The influence of power spinning and annealing temperature on microstructures and properties of Cu-Sn alloy
Highlights: • The strengthening effect of power spinning is mainly achieved by strengthening fine grains and dislocations. • Twins formed by the aggregation and overlapping of stacking faults grow and widen • In power spinning of Cu-Sn alloy, plastic deformation is primarily powered by dislocation sliding. - Abstract: Electron back scatter diffraction pattern (EBSD), metallographic microscope (OM) and transmission electron microscope (TEM) are used to analyze the microstructural state of the Cu-Sn alloy before and after power spinning and annealing. The results show that after power spinning, the α phase grains are refined and gradually evolve into small and fine α{sub II} and deformed α{sub III} crystal grains, with an average grain size of about 2.2 μm. Work hardening results in massive network-like subgrain boundaries distributed in power spinning microstructure. Annealing at 400 °C contributes to the formation of dislocation cells and stacking faults, and high-angle grain boundaries (HABS) start to migrate and slide. After the formation of less defective equiaxed grains at 500 °C, twins continue to grow and widen based through continuous accumulation of stacking faults. Further testing of mechanical properties reveals that power spinning is conducive to the improvement of mechanical properties of Cu-Sn alloy.