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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 109 records · Page 6
All sourcesNASA NTRSDOE OSTI
DOE OSTI2022

Room Temperature, Dip Coating Organic Passivation for c-Si Surfaces

Surface passivation of crystalline Si (c-Si) to reduce recombination rate is crucial to obtain high-efficiency c-Si solar cells. A fast passivation technique that can be performed at room temperature is needed when studying the degradation behaviors using various characterization methods to not destroy the degraded states. In this contribution, we explore Nafion via dip coating on n-type Cz wafers. We show that both the Nafion concentration and the conditions of surface and edge affect the passivation quality, and we achieve excellent passivation quality of iVoc of 716 mV, with a saturation current density (J0) of 7 fA/cm2. Additionally, electron paramagnetic resonance (EPR) shows Nafion can be used under cryogenic temperature and reveals the reduction of Si dangling bond after Nafion treatment.

dielectric solar cell↗
NASA NTRS1968

Tube dimpling tool assures accurate dip-brazed joints

Portable, hand-held dimpling tool assures accurate brazed joints between tubes of different diameters. Prior to brazing, the tool performs precise dimpling and nipple forming and also provides control and accurate measuring of the height of nipples and depth of dimples so formed.

Beuyukian, C. S.↗
NASA NTRS1975

Dip molding to form intricately-shaped medical elastomer devices

Preshaped mandrel mounted on rotating mechanism is partically immersed in tank filled with liquid elastomer. While mandrel rotates, elastomer film forms om mandrel surface due to surface tension and capillary behavior of liquid. Devices with well-defined flanges can be made using process.

Broyles, H. F.↗
NASA NTRS1976

DIP extractor simplifies circuit removal

Easily constructed tool can be used to pull dual in-line packaged integrated circuits off printed-wiring boards without damaging pins. Extractor can be designed for most popular IC configurations and sizes.

Nies, T.↗
NASA NTRS1977

Flat-package DIP handling tool

Device, using magnetic attraction, can facilitate handling of integrated-circuit flat packages and prevent contamination and bent leads. Tool lifts packages by their cases and releases them by operation of manual plunger.

Angelou, E.↗
NASA NTRS1977

Dip-coating process: Silicon sheet growth development for the large-area silicon sheet task of the low-cost silicon solar array project

The objective of this research program is to investigate the technical and economic feasibility of producing solar-cell-quality sheet silicon by coating one surface of carbonized ceramic substrates with a thin layer of large-grain polycrystalline silicon from the melt. The past quarter demonstrated significant progress in several areas. Seeded growth of silicon-on-ceramic (SOC) with an EFG ribbon seed was demonstrated. Different types of mullite were successfully coated with silicon. A new method of deriving minority carrier diffusion length, L sub n from spectral response measurements was evaluated. ECOMOD cost projections were found to be in good agreement with the interim SAMIS method proposed by JPL. On the less positive side, there was a decrease in cell performance which we believe to be due to an unidentified source of impurities.

Zook, J. D.↗
NASA NTRS1989

Variation of D-region nitric-oxide density with solar activity and season at the dip equator

To study the solar control on electron density (N sub e) in the equatorial D region, a program was initiated with Soviet collaboration in 1979. A total of 31 rockets were launched during the high solar activity period, and 47 rockets during the low solar activity period, from Thumba to measure the N sub e profiles. Analysis of the data shows that the average values of N sub e for the high solar activity period are higher by a factor of about 2 to 3 compared to the low solar activity values. It was found that a single nitric oxide density, (NO), profile cannot reproduce all the observed N sub e profiles. An attempt was made to reproduce theoretically the observed N sub e profiles by introducing variation in (NO) for the different solar activity periods and seasons.

Chakrabarty, D. K.↗
NASA NTRS2000

Cygnus X-1: Dips and Low Frequency Noise

The primary science result to come out of this work is the discovery that the time lags between hard and soft variability in Cyg X-1 show dramatic spikes during the transitions between hard and soft states (and possibly during "failed transitions" to the soft state), but are remarkably similar between the main soft and hard states. This work is being continued and elaborated upon with ongoing RXTE monitoring campaigns.

Wilms, Joern↗
NASA NTRS2000

X-Ray Dips In Black Hole Candidates

A total of 52 Rossi Timing Explorer (RXTE) observations of the black hole candidate 4UI630-47 were carried out during the source's bright outburst during 1998. After the data tapes arrived in August 1998, we began analyzing these data to characterize the spectral and timing behavior of the source. A preliminary report on our analysis of the data was at the Second Workshop on Relativistic Jet Sources in the Galaxy. held in Paris presented in December 1998. The most interesting result from this analysis is the discovery of quasi- periodic oscillations (QPOs) at frequencies varying from 3 Hz to 0.1 Hz during the latter part of the outburst. The QPOs turn on abruptly and simultaneously with a sharp change in the x-ray spectrum. The results have been published in the Astrophysical Journal. This work formed a major part of the Ph.D. thesis of John Tomsick, who received his Ph.D. in Physics at Columbia University in the summer of 1999 and subsequently received a postdoctoral fellowship at the University of California, San Diego.

Kaaret, P.↗
NASA NTRS1993

Thermal Cycling Fatigue in DIPs Mounted with Eutectic Tin-Lead Solder Joints in Stub and Gullwing Geometries

It has long been known that solder joints under mechanical stress are subject to failure. In early electronic systems, such failures were avoided primarily by avoiding the use of solder as a mechanical structural component. The rule was first to make sound wire connections that did not depend mechanically on solder, and only then to solder them. Careful design and miniaturization in modern electronic systems limits the mechanical stresses exerted on solder joints to values less than their yield points, and these joints have become integral parts of the mechanical structures. Unfortunately, while these joints are strong enough when new, they have proven vulnerable to fatigue failures as they age. Details of the fatigue process are poorly understood, making predictions of expected lifetimes difficult.

fatigue failure solder joints failure mechanisms s↗