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At least 109 records · Page 6

Microwave bonding of thin film metal coated substrates

Bonding of materials such as MEMS materials is carried out using microwaves. High microwave absorbing films are placed within a microwave cavity containing other less microwave absorbing materials, and excited to cause selective heating in the skin depth of the films. This causes heating in one place more than another. This thereby minimizes unwanted heating effects during the microwave bonding process.

Barmatz, Martin B.↗

NASA Tech Briefs, October 2011

Topics covered include: Laser Truss Sensor for Segmented Telescope Phasing; Qualifications of Bonding Process of Temperature Sensors to Deep-Space Missions; Optical Sensors for Monitoring Gamma and Neutron Radiation; Compliant Tactile Sensors; Cytometer on a Chip; Measuring Input Thresholds on an Existing Board; Scanning and Defocusing Properties of Microstrip Reflectarray Antennas; Cable Tester Box; Programmable Oscillator; Fault-Tolerant, Radiation-Hard DSP; Sub-Shot Noise Power Source for Microelectronics; Asynchronous Message Service Reference Implementation; Zero-Copy Objects System; Delay and Disruption Tolerant Networking MACHETE Model; Contact Graph Routing; Parallel Eclipse Project Checkout; Technique for Configuring an Actively Cooled Thermal Shield in a Flight System; Use of Additives to Improve Performance of Methyl Butyrate-Based Lithium-Ion Electrolytes; Li-Ion Cells Employing Electrolytes with Methyl Propionate and Ethyl Butyrate Co-Solvents; Improved Devices for Collecting Sweat for Chemical Analysis; Tissue Photolithography; Method for Impeding Degradation of Porous Silicon Structures; External Cooling Coupled to Reduced Extremity Pressure Device; A Zero-Gravity Cup for Drinking Beverages in Microgravity; Co-Flow Hollow Cathode Technology; Programmable Aperture with MEMS Microshutter Arrays; Polished Panel Optical Receiver for Simultaneous RF/Optical Telemetry with Large DSN Antennas; Adaptive System Modeling for Spacecraft Simulation; Lidar-Based Navigation Algorithm for Safe Lunar Landing; Tracking Object Existence From an Autonomous Patrol Vehicle; Rad-Hard, Miniaturized, Scalable, High-Voltage Switching Module for Power Applications; and Architecture for a 1-GHz Digital RADAR.

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Next Generation Lightweight Mirror Modeling Software

The advances in manufacturing techniques for lightweight mirrors, such as EXELSIS deep core low temperature fusion, Corning's continued improvements in the Frit bonding process and the ability to cast large complex designs, combined with water-jet and conventional diamond machining of glasses and ceramics has created the need for more efficient means of generating finite element models of these structures. Traditional methods of assembling 400,000 + element models can take weeks of effort, severely limiting the range of possible optimization variables. This paper will introduce model generation software developed under NASA sponsorship for the design of both terrestrial and space based mirrors. The software deals with any current mirror manufacturing technique, single substrates, multiple arrays of substrates, as well as the ability to merge submodels into a single large model. The modeler generates both mirror and suspension system elements, suspensions can be created either for each individual petal or the whole mirror. A typical model generation of 250,000 nodes and 450,000 elements only takes 5-10 minutes, much of that time being variable input time. The program can create input decks for ANSYS, ABAQUS and NASTRAN. An archive/retrieval system permits creation of complete trade studies, varying cell size, depth, and petal size, suspension geometry with the ability to recall a particular set of parameters and make small or large changes with ease. The input decks created by the modeler are text files which can be modified by any editor, all the key shell thickness parameters are accessible and comments in deck identify which groups of elements are associated with these parameters. This again makes optimization easier. With ANSYS decks, the nodes representing support attachments are grouped into components; in ABAQUS these are SETS and in NASTRAN as GRIDPOINT SETS, this make integration of these models into large telescope or satellite models possible.

Arnold, William↗

Next-Generation Lightweight Mirror Modeling Software

The advances in manufacturing techniques for lightweight mirrors, such as EXELSIS deep core low temperature fusion, Corning's continued improvements in the Frit bonding process and the ability to cast large complex designs, combined with water-jet and conventional diamond machining of glasses and ceramics has created the need for more efficient means of generating finite element models of these structures. Traditional methods of assembling 400,000 + element models can take weeks of effort, severely limiting the range of possible optimization variables. This paper will introduce model generation software developed under NASA sponsorship for the design of both terrestrial and space based mirrors. The software deals with any current mirror manufacturing technique, single substrates, multiple arrays of substrates, as well as the ability to merge submodels into a single large model. The modeler generates both mirror and suspension system elements, suspensions can be created either for each individual petal or the whole mirror. A typical model generation of 250,000 nodes and 450,000 elements only takes 5-10 minutes, much of that time being variable input time. The program can create input decks for ANSYS, ABAQUS and NASTRAN. An archive/retrieval system permits creation of complete trade studies, varying cell size, depth, and petal size, suspension geometry with the ability to recall a particular set of parameters and make small or large changes with ease. The input decks created by the modeler are text files which can be modified by any editor, all the key shell thickness parameters are accessible and comments in deck identify which groups of elements are associated with these parameters. This again makes optimization easier. With ANSYS decks, the nodes representing support attachments are grouped into components; in ABAQUS these are SETS and in NASTRAN as GRIDPOINT SETS, this make integration of these models into large telescope or satellite models possible

Arnold, William R., Sr.↗

Next Generation Lightweight Mirror Modeling Software

The advances in manufacturing techniques for lightweight mirrors, such as EXELSIS deep core low temperature fusion, Corning's continued improvements in the Frit bonding process and the ability to cast large complex designs, combined with water-jet and conventional diamond machining of glasses and ceramics has created the need for more efficient means of generating finite element models of these structures. Traditional methods of assembling 400,000 + element models can take weeks of effort, severely limiting the range of possible optimization variables. This paper will introduce model generation software developed under NASA sponsorship for the design of both terrestrial and space based mirrors. The software deals with any current mirror manufacturing technique, single substrates, multiple arrays of substrates, as well as the ability to merge submodels into a single large model. The modeler generates both mirror and suspension system elements, suspensions can be created either for each individual petal or the whole mirror. A typical model generation of 250,000 nodes and 450,000 elements only takes 5-10 minutes, much of that time being variable input time. The program can create input decks for ANSYS, ABAQUS and NASTRAN. An archive/retrieval system permits creation of complete trade studies, varying cell size, depth, and petal size, suspension geometry with the ability to recall a particular set of parameters and make small or large changes with ease. The input decks created by the modeler are text files which can be modified by any editor, all the key shell thickness parameters are accessible and comments in deck identify which groups of elements are associated with these parameters. This again makes optimization easier. With ANSYS decks, the nodes representing support attachments are grouped into components; in ABAQUS these are SETS and in NASTRAN as GRIDPOINT SETS, this make integration of these models into large telescope or satellite models easier.

Arnold, William R., Sr.↗

Flexible Ablators: Applications and Arcjet Testing

Flexible ablators were conceived in 2009 to meet the technology pull for large, human Mars Exploration Class, 23 m diameter hypersonic inflatable aerodynamic decelerators. As described elsewhere, they have been recently undergoing initial technical readiness (TRL) advancement by NASA. The performance limits of flexible ablators in terms of maximum heat rates, pressure and shear remain to be defined. Further, it is hoped that this emerging technology will vastly expand the capability of future NASA missions involving atmospheric entry systems. This paper considers four topics of relevance to flexible ablators: (1) Their potential applications to near/far term human and robotic missions (2) Brief consideration of the balance between heat shield diameter, flexible ablator performance limits, entry vehicle controllability and aft-body shear layer impingement of interest to designers of very large entry vehicles, (3) The approach for developing bonding processes of flexible ablators for use on rigid entry bodies and (4) Design of large arcjet test articles that will enable the testing of flexible ablators in flight-like, combined environments (heat flux, pressure, shear and structural tensile loading). Based on a review of thermal protection system performance requirements for future entry vehicles, it is concluded that flexible ablators have broad applications to conventional, rigid entry body systems and are enabling to large deployable (both inflatable and mechanical) heat shields. Because of the game-changing nature of flexible ablators, it appears that NASA's Office of the Chief Technologist (OCT) will fund a focused, 3-year TRL advancement of the new materials capable of performance in heat fluxes in the range of 200-600 W/sq. cm. This support will enable the manufacture and use of the large-scale arcjet test designs that will be a key element of this OCT funded activity.

Thermal Protection↗

Overview of the Design, Fabrication and Performance Requirements of Micro-Spec, an Integrated Submillimeter Spectrometer

Micro-Spec is a compact submillimeter (350-700 GHz) spectrometer which uses low loss superconducting niobium microstrip transmission lines and a single-crystal silicon dielectric to integrate all of the components of a grating-analog spectrometer onto a single chip. Here we present details of the fabrication and design of a prototype Micro-Spec spectrometer with resolution, R64, where we use a high-yield single-flip wafer bonding process to realize instrument components on a 0.45 m single-crystal silicon dielectric. We discuss some of the electromagnetic design concerns (such as loss, stray-light, cross-talk, and fabrication tolerances) for each of the spectrometer components and their integration into the instrument as a whole. These components include a slot antenna with a silicon lens for optical coupling, a phase delay transmission line network, parallel plate waveguide interference region, and aluminum microstrip transmission line kinetic inductance detectors with extremely low cross-talk and immunity to stray light. We have demonstrated this prototype spectrometer with design resolution of R64. Given the optical performance of this prototype, we will also discuss the extension of this design to higher resolutions suitable for balloon-flight.

spectrometer↗

Developing a New Generation of Integrated Micro-Spec Far Infrared Spectrometers for the EXperiment for Cryogenic Large-Aperture Intensity Mapping (EXCLAIM)

The current state of far-infrared astronomy drives the need to develop compact, sensitive spectrometers for future space and ground-based instruments. Here we present details of the µ-Spec spectrometers currently in development for the far-infrared balloon mission EXCLAIM. The spectrometers are designed to cover the 555 – 714 µm range with a resolution of R = λ/∆λ = 512 at the 638 µm band center. The spectrometer design incorporates a Rowland grating spectrometer implemented in a parallel plate waveguide on a low-loss single-crystal Si chip, employing Nb microstrip planar transmission lines and thin-film Al kinetic inductance detectors (KIDs). The EXCLAIM µ-Spec design is an advancement upon a successful R = 64 µ-Spec prototype, and can be considered a sub-mm superconducting photonic integrated circuit (PIC) that combines spectral dispersion and detection. The design operates in a single M=2 grating order, allowing one spectrometer to cover the full EXCLAIM band without requiring a multi-order focal plane. The EXCLAIM instrument will fly six spectrometers, which are fabricated on a single 150 mm diameter Si wafer. Fabrication involves a flip-wafer-bonding process with patterning of the superconducting layers on both sides of the Si dielectric. The spectrometers are designed to operate at 100 mK, and will include 355 Al KID detectors targeting a goal of NEP ∼8 × 10−19 W/√( Hz). We summarize the design, fabrication, and ongoing development of these µ-Spec spectrometers for EXCLAIM.

Carolyn G. Volpert↗

NASA Hypersonic Technology Project (HTP) Sic/Sic Research for Hypersonic Airframe Hot Structures

NASA, DoD, and industry have a vision for reusable hypersonic vehicles (Mach > 5). The realization of this vision will require high-specific-strength, high-temperature, reusable structures. In the sub-sonic and super-sonic flight regimes, high-specific-strength structures can be obtained via the use of aluminum, titanium, and composite materials. In the high-temperature environments associated with hypersonic flight, high specific strength is obtained via refractory-composite materials. NASA Langley Research Center has multiple efforts focused on evaluating refractory-composites for use as airframe hot structures for reusable hypersonic vehicles. Current efforts span the entire building-block approach, including coupon, element, subcomponent, and component manufacturing and testing. The coupon level work includes progressive damage testing and analysis, restrained thermal growth testing, stressed oxidation testing, and evaluation of laminate properties for several layup architectures. Element testing includes evaluation of over-temperature capability and co-processed bonding, fastener development, and analysis and testing of beaded (corrugated) panels. Subcomponent level work includes a solid rocket motor booster fin and a portion of a control surface, and component level work includes a control surface static test article. The current presentation will provide an update of work being performed at NASA, which is expected to transition refractory-composite materials to reusable hypersonic vehicles.

Hot structures↗

Formation of porous surface layers in reaction bonded silicon nitride during processing

Microstructural examination of reaction bonded silicon nitride (RBSN) has shown that there is often a region adjacent to the as-nitrided surfaces that is even more porous than the interior of this already quite porous material. Because this layer of large porosity is considered detrimental to both the strength and oxidation resistance of RBSN, a study was undertaken to determine if its formation could be prevented during processing. All test bars studied were made from a single batch of Si powder which was milled for 4 hours in heptane in a vibratory mill using high density alumina cylinders as the grinding media. After air drying the powder, bars were compacted in a single acting die and hydropressed.

Shaw, N. J.↗

Two-Step Plasma Process for Cleaning Indium Bonding Bumps

A two-step plasma process has been developed as a means of removing surface oxide layers from indium bumps used in flip-chip hybridization (bump bonding) of integrated circuits. The two-step plasma process makes it possible to remove surface indium oxide, without incurring the adverse effects of the acid etching process.

Greer, Harold F.↗

Disc resonator gyroscope fabrication process requiring no bonding alignment

A method of fabricating a resonant vibratory sensor, such as a disc resonator gyro. A silicon baseplate wafer for a disc resonator gyro is provided with one or more locating marks. The disc resonator gyro is fabricated by bonding a blank resonator wafer, such as an SOI wafer, to the fabricated baseplate, and fabricating the resonator structure according to a pattern based at least in part upon the location of the at least one locating mark of the fabricated baseplate. MEMS-based processing is used for the fabrication processing. In some embodiments, the locating mark is visualized using optical and/or infrared viewing methods. A disc resonator gyroscope manufactured according to these methods is described.

Shcheglov, Kirill V.↗

Extensive cost reduction studies: Composite empennage component - L-1011 commercial airliner

A series of cover skin laminate studies was conducted. The baseline laminate design is composed of 34 plies with doublers interwoven. This is costly to produce, since the broad goods tape dispersing machine must stop frequently while the doubler plies are inserted by hand during the layup sequence. The use of graphite cloth was investigated for the cover skin. Attention is also given to low resin content prepreg, the selection of optimum tape width, an increase in gap/overlap tolerances, the use of large reusable vacuum bags with mechanical edge seals for production, an integrated laminating center machine, automated hat stiffener processing, a secondary bond assembly process, and a single-stage cure process.

Van Hamersveld, J.↗

Indirect additive manufacturing process for fabricating bonded soft magnets

A bonded soft magnet object comprising bonded soft magnetic particles of an iron-containing alloy having a soft magnet characteristic, wherein the bonded soft magnetic particles have a particle size of at least 200 nm and up to 100 microns. Also described herein is a method for producing the bonded soft magnet by indirect additive manufacturing (IAM), such as by: (i) producing a soft magnet preform by bonding soft magnetic particles with an organic binder, wherein the magnetic particles have an iron-containing alloy composition with a soft magnet characteristic, and wherein the particles of the soft magnet material have a particle size of at least 200 nm and up to 100 microns; (ii) subjecting the preform to an elevated temperature sufficient to remove the organic binder to produce a binder-free preform; and (iii) sintering the binder-free preform at a further elevated temperature to produce the bonded soft magnet.

Paranthaman, Mariappan Parans↗

Manufacturing Process Development for Adhesively Bonded Joints in Large-Scale Space Structures

In order to take full advantage of the weight savings and performance gains offered by the use of composite materials in large-scale space structures, adhesively bonded joints must be considered. While bonded joint manufacturing at laboratory scale can be straightforward, the same manufacturing processes are not trivial at full scale. Surface preparation becomes particularly challenging (a viable process must yield consistent results over a large application area and be repeatable for multiple application sites), as does the application of heat to cure the doublers and/or bond them to the primary structure (the nature and scale of assembled or partially assembled aerospace structures often necessitates an out-of-oven/out-of-autoclave approach). In this work, bonded joint manufacturing processes are adapted for a full-scale (approximately 30 feet in diameter at the aft end) composite payload adapter at the NASA Marshall Space Flight Center. By iterating across a range of variables, process parameters for adhesively bonded joints on a large-scale composite structure have been developed. Primary findings are presented with respect to overarching bonded joint manufacturing concepts so as to maximize the applicability of this work to similar material systems and structures.

Guin, William E.↗

Investigation of hazards associated with plastic bonded starter mix manufacturing processes

An investigation to determine the hazards potential evaluation of plastic bonded starter mix (PBSM) production processes and the application to the M18 and M7A3 grenades is reported. The investigation indicated: (1) the materials with the greatest hazards characteristics, (2) process operating stations most likely to initiate hazardous conditions, (3) the test program required to examine ignition characteristics and process hazards, and (4) the method of handling the accumulated information from testing and safety analyses.

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