assurance program will always be a necessity to ensure mission success. As new space missions are defined and technology allows for continued access to space, these programs cannot be compromised. The organizational structure that has provided the reliability and quality assurance functions for both the manned and unmanned programs has seen many changes since the first group came to Florida in the 1950's. The roles of government and contractor personnel have changed with each program and organizational alignment has changed based on that responsibility. The organizational alignment of the personnel performing these functions must ensure independent assessment of the processes.

Childers, Frank M.↗

Accounting for Proof Test Data in a Reliability Based Design Optimization Framework

This paper investigates the use of proof (or acceptance) test data during the reliability based design optimization of structural components. It is assumed that every component will be proof tested and that the component will only enter into service if it passes the proof test. The goal is to reduce the component weight, while maintaining high reliability, by exploiting the proof test results during the design process. The proposed procedure results in the simultaneous design of the structural component and the proof test itself and provides the designer with direct control over the probability of failing the proof test. The procedure is illustrated using two analytical example problems and the results indicate that significant weight savings are possible when exploiting the proof test results during the design process.

Ventor, Gerharad↗

Reliable Optical Pump Architecture for Highly Coherent Lasers Used in Space Metrology Applications

The design and initial demonstration of a laser pump module (LPM) incorporating single-mode, grating-stabilized 808-nm diode lasers and a low-loss, high-port-count optical combiner are completed. The purpose of the developed LPM is to reliably pump an Nd:YAG crystal in the laser head (LH), which serves as the optical metrology source for SIMLite mission. Using the narrow-linewidth, single-mode laser diodes enables placement of the pump power near Nd adsorption peak, which enhances pumping efficiency. Grating stabilization allows for stable pump spectra as diode operating temperature and bias current change. The low-loss, high-port-count optical combiner enables efficient combining of tens of pumps. Overall, the module supports 5+ years of continuous operation at 2 W of pump power with reliability approaching 100 percent. The LPM consists of a laser diode farm (LDF) and a pump beam combiner (PBC). An array of 807- to 808-nm fiber-pigtailed laser diodes makes up the LDF. A Bragg grating in each 5- m core single-mode (SM) fiber pigtail acts to stabilize the lasing spectra over a range of diode operating conditions. These commercially available single-mode laser diodes can deliver up to 150 mW of optical power. The outputs from the multiple pumps in the LDF are routed to the PBC, which is a 37-input by 1-output all-fiber device. The input ports consist of 5- m core SM fiber, while the output port consists of 105- m core, 0.15 NA (numerical aperture) multi-mode (MM) fiber. The combiner is fabricated by fusing the 37 input fibers while simultaneously tapering the fused region. At the completion of this process, the MM fiber is spliced to the end of the adiabatic taper, and, for protection, the combiner is sheathed by a capillary tube. A compact and robust metal housing was designed and fabricated to protect the PBC during space deployment.

Erlig, Herman↗

Improved Reliability of SiC Pressure Sensors for Long Term High Temperature Applications

We report advancement in the reliability of silicon carbide pressure sensors operating at 600 C for extended periods. The large temporal drifts in zero pressure offset voltage at 600 C observed previously were significantly suppressed to allow improved reliable operation. This improvement was the result of further enhancement of the electrical and mechanical integrity of the bondpad/contact metallization, and the introduction of studded bump bonding on the pad. The stud bump contact promoted strong adhesion between the Au bond pad and the Au die-attach. The changes in the zero offset voltage and bridge resistance over time at temperature were explained by the microstructure and phase changes within the contact metallization, that were analyzed with Auger electron spectroscopy (AES) and field emission scanning electron microscopy (FE-SEM).

Okojie, R. S.↗

Reliability, Maintainability, and Availability: Consideration During the Design Phase in Ground Systems to Ensure Successful Launch Support

The future of Space Exploration includes missions to the moon, asteroids, Mars, and beyond. To get there, the mission concept is to launch multiple launch vehicles months, even years apart. In order to achieve this, launch vehicles, payloads (satellites and crew capsules), and ground systems must be highly reliable and/or available, to include maintenance concepts and procedures in the event of a launch scrub. In order to achieve this high probability of mission success, Ground Systems Development and Operations (GSDO) has allocated Reliability, Maintainability, and Availability (RMA) requirements to all hardware and software required for both launch operations and, in the event of a launch scrub, required to support a repair of the ground systems, launch vehicle, or payload. This is done concurrently with the design process (30/60/90 reviews).

Gillespie, Amanda M.↗

Bayesian Approach for Reliability Assessment of Sunshield Deployment on JWST

Deployable subsystems are essential to mission success of most spacecraft. These subsystems enable critical functions including power, communications and thermal control. The loss of any of these functions will generally result in loss of the mission. These subsystems and their components often consist of unique designs and applications, for which various standardized data sources are not applicable for estimating reliability and for assessing risks. In this study, a Bayesian approach for reliability estimation of spacecraft deployment was developed for this purpose. This approach was then applied to the James Webb Space Telescope (JWST) Sunshield subsystem, a unique design intended for thermal control of the observatory's telescope and science instruments. In order to collect the prior information on deployable systems, detailed studies of "heritage information", were conducted extending over 45 years of spacecraft launches. The NASA Goddard Space Flight Center (GSFC) Spacecraft Operational Anomaly and Reporting System (SOARS) data were then used to estimate the parameters of the conjugative beta prior distribution for anomaly and failure occurrence, as the most consistent set of available data and that could be matched to launch histories. This allows for an emperical Bayesian prediction for the risk of an anomaly occurrence of the complex Sunshield deployment, with credibility limits, using prior deployment data and test information.

Kaminskiy, Mark P.↗

Launch and Assembly Reliability Analysis for Mars Human Space Exploration Missions

NASA s long-range goal is focused upon human exploration of Mars. Missions to Mars will require campaigns of multiple launches to assemble Mars Transfer Vehicles in Earth orbit. Launch campaigns are subject to delays, launch vehicles can fail to place their payloads into the required orbit, and spacecraft may fail during the assembly process or while loitering prior to the Trans-Mars Injection (TMI) burn. Additionally, missions to Mars have constrained departure windows lasting approximately sixty days that repeat approximately every two years. Ensuring high reliability of launching and assembling all required elements in time to support the TMI window will be a key enabler to mission success. This paper describes an integrated methodology for analyzing and improving the reliability of the launch and assembly campaign phase. A discrete event simulation involves several pertinent risk factors including, but not limited to: manufacturing completion; transportation; ground processing; launch countdown; ascent; rendezvous and docking, assembly, and orbital operations leading up to TMI. The model accommodates varying numbers of launches, including the potential for spare launches. Having a spare launch capability provides significant improvement to mission success.

Cates, Grant R.↗

Reliability of CCGA 1152 and CCGA 1272 Interconnect Packages for Extreme Thermal Environments

Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages of high interconnect density, very good thermal and electrical performance, and compatibility with standard surface-mount packaging assembly processes. CCGA packages are used in space applications such as in logics and microprocessor functions, telecommunications, flight avionics, and payload electronics. As these packages tend to have less solder joint strain relief than leaded packages, the reliability of CCGA packages is very important for short- and long-term space missions. Certain planetary satellites require operations of thermally uncontrolled hardware under extremely cold and hot temperatures with large diurnal temperature change from day to night. The planetary protection requires the hardware to be baked at +125 C for 72 hours to kill microbugs to avoid any biological contamination, especially for sample return missions. Therefore, the present CCGA package reliability research study has encompassed the temperature range of 185 to +125 C to cover various NASA deep space missions. Advanced 1152 and 1272 CCGA packaging interconnects technology test hardware objects have been subjected to ex treme temperature thermal cycles from 185 to +125 C. X-ray inspections of CCGA packages have been made before thermal cycling. No anomalous behavior and process problems were observed in the x-ray images. The change in resistance of the daisy-chained CCGA interconnects was measured as a function of increasing number of thermal cycles. Electrical continuity measurements of daisy chains have shown no anomalies, even until 596 thermal cycles. Optical inspections of hardware have shown a significant fatigue for CCGA 1152 packages over CCGA 1272 packages. No catastrophic failures have been observed yet in the results. Process qualification and assembly are required to optimize the CCGA assembly processes. Optical inspections of CCGA boards have been made after 258 and 596 thermal cycles. Corner columns have started showing significant fatigue per optical inspection results.

Ramesham, Rajeshuni↗