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At least 109 records · Page 6

Quantifying the Influence of Defects on Selectivity of Electrodes Encapsulated by Nanoscopic Silicon Oxide Overlayers

Encapsulation of electrocatalysts and photocatalysts with semipermeable nanoscopic oxide overlayers that exhibit selective transport properties is an attractive approach to achieve high redox selectivity. However, defects within the overlayers-such as pinholes, cracks, or particle inclusions-may facilitate local high rates of parasitic reactions by creating pathways for facile transport of undesired reactants to exposed active sites. Scanning electrochemical microscopy (SECM) is an attractive method to determine the influence of defects on macroscopic performance metrics thanks to its ability to measure the relative rates of competing electrochemical reactions with high spatial resolution over the electrode. Here, we report the use of SECM to determine the influence of overlayer defects on the selectivity of silicon oxide (SiOx) encapsulated platinum thin-film electrocatalysts operated under conditions where two competing reactions-the hydrogen evolution and Fe(III) reduction reactions-can occur. After an SECM methodology is described to determine spatially resolved selectivity, representative selectivity maps are correlated with the location of defects that are characterized by optical, electron, and atomic force microscopies. This analysis reveals that certain types of defects in the oxide overlayer are responsible for ∼60-90% of the partial current density toward the undesired Fe(III) reduction reaction. By correcting for defect contributions to Fe(III) reduction rates, true Fe(III) permeability values for the SiOxoverlayers were determined to be over an order of magnitude lower than permeabilities determined from analyses that ignore the presence of defects. Lastly, different types of defects were studied revealing that defect morphology can have varying influence on both redox selectivity and calculated permeability. This work highlights the need for spatially resolved measurements to evaluate the performance of oxide-encapsulated catalysts and understand their performance limits.

25 ENERGY STORAGE↗

Encapsulating Semiconductor Quantum Dots in Supramolecular Cages Enables Ultrafast Guest–Host Electron and Vibrational Energy Transfer

In the field of supramolecular chemistry, host- guest systems have been extensively explored to encapsulate a wide range of substrates, owing to emerging functionalities in nano-confined space that cannot be achieved in dilute solutions. However, host-guest chemistry is still limited to encapsulation of small guests. Herein, we construct a water-soluble metallo-supramolecular hexagonal prism with a large hydrophobic cavity by anchoring multiple polyethylene glycol chains onto the building blocks. Then, assembled prisms are able to encapsulate quantum dots (QDs) with diameters of less than 5.0 nm. Furthermore, we find that the supramolecular cage around each QD strongly modifies the photophysics of the QD by universally increasing the rates of QD relaxation processes via ultrafast electron and vibrational energy transfer. In conclusion, taken together, these efforts expand the scope of substrates in host-guest systems and provide a new approach to tune the optical properties of QDs.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

Encapsulation Residual Stress and Ferrite Loss in Inductive Coil Assemblies

As inductive wireless charging reaches higher power levels, thermal management and mechanical durability become more critical. To address these concerns, past works have demonstrated the benefit of encapsulating coil assemblies in thermally conductive materials. However, due to the sensitivity of the MnZn ferrites commonly used in coil assemblies to mechanical stress, care must be taken to avoid creating large stresses in the ferrite that cause higher hysteresis loss. The stress formation in the encapsulant curing process is overviewed and modeled and an experiment is performed to demonstrate the effect in a small-scale coil assembly. Finally, the effect is shown in the reduced coil-coil efficiency of a first generation high power inductive power transfer prototype using a stiff epoxy compared to better performance in a second prototype using a softer thermally-conductive silicone encapsulant.

Foote, Andrew↗

Field-Aged Glass/Backsheet and Glass/Glass PV Modules: Encapsulant Degradation Comparison

Ethylene vinyl acetate (EVA) is the predominant encapsulant in crystalline-silicon photovoltaic (PV) modules; however, its degradation is a subject of major concern, which causes significant power loss under field conditions. This article presents a comparison of EVA degradation in field-aged PV modules with glass/backsheet (G/B) and glass/glass (G/G) architectures. Modulelevel characterization included UV fluorescence imaging and I-V measurements. Material analytical techniques, including colorimetry, differential scanning calorimetry, thermogravimetric analysis, Fourier transform infrared spectroscopy, and Raman spectroscopy, were performed to correlate the module performance parameters with EVA material properties. An intense EVA discoloration in G/G modules was observed, which was corroborated by higher module Isc and Pmax degradation rates compared with its counterpart G/B modules. Higher power degradation was accompanied by a significant increase in EVA crosslinking, vinyl acetate content, yellowness index, and presence of functional groups containing unsaturated moieties that are linked to degradation products of photothermal reaction, and a higher decrease in the degree of crystallinity. The absence of a polymeric backsheet in hermetically sealed G/G modules, which restricts photobleaching and enhances the entrapment of volatile acetic acid and other degradation by-products, plays a major role in causing higher EVA degradation in G/G modules. This article concludes that EVA might have been a good choice of an encapsulant for the G/B modules over the decades, but it may prove to be an inappropriate choice for the G/G modules because of potential degassing, corrosion, and/or discoloration issues. Ionomers or polyester-based encapsulants like polyolefins could be best suited for G/G modules as it appears to be a current trend in the industry.

14 SOLAR ENERGY↗

Cold Sintered Ceramics and Cements for Part Encapsulation

In this project, ceramic encapsulation materials were studied for high temperature (>~°500 C) applications where typical polymer encapsulants are unstable. A new low temperature (<~°200 C) method of processing ceramics, the cold sintering process was examined. Additionally, commercially available high temperature ceramic cements were investigated. In both cases, the mechanical strengths of available materials are less than desired (i.e., desired strengths similar to Si 3 N 4 ), limiting applicability. Composite designs to increase mechanical strength are suggested. Additionally, non-uniformities in stresses and densification while embedding alumina sheets in encapsulants via cold sintering using uni-axial pressing led to fracture of sheets, and an alternative iso-static based approach is recommended for future studies.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

High Strength, Encapsulated, Commercially Useful Components and Particles Made from Coal Combustion Residuals

This project has developed and demonstrated two high-volume applications for Coal Combustion Residuals (CCR) with annual usage on the order of billions of pounds. The CCR is encapsulated in a recently developed water-impervious inorganic resin coating to reduce leaching of toxic elements from CCR by more than 80% as a first step. Target commercial applications demonstrated for the encapsulated CCR were as reinforcement for high-strength structural columns composed of CCR embedded in a ceramic matrix and as filler in high-volume plastics such as polypropylene. The encapsulated particles produced columns with properties superior to concrete, and a 30% to 50% improvement in stiffness over current fillers in plastics. CCR from bituminous and lignite coal was evaluated and shown to provide high performance, with the bituminous CCR producing the strongest columns and the lignite-based CCR provided the best performance as coated filler in polypropylene. The two-year project advanced both material systems from a Technology Readiness Level (TRL) of 2 to TRL 4.

01 COAL, LIGNITE, AND PEAT↗

Developing the Science Basis for Understanding Polymer Encapsulant Degradation Mechanisms: DuraMAT 2.0 Final Project Report

Polymeric encapsulants are essential materials in photovoltaic modules, protecting sensitive electronics from the environment while providing mechanical integrity to the multilayered assembly. However, these polymeric materials are susceptible to degradation processes driven by the ingress of environmental species, ultraviolet radiation, thermal stresses, and mechanical loading. In this study, we employ a combined atomistic simulation and accelerated aging experimental approach to study the molecular-scale mechanisms of encapsulant degradation. Classical molecular dynamics simulations quantify the diffusion of environmental and degradation species through the polymer matrix, producing composition-specific diffusion coefficients. Reactive simulations characterize activation energy barriers and reaction rate constants for key chemical pathways. In parallel, thermal-desorption analyses coupled with mass spectrometry monitor the emergence and concentration profiles of degradation products under controlled stressor conditions. By integrating simulation and experiment, we establish quantitative correlations between polymer composition, species diffusivity, and chemical reactivity. We anticipate that these relations and quantitative values could serve as high-fidelity inputs to reaction-diffusion models, enabling physics-informed lifetime predictions and guiding the design of more durable encapsulant materials for solar energy applications.

36 MATERIALS SCIENCE↗

Status of FEP encapsulated solar cell modules used in terrestrial applications

The Lewis Research Center has been engaged in transferring the FEP encapsulated solar cell technology developed for the space program to terrestrial applications. FEP encapsulated solar cell modules and arrays were designed and built expressly for terrestrial applications. Solar cell power systems were installed at three different land sites, while individual modules are undergoing marine environment tests. Four additional power systems are being completed for installation during the summer of 1974. These tests have revealed some minor problems which have been corrected. The results confirm the inherent utility of FEP encapsulated terrestrial solar cell systems.

Ratajczak, A. F.↗

Recommended practices for encapsulating high voltage assemblies

Preparation and encapsulation of high voltage assemblies are considered. Related problems in encapsulating are brought out in these instructions. A test sampling of four frequently used encapsulating compounds is shown in table form. The purpose of this table is to give a general idea of the working time available and the size of the container required for mixing and de-aerating.

Tankisley, E. W.↗

Review of world experience and properties of materials for encapsulation of terrestrial photovoltaic arrays

Published and unpublished information relating to encapsulation systems and materials properties was collected by searching the literature and appropriate data bases (over 1,300 documents were selected and reviewed) and by personal contacts including site and company visits. A data tabulation summarizing world experience with terrestrial photovoltaic arrays (50 installations) is presented in the report. Based on criteria of properties, processability, availability, and cost, candidate materials were identified which have potential for use in encapsulation systems for arrays with a lifetime of over 20 years high reliability, an efficiency greater than 10 percent, a total price less than $500/kW, and a production capacity of 500,000 kW/yr. The recommended materials (all commercially available) include, depending upon the device design, various borosilicate and soda-lime glasses and numerous polymerics suitable for specific encapsulation system functions.

Carmichael, D. C.↗

Evaluation testing of solid encapsulated microcircuits for space applications

Epoxy encapsulated microcircuits were subjected to various thermal, vibration, thermal cycling, and reduced barometric pressure stress tests to obtain electrical, environmental, and failure data. Analyses of the data were employed to derive information on environmental and operating design limits to determine the capability of encapsulated microcircuits to perform in space applications and environments. Seven different part types (four TTL, two CMOS, one linear) from five different manufacturers were subjected to single, multiple, and combinational environmental stress levels to determine: (1) what failure mechanisms are unique to encapsulated microcircuits; (2) how believable are suppliers claims of improved reliability, (3) what stress tests and screens can be used to identify potential early failure, and (4) what stress tests and screens should be avoided to prevent unwanted life degradation.

Robinson, D. D.↗

Evaluation available encapsulation materials for low-cost long-life silicon photovoltaic arrays

Experimental evaluation of selected encapsulation designs and materials based on an earlier study which have potential for use in low cost, long-life photovoltaic arrays are reported. The performance of candidate materials and encapsulated cells were evaluated principally for three types of encapsulation designs based on their potentially low materials and processing costs: (1) polymeric coatings, transparent conformal coatings over the cell with a structural-support substrate; (2) polymeric film lamination, cells laminated between two films or sheets of polymeric materials; and (3) glass-covered systems, cells adhesively bonded to a glass cover (superstrate) with a polymeric pottant and a glass or other substrate material. Several other design types, including those utilizing polymer sheet and pottant materials, were also included in the investigation.

Carmichael, D. C.↗

Material and design considerations of encapsulants for photovoltaic arrays in terrestrial applications

Procedures for analyzing cyclic mechanical stresses in encapsulated photovoltaic arrays designed for terrestrial application are discussed. The concept of 'thermal stiffness', the product of alpha and Young's modulus, is presented, and its usefulness for minimizing mechanical stresses is demonstrated. The concept of the 'proportional-limit' helps indicate the upper limit of design stress for plastics. System design is considered with attention to cell dimensions, cell to substrate adhesive, single encapsulant system, double layer encapsulant, and stresses in the interconnects. The permeability of polymeric materials to gases is examined.

Carroll, W.↗

Integral Glass Encapsulation for Solar Arrays

Work reported was performed during the period from August 1977 to December 1978. The program objective was to continue the development of electrostatic bonding (ESB) as an encapsulation technique for terrestrial cells. Economic analyses shows that this process can be a cost-effective method of producing reliable, long lifetime solar modules. When considered in sufficient volume, both material and equipment costs are competitive with conventional encapsulation systems. In addition, the possibility of integrating cell fabrication into the encapsulation process, as in the case of the preformed cell contacts discussed in this report, offers the potential of significant overall systems cost reduction.

Younger, P. R.↗

Encapsulant materials for $2/watt terrestrial photovoltaic arrays

Materials properties, cost data, and strawman designs are presented relative to materials for $2/watt terrestrial photovoltaic arrays to meet LSA Project cost goals for 1982. It is shown that encapsulation materials can be categorized in six basic elements: top covers, super-strates, pottants, adhesives, substrates, and bottom covers. The roles of the six basic encapsulant material elements in the encapsulant system are discussed and candidate materials presented.

Maxwell, H.↗

A life prediction methodology for encapsulated solar cells

This paper presents an approach to the development of a life prediction methodology for encapsulated solar cells which are intended to operate for twenty years or more in a terrestrial environment. Such a methodology, or solar cell life prediction model, requires the development of quantitative intermediate relationships between local environmental stress parameters and the basic chemical mechanisms of encapsulant aging leading to solar cell failures. The use of accelerated/abbreviated testing to develop these intermediate relationships and in revealing failure modes is discussed. Current field and demonstration tests of solar cell arrays and the present laboratory tests to qualify solar module designs provide very little data applicable to predicting the long-term performance of encapsulated solar cells. An approach to enhancing the value of such field tests to provide data for life prediction is described.

Coulbert, C. D.↗

Hermetic encapsulation technique for solar arrays

A concept is presented for encapsulating solar cells between two layers of glass either individually, in panels, or in a continuous process. The concept yields an integral unit that is hermetically sealed and that is tolerant to high temperature thermal cycling and to particulate radiation. Data are presented on both high temperature solar cells and special glasses that soften at low temperatures for use with the concept. The results of encapsulating experiments are presented which show the successful application of the concept to the special high temperature cells. The mechanical feasibility of encapsulating 2 mil cells between two layers of 2 mil glass is also demonstrated.

Deminet, C.↗

Development of glass encapsulation techniques for terrestrial photovoltaic arrays

Two parallel development programs for terrestrial solar cell module encapsulation and fabrication are reviewed, including the status of electrostatic bonding as an encapsulation technique. Current designs of electrostatically bonded modules are discussed, fabrication of which is now routine. The design of a high-efficiency module is presented, for which performance reliability features are discussed. This design is compatible with later generation changes such as the introduction of encapsulation by electrostatic bonding. Application of wire mesh contacts by electrostatic bonding has resulted in I-V curve fill factors of 0.74. Cell designs that would allow existing Pyrex glass to be used in electrostatically bonded modules are presented.

Younger, P. R.↗