Internal visual workmanship standard for microelectronic devices /NASA STD XX-2/ and training manual, volume 2
Internal visual workmanship standards for monolithic microelectronic devices - training manual
Gaffney, J.↗
SEARCH · Engineering Papers
Results for “microelectronic”
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Microwave microelectronic techniques applied to phase shifters and other control devices Final report, 29 Jan. 1968 - 29 Aug. 1969
Microwave phase shifters and microwave control devices in microelectronic form
Robinson, G. H.↗
Design and development of microelectronic circuits for stabilization of a gas bearing gyro servo loop Phase completion report
Microelectronic servoamplifier design, tests, and evaluation for stabilizing gas bearing gyro servo loops
Friedman, B.↗
Rotating shaft-mounted microelectronic data system
Microelectronic data system mounted on rotating shaft
Lesco, D. J.↗
Development of an advanced microelectronic connection welding system Final report
Development of microelectronic connection welding system using infrared feedback control
Braswell, R. R.↗
Research achievements review, Volume 3. Report 11 - Microelectronics research for shuttle and space station
Microelectronic research and technology for shuttle and space station
Source record↗
Microelectronic power supplies Final report
Microelectronic power supply circuits for aerospace applications
Source record↗
Uses of ceramics in microelectronics: A survey
The properties and behavior of ceramic materials used in components for electronic circuitry are examined to appraise the present and future directions for microelectronics, and to suggest further product development, and how innovations may be useful in other technologies. Ceramic and glass insulators, resistors, capacitors, and the use of ceramics and glasses in microcircuitry are discussed along with technology transfer to nonaerospace uses.
Bratschun, W. R.↗
Development of a container for handling, testing, and storing discrete microelectronic components
A container has been developed for handling, testing, burning-in, and storing discrete microelectronic components without removal from the protective package. The package was designed to accommodate the leadless inverted device and other carrier-mounted active devices and chip-type discrete resistors and capacitors. Before the indicated development, components were handled and tested in various ways, some of which resulted in damage or contamination. The basic design of the container utilizes precision machined printed circuit boards and chemically milled (photoetched) contact springs. Included in this design for protection is an O-ring-sealed cover. Methods of fabrication and limitations of the current hardware are presented. Current applications of and possible extensions to the technology are discussed.
Filip, G. L.↗
Development of a hybrid microelectronics solid state relay for 2500 volts isolation and minus 120 C to 80 C thermal cycling range
A hybrid microelectronics solid state relay was developed in a TO-116 package for the MINX project. The relay provides 2500 Vdc input to output isolation and operated from a MHTL logic signal to switch a load of 400 Vdc at 2 mA. The relay is designed to operate in space and survive 1000 thermal cycles of 120 C to 80 C. The use of X-rays for failure analysis in small hybrid circuits proved valuable and the applications of vacuum deposited Parylene as a dielectric coating proved extremely valuable.
Sater, B. L.↗
Microelectronics packaging technique: A Concept
Plug-in flat packs and flat conductor cable (FCC) can be used to make compact, lightweight, external monitoring system requiring minimum of hard wiring. Microelectronic monitoring panel includes replaceable integrated or hybrid circuit flat packs and FCC.
Stringer, E. J.↗
Microelectronic bioinstrumentation system
The progess made from April 1973 to June 1974 on a microelectronics bioinstrumentation system is reported and includes data for the following three individual projects: (1) a radio frequency powered implant telemetry system; (2) an ingestible temperature telemeter; and (3) development of pO2 and pH sensors. Proposed activities for continuation of the research for the period September 1, 1974 to August 31, 1975 are also discussed.
Ko, W. H.↗
Microelectronic components and metallic oxide studies and applications
The project involved work in two basic areas: (1) Evaluation of commercial screen printable thick film conductors, resistors, thermistors and dielectrics as well as alumina substrates used in hybird microelectronics industries. Results of tests made on materials produced by seven companies are presented. (2) Experimental studies on metallic oxides of copper and vanadium, in an effort to determine their electrochemical properties in crystalline, powder mixtures and as screen printable thick films constituted the second phase of the research effort. Oxide investigations were aimed at finding possible applications of these materials as switching devices memory elements and sensors.
Williams, L., Jr.↗
High and low threshold P-channel metal oxide semiconductor process and description of microelectronics facility
The fabrication techniques and detail procedures for creating P-channel Metal-Oxide-Semiconductor (P-MOS) integrated circuits at George C. Marshall Space Flight Center (MSFC) are described. Examples of P-MOS integrated circuits fabricated at MSFC together with functional descriptions of each are given. Typical electrical characteristics of high and low threshold P-MOS discrete devices under given conditions are provided. A general description of MSFC design, mask making, packaging, and testing procedures is included. The capabilities described in this report are being utilized in: (1) research and development of new technology, (2) education of individuals in the various disciplines and technologies of the field of microelectronics, and (3) fabrication of many types of specially designed integrated circuits which are not commercially feasible in small quantities for in-house research and development programs.
Bouldin, D. L.↗
Electrical properties of adhesives used in hybrid microelectronic applications
This paper describes a test program conducted to determine the electrical properties of adhesives used in hybrid microelectronic applications and to develop test methods for measuring these properties. The electrical properties of transistor chips mounted with conductive adhesives are also measured, and the effect of long term storage at high temperature on these devices is determined.
Sergent, J. E.↗
Proceedings of the 1977 NASA/ISHM Microelectronics Conference
Current and future requirements for research, development, manufacturing and education in the field of hybrid microelectronic technology were discussed.
Caruso, S. V.↗
The large scale microelectronics Computer-Aided Design and Test (CADAT) system
The CADAT system consists of a number of computer programs written in FORTRAN that provide the capability to simulate, lay out, analyze, and create the artwork for large scale microelectronics. The function of each software component of the system is described with references to specific documentation for each software component.
Gould, J. M.↗
Evaluation of advanced microelectronic fluxless solder-bump contacts for hybrid microcircuits
Technology for interconnecting monolithic integrated circuit chips with other components is investigated. The advantages and disadvantages of the current flip-chip approach as compared to other interconnection methods are outlined. A fluxless solder-bump contact technology is evaluated. Multiple solder-bump contacts were formed on silicon integrated circuit chips. The solder-bumps, comprised of a rigid nickel under layer and a compliant solder overlayer, were electroformed onto gold device pads with the aid of thick dry film photomasks. Different solder alloys and the use of conductive epoxy for bonding were explored. Fluxless solder-bump bond quality and reliability were evaluated by measuring the effects of centrifuge, thermal cycling, and high temperature storage on bond visual characteristics, bond electrical continuity, and bond shear tests. The applicability and suitability of this technology for hybrid microelectronic packaging is discussed.
Mandal, R. P.↗