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At least 1,099 records · Page 61

Fault Clearing Operation in Low-Frequency High-Voltage AC Systems

Abstract—Low-frequency high-voltage ac (LF-HVac) system has been proposed as an alternative to HVdc and HVac systems to reduce transmission losses and improve grid flexibility. LF-HVac system employs back-to-back (BTB) converters to interconnect and control the voltage and power interchange between two power grid operating at different frequencies. While there are multiple studies on LF-HVac system in the literature, the fault clearing method in the LF-HVac system has not been analyzed. Therefore, this paper focuses on fault clearing operation in LFHVac system and proposes a novel method to reduce fault current by changing operating frequency of power source and converter. The performance of the proposed method is validated using detailed models of BTB converters developed in PSCAD/EMTDC. The ability to change operating frequency at the onset of a fault condition allows breakers to rapidly clear the fault and recloses. The results obtained by using the proposed method substantially diminish the fault current.

Kim, Woosung↗

DQ Admittance Extraction for Inverter-Based Resources

The power grid industry is pushing for electromagnetic transient (EMT)-based studies for generation interconnection and planning process due to high penetrations of inverter-based resource (IBRs). Vendor-specific and site-specific black-box IBR models are preferred in those simulation studies. For small-signal analysis, measurement-based admittance models are necessary. In this paper, we demonstrate the extraction of frequency-domain dq frame IBR models. These linear models are specific to operating conditions. We demonstrate two extraction methods: frequency scan and a step response-based method. The latter relies on converting time-domain responses to Laplace-domain expressions via eigensystem realization analysis (ERA). Both can lead to dq admittance representation and the latter is time saving.

admittance model↗

Performance and Feature Improvements in Parareal-based Power System Dynamic Simulation

In recent years, a novel Parareal-based approach has been developed for fast transient simulations of large power system interconnections. Parareal belongs to the class of Parallel-in-time algorithms for solution of systems of differential-algebraic equations in parallel over an interval of time. The selection of a reasonably fast and accurate coarse solution is crucial to improve the performance of Parareal algorithm. Semi-analytical solution methods are one promising approach to achieve this goal. They have been investigated, and some preliminary results are presented here. In addition, Parareal-based simulator has been expanded to enable co-simulation with OpenDSS, a widely used open-source distribution system simulator. Preserving the parallel nature of the Parareal approach and taking advantage of the parallel capabilities of the latest versions of OpenDSS, each distribution system can be solved in their entirety on different processors in parallel within the main Parareal simulator. This paper also presents the structure of the transmission and distribution co-simulation and some results with different dynamic models of inverter-based resources in the distribution systems.

Park, Byungkwon↗

Activation Energy for Solder Bond Degradation: Thermal Cycling of Field-aged Modules at Multiple Upper Temperatures

The reliability of solder joints in the solar cell metallization-interconnect system influences the lifetime of photovoltaic modules. Two field-aged modules-one with Sn 62 Pb 36 Ag 2 solder at the solder joints (Solarex MSX 60), and the other with the standard Sn 60 Pb 40 solder (Siemens M55)-were subjected to a modified thermal cycling (TC) test of IEC 61215. Three sections in each module were maintained at 85 degrees C, 95 degrees C, and 105 degrees C during the 15-minute high temperature dwell time. Current equivalent to the module short-circuit current was injected through the module when the chamber temperature was above 25 degrees C to simulate regular field operation. This novel approach aims to induce thermomechanical fatigue (TMF) at the solder joints and intermetallic compound (IMC) formation at the metal/solder interfaces. The activation energy (E a ) for solder bond degradation was calculated based on the series resistance (R s ) increase in TC testing rather than power drop to avoid the effect of confounding variables. Module-level R s increase in MSX 60 module after TC800 cycles and in M55 module after TC400 cycles was 1.22% and 183.7%, respectively. The E a determined for the module with 2wt% Ag is 0.24 eV and for that with the standard solder is 0.27 eV. The solder bond degradation seems to have been driven by TMF rather than IMC formation for both modules.

14 SOLAR ENERGY↗

Fill Factor Loss in Fielded Photovoltaic Modules Due to Metallization Failures, Characterized by Luminescence and Thermal Imaging

Understanding the causes of photovoltaic module failure in the field can be achieved using spatially-resolved imaging tools in combination with current-voltage (IV) characterization. We evaluate 23 field-degraded modules by comparing their IV characteristics with module images obtained by electroluminescence, photoluminescence, UV-fluorescence, and dark lock-in thermography. We identify primarily metallization failures (metallization series resistance, solder point heating, broken fingers, disrupted interconnects) in these modules that has led to a severe drop in the fill factor and up to 35% power loss over only 2 years of deployment.

14 SOLAR ENERGY↗

Monolithic Two-Terminal All-Perovskite Tandem Solar Cells with Power Conversion Efficiency Exceeding 21%

Monolithic two-terminal (2-T) all-perovskite tandem solar cells are a promising candidate for the next generation solar cells with ultrahigh efficiency and low fabrication cost. Here, we report on the fabrication of 2-T all-perovskite tandem solar cells consisting of solution-processed wide-bandgap and low-bandgap perovskite subcells connected by a vacuum processed interconnection layer. We employed a bulk-passivation strategy to enlarge the grain size, increase carrier mobilities, reduce electronic disorder, and suppress trap-assisted recombination in the low bandgap mixed Sn-Pb perovskite films, which leads to improved performance of low bandgap perovskite solar cells with an absorber thickness over 750 nm. This advance in high-quality low-bandgap perovskite layers enables the fabrication of efficient 2-T all-perovskite solar cells with power conversion efficiencies of more than 21% and decent stability. Our approach provides a suitable pathway to realize ultra-high efficiency 2-T all-perovskite tandem solar cells.

14 SOLAR ENERGY↗

Inverter Testing for Verification of Hawaiian Electric Rule 14H

As utilities increasingly require inverters to perform grid-supportive functions, it is challenging to ensure that those functions are properly configured in the field. This paper presents details of inverter testing related to Hawaiian Electric's latest rule 14H interconnection requirements to validate that field installation procedures result in the intended advanced inverter behavior. The latest Volt-VAR, Volt-Watt, and frequency-Watt curves in Hawaiian Electric's Source Requirement Document (SRD) V1.1 for UL 1741 Supplement A were tested for two inverter manufacturers used in the utility territory. Both inverters were found to be largely compliant, though several discrepancies were identified and reported to the manufacturers. The results are presented and discussed here.

24 POWER TRANSMISSION AND DISTRIBUTION↗

Conductive Adhesives for Metallization of Interdigitated Back Contact Solar Cells

The metallization and interconnection of Si solar cells to form a module is usually a multi-step process: cells are metallized individually, soldered into strings, and subsequently assembled into a module. Furthermore, the metallization process for individual cells must be compatible with the doped surfaces being contacted, which creates additional challenges when moving from diffused junctions to heterojunctions and/or passivated contact structures. To mitigate these problems and streamline module manufacturing for the case of interdigitated back contact (IBC) cell modules, we developed an approach wherein unmetallized IBC cells are bonded directly to a circuitized backsheet using a conductive adhesive (CA) that only conducts out-of-plane. The metal/CA/silicon stack is bonded by hot-pressing at 100-200 degrees C.For a CA consisting of ethylene vinyl acetate (EVA) filled with Ag-coated spheres or indium powder we find that contact resistivities in the range of 1-10 Wcm 2 are obtained, regardless of which conductive filler and which hot pressing parameters are used. XPS revealed that about 1-2 nm EVA residue bonds to the Si in these samples, suggesting the formation of an insulating barrier that is responsible for the high contact resistance. Using indium powder alone, improved contact resistivities <0.6 Wcm 2 , high shunt resistances, and an implied open-circuit voltage loss below 10 mV were obtained. Furthermore, a cost estimate is presented, indicating that substantial cost savings of up to $10/m 2 , or about $0.05/W DC , are possible through CA-based IBC module manufacturing.

14 SOLAR ENERGY↗

III-V/Si Tandem Cells Utilizing Interdigitated Back Contact Si Cells and Varying Terminal Configurations

Integrating wide-bandgap III-V with Si solar cells has been shown to yield higher efficiencies than Si alone: As also presented at this conference, four-terminal efficiencies exceeding 32% have been attained. In this contribution, independent and electrically connected operation of the subcells in such tandem cells is examined. The optics of the tandem cell change significantly if a conducting interconnect, rather than an insulating glass slide, is required between the subcells. These effects are studied, and optically optimized structures for different types of tandem cell operation are presented. It is found that minimizing reflection at the conductive interface between the two cells while maintaining conductivity is the key challenge faced in such devices.

41 EE - Solar Energy Technologies Office (EE-4S)↗

Environmental Influence on Fracture and Delamination of Electrically Conductive Adhesives

This paper presents our continued work on developing a degradation model for electrically conductive adhesive (ECA) interconnects in photovoltaic modules. Here, we characterize the fracture mechanics properties of an epoxy based ECA, for both critical and subcritical loading conditions. Emphasis is put on the influence of different environmental conditions such as temperature and humidity. We found that high levels of humidity not only weaken the adhesive joint but also promote subcritical debonding at significantly lower driving forces than in dry environments.

41 EE - Solar Energy Technologies Office (EE-4S)↗

Grid-Forming and Grid-Following Inverter Comparison of Droop Response

With the increase in penetration of inverter-based resources (IBRs) in the electrical power system, the ability of these devices to provide grid support to the system has become a necessity. With standards previously developed for the interconnection requirements of grid-following inverters (GFLI) (most commonly photovoltaic inverters), it has been well documented how these inverters “should” respond to changes in voltage and frequency. However, with other IBRs such as grid-forming inverters (GFMIs) (used for energy storage systems, standalone systems, and as uninterruptable power supplies) these requirements are either: not yet documented, or require a more in deep analysis. With the increased interest in microgrids, GFMIs that can be paralleled onto a distribution system have become desired. With the proper control schemes, a GFMI can help maintain grid stability through fast response compared to rotating machines. This paper will present an experimental comparison of commercially available GFMI and GFLI ' responses to voltage and frequency deviation, as well as the GFMI operating as a standalone system and subjected to various changes in loads.

Grid Support, Inverter, Droop Control, Volt-VAR, F↗

Evaluation of PV Module Packaging Strategies of Monofacial and Bifacial PERC Using Degradation Pathway Network Modeling

As the PV industry is rapidly expanding, it is important to thoroughly investigate the long-term impact of packaging strategies on the performance of PV modules. In this study, the variants in sets differ on the basis of manufacturer (A/B), encapsulant (EVA/POE), rear encapsulant (UV-cutoff/opaque/transparent), module architecture (GB/DG) and cell type (monofacial/bifacial). The minimodules were exposed for 2520 hours in modified damp heat, with or without full spectrum light. Every 504 hours, stepwise electrical characterization techniques were employed to track changes in minimodules. Degradation pathway modeling using network structural equation modeling was employed to study pairwise relationships between variables and service lifetime prediction in minimodules. Through this study, differences in quality control are identified in minimodules made by different manufacturers. Minimodules with UV-cutoff rear encapsulant show relatively better stability, whereas the ones with opaque rear encapsulant show greater power loss. In addition, GB having UV-cutoff rear encapsulation and GB with POE having opaque rear encapsulation were identified to be stable as they lack a best model fit. Here, the primary power loss mechanism in degrading variants is interconnect corrosion.

14 SOLAR ENERGY↗

Rapid Characterization and Statistical Analysis of High-Volume Field-Harvested Photovoltaic Connectors

Photovoltaic (PV) installations heavily depend on connectors for efficient module and string interconnections without requiring skilled labor. Yet this seemingly innocuous component of PV systems is a leading cause of module failures, multiple high-profile fires, and lawsuits in the PV industry. This work aims to answer critical questions regarding why connectors fail and the contributing factors to their failure. The study involves collecting and analyzing more than 17,000 field-harvested connectors from various solar installations across the United States. The vast dataset, which includes connector metadata, visual inspections, and resistance measurements, provides unprecedented insight into the state of health of PV connectors across the US, including the geographic locations, connector types, and installation practices most prone to failures. The work presented here describes a novel rapid characterization method for processing large numbers of connectors and is supported by parallel forensic analysis to discern the root causes of failures as well as a levelized cost of lifetime model to determine the economic ramifications of connector failure. Ultimately, the findings may inform PV developers about the best practices to extend connector longevity and lead to more resilient and reliable PV systems.

connectors↗

Developing IEEE Std 2800-Compliant Algorithms for Transmission-Connected Inverter-Based Resources

This study addresses the compliance of Inverter-based Resources (IBRs) with IEEE Standard 2800, a leading standard that defines interconnection and interoperability requirements for IBRs integrated into transmission systems. Focusing on abnormal grid scenarios, the research evaluates the specific demands on IBRs, proposing a controller development framework for abnormal grid conditions. This framework caters to maintaining ride-through operation in line with IEEE Std 2800, alongside managing currents during voltage ride-through scenarios. The effectiveness of this proposed controller frame-work is rigorously validated through case studies, employing a MATLAB/Simulink model of an IBR to test its performance under diverse grid fault conditions, ensuring the IBRs' alignment with standard requirements and their robust performance in enhancing grid reliability.

IEEE Std 2800↗

Grid Integration of Renewable Energy and Energy Storage

Grid integration of renewable energy and energy storage requires forward-looking planning process, and increased emphasizes on reliability, resilience, and equity. Power-electronics based energy generation including solar, wind, distributed energy resources (DERs), and various types of grid-tied energy storage and emerging loads, are reshaping grid operator's understanding on interconnection level performance and responses. This paper will present the ongoing work at PNNL related to power electronics R&D, energy modeling and analysis, and a wide spectrum of grid stability studies and technologies in support of grid integration of renewable energy and energy storage.

Power Electronics, grid integration of renewable e↗

Towards the Quantum Internet: Entanglement Rate Analysis of High-Efficiency Electro-Optic Transducer

Coherent microwave-optical photon conversion is a key enabling technology for the Quantum Internet, since it allows entanglement distribution among superconducting-based network nodes. A high-efficiency electro-optic transducer based on three-dimensional superconducting radio-frequency (SRF) technology has recently been proposed at Fermilab. In this paper, we evaluate the impact of Fermilab's transduction hardware on the entanglement generation probability and the entanglement rate, which are two critical metrics from a communication engineering perspective. Furthermore, we provide some guidelines to increase the direct entanglement rate, i.e., the rate before any entanglement purification process. Our analysis shows that, through high-efficiency transduction, it is possible to reduce the network overhead. This preliminary work paves the way toward distantly interconnected superconducting quantum processors.

72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS↗

Quantum/AI Topology-Aware Latency-Adaptive HPC Workflow Scheduling Optimization

The growing demand for more powerful high-performance computing (HPC) systems has led to a steady rise in energy consumption by supercomputing worldwide. This study is focused on comparing our Application-Topology Mapper (ATMapper) to the popular Simple Linux Utility for Resource Management (SLURM) for the purpose of exploring methods that can further optimize job-scheduling within HPC systems. ATMapper is an Artificial-Intelligence based approach to job-scheduling that is currently being enhanced with quantum annealing (QA) to generate optimal schedules faster. We are applying QA to speedup our ATMapper process to achieve higher computing efficiency, thereby reducing HPC energy consumption. Here, we examine how four job-scheduling approaches perform in processor node assignment when using an example network architecture of 4 interconnected nodes. Using a specialized script, we are assessing the schedule of a computation flow with 11 interdependent tasks. The data movements among nodes were tracked to count for the number of interactions (network hops) between nodes needed to complete the tasks. The total number of hops and the job completion time were then used to quantify the efficiency of the different mapping approaches. In addition to SLURM, we also compare our ATMapper to the QA-enabled LBNL TIGER and the D-Wave Distributed Computing processor assignment approaches. The preliminary results showed that our topology-aware, latency-adaptive ATMapper is significantly more efficient when compared to the other scheduling approaches due to its load-imbalance network allocation. The scheduler displayed a computing efficiency of 53% by performing significantly fewer network hops than its alternatives. By reducing the number of hops, ATMapper was able to perform all 11 tasks by using only 3 nodes out of given 4. This research indicates the potential to use QA/AI for HPC job-scheduling. Later, we will test a SLURM simulator program to draw further comparisons on the effectiveness of ATMapper's scheduling approach. The results of this comparison will serve as a baseline for later improving SLURM's performance using a QA-enhanced ATMapper approach.

Caraveo, Braulio [University of Huston - Clear Lak↗

Understanding Impacts of Frequency Calculations on Underfrequency Load Shedding

Power system fundamental frequency-dependent protection decisions and control decisions are increasingly common in the distribution system space. Understanding the algorithms used in frequency measurements is critical to understanding the decisions made by the many intelligent electronic devices in the power system. These decisions are critically important for reliability analysis for interconnected power systems as they bear directly on resource planning to mitigate under-frequency conditions that would result in under-frequency load shedding (UFLS). This work aims to improve the understanding of frequency measurement algorithms, evaluate the intelligent electronic devices that use frequency measurements for decision making, and understand the algorithms' direct impact on frequency related decision making. First, this work presents background information on the use of frequency measurements in protection logic, specifically UFLS. Second, the paper presents a relay hardware evaluation test bed used to detect and protect systems from under-frequency events. Finally, the paper presents the dynamic events used to evaluate commercially available, off-the-shelf relay equipment and the results from the relay evaluation.

COMTRADE↗