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At least 109 records · Page 6
All sourcesNASA NTRSDOE OSTI
NASA NTRS2018

Effectiveness of Surface Treatment Techniques for Composite Bonding with Different Contamination Levels

Various surface treatment techniques have been developed to promote adhesive bond performance for composite structural components in aerospace applications. The condition of the pre-bond surface is critical to achieving desirable bond quality. Contamination on bonding surfaces is well recognized as a major threat to ultimate bond performance. Variation in contamination level has brought additional challenges into manufacturing process control. High fidelity surface treatment techniques are required for effective removal of contaminants over a wide range of contamination levels. In this study, a common contaminant, i.e. silicone mold release, was introduced to pre-bond composite surfaces with different concentrations. Plasma and laser surface treatment techniques were performed and their effectiveness in restoring and enhancing desirable bond quality was investigated. Surface characterization techniques, including water contact angle goniometry, Fourier transform infrared spectroscopy and X-ray photoelectron spectroscopy, were conducted to assess the condition of contaminated surfaces and the improvement induced by plasma and laser surface treatments. Failure modes from a customized double cantilever beam test were investigated before and after surface treatments. Fundamental mechanisms of plasma and laser surface treatments on the composite bonding surfaces were also investigated.

Fang, Xiaomei↗
NASA NTRSDate not supplied

Testing and Analysis Correlation of a Large-Scale Composite Sandwich Longitudinal Bonded Joint for Space Launch Vehicle Structures

The NASA Composite Technology for Exploration (CTE) Project is developing and demonstrating critical composite technologies with a focus on composite bonded joints; incorporating materials, design/analysis, manufacturing, and tests that utilize NASA’s expertise and capabilities. The project has goals of advancing composite technologies and providing lightweight structures to support future NASA exploration missions. In particular, the CTE project will demonstrate weight-saving, performance-enhancing composite bonded joint technology for Space Launch System (SLS)-scale composite hardware. Advancements from the CTE project may be incorporated as future block upgrades for SLS structural components. This paper discusses the details of the development of a composite sandwich bonded longitudinal joint for a generic space launch vehicle structure called the CTE Point Design. This paper reports on the large-scale longitudinal bonded joint test articles that were fabricated and tested under axial compressive loading conditions to test the capability of the bonded joint design for buckling and joint failure. Test and analysis correlation of an as-manufactured undamaged longitudinal bonded joint panel are presented in the paper for tests to the onset of buckling and panel failure. Analysis predictions for buckling initiation and panel failure were both within 10% of the longitudinal bonded joint panel test results. This testing and analysis provide confidence in the potential use of composite bonded joints for future launch vehicle structures.

David W Sleight↗
NASA NTRSDate not supplied

Investigating Si Bonding Environments in Mercurian Melts

Mercury’s low oxygen fugacity results in lavas with extraordinarily high sulfur contents (> 1 wt%). The high S lowers melt viscosity, but why this occurs is unclear (Mouser et al., 2021). The detection of Si-S bonds (using NMR) in such highly reduced basaltic glasses, suggest that the decreased viscosity is due to changes in the Si bonding environment (Pommier et al., 2023). To investigate further, we synthesized a series of Mercurian glasses at 1 GPa, with S contents ranging from 0-6 wt% and oxygen fugacities from IW-4 to IW-6. The experimental glasses were analyzed by Si K-edge X-ray Absorption Near Edge Structure (XANES) spectroscopy and 29Si Nuclear Magnetic Resonance (NMR). Ongoing analyses will include Raman and Fourier Transform Infrared (FTIR). The 29Si NMR analyses suggest the presence of Si-S bonds in the melts, in agreement with Pommier et al. (2023). The Si K-edge XANES spectra show a decrease in K-edge position of 0.4 to 0.6 eV from terrestrial basalts (at ~IW+3) to the experimental melts at IW-4 to IW-6. This shift suggests a moderate (<20 mole %) amount of Si has shifted to lower valence states (Boujibar et al, 2019). The melts contain 0-6 wt% S, so if the K-edge shifts are the results of Si-S bonding, it implies that the majority of the S in the melts is bonded to Si. However, S K-edge XANES analyses indicate that much of the S is also bonded with Mg and Ca at these low oxygen fugacities (Anzures et al, 2020). The implication is that non-bridging Si-S-(Mg,Ca) bonds are prevalent in the reduced melts, consistent with the decrease in viscosity of the melts being due to melt depolymerization. Overall, our results suggest that dissolution of S into the melts at low fO2 is accomplished through bonding with Si, and is accompanied by significant structural changes that lower melt viscosity. Lower melt viscosities will affect many aspects of Mercury’s evolution, from magma ocean dynamics, to melt migration in the mantle, to eruption dynamics and degassing.

Emily L Fischer↗
NASA NTRS1994

Ultrasonic Evaluation of Thermal Degradation in Adhesive Bonds

The critical role played by adhesive bonds in lap joints is well known. A good knowledge of the mechanical properties of adhesive bonds in lap joints is a prerequisite to the design and reliable prediction of the performance of these bonded structures. Furthermore, the lap joint may be subject to high-temperature environments in service. Early detection of the degree of thermal degradation in adhesive bonds is required under these circumstances. A variety of ultrasonic nondestructive evaluation (NDE) techniques can be used to determine the thickness and the elastic moduli of adhesively bonded joints. In this paper we apply a previously developed technique based on the leaky Lamb wave (LLW) experiment to investigate the possibility of characterizing the thermal degradation of adhesive bonds in lap joints. The degradation of the adhesive bonds is determined through comparison between experimental data and theoretical calculations.

degradation lap joints mechanical properties bonde↗
DOE OSTI2026

Low-Pressure Diffusion Bonding of Vanadium to Commercially Pure Titanium and Ti-6Al-4V

Modern technology increasingly requires components to be made from specific high-performance materials. To support complex multi-metal structures, a variety of techniques are required to join dissimilar metal parts with precise shapes. This study evaluates vacuum diffusion bonding as a method for joining titanium and vanadium, focusing on both pure titanium and the common alloy Ti-6Al-4V. We employ modest pressure provided by a weight and simple surface preparation to simulate the most commercially applicable process. Here, we show that Ti-6Al-4V alloy bonds readily to V, forming a continuous, clearly defined interdiffusion layer with predictable kinetics. Conversely, commercially pure Ti forms a crack-prone bond with V that fails to improve at higher bonding temperatures or longer times. We attribute this failure to the concentration of stress caused by the ß-to-α phase transformation in Ti. The contrasting bonding efficacy between pure Ti and the alloy provides insight into the crystallographic interactions that occur at the interface during bonding and cooling. These results provide surprising insight into a new method for bonding Ti alloys to V and possibly other metals that share the body-centered cubic crystal structure.

36 MATERIALS SCIENCE↗
NASA NTRS2024

Offset-Stoichiometric Reflowable Composite Bonding Method with Adhesive for Mitigating Strict Faying Surface Tolerances

Inherent susceptibility of adhesive bonds to miniscule quantities of contamination can cause undetectable weakened bonds. For this reason, the Federal Aviation Administration (FAA) places strict regulations on adhesively bonded joints in primary aircraft structures. To meet certification requirements aircraft manufactures resort to redundant load paths in the form of fasteners which inherently add weight to the structure and increase manufacturing time. In prior work, a secondary bonding technique called AERoBOND was developed, which utilized off-stoichiometric epoxymatrix resins to facilitate reflow and diffusion of the resin within the joint interface during a secondary bonding/cure process, thus achieving a bond similar to a co-cured joint. However, the AERoBOND process required tight spatial tolerances between the two parts being joined. This study examined the utilization of conventional adhesive with the AERoBOND method to act as a filler in the joint line, effectively reducing the need for tight tolerances on the joining parts and serving as a flexible alternative for existing manufacturing processes. Ultrasonic inspection, optical microscopy, and ASTM International standard tests were performed to analyze the joints for defects and to quantify the mode-I and mode-II interlaminar fracture toughness and short beam strength of the proposed methodology with varying manufacturing parameters. The comprehensive results indicate that the AERoBOND+ method with and without surface preparation performs comparably to co-cured and conventional, adhesively bonded joints when secondary cured in an autoclave with 791 kPa of pressure. As an example, the AERoBOND+ panel without surface preparation bonded with 791 kPa of pressure (referred to as AB+3 throughout paper) had a mode-I fracture toughness (G Ic ) of 0.643 kJ/m 2 and a mode-II fracture toughness (G IIc ) of 4.000 kJ/m 2 in the non-precracked condition and 4.218 kJ/m 2 in the precracked condition at the adhesive-to-prepreg interface. These results were 96%, 142%, and 217%, respectively, of a co-cured baseline panel (referred to as C1 throughout paper).

Composites↗
DOE OSTI2025

Fuel Bonding and its Impact on Axial Gas Communication Behavior in Light-Water Reactor Fuel Rods

Axial gas communication concerns the flow along the axial axis of nuclear fuel rods during ramp and loss of coolant accident (LOCA) conditions. During power ramps, the higher linear heat generation rate may cause fuel-to-clad gap closure that may prevent transport of released fission gases to the plenum. Upon reduction in power the gas then can communicate to the plenum. This phenomenon has been experimentally observed by short power dips during ramp experiments completed at the Risø reactor. At higher burnups it is observed that the UO2 fuel and Zircaloy cladding forms a chemical bond. This bond results in complete closure of the gap. When these high burnup rods are subjected to a LOCA, the bond has implications on both the mechanical response (i.e., ballooning) of the cladding and subsequent fuel relocation and axial gas communication. In the LOCA scenario, gas communication is of interest in two different regimes: 1) pre-rupture communication from the plenum towards the lower pressure ballooning area and 2) the post-rupture depressurization of the plenum to the external system pressure. In both regimes the presence of a fuel-to-cladding bond will impact the rate of depressurization. In this work we present a fuel-to-clad bonding model that is coupled to an existing axial gas communication model framework in the BISON fuel performance code. The effect of considering the bond on fuel performance modeling predictions is presented through comparisons to existing experimental data. Experiments considered include several rods from the Halden IFA-650 test series. An evaluation on a full-length rod that explores the combined effect of plenum size and bonding status on axial gas communication behavior is also presented.

11 - NUCLEAR FUEL CYCLE AND FUEL MATERIALS↗
DOE OSTI2025

Corrosion Resistance of an AlCeMg/Stainless-Steel Reactive Bond

A major issue for metal components in many industries is corrosion as it can substantially reduce their lifetime. This issue is especially problematic for materials used in heat exchanger applications. Al–Ce–Mg alloys, which exhibit corrosion resistance and can reactively bond with other metals, may be a viable solution to this problem. This investigation studied the corrosion behavior of Al–2Ce–6Mg (atomic percent)/stainless-steel (SS) reactive bond interfaces after full immersion in nitric, sulfuric, formic, and mixed acid for 267 h. This particular Al–Ce–Mg alloy was chosen due to its good castability. The results of scanning electron microscope characterization showed that reactive bond formations repeatedly occurred throughout the length of the casting in the as-cut samples and that these formations maintained a secure bonding between the alloy and the stainless-steel tubes. Transmission electron microscopy results showed that there was a clear compositional and microstructural transition across the reactive bond. The results of the immersion tests indicated that the nitric, sulfuric, and the mixed acid did not have an observably negative effect on the reactive bond structure. As for the sample exposed to formic acid only, noticable changes were seen in both the microstructural appearance and the elemental profile across the bond, suggesting that oxide formation occurred.

Brechtl, Jamieson [ORNL] (ORCID:0000000217394283)↗
DOE OSTI2025

X-ray Spectroscopy Characterization of Electronic Structure and Metal–Metal Bonding in Dicobalt Complexes

Developing multimetallic complexes with tunable metal–metal interactions has long been a target of synthetic inorganic chemistry efforts due to the unique properties that such compounds can exhibit. However, understanding relationships between metal–metal bonding and chemical properties is challenging due to system-dependent factors that influence metal–metal and metal–ligand interactions, including ligand identity, coordination geometry, and metal–metal distance. In this work, we apply X-ray absorption and emission spectroscopy and quantum chemical calculations to describe electronic structure and bonding in a series of dicobalt complexes. The compounds with silane ligands and pseudo-octahedral coordination geometry exhibit Co–Co σ and multicentered bonding character, which we characterize from both the occupied and vacant perspectives via their contributions to the Co X-ray emission and absorption spectra, respectively. In contrast, the dicobalt complexes with a pseudotetrahedral coordination environment do not exhibit Co–Co bonding due to symmetry constraints on orbital overlap. We extend these insights to the theoretical evaluation of related dicobalt complexes to explain how ligand coordination and symmetry dictate the presence or absence of a Co–Co bond. In conclusion, this work highlights how fundamental insights into electronic structure and bonding through X-ray spectroscopy uncover important factors governing metal–metal interactions and guide the rational design of multimetallic complexes with tunable metal–metal bonds.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗
DOE OSTI2024

Optimization of Structurally Enhanced Solder Transient Liquid Phase Bonding

High temperature packaging technologies are a necessity for high temperature capable devices. SAC305 solder has an operational limit of 174°C imposed by creep effects which aligns well with current junction temperature limits of 175°C. Wide band gap semiconductor materials have the potential to reach junction temperatures of up to 800°C that are not currently attainable with significant reliability. Capitalizing on this potential will requires substrates and attachments that can operate well beyond the current 175°C standard. Silver sintering pastes have received widespread interest as a high temperature attachment alternative. However, the process requires high pressure bonding in an inert environment to achieve acceptable bond quality. Transient liquid phase (TLP) sintering is capable of good bond quality without pressure requirements but suffers from low thermal conductivity and only slightly reduced cost compared to silver sintering. SAC305 solder contains the same constituent materials for TLP as available copper-tin TLP sintering paste. By introducing engineered surface structures into the bond, intermetallic formation can be accelerated producing a bond similar to TLP sintering but in an ambient environment and for reduced cost. While this process has been demonstrated, it has not yet been optimized. Currently bonds are formed using a 75 μm stencil on substrate surface structures 24 μm tall, covering 19% of the bonding area. The process takes about 4 hours not including the formation of surface structures. Here, this study will center on the effects of stencil thickness and coating methods. Samples will be analyzed by scanning acoustic microscopy, die shear testing and cross sectional scanning acoustic microscopy.

42 ENGINEERING↗
NASA NTRS1982

Surface analysis in composite bonding

The role of the interfacial region in determining the bond strength and durability of composite bonds is discussed. The characterization of a variety of carbon fibers including Celion 6000 using both scanning electron microscopy and X-ray photoelectron spectroscopy is discussed. The emphasis is on composite bonding, that is, the adhesive bonding between composites in contrast to fiber-matrix interaction. The primary objective of the research is the characterization of composite surfaces before adhesive bonding and after fracture of bonded specimens. Work done on the analysis of composite samples pretreated in a number of ways prior to bonding is detailed.

Messick, D. L.↗
NASA NTRS1985

Equipment and techniques for rapid bonding of composites

Rapid adhesive bonding concepts have been developed at NASA Langley which employ induction heating of thermoplastic composite matrices directly along the bond line and/or adherends without heating the entire structure, the supports, and the fixtures of the bonding assembly. Short term thermal cycling and water boil exposures have shown encouraging environmental stability for these rapid bonds. These bonding techniques have been extended to continuous seam bonding of metallic and composite panels with promising results for the bonding of both like and unlike adherends; the portability of the apparatus suggests that field repairs of damaged structures are possible.

Buckley, John D.↗
NASA NTRS1994

Effects of Thermal Cycling on Thermal Expansion and Mechanical Properties of Sic Fiber-reinforced Reaction-bonded Si3n4 Composites

Thermal expansion curves for SiC fiber-reinforced reaction-bonded Si3N4 matrix composites (SiC/RBSN) and unreinforced RBSN were measured from 25 to 1400 C in nitrogen and in oxygen. The effects of fiber/matrix bonding and cycling on the thermal expansion curves and room-temperature tensile properties of unidirectional composites were determined. The measured thermal expansion curves were compared with those predicted from composite theory. Predicted thermal expansion curves parallel to the fiber direction for both bonding cases were similar to that of the weakly bonded composites, but those normal to the fiber direction for both bonding cases resulted in no net dimensional changes at room temperature, and no loss in tensile properties from the as-fabricated condition. In contrast, thermal cycling in oxygen for both composites caused volume expansion primarily due to internal oxidation of RBSN. Cyclic oxidation affected the mechanical properties of the weakly bonded SiC/RBSN composites the most, resulting in loss of strain capability beyond matrix fracture and catastrophic, brittle fracture. Increased bonding between the SiC fiber and RBSN matrix due to oxidation of the carbon-rich fiber surface coating and an altered residual stress pattern in the composite due to internal oxidation of the matrix are the main reasons for the poor mechanical performance of these composites.

Bhatt, R. T.↗
NASA NTRS1997

Development of Statistical Process Control Methodology for an Environmentally Compliant Surface Cleaning Process in a Bonding Laboratory

Bonding labs at both MSFC and the northern Utah production plant prepare bond test specimens which simulate or witness the production of NASA's Reusable Solid Rocket Motor (RSRM). The current process for preparing the bonding surfaces employs 1,1,1-trichloroethane vapor degreasing, which simulates the current RSRM process. Government regulations (e.g., the 1990 Amendments to the Clean Air Act) have mandated a production phase-out of a number of ozone depleting compounds (ODC) including 1,1,1-trichloroethane. In order to comply with these regulations, the RSRM Program is qualifying a spray-in-air (SIA) precision cleaning process using Brulin 1990, an aqueous blend of surfactants. Accordingly, surface preparation prior to bonding process simulation test specimens must reflect the new production cleaning process. The Bonding Lab Statistical Process Control (SPC) program monitors the progress of the lab and its capabilities, as well as certifies the bonding technicians, by periodically preparing D6AC steel tensile adhesion panels with EA-91 3NA epoxy adhesive using a standardized process. SPC methods are then used to ensure the process is statistically in control, thus producing reliable data for bonding studies, and identify any problems which might develop. Since the specimen cleaning process is being changed, new SPC limits must be established. This report summarizes side-by-side testing of D6AC steel tensile adhesion witness panels and tapered double cantilevered beams (TDCBs) using both the current baseline vapor degreasing process and a lab-scale spray-in-air process. A Proceco 26 inches Typhoon dishwasher cleaned both tensile adhesion witness panels and TDCBs in a process which simulates the new production process. The tests were performed six times during 1995, subsequent statistical analysis of the data established new upper control limits (UCL) and lower control limits (LCL). The data also demonstrated that the new process was equivalent to the vapor degreasing process.

Hutchens, Dale E.↗
NASA NTRS1999

Proceedings of the Second Annual Symposium for Nondestructive Evaluation of Bond Strength

Ultrasonics, microwaves, optically stimulated electron emission (OSEE), and computational chemistry approaches have shown relevance to bond strength determination. Nonlinear ultrasonic nondestructive evaluation methods, however, have shown the most effectiveness over other methods on adhesive bond analysis. Correlation to changes in higher order material properties due to microstructural changes using nonlinear ultrasonics has been shown related to bond strength. Nonlinear ultrasonic energy is an order of magnitude more sensitive than linear ultrasound to these material parameter changes and to acoustic velocity changes caused by the acoustoelastic effect when a bond is prestressed. Signal correlations between non-linear ultrasonic measurements and initialization of bond failures have been measured. This paper reviews bond strength research efforts presented by university and industry experts at the Second Annual Symposium for Nondestructive Evaluation of Bond Strength organized by the NDE Sciences Branch at NASA Langley in November 1998.

Roberts, Mark J.↗
NASA NTRS2000

Nondestructive Determination of Bond Strength

Although many nondestructive techniques have been applied to detect disbonds in adhesive joints, no absolutely reliable nondestructive method has been developed to detect poor adhesion and evaluate the strength of bonded joints prior to the present work which used nonlinear ultrasonic methods to investigate adhesive bond cure conditions. Previously, a variety of linear and nonlinear ultrasonic methods with water coupling had been used to study aluminum-adhesive-aluminum laminates, prepared under different adhesive curing conditions, for possible bond strength determination. Therefore, in the course of this research effort, a variety of finite-amplitude experimental methods which could possibly differentiate various cure conditions were investigated, including normal and oblique incidence approaches based on nonlinear harmonic generation as well as several non-collinear two-wave interaction approaches. Test samples were mechanically scanned in various ways with respect to the focus of a transmitting transducer operated at several variable excitation frequencies and excitation levels. Even when powerful sample-related resonances were exploited by means of a frequency scanning approach, it was very difficult to isolate the nonlinear characteristics of adhesive bonds. However, a multi-frequency multi-power approach was quite successful and reliable. Ultrasonic tone burst signals at increasing power levels, over a wide frequency range, were transmitted through each bond specimen to determine its excitation dependent nonlinear harmonic resonance behavior. Relative amplitude changes were observed particularly in the higher harmonic spectral data and analyzed using a local displacement and strain analysis in the linear approximation. Two analysis approaches of the excitation-dependent data at specific resonances were found to be quite promising. One of these approaches may represent a very robust algorithm for classifying an adhesive bond as being properly cured or not. Another approach, in addition to differentiation between various cure conditions, may even provide information with respect to the bond strength. Several technical papers were published during the course of this research and a summary is presented in the Ph.D. dissertation of Tobias P. Berndt, a graduate student financially supported by this NASA Grant.

Source record↗
NASA NTRS1982

Method of densifying an article formed of reaction bonded silicon nitride

A method of densifying an article formed of reaction bonded silicon nitride is disclosed. The reaction bonded silicon nitride article is packed in a packing mixture consisting of silicon nitride powder and a densification aid. The reaction bonded silicon nitride article and packing powder are sujected to a positive, low pressure nitrogen gas treatment while being heated to a treatment temperature and for a treatment time to cause any open porosity originally found in the reaction bonded silicon nitride article to be substantially closed. Thereafter, the reaction bonded silicon nitride article and packing powder are subjected to a positive high pressure nitrogen gas treatment while being heated to a treatment temperature and for a treatment time to cause a sintering of the reaction bonded silicon nitride article whereby the strength of the reaction bonded silicon nitride article is increased.

Mangels, John A.↗
NASA NTRS2008

Assessment of Proper Bonding Methods and Mechanical Characterization FPGA CQFPs

This presentation discusses fractured leads on field-programmable gate array (FPGA) during flight vibration. Actions taken to determine root cause and resolution of the failure include finite element analysis (FEA) and vibration testing and scanning electron microscopy (with X-ray microanalysis) and energy dispersive spectrometry (SEM/EDS) failure assessment. Bonding methods for surface mount parts is assessed, including critical analysis and assessment of random fatigue damage. Regarding ceramic quad flat pack (CQFP) lead fracture, after disassembling the attitude control electronics (ACE) configuration, photographs showed six leads cracked on FPGA RTSX72SU-1 CQ208B package located on the RWIC card. An identical package (FPGA RTSX32SU-1 CQ208B) mounted on the RWIC did not results in cracked pins due to vibration. FPGA lead failure theories include workmanship issues in the lead-forming, material defect in the leads of the FPGA packages, and the insecure mounting of the board in the card guides, among other theories. Studies were conducted using simple calculations to determine the response and fatigue life of the package. Shorter packages exhibited more response when loaded by out-of-plane displacement of PCB while taller packages exhibit more response when loaded by in-plane acceleration of PCB. Additionally, under-fill did not contribute to reducing stress in leads due to out-of-plane PCB loading or from component twisting, as much as corner bonding. The combination of corner bond and under-fill is best to address mechanical and thermal S/C environment. Test results of bonded parts showed reduced (dampened) amplitude and slightly shifted peaks at the un-bonded natural frequency and an additional response at the bonded frequency. Stress due to PCBB out-of-plane loading was decreased on in the corners when only a corner bond was used. Future work may address CQFP fatigue assessment, including the investigation of discrepancy in predicted fatigue damage, as well as comparing fatigue life and fatigue damage cycle ration computed using FEA and Miner's rule to results from a fatigue assessment software program.

Davis, Milton C.↗