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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 109 records · Page 6

Effects of Shuttle bay environment on UV sensitive photographic film - Instrumentation for Get-Away-Special

An account is given of a Get-Away-Special experiment flown on Space Shuttles 7 and 8 investigating the effect of the space environment on Shumann emulsions. Shumann emulsions, having low gelatin content and no protective gelatin overcoating, are useful detectors of ultraviolet radiation shorter than 2200 angstroms but are extremely sensitive to environmental conditions and handling. The instrument required no interface with the Shuttle. It was turned on by an aneroid switch at an altitude of 50,000 feet. After that, its operation was controlled completely by a CMOS digital controller. Each hour, two temperatures and one voltage were read and stored in a CMOS programmable read only memory. At intervals, valves were opened and closed to expose SO 652 film strips of three sensitivities to the cargo bay environment for various time periods. The design and operation of the instrument package is described.

Kreplin, R. W.↗

Simulation of capacitor charging power supplies

By neglecting losses and other nonidealities, the authors were able to derive a simple single-loop equivalent circuit for each mode of operation of the series resonant converter. From these equivalent circuits, a good approximation of the current and voltages within the converter was obtained, despite the simplified approach taken. It is pointed out that designers of capacitor charging power supplies can utilize this approach in deciding what type of control strategy is needed to obtain a desired characteristic. Once the basic topology of the power supply has been determined, a detailed simulation could be implemented using one of the general-purpose software packages available.

Newton, S. R.↗

Implementation of efficient sensitivity analysis for optimization of large structures

The paper presents the theoretical bases and implementation techniques of sensitivity analyses for efficient structural optimization of large structures, based on finite element static and dynamic analysis methods. The sensitivity analyses have been implemented in conjunction with two methods for optimization, namely, the Mathematical Programming and Optimality Criteria methods. The paper discusses the implementation of the sensitivity analysis method into our in-house software package, AutoDesign.

Umaretiya, J. R.↗

Microelectronics in Japan

The purpose of this JTEC study is to evaluate Japan's electronic manufacturing and packaging capabilities within the context of global economic competition. To carry out this study, the JTEC panel evaluated the framework of the Japanese consumer electronics industry and various technological and organizational factors that are likely to determine who will win and lose in the marketplace. This study begins with a brief overview of the electronics industry, especially as it operates in Japan today. Succeeding chapters examine the electronics infrastructure in Japan and take an in-depth look at the central issues of product development in order to identify those parameters that will determine future directions for electronic packaging technologies.

Boulton, William R.↗

Building the electronic industry's roadmaps

JTEC panelists found a strong consistency among the electronics firms they visited: all the firms had clear visions or roadmaps for their research and development activities and had committed resources to ensure that they achieve targeted results. The overarching vision driving Japan's electronics industry is that of achieving market success through developing appealing, high-quality, low-cost consumer goods - ahead of the competition. Specifics of the vision include improving performance, quality, and portability of consumer electronics products. Such visions help Japanese companies define in detail the roadmaps they will follow to develop new and improved electronic packaging technologies.

Boulton, William R.↗

Accelerated Thermal Cycling and Failure Mechanisms

This paper reviews the accelerated thermal cycling test methods that are currently used by industry to characterize the interconnect reliability of commercial-off-the-shelf (COTS) ball grid array (BGA) and chip scale package (CSP) assemblies.

BGA CSP CBGA thermal cycle solder joint reliabilit↗

Food products for space applications

Specially-prepared foodstuffs supply an astronaut with a diet containing his basic nutritional requirements in a form that is useful in his enironment. Several edible coatings preserve foods and give loose foods form and firmness. These coatings aid in packaging and give the food slip for easy removal from the package.

Cope, P. S.↗