NASA's Alliance with Industry in Defining Its Advanced Electronic Packaging and Interconnection
For years NASA's use of electronic packaging and the associated manufacturing processes has.
NASA Interconnection Program↗
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Results for “Package”
Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Packaging data products using data grid middleware for Deep Space Mission Systems
We are investigating a distributed computing infrastructure for releasing science products out of the mission pipeline. We are creating a DSMS Product Service and DSMS Data Packaging Service based on the OODT middleware, a Data Grid middleware technology that has proven successful in providing access to heterogeneous, disparate data, and federating that data using a common data model.
Deep Space Mission Systems↗
The NASA Electronic Parts and Packaging (NEPP) Program: Results and Direction
The NASA Electronic Parts and Packaging (NEPP) Program's mission is to provide guidance to NASA for the selection and application of microelectronic technologies, to improve understanding of the risks related to the use of these technologies in the space environment and to ensure that appropriate research is performed to meet NASA mission assurance needs. This viewgraph presentation reviews the NEPP program's goals and objectives, and reviews many of the missions that the NEPP program has impacted, both in and out of NASA. Also included are examples of the evaluation that the program performed.
LaBel, Kenneth A.↗
Parachute Dynamics Investigations Using a Sensor Package Airdropped from a Small-Scale Airplane
We explore the utility of various sensors by recovering parachute-probe dynamics information from a package released from a small-scale, remote-controlled airplane. The airdrops aid in the development of datasets for the exploration of planetary probe trajectory recovery algorithms, supplementing data collected from instrumented, full-scale tests and computer models.
Dooley, Jessica↗
Uniform rotating field network structure to efficiently package a magnetic bubble domain memory
A unique and compact open coil rotating magnetic field network structure to efficiently package an array of bubble domain devices is disclosed. The field network has a configuration which effectively enables selected bubble domain devices from the array to be driven in a vertical magnetic field and in an independent and uniform horizontal rotating magnetic field. The field network is suitably adapted to minimize undesirable inductance effects, improve capabilities of heat dissipation, and facilitate repair or replacement of a bubble device.
Wolfshagen, Ronald G.↗
Bias structure to efficiently package a magnetic bubble domain device
A single, compact bias structure to efficiently package a plurality of magnetic bubble domain device chips having different bias requirements. The vertical magnetic field distribution within the bias structure air gap is selectively controlled by a magnetically soft field adjusting assembly suitably attached within the bias structure. The size and configuration of the field adjusting assembly tailors local field variations within the air gap to correspond with the bias requirements of the bubble domain chips disposed therein.
Chen, Thomas T.↗
Apparatus and Method for Packaging and Integrating Microphotonic Devices
An apparatus is disclosed that includes a carrier structure and an optical coupling arrangement. The carrier structure is made of a silicon material and allows for the packaging and integrating of microphotonic devices onto a single chip. The optical coupling mechanism enables laser light to be coupled into and out of a microphotonic resonant disk integrated on the carrier. The carrier provides first, second and third cavities that are dimensioned so as to accommodate the insertion and snug fitting of the microphotonic resonant disk and first and second prisms that are implemented by the optical coupling arrangement to accommodate the laser coupling.
Nguyen, Hung↗
NASA Electronic Parts and Packaging (NEPP) Program
This viewgraph presentation reviews NASA's Electronic Parts and Packaging (NEPP) Program. The NEPP mission is to provide guidance to NASA for the selection and and application of microelectronics technologies, to improve understanding of the risks related to the use of these technologies in the space environment and to ensure that appropriate research is performed to meet NASA mission needs. The NEPP Program focuses on the reliability aspects of electronic devices. Three principal aspects to this reliability: (1) lifetime, (2) effects of space radiation and the space environment, and (3) creation and maintenance of the assurance support infrastructure required for success.
LaBel, Kenneth A.↗
Big Science, Small-Budget Space Experiment Package Aka MISSE-5: A Hardware And Software Perspective
Conducting space experiments with small budgets is a fact of life for many design groups with low-visibility science programs. One major consequence is that specialized space grade electronic components are often too costly to incorporate into the design. Radiation mitigation now becomes more complex as a result of being restricted to the use of commercial off-the-shelf (COTS) parts. Unique hardware and software design techniques are required to succeed in producing a viable instrument suited for use in space. This paper highlights some of the design challenges and associated solutions encountered in the production of a highly capable, low cost space experiment package.
Krasowski, Michael↗
Deep Impact Delta II Launch Vehicle Cracked Thick Film Coating on Electronic Packages Technical Consultation Report
The Deep Impact spacecraft was launched on a Boeing Delta II rocket from Cape Canaveral Air Force Station (CCAFS) on January 12, 2005. Prior to the launch, the Director of the Office of Safety and Mission Assurance (OS&MA) requested the NASA Engineering and Safety Center (NESC) lead a team to render an independent opinion on the rationale for flight and the risk code assignments for the hazard of cracked Thick Film Assemblies (TFAs) in the E-packages of the Delta II launch vehicle for the Deep Impact Mission. The results of the evaluation are contained in this report.
Cameron, Kenneth D.↗
The LISA Technology Package
The LISA Technology Package (LTP) is the payload of the European Space Agency's LISA Pathfinder mission. LISA Pathfinder was instigated to test, in a flight environment, the critical technologies required by LISA; namely, the inertial sensing subsystem and associated control laws and micro-Newton thrusters required to place a macroscopic test mass in pure free-fall. The UP is in the late stages of development -- all subsystems are currently either in the final stages of manufacture or in test. Available flight units are being integrated into the real-time testbeds for system verification tests. This poster will describe the UP and its subsystems, give the current status of the hardware and test campaign, and outline the future milestones leading to the UP delivery.
Livas, Jeff↗
NASA Electronic Parts and Packaging (NEPP) Program - Update
This slide presentation reviews the goals and mission of the NASA Electronic Parts and Packaging (NEPP) Program. The NEPP mission is to provide guidance to NASA for the selection and application of microelectronics technologies, to improve understanding of the risks related to the use of these technologies in the space environment and to ensure that appropriate research is performed to meet NASA mission assurance needs. The program has been supporting NASA for over 20 years. The focus is on the reliability aspects of electronic devices. In this work the program also supports the electronics industry. There are several areas that the program is involved in: Memories, systems on a chip (SOCs), data conversion devices, power MOSFETS, power converters, scaled CMOS, capacitors, linear devices, fiber optics, and other electronics such as sensors, cryogenic and SiGe that are used in space systems. Each of these area are reviewed with the work that is being done in reliability and effects of radiation on these technologies.
LaBel, Kenneth A.↗
Rapid Active Sampling Package
A field-deployable, battery-powered Rapid Active Sampling Package (RASP), originally designed for sampling strong materials during lunar and planetary missions, shows strong utility for terrestrial geological use. The technology is proving to be simple and effective for sampling and processing materials of strength. Although this originally was intended for planetary and lunar applications, the RASP is very useful as a powered hand tool for geologists and the mining industry to quickly sample and process rocks in the field on Earth. The RASP allows geologists to surgically acquire samples of rock for later laboratory analysis. This tool, roughly the size of a wrench, allows the user to cut away swaths of weathering rinds, revealing pristine rock surfaces for observation and subsequent sampling with the same tool. RASPing deeper (.3.5 cm) exposes single rock strata in-situ. Where a geologist fs hammer can only expose unweathered layers of rock, the RASP can do the same, and then has the added ability to capture and process samples into powder with particle sizes less than 150 microns, making it easier for XRD/XRF (x-ray diffraction/x-ray fluorescence). The tool uses a rotating rasp bit (or two counter-rotating bits) that resides inside or above the catch container. The container has an open slot to allow the bit to extend outside the container and to allow cuttings to enter and be caught. When the slot and rasp bit are in contact with a substrate, the bit is plunged into it in a matter of seconds to reach pristine rock. A user in the field may sample a rock multiple times at multiple depths in minutes, instead of having to cut out huge, heavy rock samples for transport back to a lab for analysis. Because of the speed and accuracy of the RASP, hundreds of samples can be taken in one day. RASP-acquired samples are small and easily carried. A user can characterize more area in less time than by using conventional methods. The field-deployable RASP used a Ni/Cad rechargeable battery. Power usage was less than 1 Wh/ cm3 even when sampling strong basalts, so many samples could be taken on a single battery charge.
Peters, Gregory↗
System for Packaging Planetary Samples for Return to Earth
A system is proposed for packaging material samples on a remote planet (especially Mars) in sealed sample tubes in preparation for later return to Earth. The sample tubes (Figure 1) would comprise (1) tubes initially having open tops and closed bottoms; (2) small, bellows-like collapsible bodies inside the tubes at their bottoms; and (3) plugs to be eventually used to close the tops of the tubes. The top inner surface of each tube would be coated with solder. The side of each plug, which would fit snugly into a tube, would feature a solder-filled ring groove. The system would include equipment for storing, manipulating, filling, and sealing the tubes. The containerization system (see Figure 2) will be organized in stations and will include: the storage station, the loading station, and the heating station. These stations can be structured in circular or linear pattern to minimize the manipulator complexity, allowing for compact design and mass efficiency. The manipulation of the sample tube between stations is done by a simple manipulator arm. The storage station contains the unloaded sample tubes and the plugs before sealing as well as the sealed sample tubes with samples after loading and sealing. The chambers at the storage station also allow for plug insertion into the sample tube. At the loading station the sample is poured or inserted into the sample tube and then the tube is topped off. At the heating station the plug is heated so the solder ring melts and seals the plug to the sample tube. The process is performed as follows: Each tube is filled or slightly overfilled with sample material and the excess sample material is wiped off the top. Then, the plug is inserted into the top section of the tube packing the sample material against the collapsible bellowslike body allowing the accommodation of the sample volume. The plug and the top of the tube are heated momentarily to melt the solder in order to seal the tube.
Badescu, Mircea↗
Evaluation of Small Form Factor Fiber Optic Interconnects for the NASA Electronics Parts and Packaging Program (NEPP)
The Diamond AVIM optical fiber connector has been used for over a decade in flight environments. AVIM which stands for Aviation Intermediate Maintenance is always referenced as a fiber optic connector type from the DIN (Deutsches Institut fur Normung) family of optical fiber connectors. The newly available Mini AVIM and DMI (Definition Multimedia Interface) connectors also by Diamond provide similar features as the high performance AVIM with the added benefits of being small form factor for board mount and internal box use where long connectors and strain relief can not be accommodated. Transceiver, fiber laser technology and receiver optic technology based on small sized constraints will benefit the most by the reduction in connector form factor. It is for this reason that the Mini AVIM is being evaluated for multimode and single mode optical fiber use in both fiber based and cable based packaging configurations. In a fiber based termination, there are no cable materials to bond to the connector. The only bonding that is conducted is the mounting of the fiber with epoxy to the connector ferrules (which are called DMI ferrules). In a cable configuration, the compatibility of the connector subcomponents along with the upjacketing materials of the cable around the fiber needs to be considered carefully for termination fabrication. Cabled terminations will show greater insertion loss and high probability of failures during thermal cycling testing. This is due to the stressing of the combination of materials that each have different Coefficients of Thermal Expansion (CTE's) and that are bonded together to the connector subcomponents. As the materials flex during thermal excursions, forces are applied to the termination and can make the system fail if the grouping of materials (per their CTE's) are not compatible and this includes cable materials, epoxies, ferrule and connector body components. For this evaluation, multimode 100 micron core step index fiber was used for the fiber terminated condition, and single mode SMF-28 upjacketed with W.L. Gore Flexlite was used for the cabled configuration. For background purposes, a comparison is presented here for information purposes between the high performance AVIM connector features and the Mini AVIM small form factor connectors. Basic connector features are described here.
Ott, Melanie↗
PVD Silicon Carbide as a Thin Film Packaging Technology for Antennas on LCP Substrates for Harsh Environments
This paper describes an effort to develop a thin film packaging technology for microfabricated planar antennas on polymeric substrates based on silicon carbide (SiC) films deposited by physical vapor deposition (PVD). The antennas are coplanar waveguide fed dual frequency folded slot antennas fabricated on liquid crystal polymer (LCP) substrates. The PVD SiC thin films were deposited directly onto the antennas by RF sputtering at room temperature at a chamber pressure of 30 mTorr and a power level of 300 W. The SiC film thickness is 450 nm. The return loss and radiation patterns were measured before and after the SiC-coated antennas were submerged into perchloric acid for 1 hour. No degradation in RF performance or physical integrity of the antenna was observed.
Scardelletti, Maximilian C.↗
Packaging material and flexible medical tubing containing thermally exfoliated graphite oxide
A packaging material or flexible medical tubing containing a modified graphite oxide material, which is a thermally exfoliated graphite oxide with a surface area of from about 300 m.sup.2/g to 2600 m.sup.2/g.
Prud'homme, Robert K.↗
Searching for Lunar Water: The Lunar Volatile Resources Analysis Package
The ESA Lunar Lander has been conceived to demonstrate an autonomous landing capability. Once safely on the Moon the scientific payload will conduct investigations aimed at preparing the way for human exploration. As part of the provisional payload an instrument known as The Lunar Volatile Resources Analysis Package (L-VRAP) will analyse surface and exospheric volatiles. The presence and abundance of lunar water is an important consideration for ISRU (In Situ Resource Utilisation) since this is likely to be part of a strategy for supporting long-term human exploration of the Moon.
Morse, A. D.↗