Low-loss thermomechanically stable packaging for cryogenic quantum photonic network devices: Phase I Final Report
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Sullivan, Sean (ORCID:0000000252171069)↗
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Thermal Interface Materials Selection and Application Guidelines: In Perspective of Xilinx Virtex-5QV Thermal Management
The heat from high-power microdevices for space, such as Xilinx Virtex 4 and 5 (V4 and V5), has to be removed mainly through conduction in the space vacuum environment. The class-Y type packages are designed to remove the heat from the top of the package, and the most effective method to remove heat from the class-Y type packages is to attach a heat transfer device on the lid of the package and to transfer the heat to frame or chassis. When a heat transfer device is attached to the package lid, the surfaces roughness of the package lid and the heat transfer device reduces the effective contact area between the two. The reduced contact area results in increased thermal contact resistance, and a thermal interface material is required to reduce the thermal contact resistance by filling in the gap between the surfaces of the package lid and the heat transfer device. The current report describes JPL's FY14 NEPP task study on property requirements of TIM and impact of TIM properties on the packaging reliability. The current task also developed appratuses to investigate the performances of TIMs in the actual mission environment.
Suh, Jong-ook↗
The high temperature superconductivity space experiment
The history and the current status of the high temperature superconductivity space experiment (HTSSE) initiated in 1988 are briefly reviewed. The goal of the HTSSE program is to demonstrate the feasibility of incorporating high temperature superconductivity (HTS) technology into space systems. The anticipated payoffs include the development of high temperature superconductor devices for space systems; preparation and space qualification of a cryogenically cooled experimental package containing HTS devices and components; and acquisition of data for future space experiments using more complex HTS devices and subsystems. The principal HTSSE systems and devices are described.
Webb, Denis C.↗
Thermal interface materials selection and application guidelines: in perspective of Xilinx Virtex-5QV thermal management
The heat from high-power microdevices for space, such as Xilinx Virtex 4 and 5 (V4 and V5), has to be removed mainly through conduction in the space vacuum environment. The class-Y type packages are designed to remove the heat from the top of the package, and the most effective method to remove heat from the class-Y type packages is to attach a heat transfer device on the lid of the package and to transfer the heat to frame or chassis. When a heat transfer device is attached to the package lid, the surfaces roughness of the package lid and the heat transfer device reduces the effective contact area between the two. The reduced contact area results in increased thermal contact resistance, and a thermal interface material is required to reduce the thermal contact resistance by filling in the gap between the surfaces of the package lid and the heat transfer device.
Tseng, Stephen↗
Dispatch Manager for NEML2 Constitutive Model Calculations Embedded in MOOSE
This report describes the extended capabilities of the NEML2 constitutive modeling library, including a flexible and efficient work dispatching system designed to leverage both CPU and GPU resources. This enhancement addresses one of the primary computational challenges in large-scale simulations: the ability to distribute and execute batches of material model evaluations across heterogeneous computing devices. The new dispatch system introduces a modular set of dispatcher and scheduler classes that coordinate the flow of data and execution between devices. The dispatcher is responsible for efficiently packaging work, managing device-specific memory operations, and synchronizing results. This modularity allows for extensibility, making it straightforward to integrate additional computing backends in the future. From an implementation standpoint, the dispatcher system interfaces seamlessly with NEML2's existing models. They handle device-aware tensor operations, optimize memory transfers, and support asynchronous execution when applicable. This design ensures that batches of material points can be evaluated concurrently, substantially improving throughput compared to previous single-device or serial implementations. These improvements not only enhance the raw performance of NEML2 but also improve its usability in multiscale and high-fidelity simulations, where the simultaneous evaluation of large material point batches is critical. Benchmarks included in the report demonstrate the system’s scalability, highlighting its effectiveness when leveraging modern GPU architectures.
22 GENERAL STUDIES OF NUCLEAR REACTORS↗
Evaluation of Silicon-on-Insulator HTOP-01 Operational Amplifier for Wide Temperature Operation
Electronics capable of operation under extreme temperatures are required in many of NASA space exploration missions. Aerospace and military applications, as well as some terrestrial industries constitute environments where electronic systems are anticipated to be exposed to extreme temperatures and wide-range thermal swings. Electronics that are able to withstand and operate efficiently in such harsh environments would simplify, if not eliminate, traditional thermal control elements and their associated structures for proper ambient operation. As a result, overall system mass would be reduced, design would be simplified, and reliability would be improved. Electronic parts that are built utilizing silicon-on-insulator (SOI) technology are known to offer better radiation-tolerance compared to their conventional silicon counterparts, provide faster switching, and consume less power. They also exhibit reduced leakage current and, thus, they are often tailored for high temperature operation. These attributes make SOI-based devices suitable for use in harsh environments where extreme temperatures and wide thermal swings are anticipated. A new operational amplifier, based on silicon-on-insulator technology and geared for high temperature well-logging applications, was recently introduced by Honeywell Corporation. This HTOP-01 dual precision operational amplifier is a low power device, operates on a single supply, and has an internal oscillator and an external clocking option [1]. It is rated for operation from -55 C to +225 C with a maximum output current capability of 50 mA. The amplifier chip is designed as a 14-pin, hermetically-sealed device in a ceramic package. Table I shows some of the device manufacturer s specifications.
Patterson, Richard↗
Vacuum Packaging of MEMS With Multiple Internal Seal Rings
A proposed method of design and fabrication of vacuum-packaged microelectromechanical systems (MEMS) and of individual microelectromechanical devices involves the use of multiple internal seal rings (MISRs) in conjunction with vias (through holes plated with metal for electrical contacts). The proposed method is compatible with mass production in a wafer-level fabrication process, in which the dozens of MEMS or individual microelectromechanical devices on a typical wafer are simultaneously vacuum packaged by bonding a capping wafer before the devices are singulated (cut apart by use of a dicing saw). In addition to being compatible with mass production, the proposed method would eliminate the need for some complex and expensive production steps and would yield more reliable vacuum seals. Conventionally, each MEMS or individual microelectromechanical device is fabricated as one of many identical units on a device wafer. Vacuum packaging is accomplished by bonding the device wafer to a capping wafer with metal seal rings (one ring surrounding each unit) that have been formed on the capping wafer. The electrical leads of each unit are laid out on what would otherwise be a flat surface of the device wafer, against which the seal ring is to be pressed for sealing. The resulting pattern of metal lines and their insulating oxide coverings presents a very rough and uneven surface, upon which it is difficult to pattern the sealing metal. Consequently, the seal is prone to leakage unless additional costly and complex planarization steps are performed before patterning the seal ring and bonding the wafers.
Hayworth, Ken↗
Challenges, Considerations, and Opportunities for Exercise and Medical Accommodation Inside a Small Pressurized Rover
Pressurized Rovers (PR) can enable crew to explore away from a lander or surface habitat at distances not possible on foot or even in unpressurized rovers. Sustaining crew for multiple days, they can rove for weeks, independent of other surface elements. Because these are essentially mobile habitats, it is critical that they provide sufficient volume to accommodate the exercise and medical systems to maintain human health in remote, low gravity environments such as the Moon and Mars. This is an area of extensive unknowns as requirements have not yet been developed for exercise or medical systems in pressurized rovers. Yet they must be considered in vehicle sizing studies as they are significant volume drivers, requiring allocation for stowed and deployed hardware inside the rover cabin. Previously flown spacecraft have allocated varying amounts of volume based on the expected crew mission and the state of the art in these systems. NASA-STD-3001 provides high-level requirements for standards of medical care and exercise capabilities. Crew injuries are possible both inside the cabin and on extravehicular activities (EVA), therefore requiring medical capability. Exercise countermeasures are needed to counteract the debilitating effects of lowered gravity. This may include both reconditioning following a lengthy microgravity transit as well as ongoing countermeasures against the effect of low surface gravity. The NASA reference concept for the PR dates back to the Constellation Program and prototypes have been extensively tested in NASA’s Desert Research and Technology Studies (DRATS) program as well as at the NASA Johnson Space Center. The PR cabin is designed to accommodate two crewmembers and is subdivided into a forward cockpit area and a main body for crew habitation. EVAs are accomplished by transitioning through suit ports in the aft bulkhead into spacesuits. While no exercise devices have been developed for the PR, some have been prototyped and demonstrated in DRATS analog missions. A cycle ergometer performed reasonably well in DRATS testing as an aerobic exercise device and recent analysis work has theorized that a combination aerobic and resistive device could be packaged into a form factor similar to the DRATS ergometer. It is therefore suitable for use as an initial volumetric placeholder. No sensorimotor devices have been considered for the PR to aid in adaptation to surface gravity. However, there are commercially available treadmills that at minimum represent examples of the type of exercise system that could potentially be used for such a purpose. A combination of field test data, analysis, and CAD modeling will be used to perform a first pass assessment of whether these exercise devices can be stowed and deployed within the PR. Medical inventories from the International Space Station will be used as a volume placeholder for the PR medical system. A configuration will be discussed for medical deployment, including positioning of caregiver, patient, and medical equipment / supplies.
Pressurized Rover↗
Parylene coating for circuit components
Inexpensive internal coating improves reliability of plastic-packaged parts. Coating protects device from effects of humidity and heat and acts as barrier between device and harmful substances generated by plastic-packaging material.
Berkebile, M. J.↗
Self Cooling/Heating Devices
A NASA RTTC assisted International Thermal Packaging (ITP) in the identification of a NASA-developed synthetic polymer that can absorb 1,000 times its weight in water. The desiccant was used in the manufacture of a self-chilling can, a major innovation for packaging food and beverages. The refrigeration device is a small cylinder, fully incorporated into the can. When used in beverage containers, the top of the can is popped, the internal carbonization pressure is relieved, and the self-chilling reaction is induced. Company product line has been expanded to include two related products, and several licensing agreements have been signed.
Source record↗
Thermal and Mechanical Design of a High-Voltage Power Electronics Package
This paper presents the thermal and mechanical design aspects of a power electronics package with 5-kV GaN devices. Through finite element analyses, we investigated the impact of different cooling configurations and device locations on the thermal performance and reliability of the package. We found that placing the devices closer to the direct bond copper substrate as opposed to a centered approach in the proposed double-sided cooling configuration resulted in improved heat dissipation. This approach also reduced the total number of attachment layers, thereby likely improving the reliability of the package. Furthermore, simulations revealed that the device location had a negligible impact on the thermomechanical behavior of the attachment layers, as they are more prone to the local coefficient of thermal expansion mismatch.
electronic packaging↗
Optimization of Indium Bump Morphology for Improved Flip Chip Devices
Flip-chip hybridization, also known as bump bonding, is a packaging technique for microelectronic devices that directly connects an active element or detector to a substrate readout face-to-face, eliminating the need for wire bonding. In order to make conductive links between the two parts, a solder material is used between the bond pads on each side. Solder bumps, composed of indium metal, are typically deposited by thermal evaporation onto the active regions of the device and substrate. While indium bump technology has been a part of the electronic interconnect process field for many years and has been extensively employed in the infrared imager industry, obtaining a reliable, high-yield process for high-density patterns of bumps can be quite difficult. Under the right conditions, a moderate hydrogen plasma exposure can raise the temperature of the indium bump to the point where it can flow. This flow can result in a desirable shape where indium will efficiently wet the metal contact pad to provide good electrical contact to the underlying readout or imager circuit. However, it is extremely important to carefully control this process as the intensity of the hydrogen plasma treatment dramatically affects the indium bump morphology. To ensure the fine-tuning of this reflow process, it is necessary to have realtime feedback on the status of the bumps. With an appropriately placed viewport in a plasma chamber, one can image a small field (a square of approximately 5 millimeters on each side) of the bumps (10-20 microns in size) during the hydrogen plasma reflow process. By monitoring the shape of the bumps in real time using a video camera mounted to a telescoping 12 magnifying zoom lens and associated optical elements, an engineer can precisely determine when the reflow of the bumps has occurred, and can shut off the plasma before evaporation or de-wetting takes place.
Jones, Todd J.↗
Operation of a New Half-Bridge Gate Driver for Enhancement - Mode GaN FETs, Type LM5113, Over a Wide Temperature Range
A new commercial-off-the-shelf (COTS) gate driver designed to drive both the high-side and the low-side enhancement-mode GaN FETs, National Semiconductor's type LM5113, was evaluated for operation at temperatures beyond its recommended specified limits of -40 C to +125 C. The effects of limited thermal cycling under the extended test temperature, which ranged from -194 C to +150 C, on the operation of this chip as well as restart capability at the extreme cryogenic and hot temperatures were also investigated. The driver circuit was able to maintain good operation throughout the entire test regime between -194 C and +150 C without undergoing any major changes in its outputs signals and characteristics. The limited thermal cycling performed on the device also had no effect on its performance, and the driver chip was able to successfully restart at each of the extreme temperatures of -194 C and +150 C. The plastic packaging of this device was also not affected by either the short extreme temperature exposure or the limited thermal cycling. These preliminary results indicate that this new commercial-off-the-shelf (COTS) halfbridge eGaN FET driver integrated circuit has the potential for use in space exploration missions under extreme temperature environments. Further testing is planned under long-term cycling to assess the reliability of these parts and to determine their suitability for extended use in the harsh environments of space.
Patterson, Richard↗
APS-Workshop on Characterization of MMIC (Monolithic Microwave Integrated Circuit) Devices for Array Antenna
The IEEE AP-S ADCOM is attempting to expand its educational, tutorial and information exchange activities as a further benefit to all members. To this end, ADCOM will be forming specialized workshops on topics of interest to its members. The first such workshop on Characterization and Packaging of MMIC Devices for Array Antennas was conceived. The workshop took place on June 13, 1986 as part of the 1986 International Symposium sponsored by IEEE AP-S and URSI in Philadelphia, PA, June 9-13, 1986. The workshop was formed to foster the interchange of ideas among MMIC device users and to provide a forum to collect and focus information among engineers experienced and interested in the topic. After brief presentations by the panelists and comments from attendees on several subtopics, the group was divided into working committees. Each committee evaluated and made recommendations on one of the subtopics.
Smetana, Jerry↗
Single-Event Effects in Silicon Carbide Power Devices
This report summarizes the NASA Electronic Parts and Packaging Program Silicon Carbide Power Device Subtask efforts in FY15. Benefits of SiC are described and example NASA Programs and Projects desiring this technology are given. The current status of the radiation tolerance of silicon carbide power devices is given and paths forward in the effort to develop heavy-ion single-event effect hardened devices indicated.
heavy-ion single-event effects↗
The Nature of Comet Materials and Attachment to Them
Because cometary surfaces are likely to be far colder and of a different composition and surface topography than other planetary surfaces with which we have experience, there are some new considerations that must be examined in regards to placing and attaching instrumented packages or sample return devices in or on their surfaces. The qualitative analysis of the problem of embedding hardware in a comet icy core is limited to only one of several means for the purposes of this discussion. This means can be characterized as a kinetic impact piercing device. Such kinetic impact piercing device may be used to attach the feet of an instrumented package on the surface or it may be the means for implanting the package in the icy core below the mantle. The functional requirement is to implant a device in the icy core and by mechanical means, prevent the device from being ejected back into space.
Stephens, James↗
Thermal and Mechanical Design of a High-Voltage Power Electronics Package: Preprint
Thermal and mechanical design aspects of a power electronic package with 5-kV GaN devices are presented. Through finite element analyses, the impact of different cooling configurations and device location on the thermal performance and reliability of the package was investigated. It was found that placing the devices closer to the direct-bond-copper substrate as opposed to a centered approach in the proposed double-sided-cooling configuration resulted in improved heat dissipation. This approach also reduced the total number of attachment layers, thereby likely improving the reliability of the package. Furthermore, simulations revealed that the device location had a negligible impact on the thermomechanical behavior of the attachment layers, as they are more prone to the local coefficient of thermal expansion mismatch.
27 ARPA - Advanced Research Projects Agency-Energy↗
Abatement of ionizing radiation for superconducting quantum devices
Ionizing radiation has been shown to reduce the performance of superconducting quantum circuits. In this report, we evaluate the expected contributions of different sources of ambient radioactivity for typical superconducting qubit experiment platforms. Our assessment of radioactivity inside a typical cryostat highlights the importance of selecting appropriate materials for the experiment components nearest to qubit devices, such as packaging and electrical interconnects. We present a shallow underground facility (30-meter water equivalent) to reduce the flux of cosmic rays and a lead shielded cryostat to abate the naturally occurring radiogenic gamma-ray flux in the laboratory environment. We predict that superconducting qubit devices operated in this facility could experience a reduced rate of correlated multi-qubit errors by a factor of approximately 20 relative to the rate in a typical above-ground, unshielded facility. Finally, we outline overall design improvements that would be required to further reduce the residual ionizing radiation rate, down to the limit of current generation direct detection dark matter experiments.
47 OTHER INSTRUMENTATION↗