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Results for “THERMAL STRESSES”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 109 records · Page 6
All sourcesNASA NTRSDOE OSTI
NASA NTRS1973

Vibration of thermally stressed plates with various boundary conditions.

By discarding Lurie's (1952) assumption of mode identity, it is shown that linear theory correctly predicts the frequency of all modes of a thermally stressed cantilever plate as well as the frequency and modes of plates with other boundary conditions. The thermal stress distribution is obtained for whatever temperature distribution and boundary conditions that may be specified. Experimental results are compared to calculated results for several different plates. Boundary conditions for the plates range from a plate with edges completely clamped to a plate with edges completely free with various other combinations of mixed and uniform edge conditions. Comparison of calculated data to experimental data shows that accurate, quantitative results can be obtained from linear theory for 'as cut' real plates for a significant range of heating when the assumption of mode identity is discarded.

Bailey, C. D.↗
NASA NTRS1979

Boundary layer thermal stresses in angle-ply composite laminates

Boundary-layer thermal stress singularities and distributions of angle-ply composite laminates under uniform thermal loading are investigated through a system of sixth-order governing partial differential equations developed with the aid of the anisotropic elasticity field equations and Lekhnitskii's complex stress functions. Results are presented for cases of various angle-ply graphite/epoxy laminates, and it is shown that the boundary-layer thickness depends on the degree of anisotropy of each individual lamina, thermomechanical properties of each ply, and the relative thickness of adjacent layers.

Wang, S. S.↗
NASA NTRS1967

Radome thermal stress investigation

Computer determinations of convergent series and continuous functions in main-body thermal stress solution for radomes of interceptor missiles during hypersonic flight

HYPERSONIC FLIGHT↗
NASA NTRS1974

Changes in the performance characteristics of a GaAs near infrared light emitting diode when exposed to various current and thermal stresses

The changes that occurred in the optical and electrical characteristics of a near infrared, GaAs light emitting diode, when operated under various levels and combinations of current and thermal stresses are discussed. A total of forty parts were operated for two thousand hours under eight different sets of dc current and ambient temperature conditions. Degradation in the radiant optical power of these devices was thirty-four percent when operated at their rated current and an ambient temperature of 298K (25 C). Derating the current and/or the thermal stress reduced the degradation of this parameter in approximately a linear manner. All degraded devices behaved similarly, exhibiting rapid nonlinear degradation followed by a gradual linear degradation and finally a period of stable operation. An attempt was made to correlate initial device condition to degradation during stress testing, but met with little success.

Thomas, E. F., Jr.↗
NASA NTRS1985

The evolution of impact basins - Cooling, subsidence, and thermal stress

The present study is concerned with an assessment of the contribution of thermal contraction and thermal stress to the topography and tectonics of large lunar impact basins. Exploratory models are developed, giving attention to the temperature structure following basin formation, the subsequent cooling of the basin region, and the resulting thermal displacements and stresses as functions of time. The subsidence and stress at the surface are compared with topography and tectonic features in the comparatively well-preserved Orientale basin. The results of the comparison are used as a basis to derive approximate constraints on the quantity and distribution of heat implanted during the basin-formation process.

Bratt, S. R.↗
NASA NTRS1979

An analysis of thermal stress and gas bending effects on vibrations of compressor rotor stages

A preliminary study conducted by Kerrebrock et al. (1976) has shown that the torsional rigidity of untwisted thin blades of a transonic compressor can be reduced significantly by transient thermal stresses. The aerodynamic loads have various effects on blade vibration. One effect is that gas bending loads may result in a bending-torsion coupling which may change the characteristics of the torsion and bending vibration of the blade. For a general study of transient-temperature distribution within a rotor stage, a finite-element heat-conduction analysis was developed. The blade and shroud are divided into annular elements. With a temperature distribution obtained from the heat-conduction analysis and a prescribed gas bending load distribution along the blade span, the static deformation and moment distributions of the blade can be solved iteratively using the finite-element method. The reduction of the torsional rigidity of pretwisted blades caused by the thermal stress effect is then computed. The dynamic behavior of the blade is studied by a modified Galerkin's method.

Chen, L.-T.↗
DOE OSTI2022

Thermal Stress Modeling and Analysis of Packed-bed Thermocline Energy Storage Tank for INL Thermal Energy Distribution System (TEDS)

The Thermal Energy Distribution System (TEDS) at Idaho National Laboratory (INL) is a thermal-hydraulic flow loop to support the integration of co-located multiple experimental systems, where a packed-bed thermal energy storage (TES) is installed as a thermal buffer and storage unit for TEDS. The packed-bed TES is adopted in TEDS because of its benefit as a low-cost single-tank storage option compared to the traditional two-tank storage. However, thermal ratcheting is one potential design concern which is caused by the rearrangement of granular filler inside a packed-bed tank during continuous thermal cycling operation of the packed-bed TES tank. If the thermally induced stress exceeds yield strength of the tank wall, it may cause catastrophic consequences like rupture of the thermal storage tank. Thus, it is crucial to understand the phenomenon to ensure the robust operation. Based on the temperature boundary conditions given by transient thermal analyses with computational fluid dynamics (CFD) simulations, the thermal ratcheting analysis is then conducted to evaluate the hoop stress and resultant thermal ratcheting potential of the TES tanks with two different modeling approaches: (1) infinite rigidity model and (2) Drucker-Prager (DP) model. The validity of each modeling method was examined by comparing the numerical simulation with the experimental data obtained from the packed-bed TES tank for Solar One Plant and evaluate the thermal ratcheting potential of the TEDS TES tank.

25 ENERGY STORAGE↗
NASA NTRS1968

Encapsulation technique eliminates thermal stresses in welded electronic modules

Encapsulation technique minimizes embedment and thermal stresses in welded electronic modules. A coating of thinned room-temperature- vulcanizing silicone rubber having a high coefficient of expansion and flexibility at low temperature, is applied first and then an encapsulating epoxy resin having a relatively low coefficient of expansion is added.

Kimmel, M.↗
DOE OSTI2022

Thermal Stress Reduction in Power Switching Devices Using Distributed Loss PWM Concept for Current Source Inverters

A new modulation scheme is proposed for current source inverters (CSIs) that reduces the variation and peak junction temperature in the CSIs' power devices. The distributed loss pulse-width modulation (DLM) concept is introduced and applied to traditional space vector modulation methods to develop modified modulation schemes that reduce the thermal stress on power devices. The device junction temperatures resulting from conventional and DLM schemes are compared. Simulation and experimental results confirm that the proposed DLM concept reduces thermal stress on the devices while maintaining the same high output current waveform quality compared to traditional CSI modulation schemes. The CSI power device lifetime (i.e., the number of cycles to failure) are estimated using the simulation and experimental results. The proposed DLM significantly increases the device lifetime (by 5 to 6 times) by reducing the junction temperature variation compared to the conventional modulations.

42 ENGINEERING↗