Engineering Papers⌕ Search

SEARCH · Engineering Papers

Results for “reliablity”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 1,063 records · Page 59

High Reliability, High Mix, Ultralow Volume Surface Mount Technology for Space Applications

For the past two years, JPL has been working to introduce surface mount technology (SMT) for high reliability space applications. The thrust has centered around four research and development projects, the aim of which is to facilitate the use of SMT for designing, producing, inspecting, and quantifying surface mount printed wiring assemblies for ultralow volume, long life space applications. This paper explores the current approach being pursued at JPL and some of the problems peculiar to applying SMT to spacecraft applications.

volume long life↗

Component Reliability Testing of Long-Life Sorption Cryocoolers

This paper summarizes ongoing experiments characterizing the ability of critical sorption cryocooler components to achieve highly reliable operation for long-life space missions. Test data obtained over the past several years at JPL are entirely consistent with achieving ten year life for sorption compressors, electrical heaters, container materials, valves, and various sorbent materials suitable for driving 8 to 180 K refrigeration stages. Test results for various compressor systems are reported. Planned future tests necessary to gain a detailed understanding of the sensitivity of cooler performance and component life to operating constraints, design configurations, and fabrication, assembly and handling techniques, are also discussed.

operating constraints fabrication design testing↗

CSP Assembly Reliability: Commercial and Harsh Environments

The JPL-led CSP Consortium of enterprises representing government agencies and private companies has jointed together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects.

chip scale package CSP Solder Joint Reliability Th↗

Impact of junction temperature on microelectronic device reliability and considerations for space applications

This paper provides a summary of an industry survey on junction temperature derating from key microelectronics suppliers, and offers recommendations to users for temperature derating for reliable operation over time. Background information on established derating factors, and reccommendations for safe operating junction temperatures for newer technologies are also presented.

device reliability↗

Lead-Free vs Tin-Lead Reliability of Advanced Electronic Assemblies

This presentation will provide the technical background and specific information published in literature related to reliability test, analyses, modeling, and associated issues for lead-free solder package assemblies in comparison to their tin-lead solder alloys. It also presents current understanding of lead-free thermal cycle test performance in support.

assembly reliability↗

Flash Memory Reliability: Read, Program, and Erase Latency Versus Endurance Cycling

This report documents the efforts and results of the fiscal year (FY) 2010 NASA Electronic Parts and Packaging Program (NEPP) task for nonvolatile memory (NVM) reliability. This year's focus was to measure latency (read, program, and erase) of NAND Flash memories and determine how these parameters drift with erase/program/read endurance cycling.

latency↗

Reliability Considerations of ULP Scaled CMOS in Spacecraft Systems

NASA, the aerospace community, and other high reliability (hi-rel) users of advanced microelectronic products face many challenges as technology continues to scale into the deep sub-micron region. Decreasing the feature size of CMOS devices not only allows more components to be placed on a single chip, but it increases performance by allowing faster switching (or clock) speeds with reduced power compared to larger scaled devices. Higher performance, and lower operating and stand-by power characteristics of Ultra-Low Power (ULP) microelectronics are not only desirable, but also necessary to meet low power consumption design goals of critical spacecraft systems. The integration of these components in such systems, however, must be balanced with the overall risk tolerance of the project.

reliability↗

Common Cause Failures and Ultra Reliability

A common cause failure occurs when several failures have the same origin. Common cause failures are either common event failures, where the cause is a single external event, or common mode failures, where two systems fail in the same way for the same reason. Common mode failures can occur at different times because of a design defect or a repeated external event. Common event failures reduce the reliability of on-line redundant systems but not of systems using off-line spare parts. Common mode failures reduce the dependability of systems using off-line spare parts and on-line redundancy.

reliability↗

A Framework for Reliability and Safety Analysis of Complex Space Missions

Long duration and complex mission scenarios are characteristics of NASA's human exploration of Mars, and will provide unprecedented challenges. Systems reliability and safety will become increasingly demanding and management of uncertainty will be increasingly important. NASA's current pioneering strategy recognizes and relies upon assurance of crew and asset safety. In this regard, flexibility to develop and innovate in the emergence of new design environments and methodologies, encompassing modeling of complex systems, is essential to meet the challenges.

Safety Analysis↗

A CubeSat-Payload Radiation-Reliability Assurance Case using Goal Structuring Notation

CubeSats have become an attractive platform for universities, industry, and government space missions because they are cheaper and quicker to develop than full-scale satellites. One way CubeSats keep costs low is by using commercial off-the-shelf parts (COTS) instead of space-qualified parts. Space-qualified parts are often costlier, larger, and consume more power than their commercial counterparts precluding their use within the CubeSat form-factor. Given typical power budgets, monetary budgets, and timelines for CubeSat missions, conventional radiation hardness assurance, like the use of space-qualified parts and radiation testing campaigns of COTS parts, is not practical. Instead, a system-level approach to radiation effects mitigation is needed. In this paper an assurance case for a system-level approach to mitigate radiation effects of a CubeSat science experiment is expressed using Goal Structuring Notation (GSN), a graphical argument standard. The case specifically looks at three main mitigation strategies for the radiation environment: total ionizing dose (TID) screening of parts, detection and recovery from single-event latch-ups (SEL) and single-event functional interrupts (SEFI). The graphical assurance case presented makes a qualitative argument for the radiation reliability of the CubeSat experiment using part and system-level mitigation strategies.

COTS↗