Methods of design stage reliability analysis.
Reliability methodology in design and development stage, discussing component stresses, performance variation, etc
PERFORMANCE CHARACTERISTICS↗
SEARCH · Engineering Papers
Results for “reliablity”
Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Infrared techniques for the reliability enhancement of microelectronics.
IR techniques for reliability enhancement of microelectronics
CIRCUIT RELIABILITY↗
PRINCE/APIC - A centralized parts and materials information center for the reliability engineer.
Centralized parts and materials reliability information center /PRINCE/APIC/, explaining data storage and retrieval
RELIABILITY↗
Metallurgical aspects of reliability for small nitrided parts.
Metallurgical aspects of nitrided component application in unmanned satellite drive systems to remedy sliding wear and increase reliability
NITRIDATION↗
Assessment of ground system performance and integration of reliability and maintainability with simulated system operations.
Ground system design approach integrating reliability and maintainability with performance requirements, using Saturn V simulation as example
RELIABILITY↗
Integrated reliability program for Scout research vehicle.
Integrated reliability program for Scout launch vehicle in terms of design specification, review functions, malfunction reporting, failed parts analysis, quality control, standardization and certification
SYSTEM FAILURE↗
The reliability contribution of the pilot to a large launch vehicle control system.
Reliability contribution of pilot using manual backup control for first stage of Saturn V tested using simulation
MANUAL CONTROL↗
Apollo guidance, navigation and control system gyro reliability.
Apollo gyro reliability covering Guidance, Navigation and Control systems, stressing failure mode prediction
GUIDANCE AND CONTROL↗
Implementation of high reliability objectives of Surveyor pressure vessels.
Methodology used to implement high reliability objectives for Surveyor pressure vessels, tabulating burst test results
SURVEYOR SPACECRAFT↗
Reliability and paste process optimization of eutectic and lead-free for mixed packaging
This paper reports the results of an experiment that utilized the JPL's area array consortium test vehicle design, containing a myriad of mixed technology components with an OSP finish. The details of the reliability study are presented in this paper.
reliability AAR SMT↗
Reliability and endurance of FRAM: a case study
This paper describes a case study quantifying reliability and endurance results of two FRAM nonvolatile memories.
FRAM non-volatile memory reliability single-event ↗
Effect of thermal cycling ramp rate on CSP assembly reliability
A JPL-led chip scale package consortium of enterprises recently joined together to pool in-kind resources for developing the quality and reliability of chip scale packages for a variety of projects. The experience of the consortium in building more than 150 test vehicle assemblies, single and double sided multilayer PWBs, and the environmental test results has now been published as a chip scale package guidelines document.
accelerated thermal cycle chip scale package solde↗
CSP Assembly Reliability and Effects of Underfill and Double-Sided Population
The JPL-led MicrotypeBGA Consortium of enterprises representing government agencies and private companies have jointed together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects.
chip scale package CSP solder joint reliability un↗
Assembly reliability of CSPs with various chiip sizes by accelerated thermal and mechanical cycling test
A JPL-led chip scale package (CSP) Consortium, composed of team members representing government agencies and private companies, recently joined together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects.
Chip Scale Package CSP thermal cycle fatigue solde↗
Plastic Encapsulated Microcircuits (PEMs) Reliability Guide
It is reported by some users and has been demonstrated by others via testing and qualification that the quality and reliability of plastic-encapsulated microcircuits (PEMs) manufactured today are excellent in commercial applications and closely equivalent, and in some cases superior to their hemetic counterparts.
plastic encapsulated microcircuits reliability gui↗
CSP Assembly Reliability
Reviews the many factors that affect interconnect reliability of emerging chip scale package (CSP) assemblies. These include: package type, package build, board design, and assembly variables.
chip scale package CSP solder joint reliability th↗
Reliability Roadmap for Microstructures and Micromechanical Systems
Reliability and quality issues are two of the main bottlenecks choking the effective commercialization of microsystem technology.
microsystem technology↗
An Experiment in Determining Software Reliability Model Applicability
There have been few reports on the behavior of software reliability models under controlled conditions. That is to say, most of the reported experience with the models is during the testing phase of actual projects, during which researchers have little or no control over the data with which they work. Give that failure data for actual projects can be noisy, distorted, and uncertain, reported procedures for determining model applicability may be incomplete.
Software Reliability↗