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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 109 records · Page 6

Power Electronics Thermal Management R&D: Annual Report

The objective for this project is to develop thermal management strategies to enable efficient and high-temperature wide-bandgap (WBG)-based power electronic systems (e.g., emerging inverter and DC-DC converter). Device- and system-level thermal analyses are conducted to determine the thermal limitations of current automotive power modules under elevated device temperature conditions. Additionally, novel cooling concepts and material selection will be evaluated to enable high-temperature silicon and WBG devices in power electronics components. WBG devices (silicon carbide [SiC], gallium nitride [GaN]) promise to increase efficiency, but will be driven as hard as possible. This creates challenges for thermal management and reliability.

30 DIRECT ENERGY CONVERSION↗

Theoretical Analysis of the Electron Spiral Toroid Concept

This report describes the analysis of the Electron Spiral Toroid (EST) concept being promoted by Electron Power Systems Inc. (EPS). The EST is described as a toroidal plasma structure composed Of ion and electron shells. It is claimed that the EST requires little or no external confinement, despite the extraordinarily large energy densities resulting from the self-generating magnetic fields. The present analysis is based upon documentation made available by EPS, a previous description of the model by the Massachusetts Institute of Technology (MIT), and direct discussions with EPS and MIT. It is found that claims of absolute stability and large energy storage capacities of the EST concept have not been substantiated. Notably, it can be demonstrated that the ion fluid is fundamentally unstable. Although various scenarios for ion confinement were subsequently suggested by EPS and MIT, none were found to be plausible. Although the experimental data does not prove the existence of EST configurations, there is undeniable experimental evidence that some type of plasma structures whose characteristics remain to be determined are observed. However, more realistic theoretical models must first be developed to explain their existence and properties before applications of interest to NASA can he assessed and developed.

Cambier, Jean-Luc↗

Prognostics of Power Electronics, Methods and Validation Experiments

Abstract Failure of electronic devices is a concern for future electric aircrafts that will see an increase of electronics to drive and control safety-critical equipment throughout the aircraft. As a result, investigation of precursors to failure in electronics and prediction of remaining life of electronic components is of key importance. DC-DC power converters are power electronics systems employed typically as sourcing elements for avionics equipment. Current research efforts in prognostics for these power systems focuses on the identification of failure mechanisms and the development of accelerated aging methodologies and systems to accelerate the aging process of test devices, while continuously measuring key electrical and thermal parameters. Preliminary model-based prognostics algorithms have been developed making use of empirical degradation models and physics-inspired degradation model with focus on key components like electrolytic capacitors and power MOSFETs (metal-oxide-semiconductor-field-effect-transistor). This paper presents current results on the development of validation methods for prognostics algorithms of power electrolytic capacitors. Particularly, in the use of accelerated aging systems for algorithm validation. Validation of prognostics algorithms present difficulties in practice due to the lack of run-to-failure experiments in deployed systems. By using accelerated experiments, we circumvent this problem in order to define initial validation activities.

Kulkarni, Chetan S.↗

Controller Verification of a Smart-Grid Compatible 200 kHz Single-stage Photovoltaic Microinverter

This paper presents control system design, implementation, and experimental validation of a single-stage 400 W, 200 kHz solar photovoltaic (PV) microinverter using hardware-in-the-loop (HIL) and hardware testing. The selected circuit topology is based on a Gallium Nitride (GaN) direct-matrix based dual active bridge (DAB) converter with a low voltage active power decoupler (APD) circuit. Control performance is verified, smart-grid compatibility is tested, and circuit operation is confirmed. Controller HIL (CHIL) is shown to aid in a complex power electronics system design by 1) enabling detailed control development prior to hardware implementation, 2) expanding the use of automated testing, and 3) increasing confidence in control performance prior to prototype testing. Altogether, these factors make HIL a valuable tool in complex power electronic designs.

14 SOLAR ENERGY↗

State-of-the-Art Medium- and High-Voltage Silicon Carbide Power Modules, Challenges and Mitigation Techniques: A Review

Silicon carbide (SiC) power modules have been demonstrated potential for improving power density and efficiency for low-voltage power electronics systems. This has resulted in a paradigm shift toward development of medium-voltage and high-voltage (MV/HV) SiC power modules to revolutionize the future power grid and transportation systems. However, designing MV/HV SiC power modules involves significant design challenges due to higher blocking voltage and exacerbation of side effects due to high switching dv/dt and di/dt of SiC devices-concerns that may not be as critical as in low-voltage module development. This article reviews the development of state-of-the-art MV/HV SiC power modules, ranging from 3.3 kV to 40 kV, from both industry and academia. First, a discussion on SiC modules based on voltage level is presented. This is followed by a discussion of challenges associated with designing and testing MV/HV modules- including parasitic controls, electromagnetic interference (EMI), partial discharge, and thermal management-and the corresponding mitigation approaches from various perspectives. We conclude with a summary of major findings and future directions for the development of MV/HV modules.

EMI↗

Early Oscillation Detection for DC/DC Converter Fault Diagnosis

The electrical power system of a spacecraft plays a very critical role for space mission success. Such a modern power system may contain numerous hybrid DC/DC converters both inside the power system electronics (PSE) units and onboard most of the flight electronics modules. One of the faulty conditions for DC/DC converter that poses serious threats to mission safety is the random occurrence of oscillation related to inherent instability characteristics of the DC/DC converters and design deficiency of the power systems. To ensure the highest reliability of the power system, oscillations in any form shall be promptly detected during part level testing, system integration tests, flight health monitoring, and on-board fault diagnosis. The popular gain/phase margin analysis method is capable of predicting stability levels of DC/DC converters, but it is limited only to verification of designs and to part-level testing on some of the models. This method has to inject noise signals into the control loop circuitry as required, thus, interrupts the DC/DC converter's normal operation and increases risks of degrading and damaging the flight unit. A novel technique to detect oscillations at early stage for flight hybrid DC/DC converters was developed.

Wang, Bright L.↗

Impact of Accelerated StressTests on SiC MOSFET Precursor Parameters: Preprint

Incorporating SiC power MOSFETs is very attractive for advancing power electronic system performance, yet the system reliability with new devices remains in question. This work presents an overview of accelerated lifetime tests and the packaging and semiconductor failure mechanisms they excite. The experiments explained here includes High Temperature Gate Bias (HTGB), Switching Cycling, Power Cycling, and Thermal Cycling. These experiments stress different failure mechanisms, that show degradation in different device parameters including, but not limited to, threshold voltage and on-resistance. These four experiments help illustrate the spectrum between device and package degradation that can be used to design more reliable power electronic circuits.

33 ADVANCED PROPULSION SYSTEMS↗

Impact of Accelerated Stress-Tests on SiC MOSFET Precursor Parameters

Integrating SiC power MOSFETs is very attractive for advancing power electronic system performance, yet the system reliability with new devices remains in question. This work presents an overview of accelerated lifetime tests and the packaging and semiconductor failure mechanisms they excite. The experiments explained here includes High Temperature Gate Bias (HTGB), Switching Cycling, Power Cycling, and Thermal Cycling. These experiments stress different failure mechanisms, that show degradation in different device parameters including, but not limited to, threshold voltage and on-resistance. These four experiments help illustrate the spectrum between device and package degradation that can be used to design more reliable power electronic circuits.

33 ADVANCED PROPULSION SYSTEMS↗

High-Temperature, Wirebondless, Ultracompact Wide Bandgap Power Semiconductor Modules

Silicon carbide (SiC) and other wide bandgap semiconductors offer great promise of high power rating, high operating temperature, simple thermal management, and ultrahigh power density for both space and commercial power electronic systems. However, this great potential is seriously limited by the lack of reliable high-temperature device packaging technology. This Phase II project developed an ultracompact hybrid power module packaging technology based on the use of double lead frames and direct lead frame-to-chip transient liquid phase (TLP) bonding that allows device operation up to 450 degC. The new power module will have a very small form factor with 3-5X reduction in size and weight from the prior art, and it will be capable of operating from 450 degC to -125 degC. This technology will have a profound impact on power electronics and energy conversion technologies and help to conserve energy and the environment as well as reduce the nation's dependence on fossil fuels.

Elmes, John↗

Agent-Based Distributed Energy Resources for Supporting Intelligence at the Grid Edge

This article proposes a novel multi-agent framework that can link various forms of resources and power electronic systems into distributed energy resources (DER). The proposed multiagent architecture can also integrate DERs to a central controller for optimization and control to support the grid. To demonstrate the flexibility of this novel framework, the developed agent system is applied to a set of end-use systems. Furthermore, the agent framework is validated in hardware using controller-hardware-in-the-loop simulation platform.

24 POWER TRANSMISSION AND DISTRIBUTION↗

The Next Challenge: High Power Electric Aircraft Propulsion

Introduction of the Aeronautic Research Mission Directorate Technical Challenge 10.2 “High Power Electric Aircraft Propulsion” to the power electronics community. The presentation was given as part of a panel discussion “Challenges of Power Electronics Systems for Sustainable Aviation” during the 2024 Sustainable Aviation Workshop held at The Ohio State University.

power electroics↗

MUSTANG: A Workhorse for NASA Spaceflight Avionics

The Modular Unified Space Technology Avionics for Next Generation (MUSTANG) is a small integrated Avionics system including Command and Data Handling (C&DH), Power System Electronics (PSE), Attitude Control System Interfaces (ACS), and Propulsion Electronics. The MUSTANG Avionics Architecture is built upon many years of knowledge capture and lessons learned at the Goddard Space Flight Center. With a motivation towards modularity and keeping board redesign costs to a minimum, MUSTANG offers flexibility in features with a backplane-less design and allows the user to choose the options (cards) needed for their system. It incorporates a distributed power system that provides secondary power to all its subcomponents reducing the number of primary services needed for an Avionics. MUSTANG can be integrated into one system or divided into several smaller components. MUSTANG supports redundancy and cross-strap ability for a more robust and reliable Avionics system. A variation of MUSTANG exists for Instrument Electronics called iMUSTANG and allows the user to select functionality applicable to the instrument electronics. MUSTANG is not meant to replace Avionics for all spacecraft. There are limitations due to its relatively compact size, but the MUSTANG design has proven broadly applicable on many spacecraft and instrument bus avionics architectures.

MUSTANG↗

Review of Ultrafast Switching Power Modules: Trends, Challenges, and Technical Solutions

Benefiting from the superior properties of wide-bandgap semiconductor materials, wide-bandgap power devices demonstrate exceptional switching performance, enabling more efficient and compact power electronics systems. However, ultrafast switching poses challenges to the reliability of the system in terms of severe oscillations and voltage overshoot, electromagnetic interference, and increased risk of partial discharge. By developing advanced power module packaging for fast-switching power devices, the above-mentioned challenges can be mitigated at the packaging level, enabling the full utilization of the fast-switching capability of wide-bandgap devices. Meanwhile, such technology also lays the groundwork for packaging next-generation power devices with even higher blocking voltage and faster switching speed. In this paper, a comprehensive review of ultrafast switching power modules has been made, including the benefits and status of ultrafast switching power modules, challenges brought by ultrafast switching, and promising technologies to address these challenges. In addition, future development trends and research gaps are also discussed in this paper. Furthermore, this review can serve as a reference for future wide-bandgap power module packaging design.

24 POWER TRANSMISSION AND DISTRIBUTION↗

pnnl/pecblocks

ConverterBlocks uses the output of detailed electromagnetic transient (EMT) simulations to produce generalized block diagram models of power electronic systems. The process uses deep learning with customized block architectures. The outputs are reduced-order models that meet specified accuracy requirements, while providing important advantages over the original EMT models: ConverterBlock models have fewer nodes and can take longer time steps, resulting in shorter simulation times ConverterBlock models are continuously differentiable, making them compatible with control design methodsGeneralized block diagram modeling of power electronic converters for grid solar and storage applications.

McDermott, Tom↗

Integration of high capacity materials into interdigitated mesostructured electrodes for high energy and high power density primary microbatteries

Microbatteries are increasingly important for powering electronic systems, however, the volumetric energy density of microbatteries lags behind that of conventional format batteries. This paper reports a primary microbattery with energy density 45.5 μWh cm –2 μm –1 and peak power 5300 μW cm –2 μm –1 , enabled by the integration of large volume fractions of high capacity anode and cathode chemistry into porous micro-architectures. The interdigitated battery electrodes consist of a lithium metal anode and a mesoporous manganese oxide cathode. The key enabler of the high energy and power density is the integration of the high capacity manganese oxide conversion chemistry into a mesostructured high power interdigitated bicontinuous cathode architecture and an electrodeposited dense lithium metal anode. Here, the resultant energy density is greater than previously reported three-dimensional microbatteries and is comparable to commercial conventional format lithium-based batteries.

25 ENERGY STORAGE↗

Trends in SiC MOSFET Threshold Voltage and ON-Resistance Measurements from Thermal Cycling and Electrical Switching Stresses: Preprint

Integrating SiC power MOSFETs is very attractive for advancing power electronic systems, yet the system reliability with new devices remains in question. This work presents two accelerated test experiments to further investigate the packaging and semiconductor failures of a TO-247 SiC MOSFET. First, a variation on power cycling experiments -- switching cycling -- is introduced. Traditional power cycling experiments utilize conduction losses to self-heat the device where a large temperature swing causes degradation at the packaging level. However, by decreasing the on-time such that the device only turns on and immediately turns off, the temperature swing is decreased and the semiconductor itself is degraded. This work shows experimental device degradation caused by continuous switching events - switching cycling, at 90% of the device's breakdown voltage. Second, thermal cycling experiments were conducted between -40 degrees C and 175 degrees C to observe degradation in the mechanical packaging of the device. Experimentally-measured changes in threshold voltage and ON-resistance are recorded in both experiments and compared. These results also illustrate the spectrum between device and package degradation from accelerated test methods.

33 ADVANCED PROPULSION SYSTEMS↗

The Space Technology 5 Avionics System

The Space Technology 5 (ST5) mission is a NASA New Millennium Program project that will validate new technologies for future space science missions and demonstrate the feasibility of building launching and operating multiple, miniature spacecraft that can collect research-quality in-situ science measurements. The three satellites in the ST5 constellation will be launched into a sun-synchronous Earth orbit in early 2006. ST5 fits into the 25-kilogram and 24-watt class of very small but fully capable spacecraft. The new technologies and design concepts for a compact power and command and data handling (C&DH) avionics system are presented. The 2-card ST5 avionics design incorporates new technology components while being tightly constrained in mass, power and volume. In order to hold down the mass and volume, and quali& new technologies for fUture use in space, high efficiency triple-junction solar cells and a lithium-ion battery were baselined into the power system design. The flight computer is co-located with the power system electronics in an integral spacecraft structural enclosure called the card cage assembly. The flight computer has a full set of uplink, downlink and solid-state recording capabilities, and it implements a new CMOS Ultra-Low Power Radiation Tolerant logic technology. There were a number of challenges imposed by the ST5 mission. Specifically, designing a micro-sat class spacecraft demanded that minimizing mass, volume and power dissipation would drive the overall design. The result is a very streamlined approach, while striving to maintain a high level of capability, The mission's radiation requirements, along with the low voltage DC power distribution, limited the selection of analog parts that can operate within these constraints. The challenge of qualifying new technology components for the space environment within a short development schedule was another hurdle. The mission requirements also demanded magnetic cleanliness in order to reduce the effect of stray (spacecraft-generated) magnetic fields on the science-grade magnetometer.

Speer, Dave↗

Single and Double-Sided Jet Impingement Cooling for SiC-Based Power Modules

Efficient thermal management of power electronics systems is crucial for higher reliability. With the miniaturization of systems, high-loss-density electronics require cooling systems that can extract a large amount of heat. This study explored a liquid-jet-impingement-based direct substrate cooling system for single-sided and double-sided cooling to improve heat extraction efficiency and improve the power density by reducing the volume and mass. The cooling system was implemented for a SiC-based direct bonded copper substrate. Numerical simulations were performed to determine the effects of nozzle diameter, the number of nozzles, and nozzle array orientation on single-sided cooling and thermal performance gain over double-sided cooling. A novel manifold design was proposed that reduced the volume and mass of the manifold and still achieved the target power density. The performance of the proposed design was compared with the pin-fin-based cooling system used in the BMW I3 module, and a comparative analysis was done.

Barua, Himel↗