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An article, such as, but not limited to, a cable strap to wrap, support, or secure one or more wires or cables, is formed by cyclically heating and cooling and/or irradiating an article formed of a static dissipative ethylene tetrafluoroethylen (ETFE) resin, to reduce an electrical resistivity and/or to increase a tensile strength of the article.
This research focuses on the strength and creep performance of SiC fiber-reinforced SiC ceramic matrix composite (CMC) environmental barrier coating (EBC) systems under complex simulated engine environments. Tensile-strength and stress-rupture testing was conducted to illustrate the material properties under isothermal and thermal gradient conditions. To determine material durability, further testing was conducted under exposure to thermal cycling, thermal gradients and simulated combustion environments. Emphasis is placed on experimental techniques as well as implementation of non-destructive evaluation, including modal acoustic emission and electrical resistivity monitoring, to characterize strength degradation and damage mechanisms. Currently, little is known about the behavior of EBC-CMCs under these conditions; consequently, this work will prove invaluable in the development of structural components for use in high temperature applications.
SiC/SiC ceramic matrix composites (CMCs) require new state-of-the art environmental barrier coatings (EBCs) to withstand increased temperature requirements and high velocity combustion corrosive combustion gasses. The present work compares the response of coated and uncoated SiC/SiC CMC substrates subjected to simulated engine environments followed by high temperature mechanical testing to asses retained properties and damage mechanisms. Our focus is to explore the capabilities of electrical resistance (ER) measurements as an NDE technique for testing of retained properties under combined high heat-flux and mechanical loading conditions. Furthermore, Acoustic Emission (AE) measurements and Digital Image Correlation (DIC) were performed to determine material damage onset and accumulation.
Copper wire bonds have replaced gold wire bonds in the majority of commercial semiconductor devices for the latest technology nodes. Although economics has been the driving mechanism to lower semiconductor packaging costs for a savings of about 20% by replacing gold wire bonds with copper, copper also has materials property advantages over gold. When compared to gold, copper has approximately: 25% lower electrical resistivity, 30% higher thermal conductivity, 75% higher tensile strength and 45% higher modulus of elasticity. Copper wire bonds on aluminum bond pads are also more mechanically robust over time and elevated temperature due to the slower intermetallic formation rate - approximately 1/100th that of the gold to aluminum intermetallic formation rate. However, there are significant tradeoffs with copper wire bonding - copper has twice the hardness of gold which results in a narrower bonding manufacturing process window and requires that the semiconductor companies design more mechanically rigid bonding pads to prevent cratering to both the bond pad and underlying chip structure. Furthermore, copper is significantly more prone to corrosion issues. The semiconductor packaging industry has responded to this corrosion concern by creating a palladium coated copper bonding wire, which is more corrosion resistant than pure copper bonding wire. Also, the selection of the device molding compound is critical because use of environmentally friendly green compounds can result in internal CTE (Coefficient of Thermal Expansion) mismatches with the copper wire bonds that can eventually lead to device failures during thermal cycling. Despite the difficult problems associated with the changeover to copper bonding wire, there are billions of copper wire bonded devices delivered annually to customers. It is noteworthy that Texas Instruments announced in October of 2014 that they are shipping microcircuits containing copper wire bonds for safety critical automotive applications. An evaluation of copper wire bond technology for applicability to spaceflight hardware may be warranted along with concurrently compiling a comprehensive understanding of the failure mechanisms involved with copper wire bonded semiconductor devices.
Part I of the paper discussed the temperature dependencies of the electrical resistivities, thermal conductivities, thermal diffusivities and total hemispherical emissivities of several vacuum plasma sprayed (VPS) and cold sprayed copper alloy monolithic coatings, VPS NiAl, VPS NiCrAlY, extruded GRCop-84 and as-cast Cu-17(wt.%)Cr-5%Al. Part II discusses the temperature dependencies of the constant pressure specific heat capacities, CP, of these coatings. The data were empirically were regression-fitted with the equation: CP = AT4 + BT3 + CT2 + DT +E where T is the absolute temperature and A, B, C, D and E are regression constants. The temperature dependencies of the molar enthalpy, molar entropy and Gibbs molar free energy determined from experimental values of molar specific heat capacity are reported. Calculated values of CP using the Neumann-Kopp (NK) rule were in poor agreement with experimental data. Instead, a modification of the Neumann-Kopp rule was found to predict values closer to the experimental data with an absolute deviation less than 6.5%. The specific molar heat capacities for all the alloys did not agree with the Dulong-Petit law, and CP is greater than 3R, where R is the universal gas constant, were measured for all the alloys except NiAl for which CP is less than 3R at all temperatures.
This paper aims at establishing connections between electrical resistivity and stresses in carbon fiber reinforced epoxy-graphene composites. To avoid the interconnection of multiple parameters, we examined composite specimens consisting of a single strand or tow (12,000 carbon fiber filaments) embedded in an epoxy matrix containing up to 1.0 wt% of graphene (TG679) particles. The specimens show resistance increase with the tensile stress. The characteristic of the dependence varies with the content of graphene particles, tending to be linear as the percentage of graphene content increases. We did not observe any significant changes in the ultimate strength of the composite with an increase of the graphene particles concentration.
We have prepared silicate based hard materials and have processed it with organic flux. Because of the bioactivities of hydroxyapatites with tissues, this class of materials have attracted interest for bone applications. We have utilized low temperature processing techniques. Organic melt was used and the directional solidification method to cast the shaped sample. This organic treated material has different characteristics than coarsened oxide materials. Our approach involved low temperature processing using nano and micron sized powders of the material system Na2O-K2O-CaO- MgO-Ga2O3-SiO2, and titanates were processed by sintering and grain growth. Our results indicate that substitution of gallium and magnesium or titanium with some variation in processing methods have great potential to improve the glassy characteristics without decreasing the mechanical properties of bones. Effect of radiation on bone was studied by exposing with commercially available Cs137 gamma ray source. It was observed that electrical resistivity increased due to radiation exposure for this system.
The NASA Shell Buckling Knockdown Factor Project (SBKF) was established in 2007 by the NASA Engineering and Safety Center (NESC) with the primary goal to develop new analysis-based buckling design factors (a.k.a. knockdown factors) and high-fidelity buckling simulations for selected launch-vehicle-like cylindrical shell structures. A series of tests are being conducted on large-scale metallic and composite cylindrical shells in order to provide validation data for these new factors and simulations. However, the validation of these new factors and simulations is quite demanding and requires test data that is commensurate with their fidelity. Traditional instrumentation, such as linear variable displacement transducers (LVDTs) and electrical-resistance strain gages serve a critical role in providing accurate displacement and strain measurements in these tests, but only allow for data to be recorded at a select number of point locations and are not sufficient to provide all the necessary validation data. Advanced measurement technologies can be used effectively to complement traditional instrumentation and gather additional data required to validate these structural simulations. In particular, three-dimensional digital image correlation (DIC) was implemented during SBKF cylinder testing to characterize the full-field displacement and strain behavior. Commercially available VIC-3DTM software and user-written data processing scripts were used to generate valuable data and insight into the complex buckling response of the cylinders that otherwise would be impossible to gather using traditional instrumentation. In addition, the measured data from DIC was used to verify measured test data obtained from other instrumentation, enhance test and analysis correlation, and help identify the root cause of anomalous test results that may have gone unexplained if only traditional instrumentation was used. Selected test results that demonstrate the use of DIC on the SBKF cylinders are presented and a portion of the data processing methods are described.
Thermal land imaging (imaging at ~8-14 micron optical wavelength) is an essential tool for understanding and managing terrestrial freshwater resources. Current thermal imaging instruments employ low temperature detectors, which require cryocoolers. Consequently, cost-saving reductions in size, weight, and power can be achieved by employing uncooled detectors. One uncooled detector concept, which NASA is pursuing, is a thermopile detector with sub-micron thick doped-Si thermoelectric materials. In order to characterize the thermoelectric properties of the doped silicon, we designed and optimized a novel apparatus. This simple apparatus measures the Seebeck coefficient with thermally isolated stages and LABVIEW automation. We optimized thermal stability using PID tuning and optimized the thermal contact between the thin film samples and stages using electrically conductive springs. Utilizing our apparatus, we measured the Seebeck coefficient of 0.45 micron thick phosphorus-doped single crystal Si samples bonded to alumina substrates. Using these Seebeck coefficient measurements and four-wire electrical resistivity measurements, we determined the relationship between the thermoelectric figure of merit and dopant concentration. These characterization results for doped-Si will guide our thermopile detector design to provide an optimal and competitive detector alternative for future thermal imaging instruments.
The Thermal Energy Conversion Technologies Group at the Jet Propulsion Laboratory has been pursuing the development of thermopiles capable of higher temperature operation in support of terrestrial and space sensing applications in extreme environments. The next-generation sensor technology would rely on filled skutterudite (SKD) compounds, the same materials currently being considered for use in the enhanced Multi-Mission Radioisotope Thermoelectric Generator (eMMRTG). We report on the design, development and fabrication of SKD-based prototype thermopile devices. The beginning-of-life (BOL) experimental and predicted performance of the SKD-based prototype thermopile in terms of electrical resistance, output voltage, current, power output and efficiency in the 423 to 723 K operating temperature range is reported and discussed.
The unique multifunctional properties of boron nitride (BN) nanomaterials are identified as a parameter that would revolutionize electric propulsion in Aeronautics due to the lightweight ceramic with chemical inertness, high strength, high electrical resistivity and high thermal conductivity. Hexagonal BN (h-BN) nanofibers will enable new high-performance fibers that can be used in ceramic or polymer matrix composites, or thin films to provide revolutionary multifunctional ceramics for extreme environments and structures. Polymer derived h-BN materials have been previously demonstrated, providing an avenue to tailor properties of the ceramic end product. This effort also uses forcespinning (FS) technology that produces continuous non-woven nanofibers in a range of diameters depending on the processing parameters with a large production rate of 1 g/min allowing for manufacturing scale production. FTIR, SEM, TGA and XRD were used to characterize the materials in each processing steps.
The first study of the full coupling between the aerothermodynamics, the magnetohydrodynamics, and the plasma sheaths within earth entry flows is here per-formed. The problem tackled herein is representative of a force-generating MHD patch located between the plenum and the frustum of a capsule entering the earth’s atmosphere at Mach 34. The reactions are obtained from a modified 11-species Park chemical solver. The physical model fully couples the drift-diffusion model for the sheaths to the multispecies Navier-Stokes equations for the plasma flow. The Hall and ion slip effects are taken into consideration within the plasma flow and within the sheaths. The effect of the electrode material on the MHD process is studied. Using thoriated tungsten instead of graphite leads to a four-fold increase in the Lorentz forces and also leads to significantly reduced heat fluxes on the cathode. This is attributed to the much higher electrical conductivity of the thoriated tungsten sheath reducing by orders of magnitude the plasma electrical resistance near the surfaces.
This paper describes a high performance thermal switch for lunar/planetary extreme environments. This device has been given the name Reverse-Operation DTE Thermal Switch (or ROD-TSW). Two different prototypes were designed, built, and tested. Their basis of operation is the mating/de-mating of parallel flat metal surfaces driven by the differential thermal expansion (DTE) between mid-to-high CTE metal/polymer or metal-only end-pieces and a low CTE, low thermal conductivity (k) metal/polymer support rod. The requirements were to be fully ON above 300 K and fully OFF below 260 K. A series of four tests were carried out to verify/qualify the prototypes. In the first (non-vacuum) test, the thermal switches were cooled with freeze-spray and the non-conductive rod in the OFF thermal path allowed electrical resistance to confirm the 273 K as-designed ON/OFF actuation temperature. In the second (vacuum) test, a calibrated Q-meter was used, which indicated 5 W/K ON, 0.002 W/K OFF conductance (2500:1 ON/OFF ratio). To increase readiness to TRL6, a vibration test with pre/post thermal cycling followed by a 36-day test in a relevant environment were also carried out. This paper describes the development program and on-going related work at JPL.
This paper describes a high performance thermal switch for lunar/planetary extreme environments. This device has been given the name Reverse-Operation DTE Thermal Switch (or ROD-TSW). Two different prototypes were designed, built, and tested. Their basis of operation is the mating/de-mating of parallel flat metal surfaces driven by the differential thermal expansion (DTE) between mid-to-high CTE metal/polymer or metal-only end-pieces and a low CTE, low thermal conductivity (k) metal/polymer support rod. The requirements were to be fully ON above 300 K and fully OFF below 260 K. A series of four tests were carried out to verify/qualify the prototypes. In the first (non-vacuum) test, the thermal switches were cooled with freeze-spray and the non-conductive rod in the OFF thermal path allowed electrical resistance to confirm the 273 K as-designed ON/OFF actuation temperature. In the second (vacuum) test, a calibrated Q-meter was used, which indicated 5 W/K ON, 0.002 W/K OFF conductance (2500:1 ON/OFF ratio). To increase readiness to TRL6, a vibration test with pre/post thermal cycling followed by a 36-day test in a relevant environment were also carried out. This paper describes the development program and on-going related work at JPL.
Following the successful implementation of full-field photogrammetry, more specifically three-dimensional Digital Image Correlation (3D-DIC), on the Mars 2020 Heat Shield Structural Failure Review assessment, 3D-DIC was selected as one of the primary measurement techniques for the Mars 2020 Rover wheel assembly qualification test at the NASA Jet Propulsion Laboratory (JPL). To validate the Rover wheel landing loads simulations, it was extremely important to have high confidence in the wheel models. Due to the large deformations and strains that the wheel would be subject to during landing, traditional instrumentation such as linear variable displacement transducers (LVDTs), electrical-resistance strain gages and string potentiometers, would not be sufficient on their own to provide all the necessary validation data. Therefore, the NASA Engineering and Safety Center (NESC) provided the 3D-DIC expertise and support to measure the high deformation and strain in the wheel flexures and qualify the overall structural response of the Mars 2020 rover wheel assembly. There were two key objectives for the photogrammetry technique: (1) monitor the wheel response in real-time, guarding against anomalous behavior and failure, and (2) provide test data for test-analysis correlation to validate and/or improve the high-fidelity computational model. The contents of this paper will focus on the challenges of applying 3D-DIC to the Mars 2020 Rover wheel assembly and how these challenges were overcome. Examples of test-analysis correlation during the stiffness characterization and structural qualification will be presented and discussed in detail. Experimental results were compared with the analysis and showed excellent agreement between the predicted behavior and helped validate the high-fidelity models.
The need for multifunctional materials in aerospace technologies is currently driving the development of new novel composite materials. Specifically, insulation materials with high thermal conductivity, high electrical resistivity, and are chemically inert are needed for high voltage power applications. Boron nitride (BN) nanomaterials fit these criteria and can be incorporated into composites for further material design. The synthesis of boron nitride through a polymer derived ceramic route allows for the morphology of the resulting BN to be tailored. This is especially beneficial since the polymers can be shaped or spun into fibers prior to the ceramic conversion. This project utilizes the Forcespinning technique to produce boron-containing polymer fibers that are converted to boron nitride through a heat treatment. The chemical compositions and fiber morphologies were studied and reported here.
Indium iodide (InI) single crystals, grown by the Bridgman process, have shown a significant promise as room temperature detector material for X-rays and γ-rays due to the large, close to ideal, bandgap of Eg = 2 eV, and high electrical resistivity. Yet the transport properties of the charge and the detector performance remain inadequate. The Bridgman growth of semiconductor crystals in microgravity have typically resulted in partial dewetting and Marangoni convection, which disturbed the diffusion-controlled growth and produced nonuniform dopant distribution. However, unconfined or partially confined solidification drastically reduced the number of stress-induced defects compared to the confined growth in crucibles on Earth.The goal of the present investigation was to explore melt growth of a heavy metal halide in microgravity, focusing on dewetting, in order to improve the crystalline perfection, i.e., to reduce the number of stress-related defects. InI was chosen because it is non-toxic and has a low melting point of only 365 C (~150 C below the melting point of InSb, used in the SUBSA experiments in 2002). Furthermore, InI melts and evaporates congruently, making it suitable for both growth by directional solidification and growth from the vapor phase. In preparation for the flight experiments, ground-based experiments were conducted in the SUBSA ground unit, consisting of 4 melt growth and 2 vapor growth experiments. The crystals were grown by a gradient freeze method by lowering the setpoint of the furnace. The transparent section of the SUBSA furnace did not allow observations of the solid-liquid interface. Contrary to our expectations, the possible occurrence of dewetting during growth could not be observed. We will present i) the ampoule design and preparation, ii) the experiments conducted in the SUBSA ground unit, iii) the images obtained during the microgravity experiments and iv) the results of the characterization of the grown crystals and detector fabrication.
Silicon carbide (SiC) based ceramic matrix composites (CMCs) are of interest for high-temperature structural applications, including use in turbine engine components. To understand damage mechanisms and predict durability of these systems, in-depth knowledge of their behavior at ambient and high temperatures is necessary. A method for high temperature testing of SiC/SiC minicomposite specimens up to 1500oC in both tensile fast fracture and creep conditions to investigate their thermomechanical behavior will be presented. This method utilizes a novel radiation heat furnace, equipped with infrared lamps with ellipsoidal reflectors, to heat the specimen at the furnace center in user-defined atmospheres. The housing structure of the lamps allows for observation of the specimen during testing using optical methods and for conducting other experimental studies. The goal is to employ nondestructive health monitoring techniques in-situ, including acoustic emission (AE), electrical resistance (ER), and digital image correlation (DIC) to evaluate damage initiation and evolution in the minicomposite specimens during tensile testing. Results from mechanical testing and nondestructive techniques will be presented. Electron microscopy and X-ray micro-computed tomography were used to further characterize specimen damage after testing.