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At least 109 records · Page 6

Molecular-scale Insights into Cooperativity Switching of x TAB Adsorption on Gold Nanoparticles

Quantifying adsorption behaviors is crucial for various applications such as catalysis, separation, and sensing, yet it is generally challenging to access in solution. Here, we report a combined experimental and computational study of the adsorption behaviors of alkyl-trimethylammonium bromides (xTAB), a class of ligands important for colloidal nanoparticle stabilization and shape control, with various alkyl chain lengths x on Au nanoparticles. We use density functional theory (DFT) to calculate xTAB binding energies on Au{111} and Au{110} surfaces with standing-up and lying-down configurations, which provides insights into the adsorption affinity and cooperativity differences of xTAB on these two facets. We demonstrate the key role of van der Waals interactions in determining the xTAB adsorption behavior. These computational results predict and explain the experimental discovery of xTAB’s adsorption behavior switch from stronger affinity, negative cooperativity to weaker affinity, positive cooperativity when the concentration of xTAB increases in solution. We also show that in the standing-up configuration, bilayer adsorption may occur on both facets, which can lead to different differential binding energies and consequently adsorption crossover between the two facets when the ligand concentration increases. Our combined experimental and computational approaches demonstrate a paradigm for gaining molecular-scale insights into adsorbate–surface interactions.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

Methods for measuring plating thicknesses on TAB lead frames

Plating three layer tape lead frames, used for tape automated bonding, offers a challenge to the electroplater because of nonuniform topography. Each lead frame contains large (typically .05 x. .05 inch) flat test pads located around the perimeter of the frame. These test pads are electrically connected to the bondable lead frame fingers which extend into an area in the center of the frame called the feature hole. The feature hole exposes these fingers to plating on all sides, while the test pads are exposed on only one side. In addition, the fingers are small in cross section (typically .003 x .0015 inches). Recent thickness measurements indicate that plating around the lead frame fingers is nearly twice as thick as that on test pad areas. Procedures and equipment were developed for measuring the thickness of the deposited material. Discussion was centered on the data obtained using the various measurement techniques and equipment.

Hagen, M. P.↗