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At least 109 records · Page 6

Utilizing various test methods to study the stress corrosion behavior of Al-Li-Cu alloys

Recently, much attention has been given to aluminum-lithium alloys because of rather substantial specific-strength and specific-stiffness advantages offered over commercial 2000and 7000-series aluminum alloys. An obstacle to Al-Li alloy development has been inherent limited ductility. In order to obtain a more refined microstructure, powder metallurgy (P/M) has been employed in alloy development programs. As stress corrosion (SC) of high-strength aluminum alloys has been a major problem in the aircraft industry, the possibility of an employment of Al-Li alloys has been considered, taking into account a use of Al-Li-Cu alloys. Attention is given to a research program concerned with the evaluation of the relative SC resistance of two P/M processed Al-Li-Cu alloys. The behavior of the alloys, with and without an addition of magnesium, was studied with the aid of three test methods. The susceptibility to SC was found to depend on the microstructure of the alloys.

Pizzo, P. P.↗

Study on effects of powder and flake chemistry and morphology on the properties of Al-Cu-Mg-X-X-X powder metallurgy advanced aluminum alloys

The effects of alloy chemistry and particulate morphology on consolidation behavior and consolidated product properties in rapid solidification processed, powder-metallurgical Al-3Li-1.5Cu-1Mg-0.5Co-0.2Zr and Al-4.4Cu-1.5Mg-Fe-Ni-0.2Zr extrusions and forgings were studied. Microstructures and mechanical properties of both alloys are largely unaffected by particulate production method (vacuum atomization, ultrasonic atomization, or twin-roller quenching) and by particulate solidification rates between 1000 and 100,000 K/s. Consolidation processing by canning, cold compaction, degassing, and hot extrusion is sufficient to yield mechanical properties in the non-Li-containing alloy extrusions which are similar to those of 7075-Al, but ductilities and fracture toughnesses are inferior owing to poor interparticle bonding caused by lack of a vacuum-hot-pressing step during consolidation. Mechanical properties of extrusions are superior to those of forgings owing to the stronger textures produced by the more severe hot working during extrusion. The effects on mechanical properties of dispersoid size and volume fraction, substructural refinement, solid solution strengthening by Mg, and precipitate size and distribution are elucidated for both alloy types.

Meschter, P. J.↗

Laser-produced spectra and QED effects for Fe-, Co-, Cu-, and Zn-like ions of Au, Pb, Bi, Th, and U

Spectra of very highly charged ions of Au, Pb, Bi, Th, and U have been observed in laser-produced plasmas generated by the OMEGA laser. Line identifications in the region 9-110 A were made for ions in the Fe, Co, Cu, and Zn isoelectronic sequences. Comparison of the measured wavelengths of the Cu-like ions with values calculated with and without QED corrections shows that the inclusion of QED corrections greatly improves the accuracy of the calculated 4s-4p wavelengths. However, significant differences between the observed and calculated values remain.

Seely, J. F.↗

Thermal and structural stability of cosputtered amorphous Ta(x)Cu(1-x) alloy thin films on GaAs

The characteristics of thin films of Ta-Cu, prepared over a wide range of compositions by cosputter deposition onto GaAs and fused quartz substrates, are studied by X-ray diffraction and van der Pauw resistivity measurement. Results show films to be amorphous over the range of 55-95 at. pct, and show Ta(93)Cu(7) barriers to be effective in preventing Au in-diffusion, with a 3000-A layer remaining unpenetrated after an annealing at 700 C for 20 min. Diffusion of Ga and/or As into amorphous 93 at. pct Ta is found to be more rapid than that of Au, and interfacial reactions were shown to form compounds including Ta3Au, CuAu, TaAs2, and Ga3Cu7 above 700 C.

Oh, J. E.↗

Aqueous sodium chloride induced intergranular corrosion of Al-Li-Cu alloys

Two methods have been explored to assess the susceptibility of Al-Li-Cu alloys to intergranular corrosion in aqueous sodium chloride solution. They are: (1) constant extension rate testing with and without alternate-immersion preexposure and (2) metallographic examination after exposure to a NaCl-H2O2 corrosive solution per Mil-H-6088F. Intergranular corrosion was found to occur in both powder and ingot metallurgy alloys of similar composition, using both methods. Underaging rendered the alloys most susceptible. The results correlate to stress-corrosion data generated in conventional time-to-failure and crack growth-rate tests. Alternate-immersion preexposure may be a reliable means to assess stress corrosion susceptibility of Al-Li-Cu alloys.

Pizzo, P. P.↗

Effects of oxidation and roughness on Cu contact resistance from 4 to 290 K

Knowledge of the factors influencing contact resistance is important for optimizing system design in cryogenic applications. In space cryogenics, indirect cooling of infrared components is the primary concern. The presence of bolted joints results in contact resistances which can dominate all other contributions to the overall heat transfer rate. Here, thermal and electrical contact resistances measured between 4 K and 290 K for a series of bolted OFHC Cu contacts are reported. Surface roughness is found to have little effect on the overall contact resistance within the experimental limits, while oxidation can increase the contact resistance by as much as a factor of 100. Thermal and electrical contact resistances measured on the same contact show that the contact resistance temperature dependence does not follow the bulk dependence. For example, the residual resistance ratio (RRR) of the OFHC Cu is 110, but for contacts made from this material, the RRR is about two.

Nilles, M. J.↗

Microstructures and properties of superconducting Y-Er-BaCu-O thin films obtained from disordered Y-Er-BaF2-Cu films

Since the first reports on superconducting thin films obtained by evaporating BaF2, Cu and Y(sup 1), or Yb or Er(sup 2), several others have followed. All these reports describe thin films prepared by means of molecular beam cells or electron guns. Researchers show that films with similar properties can be obtained by radio frequency sputtering of a single mosaic target composed by Y-Er, BaF2 and Cu. Process steps are described.

Cikmach, P.↗

Optical and microwave detection using Bi-Sr-Ca-Cu-O thin films

Recent progress at the Johns Hopkins University Applied Physics Laboratory (JHU/APL) in the development of optical and microwave detectors using high temperature superconducting thin films is described. Several objectives of this work have been accomplished, including: deposition of Bi-Sr-Ca-Cu-O thin films by laser abation processing (LAP); development of thin film patterning techniques, including in situ masking, wet chemical etching and laser patterning; measurements of bolometric and non-bolometric signatures in patterned Bi-Sr-Ca-Cu-O films using optical and microwave sources, respectively; analysis and design of an optimized bolometer through computer simulation, and investigation of its use in a Fourier transform spectrometer. The focus here is primarily on results from the measurement of the bolometric and non-bolometric response.

Grabow, B. E.↗

Ion beam sputtering of in situ superconducting Y-Ba-Cu-O films

Oriented superconducting YBa2Cu3O7 thin films were deposited on yttria stabilized zirconia and SrTiO3 substrates by ion-beam sputtering of a nonstoichiometric oxide target. The films exhibited zero-resistance critical temperatures as high as 83.5 K without post-deposition anneals. Both the deposition rate and the c-lattice parameter data displayed two distinct regimes of dependence on the beam power of the ion source. Low-power sputtering yielded films with large c-dimensions and low Tc. Higher-power sputtering produced a continuous decrease in the c-lattice parameter and increase in critical temperature. Films having the smaller c-lattice parameters were Cu rich. The Cu content of films deposited at beam voltages of 800 V and above increased with increasing beam power.

Klein, J. D.↗

Superplastic formability of Al-Cu-Li alloy Weldalite (TM) 049

Extensive research during the past decade shows that several aluminum lithium alloys can be processed to attain a microstructure that enables superplasticity. The high tensile stress of Al-Cu-Li alloy Weldalite (TM) 049 in the T4 and T6 tempers offers tremendous potential for attaining exceptional post-SPF (superplastic formability) properties. The used SPF material is Weldalite, which was shown to induce SPF behavior in other Al-Cu-Li alloys. The superplastic behavior and resulting post-SPF mechanical properties of this alloy, which was designed to be the next major structural alloy for space applications, were evaluated. The results indicate that Weldalite alloy does indeed exhibit excellent superplasticity over a wide range of temperatures and strain rates and excellent post-SPF tensile strength at various potential service temperatures.

Ma, Bao-Tong↗

Temperature effects on the deformation and fracture of Al-Li-Cu-In alloys

The crack initiation and growth fracture resistance of Al-Cu-Li and Al-Cu-Li-In alloys were characterized and optimized for cryogenic tank applications. Presently, the effects of stress state and temperature is being determined on the fracture toughness and fracture mechanisms of commercially available Vintage 3 2090-T81 and experimental 2090+In-T6. Precracked J-integral specimens of both alloys were tested at ambient and cryogenic temperatures in the plane stress and plane strain conditions. Considering ambient temperature, results showed that 2090-T81 exhibited the highest toughness in both plane strain and plane stress conditions. For the plane strain condition, reasonable crack initiation and growth toughness of 1090-T81 are associated with a significant amount of delamination and transgranular fracture. Plane stress toughnesses were higher and fracture was characterized by shear cracking with minimal delaminations. In comparisons, the fracture behavior of 2090+In-T6 is significantly degraded by subgrain boundary precipitation. Toughness is low and characterized by intersubgranular fracture with no delamination in the plane stress or plane strain conditions. Intersubgranular cracking is a low energy event which presumably occurs prior to the onset of slip band cracking. Copious grain boundary precipitation is atypical of commercially available 2090. At cryogenic temperatures, both alloys exhibit increased yield strength, toughness, and amount of delamination and shear cracking. The change in fracture mode of 2090+In-T6 from intersubgranular cracking at ambient temperature to a combination of intersubgranular cracking, shear cracking, and delamination at cryogenic temperature is the subject of further investigation.

Wagner, John A.↗

All high Tc edge-geometry weak links utilizing Y-Ba-Cu-O barrier layers

High quality YBa2Cu3O(7-x) normal-metal/YBa2Cu3O(7-x) edge-geometry weak links have been fabricated using nonsuperconducting Y-Ba-Cu-O barrier layers deposited by laser ablation at reduced growth temperatures. Devices incorporating 25-100 A thick barrier layers exhibit current-voltage characteristics consistent with the resistively shunted junction model, with strong microwave and magnetic field response at temperatures up to 85 K. The critical currents vary exponentially with barrier thickness, and the resistances scale linearly with Y-Ba-Cu-O interlayer thickness and device area, indicating good barrier uniformity, with an effective mormal metal coherence length of 20 A.

Hunt, B. D.↗

Optical and microwave detection using Bi-Sr-Ca-Cu-O thin films

Recent progress at the Johns Hopkins University Applied Physics Laboratory (JHU/APL) in the development of optical and microwave detectors using high temperature superconducting thin films is described. Several objectives of this work have been accomplished, including: deposition of Bi-Sr-Ca-Cu-O thin films by laser abation processing (LAP); development of thin film patterning techniques, including in situ masking, wet chemical etching, and laser patterning; measurements of bolometric and non-bolometric signatures in patterned Bi-Sr-Ca-Cu-O films using optical and microwave sources, respectively; analysis and design of an optimized bolometer through computer simulation; and investigation of its use in a Fourier transform spectrometer. The focus here is primarily on results from the measurement of the bolometric and non-bolometric response.

Grabow, B. E.↗

Energetics and structural properties of twist grain boundaries in Cu

Structural and energetics properties of atoms near a grain boundary are of great importance from theoretical and experimental standpoints. From various experimental work it is concluded that diffusion at low temperatures at polycrystalline materials take place near grain boundary. Experimental and theoretical results also indicate changes of up to 70 percent in physical properties near a grain boundary. The Embedded Atom Method (EAM) calculations on structural properties of Au twist grain boundaries are in quite good agreement with their experimental counterparts. The EAM is believed to predict reliable values for the single vacancy formation energy as well as migration energy. However, it is not clear whether the EAM functions which are fitted to the bulk properties of a perfect crystalline solid can produce reliable results on grain boundaries. One of the objectives of this work is to construct the EAM functions for Cu and use them in conjunction with the molecular static simulation to study structures and energetics of atoms near twist grain boundaries in Cu. This provides tests of the EAM functions near a grain boundary. In particular, we determine structure, single vacancy formation energy, migration energy, single vacancy activation energy, and interlayer spacing as a function of distance from grain boundary. Our results are compared with the available experimental and theoretical results from grain boundaries and bulk.

Karimi, Majid↗

Structural and electronic changes in the growth of mercury overlayers on Cu(001) - A helium beam scattering, LEED and ARPES study

We used ABS, LEED and angle-resolved photo-electron spectroscopy (ARPES) to study bilayer films of Hg on Cu(001). In the surface temperature range of 180 to 330 K, the first Hg layer forms two ordered phases, a c(2x2) (with coverage-0.5 of Cu(001)) and a high density (partially commensurate) c(4x4) (coverage-0.62). ARPES data show that there is little or no dispersion of the 5d band of Hg. ABS data show that this layer is not flat, with in-registry Hg atoms lying about 0.15 below the not-in-registry Hg atoms. From ABS we find that the second layer forms a completely registered c(4x4) phase. From ARPES we obtain that the second layer has an electronic structure, particularly the 5d levels, characteristic of bulk mercury. Preliminary results of calculations of the structure of the bilayer are given.

Vidali, G.↗

Tensile strength of simulated and welded butt joints in W-Cu composite sheet

The weldability of W-Cu composite sheet was investigated using simulated and welded joints. The welded joints were produced in a vacuum hot press. Tensile test results showed that simulated joints can provide strength and failure mode data which can be used in joint design for actual weldments. Although all of the welded joints had flaws, a number of these joints were as strong as the W-Cu composite base material.

Moore, Thomas J.↗

High pressure synthesis and magnetic studies of quasi one dimensional systems Sr(n-1)Cu(n+1)O(2n) (n=3,5)

SrCu2O3 and Sr2Cu3O5 containing two-leg and three-leg S = 1/2 ladders made of antiferromagnetic Cu-O-Cu linear bonds, respectively, were synthesized at high pressure, and their crystallographic and magnetic properties were investigated. Both susceptibility and T(1) data of NMR (nuclear magnetic resonance) revealed the existence of a large spin gap only for SrCu2O3. Superconductivity, which had been predicted theoretically for carrier-doped SrCu2O3 could not be realized although partial substitution of La(3+) for Sr(2+) seemed to be carried out successfully. Electron carriers injected seems to remain localized.

Azuma, M.↗

Cu-Au Alloys Using Monte Carlo Simulations and the BFS Method for Alloys

Semi empirical methods have shown considerable promise in aiding in the calculation of many properties of materials. Materials used in engineering applications have defects that occur for various reasons including processing. In this work we present the first application of the BFS method for alloys to describe some aspects of microstructure due to processing for the Cu-Au system (Cu-Au, CuAu3, and Cu3Au). We use finite temperature Monte Carlo calculations, in order to show the influence of 'heat treatment' in the low-temperature phase of the alloy. Although relatively simple, it has enough features that could be used as a first test of the reliability of the technique. The main questions to be answered in this work relate to the existence of low temperature ordered structures for specific concentrations, for example, the ability to distinguish between rather similar phases for equiatomic alloys (CuAu I and CuAu II, the latter characterized by an antiphase boundary separating two identical phases).

Bozzolo, Guillermo↗