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104 records · Page 6

A Robust and Engineerable Self-Assembling Protein Template for the Synthesis and Patterning of Ordered Nanoparticle Arrays

Self-assembling biomolecules that form highly ordered structures have attracted interest as potential alternatives to conventional lithographic processes for patterning materials. Here we introduce a general technique for patterning materials on the nanoscale using genetically modified protein cage structures called chaperonins that self-assemble into crystalline templates. Constrained chemical synthesis of transition metal nanoparticles is specific to templates genetically functionalized with poly-Histidine sequences. These arrays of materials are ordered by the nanoscale structure of the crystallized protein. This system may be easily adapted to pattern a variety of materials given the rapidly growing list of peptide sequences selected by screening for specificity for inorganic materials.

McMillan, R. Andrew↗

A Versatile Platform for Nanotechnology Based on Circular Permutation of a Chaperonin Protein

A number of protein complexes have been developed as nanoscale templates. These templates can be functionalized using the peptide sequences that bind inorganic materials. However, it is difficult to integrate peptides into a specific position within a protein template. Integrating intact proteins with desirable binding or catalytic activities is an even greater challenge. We present a general method for modifying protein templates using circular permutation so that additional peptide sequence can be added in a wide variety of specific locations. Circular permutation is a reordering of the polypeptide chain such that the original termini are joined and new termini are created elsewhere in the protein. New sequence can be joined to the protein termini without perturbing the protein structure and with minimal limitation on the size and conformation of the added sequence. We have used this approach to modify a chaperonin protein template, placing termini at five different locations distributed across the surface of the protein complex. These permutants are competent to form the double-ring structures typical of chaperonin proteins. The permuted double-rings also form the same assemblies as the unmodified protein. We fused a fluorescent protein to two representative permutants and demonstrated that it assumes its active structure and does not interfere with assembly of chaperonin double-rings.

Paavola, Chad↗

Circular Permutation of a Chaperonin Protein: Biophysics and Application to Nanotechnology

We have designed five circular permutants of a chaperonin protein derived from the hyperthermophilic organism Sulfolobus shibatae. These permuted proteins were expressed in E. coli and are well-folded. Furthermore, all the permutants assemble into 18-mer double rings of the same form as the wild-type protein. We characterized the thermodynamics of folding for each permutant by both guanidine denaturation and differential scanning calorimetry. We also examined the assembly of chaperonin rings into higher order structures that may be used as nanoscale templates. The results show that circular permutation can be used to tune the thermodynamic properties of a protein template as well as facilitating the fusion of peptides, binding proteins or enzymes onto nanostructured templates.

Paavola, Chad↗

Attachment of Free Filament Thermocouples for Temperature Measurements on Ceramic Matrix Composites

At the NASA Lewis Research Center, a new installation technique utilizing convoluted wire thermocouples (TC's) was developed and proven to produce very good adhesion on CMC's, even in a burner rig environment. Because of their unique convoluted design, such TC's of various types and sizes adhere to flat or curved CMC specimens with no sign of delamination, open circuits, or interactions-even after testing in a Mach 0.3 burner rig to 1200 C (2200 F) for several thermal cycles and at several hours at high temperatures. Large differences in thermal expansion between metal thermocouples and low-expansion materials, such as CMC's, normally generate large stresses in the wires. These stresses cause straight wires to detach, but convoluted wires that are bonded with strips of coating allow bending in the unbonded portion to relieve these expansion stresses.

Lei, Jih-Fen↗

Sensor Lead Wires Positioned on SiC-based Monolithic Ceramic and Fiber- reinforced Ceramic Matrix Composite Subcomponents with Flat and Curved Surfaces

There is strong interest in the development of silicon carbide-based monolithic ceramic and composite materials and components for demanding, high-temperature applications. Thorough characterization of material properties, including high-temperature testing under simulated or actual operating conditions, is a high priority for programs involved in developing these silicon carbide- (SiC) based materials and components. Members of the Sensors and Electronics Technology Branch at the NASA Lewis Research Center are developing minimally intrusive methods of measuring the properties (such as the surface temperature, strain, and heat flux characteristics) of components and subelements that are being tested or operated in hostile, high-temperature environments. Their primary goal is to instrument the test article or operating component with durable sensors that have a minimal effect on test conditions such as the gas flow across the surface of the item and the material response (including the through-thickness conduction of heat). Therefore, the main thrust of their work has been the development of thin-film sensors (e.g., thermocouples or strain gauges) for use on various advanced material test articles, including SiC/SiC composite components. There was a need for a better method of securing sensor lead wires on SiC-based components and subelements that would be tested at temperatures to 1000 C (or higher), to enhance the durability of the overall minimally intrusive sensor system. To address this need, Lewis researchers devised an alternative approach for positioning the sensor lead wires (which are connected to the thin-film sensors) on SiC or SiC/SiC components. A reaction-forming method of joining was used to strongly bond hoop-shaped monolithic SiC and SiC/SiC composite attachments of various sizes to both flat and curved surfaces of SiC/SiC composite subelements (see the photos). This approach is based on an affordable, robust ceramic joining technology, named ARCJoinT, which was developed at Lewis for the joining of SiC-based ceramics and fiber-reinforced composites.

Kiser, James D.↗

Packaging Technology Developed for High-Temperature SiC Sensors and Electronics

A ceramic- and thick-film-materials-based prototype electronic package designed for silicon carbide (SiC) high-temperature sensors and electronics has been successfully tested at 500 C in an oxygen-containing air environment for 500 hours. This package was designed, fabricated, assembled, and electronically evaluated at the NASA Glenn Research Center at Lewis Field with an in-house-fabricated SiC semiconductor test chip. High-temperature electronics and sensors are necessary for harsh-environment space and aeronautical applications, such as space missions to the inner solar system or the emission control electronics and sensors in aeronautical engines. Single-crystal SiC has such excellent physical and chemical material properties that SiC-based semiconductor electronics can operate at temperatures over 600 C, which is significantly higher than the limit for Si-based semiconductor devices. SiC semiconductor chips were recently demonstrated to be operable at temperatures as high as 600 C, but only in the probe station environment because suitable packaging technology for sensors and electronics at temperatures of 500 C and beyond did not exist. Thus, packaging technology for SiC-based sensors and electronics is immediately needed for both application and commercialization of high-temperature SiC sensors and electronics. In response to this need, researchers at Glenn designed, fabricated, and assembled a prototype electronic package for high-temperature electronics, sensors, and microelectromechanical systems (MEMS) using aluminum nitride (AlN) substrate and gold (Au) thick-film materials. This prototype package successfully survived a soak test at 500 C in air for 500 hours. Packaging components tested included thick-film high-temperature metallization, internal wire bonds, external lead bonds, and a SiC diode chip die-attachment. Each test loop, which was composed of thick-film printed wire, wire bond, and lead bond was subjected to a 50-mA direct current for 250 hours at 500 C.

Chen, Liang-Yu↗

Linear-Parameter-Varying Antiwindup Compensation for Enhanced Flight Control Performance

Actuator saturation is one of the major issues of flight control in the high angle-of-attack region. This paper presents a saturation control scheme for linear parameter varyjing (LPV) systems from an antiwindup control perspective. The proposed control approach is advantageous from the implementation standpoint because it can be thought of as an augmented control algorithm to the existing control system. Moreover, the synthesis condition for an antiwindup compensator is formulated as a linear matrix inequality (LMI) optimization problem and can be solved efficiently. We have applied te LPV antiwindup controller to an F-16 longitudinal autopilot control system design and compared it with the thrust vectoring control scheme. The nonlinear simulations show that an LPV antiwindup controller improves flight quality and offers advantages over thrust vectoring in a high angle-of-attack region.

Lu, Bei↗

Post-Stall Aerodynamic Modeling and Gain-Scheduled Control Design

A multidisciplinary research e.ort that combines aerodynamic modeling and gain-scheduled control design for aircraft flight at post-stall conditions is described. The aerodynamic modeling uses a decambering approach for rapid prediction of post-stall aerodynamic characteristics of multiple-wing con.gurations using known section data. The approach is successful in bringing to light multiple solutions at post-stall angles of attack right during the iteration process. The predictions agree fairly well with experimental results from wind tunnel tests. The control research was focused on actuator saturation and .ight transition between low and high angles of attack regions for near- and post-stall aircraft using advanced LPV control techniques. The new control approaches maintain adequate control capability to handle high angle of attack aircraft control with stability and performance guarantee.

Wu, Fen↗

Oxidation of Palladium-Chromium Alloys for High Temperature Applications

An alloy consisting of Pd with 13 wt % Cr is a promising material for high temperature applications. High temperature performance is degraded by the oxidation of the material, which is more severe in the fine wires and thin films used for sensor applications than in the bulk. The present study was undertaken to improve our understanding of the physical and chemical changes occurring at these temperatures and to identify approaches to limit oxidation of the alloy. The alloy was studied in both ribbon and wire forms. Ribbon samples were chosen to examine the role of grain boundaries in the oxidation process because of the convenience of handling for the oxidation studies. Wire samples 25 microns in diameter which are used in resistance strain gages were studied to correlate chemical properties with observed electrical, physical, and structural properties. Overcoating the material with a metallic Cr film did prevent the segregation of Pd to the surface; however, it did not eliminate the oxidation of the alloy.

Piltch, Nancy D.↗

Switching LPV Control of an F-16 Aircraft via Controller State Reset

In flight control, the design objective and the aircraft dynamics may be different in low and high angle of attack regions. This paper presents a systematic switching Linear Parameter-varying LPV method to determine if it is practical to use for flight control designs over a wide angle of attack region. The approach is based on multiple parameter-dependent Lyapunov functions a family of LPV controllers are designed, and each of them is suitable for a specific parameter subspace. The state of the controller is reset to guarantee the stability requirement of the Lyapunov function when the switching event occurs. Two parameter-dependent switching logics, hysteresis switching and switching with average dwell times are examined. The proposed switching LPV control scheme is applied to an F-16 aircraft model with different design objectives and aircraft dynamics in low and high angle of attack regions. The nonlinear simulating results using both switching logics are compared.

Lu, Bei↗

PdCr Based High Temperature Static Strain Gage

The program at NASA Lewis Research Center to develop a high temperature static strain gage system for the hypersonic vehicle and turbine engine research has emphasized a palladium- 13wt%chromium (PdCr) alloy. Gages made from this alloy are being developed in both fine wire and thin film form. The wire gage system had platinum wire as a temperature compensator and was coated with a special alumina and zirconia mixture overcoat. This PdCr compensated wire gage responded linearly to the imposed strain to at least i000 microstrain. The strain sensitivity of the gage did not vary much with temperature. The apparent strain of this compensated gage was significantly lower than that of the other gages. It varied within 300 microstrain from room temperature to 800 deg. C with a reproducibility within 50 microstrain between thermal cycles to 800 deg. C. This is a significant advance over the 400 deg. C barrier of previous techniques for resistance static strain gages. The sputtered thin film PdCr strain gage, whose size was 8x8 mm and 10 micron thick, has demonstrated the possibility of extending the use of the PdCr strain gage to a temperature of approximately 1000 deg. C.

Lei, Jih-Fen↗

Versatile platform for nanotechnology based on circular permutations of chaperonin protein

The present invention provides chaperonin polypeptides which are modified to include N-terminal and C-terminal ends that are relocated from the central pore region to various different positions in the polypeptide which are located on the exterior of the folded modified chaperonin polypeptide. In the modified chaperonin polypeptide, the naturally-occurring N-terminal and C-terminal ends are joined together directly or with an intervening linker peptide sequence. The relocated N-terminal or C-terminal ends can be covalently joined to, or bound with another molecule such as a nucleic acid molecule, a lipid, a carbohydrate, a second polypeptide, or a nanoparticle. The modified chaperonin polypeptides can assemble into double-ringed chaperonin structures. Further, the chaperonin structures can organize into higher order structures such as nanofilaments or nanoarrays which can be used to produce nanodevices and nanocoatings.

Paavola, Chad D.↗