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At least 109 records · Page 6

Texturing of InP surfaces for device applications

A unique process for texturing InP (100) wafers by anisotropic etching was developed. The process produces irregular V-grooves on the surface, which reduce the surface reflectivity. The process does not require photolithography or masking. The etching characteristics depend on doping, with etching tending to proceed more rapidly on the more heavily doped samples. Reduced reflectivity surfaces formed using this process can be applied to solar cells, photodetectors, and other optoelectronic devices.

Bailey, Sheila G.↗

New technologies for UV detectors

Several technologies are currently being developed, leading to substantial improvements in the performance of UV detectors or significant reductions in power or weight. Four technologies discussed are (1) thin-film coatings to enhance the UV sensitivity of CCD's, (2) highly innovative magnet assemblies that dramatically reduce weight and result in virtually no external flux, (3) new techniques for curving microchannel plates (MCP's) so that single plates can be used to prevent ion feedback and present highly localized charge clouds to an anode structure, and (4) high-performance alternatives to glass-based MCP's. In item (2), for example, very robust magnets are made out of rare earth materials such as samarium cobalt, and cladding magnets are employed to prevent flux from escaping from the detector into the external environment. These new ultralight magnet assemblies are able to create strong, exceptionally uniform magnetic fields for image intensification and focusing of photoelectrons. The principle advantage of such detectors is the quantum efficiencies of 70-80 percent obtained throughout ultraviolet wavelengths (900-2000 A), the highest of any device. Despite the improvements achieved under item (3), high-performance alternatives to conventional glass-based MCP's potentially offer three distinct new advantages that include (1) a 30-100-fold improvement in dynamic range resulting in correspondingly higher signal-to-noise ratios, (2) the use of pure dielectric and semiconductor materials that will not outgas contaminants that eventually destroy photocathodes, and (3) channels that have constant spacing providing long-ranged order since the plates are made using photolithography techniques from the semiconductor industry. The manufacturers of these advanced-technology MCP's, however, are a couple of years away from actually producing a functioning image intensifier. In contrast to the use of CCD's for optical, ground based observations, there is no single detector technology in the ultraviolet that dominates or is as universally suitable for all applications. Thus, several technological problems, recent advances, and the impact that these new enabling technologies represent for UV applications are addressed.

Joseph, C. L.↗

Electrochemical patterning of amorphous carbon on diamond

The ability to pattern ion-implantation damaged or other nondiamond carbon on a diamond substrate is useful for fabricating a variety of devices. We accomplished such patterning by an unmasked implantation into a diamond substrate followed by photolithography and a selective electrochemical etch. The use of a high resistivity medium coupled with applied biases over 50 V permitted etching without requiring contact between the substrate and an electrode. Many electrolytes gave etches that exhibit high selectivity for nondiamond carbon over both diamond and dielectrics such as photoresist. Optical, electrical, and Raman spectroscopic measurements elucidate the effects of the etch on the implanted diamond surface.

Marchywka, Mike↗

Microstrip proportional counter development at MSFC

Microstrip detectors are an exciting new development in proportional counter design fabricated using integrated circuit-type photolithography techniques; they therefore offer very high spatial accuracy and uniformity. A development program is underway at NASA-Marshall to produce large-area microstrips for use in an X-ray detector balloon flight program and to investigate the general performance limits of these new devices. Microstrips tested so far have been fabricated both in-house using standard photolithographic techniques and by an outside contractor using electron beam technology. Various substrate materials have been tested along with different electrode configurations. The distributions of pickup on subdivided cathodes on both top and bottom surfaces of the microstrips are also being investigated for use as two-dimensional imaging detectors. Data from these tests in the development of a large-area device will be presented.

Fulton, M. A.↗

Subcritical crack growth in soda-lime glass in combined mode I and mode II loading

Subcritical crack growth under mixed-mode loading was studied in soda-lime glass. Pure mode I, combined mode I and mode II, and pure mode II loadings were achieved in precracked disk specimens by loading in diametral compression at selected angles with respect to the symmetric radial crack. Crack growth was monitored by measuring the resistance changes in a microcircuit grid consisting of parallel, electrically conducting grid lines deposited on the surface of the disk specimens by photolithography. Subcritical crack growth rates in pure mode I, pure mode II, and combined mode I and mode II loading could be described by an exponential relationship between crack growth rate and an effective crack driving force derived from a mode I-mode II fracture toughness envelope. The effective crack driving force was based on an empirical representation of the noncoplanar strain energy release rate. Stress intensities for kinked cracks were assessed using the method of caustics and an initial decrease and a subsequent increase in the subcritical crack growth rates of kinked cracks were shown to correlate with the variations of the mode I and the mode II stress intensities.

Singh, Dileep↗

Design considerations for 0.1K bolometers

Bolometers operating at low temperatures (T greater than 0.3 K) are the best candidate for far infrared (lambda greater than or = 120 microns) and submillimeter detection from cold orbiting telescopes. The limits of sensitivity for such devices have been studied (Mather, 1983). Based on this work, we conclude that excellent sensitivity is possible given careful detector design. We have designed and are fabricating bolometers for operation at low temperatures. The crucial components in detector design are (1) heat capacity, (2) temperature sensing, and (3) absorption of infrared radiation. In this presentation, we discuss the choice of materials and fabrication techniques we have made in the interest of maximum sensitivity. In order that optimization of detector performance be reasonably easy to carry out, we have attempted to use conventional fabrication techniques wherever possible (photolithography, wire bonding). The use of such procedures allows us to make design changes on short time scales, which is essential in achieving optimal performance.

Moseley, Harvey↗

Making Rectangular Apertures In Silicon

Conventional silicon micromachining techniques produce micrometer-sized rectangular apertures. Used to define source and detector openings for measurements of images and scattered light in visible, ultraviolet, and soft x-ray wavelength regions, and as general-purpose optical slits or slit arrays. Rectangular microscopic apertures replace circular pinholes made by puncturing foils with needles or by drilling foils with intense, highly-focused laser beams. Precise photolithography yields apertures of superior geometry.

Leviton, Douglas B.↗

Fabricating binary optics: An overview of binary optics process technology

A review of binary optics processing technology is presented. Pattern replication techniques have been optimized to generate high-quality efficient microoptics in visible and infrared materials. High resolution optical photolithography and precision alignment is used to fabricate maximally efficient fused silica diffractive microlenses at lambda = 633 nm. The degradation in optical efficiency of four-phase-level fused silica microlenses resulting from an intentional 0.35 micron translational error has been systematically measured as a function of lens speed (F/2 - F/60). Novel processes necessary for high sag refractive IR microoptics arrays, including deep anisotropic Si-etching, planarization of deep topography and multilayer resist techniques, are described. Initial results are presented for monolithic integration of photonic and microoptic systems.

Stern, Margaret B.↗

Emerging technologies in microguidance and control

Employing recent advances in microfabrication, the Charles Stark Draper Laboratory has developed inertial guidance instruments of very small size and low cost. Microfabrication employs the batch processing techniques of solid state electronics, such as photolithography, diffusion, and etching, to carve mechanical parts. Within a few years, microfabricated gyroscopes should perform in the 10 to 100 deg/h range. Microfabricated accelerometers have demonstrated performance in the 50 to 500 microgravity range. These instruments will result in not only the redesign of conventional military products, but also new applications that could not exist without small, inexpensive sensors and computing. Draper's microfabricated accelerometers and gyroscopes will be described and test results summarized. Associated electronics and control issues will also be addressed. Gimballed, vibrating gyroscopes and force rebalance accelerometers constructed from bulk silicon, polysilicon surface-machined tuning fork gyroscopes, and quartz resonant accelerometers and gyroscopes are examined. Draper is pursuing several types of devices for the following reasons: to address wide ranges of performance, to realize construction in a flat pack, and to lessen the risks associated with emerging technologies.

Weinberg, Marc S.↗

Micro-opto-mechanical devices and systems using epitaxial lift off

The integration of high quality, single crystal thin film gallium arsenide (GaAs) and indium phosphide (InP) based photonic and electronic materials and devices with host microstructures fabricated from materials such as silicon (Si), glass, and polymers will enable the fabrication of the next generation of micro-opto-mechanical systems (MOMS) and optoelectronic integrated circuits. Thin film semiconductor devices deposited onto arbitrary host substrates and structures create hybrid (more than one material) near-monolithic integrated systems which can be interconnected electrically using standard inexpensive microfabrication techniques such as vacuum metallization and photolithography. These integrated systems take advantage of the optical and electronic properties of compound semiconductor devices while still using host substrate materials such as silicon, polysilicon, glass and polymers in the microstructures. This type of materials optimization for specific tasks creates higher performance systems than those systems which must use trade-offs in device performance to integrate all of the function in a single material system. The low weight of these thin film devices also makes them attractive for integration with micromechanical devices which may have difficulty supporting and translating the full weight of a standard device. These thin film devices and integrated systems will be attractive for applications, however, only when the development of low cost, high yield fabrication and integration techniques makes their use economically feasible. In this paper, we discuss methods for alignment, selective deposition, and interconnection of thin film epitaxial GaAs and InP based devices onto host substrates and host microstructures.

Camperi-Ginestet, C.↗

Fiber optic probes for laser light scattering: Ground based evaluation for micgrogravity flight experimentation. Integrated coherent imaging fiber optic systems for laser light scattering and other applications

The research work presented in this report has established a new class of backscatter fiber optics probes for remote dynamic light scattering capability over a range of scattering angles from 94 degrees to 175 degrees. The fiber optic probes provide remote access to scattering systems, and can be utilized in either a noninvasive or invasive configuration. The fiber optics create an interference free data channel to inaccessible and harsh environments. Results from several studies of concentrated suspension, microemulsions, and protein systems are presented. The second part of the report describes the development of a new technology of wavefront processing within the optical fiber, that is, integrated fiber optics. Results have been very encouraging and the technology promises to have significant impact on the development of fiber optic sensors in a variety of fields ranging from environmental monitoring to optical recording, from biomedical sensing to photolithography.

Dhadwal, Harbans Singh↗

Materials for efficient high-flux magnetic bearing actuators

Magnetic bearings have demonstrated the capability for achieving positioning accuracies at the nanometer level in precision motion control stages. This makes possible the positioning of a wafer in six degrees of freedom with the precision necessary for photolithography. To control the position of an object at the nanometer level, a model of the magnetic bearing actuator force-current-airgap relationship must be accurately obtained. Additionally, to reduce thermal effects the design of the actuator should be optimized to achieve maximum power efficiency and flux density. Optimization of the actuator is accomplished by proper pole face sizing and utilizing a magnetic core material which can be magnetized to the highest flux density with low magnetic loss properties. This paper describes the construction of a magnetic bearing calibration fixture designed for experimental measurement of the actuator force characteristics. The results of a material study that review the force properties of nickel-steel, silicon-steel, and cobalt-vanadium-iron, as they apply to magnetic bearing applications are also presented.

Williams, M. E.↗

Technology Directions for the 21st Century, volume 1

For several decades, semiconductor device density and performance have been doubling about every 18 months (Moore's Law). With present photolithography techniques, this rate can continue for only about another 10 years. Continued improvement will need to rely on newer technologies. Transition from the current micron range for transistor size to the nanometer range will permit Moore's Law to operate well beyond 10 years. The technologies that will enable this extension include: single-electron transistors; quantum well devices; spin transistors; and nanotechnology and molecular engineering. Continuation of Moore's Law will rely on huge capital investments for manufacture as well as on new technologies. Much will depend on the fortunes of Intel, the premier chip manufacturer, which, in turn, depend on the development of mass-market applications and volume sales for chips of higher and higher density. The technology drivers are seen by different forecasters to include video/multimedia applications, digital signal processing, and business automation. Moore's Law will affect NASA in the areas of communications and space technology by reducing size and power requirements for data processing and data fusion functions to be performed onboard spacecraft. In addition, NASA will have the opportunity to be a pioneering contributor to nanotechnology research without incurring huge expenses.

Crimi, Giles F.↗

Precision Magnetic Bearing Six Degree of Freedom Stage

Magnetic bearings are capable of applying force and torque to a suspended object without rigidly constraining any degrees of freedom. Additionally, the resolution of magnetic bearings is limited only by sensors and control, and not by the finish of a bearing surface. For these reasons, magnetic bearings appear to be ideal for precision wafer positioning in lithography systems. To demonstrate this capability a linear magnetic bearing has been constructed which uses variable reluctance actuators to control the motion of a 14.5 kg suspended platen in five degrees of freedom. A Lorentz type linear motor of our own design and construction is used to provide motion and position control in the sixth degree of freedom. The stage performance results verify that the positioning requirements of photolithography can be met with a system of this type. This paper describes the design, control, and performance of the linear magnetic bearing.

Williams, M. E.↗

A Fluorescence Recovery After Photobleaching (FRAP) Technique for the Measurement of Solute Transport Across Surfactant-Laden Interfaces

The technique of Fluorescence Recovery After Photobleaching (FRAP) has been applied to the measurement of interfacial transport in two-phase systems. FRAP exploits the loss of fluorescence exhibited by certain fluorophores when over-stimulated (photobleached), so that a two-phase system, originally at equilibrium, can be perturbed without disturbing the interface by strong light from an argon-ion laser and its recovery monitored by a microscope-mounted CCD camera as it relaxes to a new equilibrium. During this relaxation, the concentration profiles of the probe solute are measured on both sides of the interface as a function of time, yielding information about the transport characteristics of the system. To minimize the size of the meniscus between the two phases, a photolithography technique is used to selectively treat the glass walls of the cell in which the phases are contained. This allows concentration measurements to be made very close to the interface and increases the sensitivity of the FRAP technique.

Browne, Edward P.↗

Poling of Microwave Electro-Optic Devices

The desire to transmit high frequency, microwave RF signals over fiber optic cables has necessitated the need for electro-optic modulation devices. However, in order to reap these potential benefits, it is necessary to develop the devices and their associated fabrication processes, particularly those processes associated with the poling of the devices. To this end, we entered into a cooperative research agreement with Richard Kunath of NASA LeRC. A graduate student in my group, Tony Kowalczyk, worked closely with the group at NASA to develop processes for construction of a microwave frequency electro-optic modulator. Materials were commercially obtained from Amoco Chemical and in collaboration with Lockheed-Martin. The photolithography processes were developed at NASA LeRC and the electric-field poling process was carried out in our laboratory at CWRU. During the grant period, the poling process conditions were investigated for these multilayer devices. Samples were poled and the resulting nonlinear optical properties were evaluated in our laboratory. Following the grant period, Kowalczyk went to NASA under a NRC fellowship, and I continued to collaborate as a consultant. Publications listed at the end of this report came out of this work. Another manuscript is in preparation and will be submitted shortly.

Singer, Kenneth D.↗

Thin Film Sensors for Minimally-Intrusive Measurements in Harsh High Temperature Environment

Advanced thin film sensors are being developed to provide accurate surface temperature, heat flux and strain measurements for components used in hostile propulsion environments. These sensors are sputter deposited and microfabricated directly onto the test articles with no additional bonding agent. The thickness of the sensors is only a few micrometers which creates minimal disturbance of the gas flow over the test surface. Thus thin film sensors have the advantage over conventional wire- based sensors by providing minimally intrusive measurement and having a faster response. These thin film sensors are being developed for characterization of advanced materials and structures in hostile, high-temperature environments, and for validation of design codes. This paper presents the advances of three high temperature thin film sensor technologies developed at NASA Lewis Research Center: thermocouples, heat-flux gages and strain gages. The fabrication techniques of these thin film sensors which include physical vapor deposition, photolithography patterning and lead Wire attachment are described. Sensors demonstrations on a variety of engine materials, including superalloys, ceramics and advanced ceramic matrix composites, in several hostile, high-temperature test environments are presented. The advantages and limitations of thin film sensor technology are also discussed.

Lei, Jih-Fen↗

Advances in Thin Film Thermocouple Durability Under High Temperature and Pressure Testing Conditions

Thin film thermocouples for measuring material surface temperature have been previously demonstrated on several material systems and in various hostile test environments. A well-developed thin film fabrication procedure utilizing shadow masking for patterning the sensors elements had produced thin films with sufficient durability for applications in high temperature and pressure environments that exist in air-breathing and hydrogen-fueled burner rig and engine test facilities. However, while shadow masking had been a reliable method for specimens with flat and gently curved surfaces, it had not been consistently reliable for use on test components with sharp contours. This work reports on the feasibility of utilizing photolithography processing for patterning thin film thermocouples. Because this patterning process required changes in the thin film deposition process from that developed for shadow masking, the effect of these changes on thin film adherence during burner rig testing was evaluated. In addition to the results of changing the patterning method, the effects on thin film adherence of other processes used in the thin film fabrication procedure is also presented.

Martin, Lisa C.↗