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At least 109 records · Page 6
All sourcesNASA NTRSDOE OSTI
NASA NTRS1995

Hydrogen Effects on GaAs, Status and Progress

It has been observed that GaAs devices in hermetically sealed packages when exposed to temperatures as low as 125oC can exhibit unacceptable degradation in both RF and DC characteristics. The source of the problem was found to be hydrogen that has been absorbed in the package's metals (Kovar, plating, etc.) and converted into atomic hydrogen within the Pt metallization of the gate structure. Subsequently, atomic hydrogen diffuses into the channel region of the FET structure and neutralizes the Si donors, resulting in a degradation of the device characteristics. Most of the data indicates the onslaught of the problem to occur after 500 hours at 125oC. This onslaught has been observed to be dependent on the thickness and processing conditions of the passivation layer, the sealing environment, and the amount of Pt or Pd in the gate structure of the device.

Hydrogen GaAs↗
NASA NTRS1996

Hydrogen Effects on GaAs Device Reliability

GaAs and InP devices in hermetically sealed packages have been observed to exhibit unacceptable degradation in both RF and DC characteristics. This degradation has been observed to occur at temperatures as low as 125oC. The source of the degradation has been linked to hydrogen gas that has been absorbed in the package's metals (Kovar, plating, etc.) and converted into atomic hydrogen within the Pt or Pd metallization of the gate structure. Subsequently, atomic hydrogen diffuses into the channel region of the FET structure and neutralizes the Si donors, resulting in a degradation of the device characteristics.

Gallium Arsenide↗
NASA NTRS2012

Qualification of Engineering Camera for Long-Duration Deep Space Missions

Qualification and verification of advanced electronic packaging and interconnect technologies, and various other types of hardware elements for the Mars Exploration Rover s Spirit and Opportunity (MER)/Mars Science Laboratory (MSL) flight projects, has been performed to enhance the mission assurance. The qualification of hardware (engineering camera) under extreme cold temperatures has been performed with reference to various Mars-related project requirements. The flight-like packages, sensors, and subassemblies have been selected for the study to survive three times the total number of expected diurnal temperature cycles resulting from all environmental and operational exposures occurring over the life of the flight hardware, including all relevant manufacturing, ground operations, and mission phases. Qualification has been performed by subjecting above flight-like hardware to the environmental temperature extremes, and assessing any structural failures or degradation in electrical performance due to either overstress or thermal cycle fatigue. Engineering camera packaging designs, charge-coupled devices (CCDs), and temperature sensors were successfully qualified for MER and MSL per JPL design principles. Package failures were observed during qualification processes and the package redesigns were then made to enhance the reliability and subsequent mission assurance. These results show the technology certainly is promising for MSL, and especially for longterm extreme temperature missions to the extreme temperature conditions. The engineering camera has been completely qualified for the MSL project, with the proven ability to survive on Mars for 2010 sols, or 670 sols times three. Finally, the camera continued to be functional, even after 2010 thermal cycles.

Ramesham, Rajeshuni↗
NASA NTRS1998

Virtual Environment User Interfaces to Support RLV and Space Station Simulations in the ANVIL Virtual Reality Lab

Several virtual reality I/O peripherals were successfully configured and integrated as part of the author's 1997 Summer Faculty Fellowship work. These devices, which were not supported by the developers of VR software packages, use new software drivers and configuration files developed by the author to allow them to be used with simulations developed using those software packages. The successful integration of these devices has added significant capability to the ANVIL lab at MSFC. In addition, the author was able to complete the integration of a networked virtual reality simulation of the Space Shuttle Remote Manipulator System docking Space Station modules which was begun as part of his 1996 Fellowship. The successful integration of this simulation demonstrates the feasibility of using VR technology for ground-based training as well as on-orbit operations.

Dumas, Joseph D., II↗
NASA NTRS2000

Assessment and Assurance of Microelectronics Packaging Technology of Microelectromechanical Systems (MEMS)

Microelectromechanical systems (MEMS) have shown a significant promise in the last decade for a variety of applications such as air-bag, pressure sensors, accelerometer, microgyro, etc. Standard semiconductor microelectronics packaging needs the integrated circuits to be protected from the harsh environment, and provide electrical communication with the other parts of the circuit, facilitate thermal dissipation efficiently, and impart mechanical strength to the silicon die. Microelectronics packaging involves wafer dicing, bonding, lead attachment, encapsulation to protect from the environment, electrical integrity, and package leak tests to assure the packaging technology. In the case of MEMS the microstructures (active elements) often interfaces with the hostile environment where packaging leak tests and testing of such devices using chemical and mechanical parameters will be very difficult and expensive. Packaging of MEMS is significantly complex as they serve to protect from the environment and microstructures interact with the same environment to measure or affect the desired physical or chemical parameters. The most of the silicon circuitry is sensitive to temperature, moisture, magnetic field, light, and electromagnetic interference. The package must then protect the on-board silicon circuitry while simultaneously exposing the microsensor to the effect it 'measures to assure the MEMS technology by lowering the risk to zero. MEMS technology has a major application in developing a microspacecraft for space systems provided assurance of MEMS technology is sufficiently addressed nondestructively. This technology would eventually miniaturize many of the components of the spacecraft to reach the NASA's safety and mission assurance goal by building faster, cheaper, better, smaller spacecraft to explore the space more effectively by teaming-up with the other NASA centers using the limited resources available. This paper discusses the latest developments in the MEMS technology and challenging issues in the packaging of hermetically sealed and non-hermetically sealed MEMS sensor devices based on silicon, poly-silicon, and other materials for microspacecraft applications considering the space environment and reliability assurance qualification guidelines in perspective. Acknowledgments: The above research work is supported by the NASA Electronics Parts and Packaging Program (NEPP) and performed by the Jet Propulsion Laboratory, California Institute of Technology, Pasadena, CA under a contract with the NASA - Code Q for the Office of Safety and Mission Assurance Program 323-79.

Ramesham, Rajeshuni↗
NASA NTRS2000

Novel Integrated Radial and Axial Magnetic Bearing

Typically, fully active magnetically suspended systems require one axial and two radial magnetic bearings. Combining radial and axial functions into a single device allows for more compact and elegant packaging. Furthermore, in the case of high-speed devices such as energy storage flywheels, it is beneficial to minimize shaft length to keep rotor mode frequencies as high as possible. Attempts have been made to combine radial and axial functionality, but with certain drawbacks. One approach requires magnetic control flux to flow through a bias magnet reducing control effectiveness, thus resulting in increased resistive losses. This approach also requires axial force producing magnetic flux to flow in a direction into the rotor laminate that is undesirable for minimizing eddy-current losses resulting in rotational losses. Another approach applies a conical rotor shape to what otherwise would be a radial heteropolar magnetic bearing configuration. However, positional non-linear effects are introduced with this scheme and the same windings are used for bias, radial, and axial control adding complexity to the controller and electronics. For this approach, the amount of axial capability must be limited. It would be desirable for an integrated radial and axial magnetic bearing to have the following characteristics, separate inputs for radial and axial control for electronics and control simplicity, all magnetic control fluxes should only flow through their respective air gaps and should not flow through any bias magnets for minimal resistive losses, be of a homopolar design to minimize rotational losses, position related non-linear effects should be minimized, and dependent upon the design parameters, be able to achieve any radial/axial force or power ratio as desired. The integrated radial and axial magnetic bearing described in this paper exhibits all these characteristics. Magnetic circuit design, design equations, and analysis results will be presented.

Blumenstock, Kenneth A.↗
NASA NTRS2000

Novel Integration Radial and Axial Magnetic Bearing

Typically, fully active magnetically suspended systems require one axial and two radial magnetic bearings. Combining radial and axial functions into a single device allows for more compact and elegant packaging. Furthermore, in the case of high-speed devices such as energy storage flywheels, it is beneficial to minimize shaft length to keep rotor mode frequencies as high as possible. Attempts have been made to combine radial and axial functionality, but with certain drawbacks. One approach requires magnetic control flux to flow through a bias magnet reducing control effectiveness, thus resulting in increased resistive losses. This approach also requires axial force producing magnetic flux to flow in a direction into the rotor laminate that is undesirable for minimizing eddy-current losses resulting in rotational losses. Another approach applies a conical rotor shape to what otherwise would be a radial heteropolar magnetic bearing configuration. However, positional non-linear effects are introduced with this scheme and the same windings are used for bias, radial, and axial control adding complexity to the controller and electronics. For this approach, the amount of axial capability must be limited. It would be desirable for an integrated radial and axial magnetic bearing to have the following characteristics; separate inputs for radial and axial control for electronics and control simplicity, all magnetic control fluxes should only flow through their respective air gaps and should not flow through any bias magnets for minimal resistive losses, be of a homopolar design to minimize rotational losses, position related non-linear effects should be minimized, and dependent upon the design parameters, be able to achieve any radial/axial force or power ratio as desired. The integrated radial and axial magnetic bearing described in this paper exhibits all these characteristics. Magnetic circuit design, design equations, and magnetic field modeling results will be presented.

Blumenstock, Kenneth↗
NASA NTRS2018

Update - Body of Knowledge (BOK) for Copper Wire Bonds

Copper wire bond technology developments continue to be a subject of technical interest to the NASA (National Aeronautics and Space Administration) NEPP (NASA Electronic Parts and Packaging Program) which funded this update. Based on this new research, additional copper bond wire vulnerabilities were found in the literature - Crevice corrosion, intrinsic degradation of palladium coated copper wire, congregation of palladium near ball bond interface leading to failure, residual aluminum pad metallization impact on device lifetimes, stitch cracking phenomena, package delamination's that have resulted in wire bond failures and device failure due to elemental sulfur. A search of the U.S.A. patent web site found 3 noteworthy patents on the following developments: claim of a certain IMC (Intermetallic Compound) thickness as a mitigation solution to chlorine corrosion; claim of using materials with different pHs to neutralize contaminants in a package containing copper wire bonds; and a discussion on ball shear test threshold values for different applications. In addition, an aerospace contractor of military hardware had a presentation on copper bond wires where it was reported that there was a parametric shift and noise susceptibility of devices with copper bond wires which affected legacy design performance. A review of silver bond wire (another emerging technology) technical papers found that an electromigration failure mechanism was evident in device applications that operate under high current conditions. More studies may need to be performed on a comprehensive basis. Research areas for consideration are suggested, however, these research and or qualification/standard test areas are not all inclusive and should not be construed as the element (s) that delivers any potential copper wire bond solution. A false sense of security may occur, whenever there is a reliance on passing any particular qualification, standard, or test protocol.

Rutkowski, E.↗
NASA NTRS2016

System and Method for Providing a Climate Data Analytic Services Application Programming Interface Distribution Package

A system, method and computer-readable storage devices for providing a climate data analytic services application programming interface distribution package. The example system can provide various components. The system provides a climate data analytic services application programming interface library that enables software applications running on a client device to invoke the capabilities of a climate data analytic service. The system provides a command-line interface that provides a means of interacting with a climate data analytic service by issuing commands directly to the system's server interface. The system provides sample programs that call on the capabilities of the application programming interface library and can be used as templates for the construction of new client applications. The system can also provide test utilities, build utilities, service integration utilities, and documentation.

Schnase, John L.↗
NASA NTRS1978

Adaptation of ion beam technology to microfabrication of solid state devices and transducers

A number of areas were investigated to determine the potential uses of ion beam techniques in the construction of solid state devices and transducers and the packaging of implantable electronics for biomedical applications. The five areas investigated during the past year were: (1) diode-like devices fabricated on textured silicon; (2) a photolithographic technique for patterning ion beam sputtered PVC (polyvinyl chloride); (3) use of sputtered Teflon as a protective coating for implantable pressure sensors; (4) the sputtering of Macor to seal implantable hybrid circuits; and (5) the use of sputtered Teflon to immobilize enzymes.

Topich, J. A.↗
NASA NTRS1981

Superconducting tensor gravity gradiometer for satellite geodesy and inertial navigation

A sensitive gravity gradiometer can provide much needed gravity data of the earth and improve the accuracy of inertial navigation. Superconductivity and other properties of materials at low temperatures can be used to obtain a sensitive, low-drift gravity gradiometer; by differencing the outputs of accelerometer pairs using superconducting circuits, it is possible to construct a tensor gravity gradiometer which measures all the in-line and cross components of the tensor simultaneously. Additional superconducting circuits can be provided to determine the linear and angular acceleration vectors. A tensor gravity gradiometer with these features is being developed for satellite geodesy. The device constitutes a complete package of inertial navigation instruments with angular and linear acceleration readouts as well as gravity signals.

Paik, H. J.↗
NASA NTRS1986

MMIC antenna technology development in the 30/20 gigahertz band

This paper presents a progress summary of NASA's efforts in developing 20 and 30 GHz GaAs MMIC devices and an advanced satellite communications antenna system using these devices. In the interest of preserving resources such as frequency spectrum and orbital space the antenna system is being developed with multiple fixed spot beams and multiple scanning spot beams. NASA set high goals for the MMIC development to pushc GaAs technology. These goals and the main features of the MMIC devices are discussed. Some packaging and characterization considerations are also discussed. The 20 GHz transmit antenna and 30 GHz receive antenna are being developed separately. The approach selected is to perform contractual configuration studies, purchase a 20-GHz experimental antenna system (EAS) and perform in-house evaluation. The features and key specifications of the EAS are discussed. Additional supporting technologies such as effects of coupling on modest sized arrays, MMIC matching techniques, in-house analytical capability, wideband and dual frequency microstrip patch array development, and MMIC packaging techniques are described. Some plans for future are also discussed.

Smetana, J.↗
NASA NTRS1986

MMIC antenna technology development in the 30/20 gigahertz band

This paper presents a progress summary of NASA's efforts in developing 20 and 30 GHz GaAs MMIC devices and an advanced satellite communications antenna system using these devices. In the interest of preserving resources such as frequency spectrum and orbital space the antenna system is being developed with multiple fixed spot beams and multiple scanning spot beams. NASA set high goals for the MMIC development to push GaAs technology. These goals and the main features of the MMIC devices are discussed. Some packaging and characterization considerations are also discussed. The 20 GHz transmit antenna and 30 GHz receive antenna are being developed separately. The approach selected is to perform contractual configuration studies, purchase a 20-GHz experimental antenna system (EAS) and perform in-house evaluation. The features and key specifications of the EAS are discussed. Additional supporting technologies such as effects of coupling on modest sized arrays, MMIC matching techniques, in-house analytical capability, wideband and dual frequency microstrip patch array development, and MMIC packaging techniques are described. Some plans for future work are also discussed.

Smetana, J.↗
NASA NTRS1987

Micro-focus X-ray imaging

The acceptance of surface mounting in the electronics industry has been slowed by problems with component availability, electrical testing, and inspection. Industry suppliers and users have been working to solve these problems, and they are easing. Component manufacturers are offering substantially more devices in surface mountable packages. Automated test equipment vendors are offering test fixtures for surface mount circuit boards. And just recently, solder connection inspection has been automated through a partership effort with a major electronics manufacturer. The results achieved in this effort are presented.

Juha, Michael↗
NASA NTRS1989

The nature of cometary materials

Because cometary surfaces are likely to be far colder and of a different composition than planetary surfaces, there are some new considerations that must be examined in regards to placing instrumented packages or sample return devices on their surfaces. The qualitative analysis of the problem of attaching hardware to a comet and not being ejected back into space can be divided into two parts. The first problem is to pierce the mantle and obtain access to the icy core. Drilling through the mantle requires that the drilling forces be reacted. Reacting such forces probably requires attachment to the icy core below. Therefore, some kinetic impact piercing device is likely to be required as the first act of attachment. The second problem for a piercing device to overcome is the force produced by the impact kinetic energy that tries to eject the piercing device back into space. The mantle and icy core can absorb some of the impact kinetic energy in the form of fracture formation and friction energy. The energy that is not absorbed in these two ways is stored by the core as elastic deformation of the mantle and icy core. It is concluded that because the cometary materials are almost certainly brittle and the icy core is likely to be self lubricating, the elastic rebound and gas pressure expulsion forces must be counteracted by forces greater than those that may be provided by a piercing device or its capture devices (barbs).

Stephens, James↗
NASA NTRS1990

Submillimeter sources for radiometry using high power Indium Phosphide Gunn diode oscillators

A study aimed at developing high frequency millimeter wave and submillimeter wave local oscillator sources in the 60-600 GHz range was conducted. Sources involved both fundamental and harmonic-extraction type Indium Phosphide Gunn diode oscillators as well as varactor multipliers. In particular, a high power balanced-doubler using varactor diodes was developed for 166 GHz. It is capable of handling 100 mW input power, and typically produced 25 mW output power. A high frequency tripler operating at 500 GHz output frequency was also developed and cascaded with the balanced-doubler. A dual-diode InP Gunn diode combiner was used to pump this cascaded multiplier to produce on the order of 0.5 mW at 500 GHz. In addition, considerable development and characterization work on InP Gunn diode oscillators was carried out. Design data and operating characteristics were documented for a very wide range of oscillators. The reliability of InP devices was examined, and packaging techniques to enhance the performance were analyzed. A theoretical study of a new class of high power multipliers was conducted for future applications. The sources developed here find many commercial applications for radio astronomy and remote sensing.

Deo, Naresh C.↗
NASA NTRS1991

Intelligent structures technology

Viewgraphs on intelligent structures technology are presented. Topics covered include: embedding electronics; electrical and mechanical compatibility; integrated circuit chip packaged for embedding; embedding devices within composite structures; test of embedded circuit in G/E coupon; temperature/humidity/bias test; single-chip microcomputer control experiment; and structural shape determination.

Crawley, Edward F.↗