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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 109 records · Page 6

Constellation Ground Systems Launch Availability Analysis: Enhancing Highly Reliable Launch Systems Design

Success of the Constellation Program's lunar architecture requires successfully launching two vehicles, Ares I/Orion and Ares V/Altair, in a very limited time period. The reliability and maintainability of flight vehicles and ground systems must deliver a high probability of successfully launching the second vehicle in order to avoid wasting the on-orbit asset launched by the first vehicle. The Ground Operations Project determined which ground subsystems had the potential to affect the probability of the second launch and allocated quantitative availability requirements to these subsystems. The Ground Operations Project also developed a methodology to estimate subsystem reliability, availability and maintainability to ensure that ground subsystems complied with allocated launch availability and maintainability requirements. The verification analysis developed quantitative estimates of subsystem availability based on design documentation; testing results, and other information. Where appropriate, actual performance history was used for legacy subsystems or comparative components that will support Constellation. The results of the verification analysis will be used to verify compliance with requirements and to highlight design or performance shortcomings for further decision-making. This case study will discuss the subsystem requirements allocation process, describe the ground systems methodology for completing quantitative reliability, availability and maintainability analysis, and present findings and observation based on analysis leading to the Ground Systems Preliminary Design Review milestone.

Gernand, Jeffrey L.↗

Optimized Biasing of Pump Laser Diodes in a Highly Reliable Metrology Source for Long-Duration Space Missions

Optical metrology system reliability during a prolonged space mission is often limited by the reliability of pump laser diodes. We developed a metrology laser pump module architecture that meets NASA SIM Lite instrument optical power and reliability requirements by combining the outputs of multiple single-mode pump diodes in a low-loss, high port count fiber coupler. We describe Monte-Carlo simulations used to calculate the reliability of the laser pump module and introduce a combined laser farm aging parameter that serves as a load-sharing optimization metric. Employing these tools, we select pump module architecture, operating conditions, biasing approach and perform parameter sensitivity studies to investigate the robustness of the obtained solution.

808 mm diode pumps↗

A High-Voltage High-Reliability Scalable Architecture for Electric Vehicle Power Electronics (Final Report)

This project developed and demonstrated new composite converter technologies that lead to high power density (> 20 kW/L) at power levels of 10s of kW, 100s of kW, or possibly higher, with fundamental advances in converter efficiency and Q that lead to substantial increases in mean time to failure (MTTF). These advantages were realized through development of new composite converter topologies that perform buck, boost, or other conversion functions and that are scalable to higher voltage and power levels through sharing of voltage and current stresses among multiple dissimilar partial-power converter modules. The project led to experimental demonstration of a125 kW multifunction electric vehicle power conversion system having in-creased dc bus voltage (950 V nominal, 1200 V peak) that interfaces a 200 V to 400 V battery pack, and that includes integrated level 2 wired charging and wireless charging functions. The project incorporated SiC MOSFET modules having switching frequencies in excess of 100 kHz, planar magnetics, a hierarchical control architecture that enables scaling to higher voltages and powers with additional converter modules, and a high-power density in excess of 20 kW/L. The research demonstrated how a more complex converter approach can increase mean-time-to-failure, even though the number of elements is increased. This is achieved through significant reduction of temperature rise through fundamentally superior converter circuit topologies. The research also demonstrated new high power planar magnetics that increase power density. The technology is appropriate to a variety of applications including EV power trains, EV charging, PV inverters, battery storage, and similar areas. These systems potentially can be manufactured in the U.S.

33 ADVANCED PROPULSION SYSTEMS↗

High-power operation of highly reliable narrow stripe pseudomorphic single quantum well lasers emitting at 980 nm

Ridge waveguide pseudomorphic InGaAs/GaAs/AlGaAs single-quantum-well lasers exhibiting record high quantum efficiencies and high output power densities (105 mW per facet from a 6 micron wide stripe) at a lasing wavelength of 980 nm are discussed that were fabricated from a graded index separate confinement heterostructure grown by molecular beam epitaxy. Life testing at an output power of 30 mW per uncoated facet reveals a slow gradual degradation during the initial 500 h of operation after which the operating characteristics of the lasers become stable. The emission wavelength, the high output power, and the fundamental lateral mode operation render these lasers suitable for pumping Er3+-doped fiber amplifiers.

Larsson, A.↗

Highly Reliable Superhydrophobic Protection for Organic Field-Effect Transistors by Fluoroalkylsilane-Coated TiO 2 Nanoparticles

One of the long-standing problems in the field of organic electronics is their instability in an open environment, especially their poor water resistance. For the reliable operation of organic devices, introducing an effective protection layer using organo-compatible materials and processes is highly desirable. In this paper, we report a facile method for the depositing of an organo-compatible superhydrophobic protection layer on organic semiconductors under ambient conditions. The protection layer exhibiting excellent water-repellent and self-cleaning properties was deposited onto organic semiconductors directly using a dip-coating process in a highly fluorinated solution with fluoroalkylsilane-coated titanium dioxide (TiO 2 ) nanoparticles. The proposed protection layer did not damage the underlying organic semiconductors and had good resistance against mechanical-, thermal-, light-stress-, and water-based threats. The protected organic field-effect transistors exhibited more-reliable electrical properties, even when exposed to strong solvents, due to its superhydrophobicity. This study provides a practical solution with which to enhance the reliability of environmentally sensitive organic semiconductor devices in the natural environment.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

Development of a highly reliable composite board for printed circuitry for use in space environment

Materials, processes and fabrication techniques have been investigated for the development of a high-temperature circuit-board laminate. High quality, void-free copper-clad laminates have been made using 7628/HS-1 style fiberglas reinforcements with filled polyimide matrices. The fabricating characteristics of P13N resin appear suitable for use as a filled matrix in this circuit board development. High-fired, ball-milled alumina appears to be necessary to obtain the desired effects in the circuit board system. Nickel-clad copper foil bonding surfaces appear to be another requirement for retention of good bond strengths after art work and plating sequences. The fabrication cycle for this circuit board system is very dependent on the heating profile. Very rapid heating with quick loading is recommended. A stack approach to lamination was successfully used.

Bradbury, E. J.↗

Development of a breadboard design of a high-performance, high-reliability switching regulator

A comparison of two potential conversion methods, the series inverter and the inductive energy transfer (IET) conversion technique, is presented. The investigations showed that a characteristic of the series inverter circuit (high equalizing current values in each half cycle) could not be accomplished with available components, and the investigations continued with the IET circuit only. An IET circuit system was built with the use of computer-aided design in a 2, 4, and 8 stage configuration, and these stages were staggered 180, 90, and 45 degrees, respectively. All stages were pulsewidth modulated to regulate over an input voltage range from 200 to 400 volts dc at a regulated output voltage of 56 volts. The output power capability was 100 to 500 watts for the 2 and 8 stage configuration and 50 to 250 watts for the 4 stage configuration. Equal control of up to eight 45 degree staggered stages was accomplished through the use of a digital-to-analog control circuit. Equal power sharing of all stages was achieved through a new technique using an inductively coupled balancing circuit. Conclusions are listed.

Lindena, S. J.↗

Electronically controlled motor drive system has ultra-high reliability and long lifetime

Direct drive electromechanical system is composed of brushless dc torque motor, offset-tooth magnetic sensor that derives position and rate information directly from output shaft, and rotary power transformer that transfers electrical power from external source to proper load. System has high servo loop stiffness and minimum power consumption.

Veillette, L. J.↗

Feasibility model of a high reliability five-year tape transport, volume 2

Analysis of the design features of the modularized tape transport renders a life expectancy in excess of five years. Tests performed on the tape transport were directed toward determining its performance capability. These tests revealed that the tape jitter and skew are in the range achieved by high quality digital tape transports. Guidance of the tape in the lateral sense by the use of the two hybrid crowned rollers proved to be excellent. Tracking was maintained within less than one thousandth inch (approximately 2 micrometers). The guidance capability demonstrated makes possible the achievement of the performance objective of 7.2 x 10 to the 9th power storage capability employing 1500 ft. of one inch wide tape with a packing density of 5,000 bits per inch per track on 80 tracks. Also, the machine showed excellent characteristics operating over a wide range of tape speeds. The basic design concept lends itself to growth and adaptation to a wide range of recorder requirements.

Eshleman, R. L.↗

Potential application of curium neutron detection in the high reliability safeguards approach for remotely handled nuclear facilities

The study presented in this paper is part of a series of quantitative modeling efforts to characterize the neutron flux for the major subsystems in a pyroprocessing facility. An MCNPX model has established the electroreduction process, in which uranium oxide is converted into a metal product by electrochemical methods. This process is important because the electroreduction stage is the earliest point in the system where a diversion attempt could occur. This paper will present neutron flux for a commercial batch size. The intent of this study is to determine if the magnitude of the flux is sufficiently high as to affect facility design. (author)

11 NUCLEAR FUEL CYCLE AND FUEL MATERIALS↗

Application of Risk Informed Decision Making to Highly Reliable Three Dimensionally Woven Thermal Protection System for Mars Sample Return

The NASA Risk Informed Decision Making process is used to assess a trade space of three dimensionally woven thermal protection systems for application to the Mars Sample Return Earth Entry Vehicle. Candidate architectures are assessed based on mission assurance, technical development, cost, and schedule risk. Assessment methodology differed between the architectures, utilizing a four-point quantitative scale for mission assurance and technical development and highly tailored PERT techniques for cost and schedule. Risk results are presented, in addition to a review of RIDM effectiveness for this application.

Needels, J.↗

Application of Risk Informed Decision Making to a Highly Reliable Three-Dimensionally Woven Thermal Protection System for Mars Sample Return

The NASA Risk Informed Decision Making process is used to assess a trade space of three dimensionally woven thermal protection systems for application to the Mars Sample Return Earth Entry Vehicle. Candidate architectures are assessed based on mission assurance, technical development, cost, and schedule risk. Assessment methodology differed between the architectures, utilizing a four-point quantitative scale for mission assurance and technical development and highly tailored PERT techniques for cost and schedule. Risk results are presented, in addition to a review of RIDM effectiveness for this application.

Needels, J.↗

A highly reliable, autonomous data communication subsystem for an advanced information processing system

The need to meet the stringent performance and reliability requirements of advanced avionics systems has frequently led to implementations which are tailored to a specific application and are therefore difficult to modify or extend. Furthermore, many integrated flight critical systems are input/output intensive. By using a design methodology which customizes the input/output mechanism for each new application, the cost of implementing new systems becomes prohibitively expensive. One solution to this dilemma is to design computer systems and input/output subsystems which are general purpose, but which can be easily configured to support the needs of a specific application. The Advanced Information Processing System (AIPS), currently under development has these characteristics. The design and implementation of the prototype I/O communication system for AIPS is described. AIPS addresses reliability issues related to data communications by the use of reconfigurable I/O networks. When a fault or damage event occurs, communication is restored to functioning parts of the network and the failed or damage components are isolated. Performance issues are addressed by using a parallelized computer architecture which decouples Input/Output (I/O) redundancy management and I/O processing from the computational stream of an application. The autonomous nature of the system derives from the highly automated and independent manner in which I/O transactions are conducted for the application as well as from the fact that the hardware redundancy management is entirely transparent to the application.

Nagle, Gail↗

High Reliability R-10 Windows Using Vacuum Insulating Glass Units

The objective of this effort was for EverSealed Windows (“EverSealed” or “ESW”) to design, assemble, thermally and environmentally test and demonstrate a Vacuum Insulating Glass Unit (“VIGU” or “VIG”) that would enable a whole window to meet or exceed the an R-10 insulating value (U-factor ≤ 0.1). To produce a VIGU that could withstand any North American environment, ESW believed it needed to design, produce and use a flexible edge seal system. This is because a rigid edge seal, used by all other know VIG producers and developers, limits the size and/or thermal environment of the VIG to where the unit is not practical for typical IG sizes and cannot withstand severe outdoor environments. The rigid-sealed VIG’s use would be limited to mild climates where it would not have a reasonable economic payback when compared to traditional double-pane or triple-pane IGs. ESW’s goals, in addition to achieving a sufficiently high R-value to enable a whole window to achieve R-10, included creating a VIG design that could be produced for a cost equal to or lower than a traditional triple-pane IG (low-e, argon filled). ESW achieved these goals. EverSealed produced, tested and demonstrated a flexible edge-seal VIG that had an R-13 insulating value and the edge-seal system durability to operate reliably for at least 40 years in the harshest climates of North America.

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗

A high reliability battery management system

Over a period of some 5 years Canadian Astronautics Limited (CAL) has developed a system to autonomously manage, and thus prolong the life of, secondary storage batteries. During the development, the system was aimed at the space vehicle application using nickel cadmium batteries, but is expected to be able to enhance the life and performance of any rechargeable electrochemical couple. The system handles the cells of a battery individually and thus avoids the problems of over, and under, drive that inevitably occur in a battery of cells managed by an averaging system. This individual handling also allow cells to be totally bypassed in the event of failure, thus avoiding the losses associated with low capacity, partial short circuit, and the catastrophe of open circuit. The system has an optional capability of managing redundant batteries simultaneously, adding the advantage of on line reconditioning of one battery, while the other maintains the energy storage capability of the overall system. As developed, the system contains a dedicated, redundant, microprocessor, but the capability exists to have this computing capability time shared, or remote, and operating through a data link. As adjuncts to the basic management system CAL has developed high efficiency, polyphase, power regulators for charge and discharge power conditioning.

Moody, M. H.↗

Rapid Solidification of Sn-Cu-Al Alloys for High-Reliability, Lead-Free Solder: Part I. Microstructural Characterization of Rapidly Solidified Solders

Particles of Cu x Al y in Sn-Cu-Al solders have previously been shown to nucleate the Cu 6 Sn 5 phase during solidification. In this study, the number and size of Cu 6 Sn 5 nucleation sites were controlled through the particle size refinement of Cu x Al y via rapid solidification processing and controlled cooling in a differential scanning calorimeter. Cooling rates spanning eight orders of magnitude were used to refine the average Cu x Al y and Cu 6 Sn 5 particle sizes down to submicron ranges. The average particle sizes, particle size distributions, and morphologies in the microstructures were analyzed as a function of alloy composition and cooling rate. Deep etching of the samples revealed the three-dimensional microstructures and illuminated the epitaxial and morphological relationships between the Cu x Al y and Cu 6 Sn 5 phases. Transitions in the Cu 6 Sn 5 particle morphologies from faceted rods to nonfaceted, equiaxed particles were observed as a function of both cooling rate and composition. Initial solidification cooling rates within the range of 10 3 to 10 4 °C/s were found to be optimal for realizing particle size refinement and maintaining the Cu x Al y /Cu 6 Sn 5 nucleant relationship. In addition, little evidence of the formation or decomposition of the ternary-β phase in the solidified alloys was noted. As a result, solidification pathways omitting the formation of the ternary-β phase agreed well with observed room temperature microstructures.

36 MATERIALS SCIENCE↗

Rapid Solidification of Sn-Cu-Al Alloys for High-Reliability, Lead-Free Solder: Part II. Intermetallic Coarsening Behavior of Rapidly Solidified Solders After Multiple Reflows

Controlling the size, dispersion, and stability of intermetallic compounds in lead-free solder alloys is vital to creating reliable solder joints regardless of how many times the solder joints are melted and resolidified (reflowed) during circuit board assembly. In this article, the coarsening behavior of Cu x Al y and Cu 6 Sn 5 in two Sn-Cu-Al alloys, a Sn-2.59Cu-0.43Al at. pct alloy produced via drip atomization and a Sn-5.39Cu-1.69Al at. pct alloy produced via melt spinning at a 5-m/s wheel speed, was characterized after multiple (1-5) reflow cycles via differential scanning calorimetry between the temperatures of 293 K and 523 K (20 °C and 250 °C). Little-to-no coarsening of the Cu x Al y particles was observed for either composition; however, clustering of Cu x Al y particles was observed. For Cu 6 Sn 5 particle growth, a bimodal size distribution was observed for the drip atomized alloy, with large, faceted growth of Cu 6 Sn 5 observed, while in the melt spun alloy, Cu 6 Sn 5 particles displayed no significant increase in the average particle size, with irregularly shaped, nonfaceted Cu 6 Sn 5 particles observed after reflow, which is consistent with shapes observed in the as-solidified alloys. The link between original alloy composition, reflow undercooling, and subsequent intermetallic coarsening behavior was discussed by using calculated solidification paths. As a result, the reflowed microstructures suggested that the heteroepitaxial relationship previously observed between the Cu x Al y and the Cu 6 Sn 5 was maintained for both alloys.

36 MATERIALS SCIENCE↗