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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 109 records · Page 6
All sourcesNASA NTRSDOE OSTI
NASA NTRS1993

Synthesis, Properties, and Applications Of Boron Nitride

Report describes synthesis, properties, and applications of boron nitride. Especially in thin-film form. Boron nitride films useful as masks in x-ray lithography; as layers for passivation of high-speed microelectronic circuits; insulating films; hard, wear-resistant, protective films for optical components; lubricants; and radiation detectors. Present status of single-crystal growth of boron nitride indicates promising candidate for use in high-temperature semiconductor electronics.

Pouch, John J.↗
NASA NTRS1997

On the Mechanism of Boron Ignition

Boron filaments were electrically heated in air and argon/oxygen mixtures while their resistance, temperature, and radiation at the wavelengths of BO and BO2 bands were monitored. The filaments 'burned' in two distinct stages. Samples of the filaments were quenched at different times before and during the burning and analyzed using electron microscopy. The beginning of the first stage combustion characterized by a local resistance minimum, a sharp spike in boron oxide radiation emission, and a rapid rise in temperature, occurred at 1500 +/- 70 deg. C, independent of pre-heating history and oxygen content (540%) in the gas environment. The data suggest that a phase transition occurs in the filaments at this temperature that triggers stage one combustion. Significant amounts of oxygen were found inside quenched filaments. Large spherical voids formed in the boron filaments during their second stage combustion which is interpreted to indicate a crucial role for the gas dissolution processes in the combustion scenario.

Keil, D. G.↗
NASA NTRS2000

The Effect of Boron on the Low Cycle Fatigue Behavior of Disk Alloy KM4

The durability of powder metallurgy nickel base superalloys employed as compressor and turbine disks is often limited by low cycle fatigue (LCF) crack initiation and crack growth from highly stressed surface locations (corners, holes, etc.). Crack growth induced by dwells at high stresses during aerospace engine operation can be particularly severe. Supersolvus solution heat treatments can be used to produce coarse grain sizes approaching ASTM 6 for improved resistance to dwell fatigue crack growth. However, the coarse grain sizes reduce yield strength, which can lower LCF initiation life. These high temperature heat treatments also can encourage pores to form. In the advanced General Electric disk superalloy KM4, such pores can initiate fatigue cracks that limit LCF initiation life. Hot isostatic pressing (HIP) during the supersolvus solution heat treatment has been shown to improve LCF initiation life in KM4, as the HIP pressure minimizes formation of the pores. Reduction of boron levels in KM4 has also been shown to increase LCF initiation life after a conventional supersolvus heat treatment, again possibly due to effects on the formation tendencies of these pores. However, the effects of reduced boron levels on microstructure, pore characteristics, and LCF failure modes in KM4 still need to be fully quantified. The objective of this study was to determine the effect of boron level on the microstructure, porosity, LCF behavior, and failure modes of supersolvus heat treated KM4.

Gabb, Timothy↗
NASA NTRS2003

Dry Process for Making Polyimide/ Carbon-and-Boron-Fiber Tape

A dry process has been invented as an improved means of manufacturing composite prepreg tapes that consist of high-temperature thermoplastic polyimide resin matrices reinforced with carbon and boron fibers. Such tapes are used (especially in the aircraft industry) to fabricate strong, lightweight composite-material structural components. The inclusion of boron fibers results in compression strengths greater than can be achieved by use of carbon fibers alone. The present dry process is intended to enable the manufacture of prepreg tapes (1) that contain little or no solvent; (2) that have the desired dimensions, fiber areal weight, and resin content; and (3) in which all of the fibers are adequately wetted by resin and the boron fibers are fully encapsulated and evenly dispersed. Prepreg tapes must have these properties to be useable in the manufacture of high-quality composites by automated tape placement. The elimination of solvent and the use of automated tape placement would reduce the overall costs of manufacturing.

Belvin, Harry L.↗
NASA NTRS2014

High-Speed Imaging Optical Pyrometry for Study of Boron Nitride Nanotube Generation

A high-speed imaging optical pyrometry system is designed for making in-situ measurements of boron temperature during the boron nitride nanotube synthesis process. Spectrometer measurements show molten boron emission to be essentially graybody in nature, lacking spectral emission fine structure over the visible range of the electromagnetic spectrum. Camera calibration experiments are performed and compared with theoretical calculations to quantitatively establish the relationship between observed signal intensity and temperature. The one-color pyrometry technique described herein involves measuring temperature based upon the absolute signal intensity observed through a narrowband spectral filter, while the two-color technique uses the ratio of the signals through two spectrally separated filters. The present study calibrated both the one- and two-color techniques at temperatures between 1,173 K and 1,591 K using a pco.dimax HD CMOS-based camera along with three such filters having transmission peaks near 550 nm, 632.8 nm, and 800 nm.

Inman, Jennifer A.↗
NASA NTRS2014

Integrated Rig for the Production of Boron Nitride Nanotubes via the Pressurized Vapor-Condenser Method

An integrated production apparatus for production of boron nitride nanotubes via the pressure vapor-condenser method. The apparatus comprises: a pressurized reaction chamber containing a continuously fed boron containing target having a boron target tip, a source of pressurized nitrogen and a moving belt condenser apparatus; a hutch chamber proximate the pressurized reaction chamber containing a target feed system and a laser beam and optics.

Smith, Michael W.↗
NASA NTRS2020

Effects of Texture and Silica Content on Crack Growth in Boron Nitrides

Boron nitride is used in applications such as crucibles for melting and casting glasses and metals, insulators for furnaces, molds for hot pressing, and neutron absorbers. Historically, various grades of hot pressed hexagonal boron nitride (BN) have been used. This study investigates the fracture toughness and slow crack growth parameters of several commercially available BN grades. Prior work revealed that some grades of BN absorb water and change strength, thus presenting a philosophical conundrum on crack growth test methods. The grades selected for this study are of interest because their available billet size is sufficient for large components, or because they have heritage in specific applications. Ultimately, the data will be used to perform material selection, system design and reliability analyses of components of interest. Boron nitrides exhibit limited slow crack growth in humidity, with an orientation dependence due to crystallographic texture: orientations with van der Waal bonds are insensitive to water whereas those with covalent bonds are sensitive. Fracture toughness is low, around that of glass, and is also a function of orientation (bond type), with fracture occurring more readily along van der Waal bonds between hexagonal BN platelets than at covalent bonds across platelets. Silica additions toughen BN, but increase slow crack growth susceptibility.

Salem, Jonathan A.↗
NASA NTRS2025

The Shape Effect: Influence of 1D and 2D Boron Nitride Nanostructures on the Radiation Shielding, Thermal, and Damping Properties of High-Temperature Epoxy Composites

In space exploration, lightweight multifunctional materials capable of shielding neutron radiation, dissipating heat, and providing damping are essential. Polymer composites reinforced with boron nitride (BN) nanomaterials—specifically one-dimensional boron nitride nanotubes (BNNTs) and two-dimensional boron nitride nanoplatelets (BNNPs)—offer promising solutions. This study investigates how BN nanomaterial morphology influences the performance of high-temperature (HT) epoxy composites. We developed ultralightweight, three-dimensional BN foams comprising 1D BNNTs, 2D BNNPs, and hybrid 1D BNNT/2D BNNP structures via freeze-drying, then infiltrated them with HT epoxy to form dense composites. The BNNT foam exhibited the highest neutron radiation shielding, with a mass absorption coefficient of 26.64 cm2 g −1 , outperforming the hybrid foam (18.18 cm 2 g −1 ) and the BNNP foam (11.12 cm 2 g −1 ). A similar trend was observed in the HT epoxy composites; incorporating these foams at least doubled the mass absorption coefficient compared to the neat polymer. In terms of thermal conductivity, the BNNT/BNNP foam-epoxy composite achieved the highest value of 0.34 W m −1 K −1 , a 2.13-fold increase over neat HT epoxy. The BNNT/BNNP foam-epoxy composites also improved by 1.88 and 1.75 times, respectively. Mechanical testing revealed that BNNP foams withstood the highest loads during nanoindentation (3.53 kN), followed by BNNT/BNNP foams (1.93 kN) and BNNT foams (1.56 kN). All BN foam-epoxy composites exhibited enhanced damping properties, with tan δ increasing by at least 30 % compared to neat HT epoxy. These findings elucidate the impact of BN nanomaterial morphology on the multifunctional performance of HT epoxy composites, offering insights for developing high-performance, tailorable materials for demanding environments.

Kazue Orikasa↗
NASA NTRS2019

Slow Crack Growth of Boron Nitrides for Electric Propulsion Components

The Deep Space Gateway requires thruster systems to maintain spatial position. One control system being considered involves Hall thrusters. Historically, Hall thruster discharge channels have used several grades of hot-pressed hexagonal boron nitride. This study compliments data presented at ICACC (International Conference and Expo on Advanced Ceramics and Composites) 2018 and investigates the fracture toughness and slow crack growth parameters of several commercially available boron nitride grades including HP, M, M26, and Shapal Hi-M. The prior work revealed that some grades of BN absorb water and change strength thus presenting a philosophical conundrum on crack growth test methods. Advantages of different test methods will be discussed. The grades selected for this study are of interest because their available billet size is sufficient for Hall thruster discharge channels, or because they have heritage in Hall thruster applications. Ultimately, the data will be used to perform material selection, system design and reliability analyses.

Ceramics↗
NASA NTRSDate not supplied

Fabrication of Extruded Polyphenylsulfone – Boron Nitride Composite Tapes

Polyphenylsulfone (PPSU) is a high-temperature, chemically resistant thermoplastic with high impact resistance that is often used in interior aircraft cabin components, medical devices, and membranes. The aforementioned properties have led to interest investigating PPSU’s compatibility with hexagonal boron nitride (hBN) platelets as a thermally conductive, electrical composite insulator for high power-density electric machines. Preliminary trials extruding PPSU-hBN composite tapes showed promising dielectric properties and higher thermal conductivity as a function of hBN concentration compared to their neat analog. On the other hand, only few studies have reported on the extrusion process and resulting thermo-mechanical properties for PPSU and its composites made with chopped fiber reinforcement or fillers, none of which containing boron nitride filler. Prospects may exist for this type of material to be incorporated into extrusion-based additive manufacturing techniques to print other composites bearing unique properties useful for aerospace. Loading levels with up to approximately 23 wt% were achieved using micro-size BN platelets without observing any significant affects to PPSU’s glass-transition temperature. This work includes a description of the rheological properties of PPSU, the extrusion parameters for mixing and compounding the PPSU-hBN composite tapes, and the thermal and thermo-mechanical properties of PPSU-hBN composites.

polyphenylsulfone↗
NASA NTRS1965

Boron carbide whiskers produced by vapor deposition

Boron carbide whiskers have an excellent combination of properties for use as a reinforcement material. They are produced by vaporizing boron carbide powder and condensing the vapors on a substrate. Certain catalysts promote the growth rate and size of the whiskers.

Source record↗
NASA NTRS1965

Boron nitride housing cools transistors

Boron nitride ceramic heat sink cools transistors in r-f transmitter and receiver circuits. Heat dissipated by the transistor is conducted by the boron nitride housing to the metal chassis on which it is mounted.

Source record↗
NASA NTRS1972

Titanium reinforced boron polyimide composite

Program involves development of process technique for boron-polyimide prepeg, lay-up and curing procedures for prepegs when processed under vacuum bag pressure, and development and evaluation of titanium hard points for smooth transition of loads from titanium attach points into boron reinforced body of structure.

Clark, G. A.↗
NASA NTRS1971

Compressive behavior of titanium alloy skin-stiffener specimens selectively reinforced with boron-aluminum composite

A method of selectively reinforcing a conventional titanium airframe structure with unidirectional boron-aluminum composite attached by brazing was successfully demonstrated in compression tests of short skin-stiffener specimens. In a comparison with all-titanium specimens, improvements in structural performance recorded for the composite-reinforced specimens exceeded 25 percent on an equivalent-weight basis over the range from room temperature to 700 K (800 F) in terms of both initial buckling and maximum strengths. Performance at room temperature was not affected by prior exposure at 588 K (600 F) for 1000 hours in air or by 400 thermal cycles between 219 K and 588 K (-65 F and 600 F). The experimental results were generally predictable from existing analytical procedures. No evidence of failure was observed in the braze between the boron-aluminum composite and the titanium alloy.

Herring, H. W.↗
NASA NTRS1972

Electrochemical behavior of the boron anode in aqueous solutions

The electrochemical oxidation of p-type boron in 0.2 N NaNO3 solutions of pH 0.4 to 13.1 was studied by galvanostatic techniques. The capacitance of the electrode, Tafel slopes, and a limited analysis of reaction mechanisms are reported. The anodic dissolution in acid solution is a charge-transfer-limited one-electron reaction to form a monovalent species in the over-potential region of 0.25 to 0.70 V. The dissolution in basic solution is most probably a one-electron charge-transfer reaction from a monovalent to divalent species involving three hydroxyl ions. Open circuit potentials were mixed potentials, probably due to hydrogen formation at open circuit but not contributing to the electrochemical reaction at the applied overpotential. Exchange current, estimated by extrapolation of the Tafel line to the standard oxidation potential for the boron reaction, were of the order of 10 to the minus 6th power A/cm2 in acid solution and 10 to the minus 12th power A/cm2 in basic solution. The reaction order of the rate determining acidic and basic reactions was determined with regard to (H+) and (OH-). The level of illumination had no effect on the electrochemical behavior of the electrode.

Delduca, B. S.↗
NASA NTRS1969

Titanium reinforced boron-polyimide composite

Processing techniques for boron polyimide prepreg were developed whereby composites could be molded under vacuum bag pressure only. A post-cure cycle was developed which resulted in no loss in room temperature mechanical properties of the composite at any time during up to 16 hours at 650 F. A design utilizing laminated titanium foil was developed to achieve a smooth transition of load from the titanium attachment points into the boron-reinforced body of the structure. The box beam test article was subjected to combined bending and torsional loads while exposed to 650 F. Loads were applied incrementally until failure occurred at 83% design limit load.

Clark, G. A.↗
NASA NTRS1971

Boron epoxy reinforced structural sections.

A NASA Research program on the development of lightweight aluminum stiffening sections will be reviewed. The sections under investigation are hollowed extrusions which have been reinforced with boron epoxy by means of a fiber infiltration scheme being developed by Avco. Advantages of this type of construction are cost, environmental stability, manufacturing flexibility, and simplicity in joining. Present studies are focused on developing and verifying structural concepts for stiffener sections for compression panels. Results of analytical studies to size boron reinforcement will be discussed. Compression test results on stiffener sections will be presented and the design of a large compression panel will be reviewed. Results from compression panel efficiency studies indicate that panels with infiltrated stiffeners may be as much as 25% lighter than comparable all aluminum panels.-

Roy, P. A.↗
NASA NTRS1971

Effects of ultraviolet radiation on lattice imperfections in pyrolytic boron nitride.

Pyrolitic boron nitride was exposed to 310 equivalent sun hours of ultraviolet radiation in a space environment simulator with the objective to evaluate its applicability as a pigment for a thermal control coating and to identify radiation damage using X-ray diffraction techniques. Lattice parameter comparisons show a definite increase in lattice imperfections in the crystal structure resulting from the ultraviolet irradiation. This sensitivity to radiation damage makes pyrolitic boron nitride unsuitable as a pigment for thermal control coating.

Buckley, J. D.↗