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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 109 records · Page 6

Johnson Space Center: Workmanship Training

Special processes require special skills, knowledge and experienced application. For over 15 years, the NASA Johnson Space Center's Receiving, Inspection and Test Facility (RITF) has provided Agency-wide NASA Workmanship Standards compliance training, issuing more than 500 to 800 training completion certificates annually. It is critical that technicians and inspectors are trained and that they maintain their proficiency to implement the applicable standards and specifications. Training services include "hands-on" training to engineers, technicians, and inspectors in the areas of electrostatic discharge (ESD), soldering, surface mount technology (SMT), crimping, conformal coating, and fiber-optic terminations.

Patterson, Ashley↗

Stirling to Flight Initiative

NASA has a consistent need for radioisotope power systems (RPS) to enable robotic scientific missions for planetary exploration that has been present for over four decades and will continue into the foreseeable future, as documented in the most recent Planetary Science Decadal Study Report. As RPS have evolved throughout the years, there has also grown a desire for more efficient power systems, allowing NASA to serve as good stewards of the limited plutonium-238 (238Pu), while also supporting the ever-present need to minimize mass and potential impacts to the desired science measurements. In fact, the recent Nuclear Power Assessment Study (NPAS) released in April 2015 resulted in several key conclusion regarding RPS, including affirmation that RPS will be necessary well into the 2030s (at least) and that 238Pu is indeed a precious resource requiring efficient utilization and preservation. Stirling Radioisotope Generators (SRGs) combine a Stirling cycle engine powered by a radioisotope heater unit into a single generator system. Stirling engine technology has been under development at NASA Glenn Research Center (GRC) in partnership with the Department of Energy (DOE) since the 1970's. The most recent design, the 238Pu-fueled Advanced Stirling Radioisotope Generator (ASRG), was offered as part of the NASA Discovery 2010 Announcement of Opportunity (AO). The Step-2 selections for this AO included two ASRG-enabled concepts, the Titan Mare Explorer (TiME) and the Comet Hopper (CHopper), although the only non-nuclear concept, InSight, was ultimately chosen. The DOE's ASRG contract was terminated in 2013. Given that SRGs utilize significantly less 238Pu than traditional Radioisotope Thermoelectric Generators (RTGs) - approximately one quarter of the nuclear fuel, to produce similar electrical power output - they provide a technology worthy of consideration for meeting the aforementioned NASA objectives. NASA's RPS Program Office has recently investigated a new Stirling to Flight (S2F) initiative with the objective of developing a 100-500 We Stirling generator system. Additionally, a different approach is being devised for this initiative to avoid pitfalls of the past, and apply lessons learned from the recent ASRG experience. Two key aspects of this initiative are a Stirling System Technology Maturation Effort, and a Surrogate Mission Team (SMT) intended to provide clear mission pull and requirements context. The S2F project seeks to lead directly into a DOE flight system development of a new SRG. This paper will detail the proposed S2F initiative, and provide specifics on the key efforts designed to pave a forward path for bringing Stirling technology to flight.

Robotics↗

Design Considerations for Spacecraft Operations During Uncrewed Dormant Phases of Human Exploration Missions

NASA is transforming human spaceflight. The Agency is shifting from an exploration-based program with human activities in low Earth orbit (LEO) and targeted robotic missions in deep space to a more sustainable and integrated pioneering approach. However, pioneering space involves daunting technical challenges of transportation, maintaining health, and enabling crew productivity for long durations in remote, hostile, and alien environments. Subject matter experts from NASA's Human Exploration and Operations Mission Directorate (HEOMD) are currently studying a human exploration campaign that involves deployment of assets for planetary exploration. This study, called the Evolvable Mars Campaign (EMC) study, explores options with solar electric propulsion as a central component of the transportation architecture. This particular in-space transportation option often results in long duration transit to destinations. The EMC study is also investigating deployed human rated systems like landers, habitats, rovers, power systems and ISRU system to the surface of Mars, which also will involve long dormant periods when these systems are staged on the surface. In order to enable the EMC architecture, campaign and element design leads along with system and capability development experts from HEOMD's System Maturation Team (SMT) have identified additional capabilities, systems and operation modes that will sustain these systems especially during these dormant phases of the mission. Dormancy is defined by the absence of crew and relative inactivity of the systems. For EMC missions, dormant periods could range from several months to several years. Two aspects of uncrewed dormant operations are considered herein: (1) the vehicle systems that are placed in a dormant state and (2) the autonomous vehicle systems and robotic capabilities that monitor, maintain, and repair the vehicle and systems. This paper describes the mission stages of dormancy operations, phases of dormant operations, and critical system capabilities that are needed for dormant operations. This paper will compare dormancy operations of past robotic missions to identify lessons that can be applied to planned human exploration missions. Finally, this paper will also identify future work and analysis planned to assess system performance metrics and integrated system operations.

Williams-Byrd, Julie↗

High Density Packaging Technologies for RF Electronics in Small Spacecraft

This paper will describe a few high density packaging technologies which we are currently exploring for use in current and future small spacecraft applications. The three categories of technologies include organic multichip modules (MCMs), ceramic leadless surface mount technology (SMT) and 3D printed waveguide structures. There are many other packaging technologies that currently exist but these three were selected in part due to their long heritage in various commercial, military and space applications along with each having a relatively clear path to flight. For each of these technologies, detailed examples will be included in which hardware has been fabricated and tested for use in RF electronics for spacecraft transponders. The organic MCM example will be described in most detail and it utilizes a packaging technology by the name of CoreEZ which is a trademark of i3 Electronics. This MCM has shrunk a portion of our electronics down to 1/8th of its previous area. The CoreEZ technology has been shown to be rad hard beyond a total ionizing dose (TID) of 300kRad and the MCM which was fabricated has gone through thermal cycling and shown to have no degradation in performance. The ceramic leadless package examples include packages from high reliability manufactures by the name of KCB solutions and Barry Industries. In the case of KCB solutions, we have multiple products that will be described including a hermetic ceramic carrier which houses three microwave monolithic integrated circuits (MMICs) along with small discrete components. Finally, we will discuss the results of our search for a 3D printing process that allows us to reduce the cost and volume of our waveguide filters and diplexers for low cost small satellite applications. We have fabricated a few prototypes using direct metal laser sintering (DMLS) and metal coated plastics. Each of these packaging technology discussions will have a brief overview of its current and future use.

Aquirre, Fernando↗

Integrating Realizability Checking in FRET

Realizability (alternatively referred to as relative consistency or implementability) - checking whether a specification can be implemented by an open system - has been the subject of extensive study. Realizability can be viewed as a stronger analysis method when compared to consistency checking in that it does not only check whether the system works in some environment, but instead whether the system works in all environments. In this report, we experiment and build on the approach presented by Gacek et al. that supports checking realizability of contracts involving infinite theories using SMT solvers. In particular, we 1) extend the Formal Requirements Elicitation Tool (FRET) to support generation of Lustre contracts that can be checked for realizability with the JKind k-induction and fix point generation engines; 2) study a compositional way for checking realizability based on the notion of connected components; and 3) test our approach and the capabilities of the JKind realizability engines on a large subset of the Lockheed Martin Cyber Physical System Challenge Problems.

Kooi, David↗

A Mixed Real and Floating-Point Solver

Reasoning about mixed real and floating-point constraints is essential for developing accurate analysis tools for floating-point pro- grams. This paper presents FPRoCK, a prototype tool for solving mixed real and floating-point formulas. FPRoCK transforms a mixed formula into an equisatisfiable one over the reals. This formula is then solved using an off-the-shelf SMT solver. FPRoCK is also integrated with the PRECiSA static analyzer, which computes a sound estimation of the round-off error of a floating-point program. It is used to detect infeasible computational paths, thereby improving the accuracy of PRECiSA.

Salvia, Rocco↗

The Ten Lockheed Martin Cyber-Physical Challenges: Formalized, Analyzed, and Explained

Capturing and analyzing requirements of Cyber-Physical Systems (CPS) can be challenging, since CPS models typically involve time-varying and real-valued variables, physical system dynamics, or even adaptive behavior. MATLAB/Simulinkis a development and simulation framework that is widely used in industry to capture such systems. In this paper, we report on the application of NASA Ames tools to perform end-to-end analysis of the Ten Lockheed Martin Challenge Problems (LMCPS). LMCPS is a set of industrial Simulink model benchmarks and natural language requirements developed by domain experts. Our framework, which integrates the tools FRET and COCOSIM, is used to: 1) elicit, explain, and formalize the semantics of the given natural language requirements; 2) generate verification code and monitors that can be automatically attached to the Simulink models; 3) perform verification by using SMT-based model checkers. FRET and COCOSIM are open source, and can be used by other researchers and practitioners to replicate our case study. We provide a categorization of recurring patterns in the formalization of the requirements and discuss the strengths and weaknesses of our automated verification approach.

Anastasia Mavridou↗

High Density Packaging Technologies for RF Electronics in Small Spacecraft

This paper will describe a few high density packaging technologies which we are currently exploring for use in current and future small spacecraft applications. The three categories of technologies include organic multichip modules (MCMs), ceramic leadless surface mount technology (SMT) and 3D printed waveguide structures. There are many other packaging technologies that currently exist but these three were selected in part due to their long heritage in various commercial, military and space applications along with each having a relatively clear path to flight. For each of these technologies, detailed examples will be included in which hardware has been fabricated and tested for use in RF electronics for spacecraft transponders. The organic MCM example will be described in most detail and it utilizes a packaging technology by the name of CoreEZ which is a trademark of i3 Electronics. This MCM has shrunk a portion of our electronics down to 1/8th of its previous area. The CoreEZ technology has been shown to be rad hard beyond a total ionizing dose (TID) of 300kRad and the MCM which was fabricated has gone through thermal cycling and shown to have no degradation in performance. The ceramic leadless package examples include packages from high reliability manufactures by the name of KCB solutions and Barry Industries. In the case of KCB solutions, we have multiple products that will be described including a hermetic ceramic carrier which houses three microwave monolithic integrated circuits (MMICs) along with small discrete components. Finally, we will discuss the results of our search for a 3D printing process that allows us to reduce the cost and volume of our waveguide filters and diplexers for low cost small satellite applications. We have fabricated a few prototypes using direct metal laser sintering (DMLS) and metal coated plastics. Each of these packaging technology discussions will have a brief overview of its current and future use.

Schatzel, Donald↗

Thermal cycling testing to failure of a ceramic column grid array package for space applications

Ceramic column grid array (CCGA) packages have been used increasingly in logic and microprocessor functions, telecommunications, flight avionics boards, payload electronics boards, engineering navigational and science cameras, electronic assemblies, and other applications, because of their inherent advantages such as high electrical interconnect density, very good thermal and electrical performance, and compatibility with standard surface-mount technology (SMT) packaging assembly processes. Because these advanced electronic packages tend to have less solder-joint strain-relief than do leaded flat-pack electronic packages, the reliability of CCGA packages in challenging thermal environments is a very important consideration for their short- and long-term use in JPL-NASA space missions. In this study, we assembled daisy chains of polyimide printed wiring boards from CCGA-interconnect packages, inspected the boards nondestructively, and then subjected them to thermal cycling to assess their reliability in thermal environments from +125°C to -40°C±25°C. The test hardware consists of a CCGA 1752 package (CN version). The package was divided into four daisy-chained sections that were electrically monitored for their continuity during thermal cycling. The CCGA 1752 package is roughly 45 mm × 45 mm with a 42-mm × 42-mm array of 80%/20% Pb/Sn columns on a 1.00-mm pitch. The resistance of the daisy-chained CCGA interconnects was continuously monitored during thermal cycling in a gaseous nitrogen environment. Electrical continuity resistance measurements as a function of thermal cycling are reported here; tests to date have shown significant change to an open circuit in daisy-chain resistance as a function of thermal cycling. The change in interconnect resistance becomes increasingly noticeable with increasing number of thermal cycles. This paper describes the experimental thermal-cycling test results of CCGA 1752 package reliability testing under an extremely wide temperature range. The first failure was observed at 1479th thermal cycle. We report the thermal-cycle reliability test data for ~2500 thermal cycles.

Ramesham, Rajeshuni↗

SafeDNN: Understanding and Verifying Neural Networks

The SafeDNN project at NASA Ames explores analysis techniques and tools to ensure that systems that use Deep Neural Networks (DNN) are safe, robust and interpretable. Research directions we are pursuing include: symbolic execution for DNN analysis, label-guided clustering to automatically identify input regions that are robust, parallel and compositional approaches to improve formal SMT-based verification, property inference and automated program repair for DNNs, adversarial training and detection, probabilistic reasoning for DNNs. In this talk I will highlight some of the research advances from SafeDNN, that were already published.

Corina Pasareanu↗

Surveillance Test Articles Development

Material degradation in Advance Test Reactors (ATR) is governed by irradiation, corrosion, elevated temperature exposure and cyclic mechanical creep-fatigue loads. This degradation information during reactor operation condition is limited. Hence, material damage monitoring is a key aspect of the design, analysis and licensing of ATR components. The idea is to monitor material component operation conditions of component by using a surveillance test article. This test article is fabricated with bi-metal configuration with two different thermal expansion coefficients, and design is motivated by Simplified Model Test (SMT) specimen which can capture structure-like mechanical response. Upon raising temperature of the bi-metal test article configuration, expansion mismatch results tensile load on specimen. Thus, temperature dependent passively actuated loading is achieved. The idea is to place this surveillance test article in reactor at location ‘x’ to surveil the mechanical response at critical location ‘y’. By calibrating the test article design, material degradation at critical location can be surveilled through assessing the degradation in surveillance test article. This study presents test article development with different material combinations and follow-up experimental testing work through passively loading test article with temperature history. The test article geometry and observed test results are presented in presentation slides.

36 MATERIALS SCIENCE↗

The Interplay of Surface Mount Solder Joint Quality and Reliability of Low Volume SMAs

Spacecraft electronics including those used at the Jet Propulsion Laboratory (JPL), demand production of highly reliable assemblies. JPL has recently completed an extensive study, funded by NASA's code Q, of the interplay between manufacturing defects and reliability of ball grid array (BGA) and surface mount electronic components.

Spacecraft electronics electronic assemblies J-lea↗