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NASA NTRS2009

Silicon Wafer-Scale Substrate for Microshutters and Detector Arrays

The silicon substrate carrier was created so that a large-area array (in this case 62,000+ elements of a microshutter array) and a variety of discrete passive and active devices could be mounted on a single board, similar to a printed circuit board. However, the density and number of interconnects far exceeds the capabilities of printed circuit board technology. To overcome this hurdle, a method was developed to fabricate this carrier out of silicon and implement silicon integrated circuit (IC) technology. This method achieves a large number of high-density metal interconnects; a 100-percent yield over a 6-in. (approximately equal to 15-cm) diameter wafer (one unit per wafer); a rigid, thermally compatible structure (all components and operating conditions) to cryogenic temperatures; re-workability and component replaceability, if required; and the ability to precisely cut large-area holes through the substrate. A method that would employ indium bump technology along with wafer-scale integration onto a silicon carrier was also developed. By establishing a silicon-based version of a printed circuit board, the objectives could be met with one solution. The silicon substrate would be 2 mm thick to survive the environmental loads of a launch. More than 2,300 metal traces and over 1,500 individual wire bonds are required. To mate the microshutter array to the silicon substrate, more than 10,000 indium bumps are required. A window was cut in the substrate to allow the light signal to pass through the substrate and reach the microshutter array. The substrate was also the receptacle for multiple unpackaged IC die wire-bonded directly to the substrate (thus conserving space over conventionally packaged die). Unique features of this technology include the implementation of a 2-mmthick silicon wafer to withstand extreme mechanical loads (from a rocket launch); integrated polysilicon resistor heaters directly on the substrate; the precise formation of an open aperture (approximately equal to 3x3cm) without any crack propagation; implementation of IR transmission blocking techniques; and compatibility with indium bump bonding. Although designed for the microshutter arrays for the NIRSpec instrument on the James Webb Space Telescope, these substrates can be linked to microshutter applications in the photomask generation and stepper equipment used to make ICs and microelectromechanical system (MEMS) devices.

Jhabvala, Murzy↗

NASA NTRS2007

SiC Multi-Chip Power Modules as Power-System Building Blocks

The term "SiC MCPMs" (wherein "MCPM" signifies "multi-chip power module") denotes electronic power-supply modules containing multiple silicon carbide power devices and silicon-on-insulator (SOI) control integrated-circuit chips. SiC MCPMs are being developed as building blocks of advanced expandable, reconfigurable, fault-tolerant power-supply systems. Exploiting the ability of SiC semiconductor devices to operate at temperatures, breakdown voltages, and current densities significantly greater than those of conventional Si devices, the designs of SiC MCPMs and of systems comprising multiple SiC MCPMs are expected to afford a greater degree of miniaturization through stacking of modules with reduced requirements for heat sinking. Moreover, the higher-temperature capabilities of SiC MCPMs could enable operation in environments hotter than Si-based power systems can withstand. The stacked SiC MCPMs in a given system can be electrically connected in series, parallel, or a series/parallel combination to increase the overall power-handling capability of the system. In addition to power connections, the modules have communication connections. The SOI controllers in the modules communicate with each other as nodes of a decentralized control network, in which no single controller exerts overall command of the system. Control functions effected via the network include synchronization of switching of power devices and rapid reconfiguration of power connections to enable the power system to continue to supply power to a load in the event of failure of one of the modules. In addition to serving as building blocks of reliable power-supply systems, SiC MCPMs could be augmented with external control circuitry to make them perform additional power-handling functions as needed for specific applications: typical functions could include regulating voltages, storing energy, and driving motors. Because identical SiC MCPM building blocks could be utilized in a variety of ways, the cost and difficulty of designing new, highly reliable power systems would be reduced considerably. Several prototype DC-to-DC power-converter modules containing SiC power-switching devices were designed and built to demonstrate the feasibility of the SiC MCPM concept. In anticipation of a future need for operation at high temperature, the circuitry in the modules includes high-temperature inductors and capacitors. These modules were designed to be stacked to construct a system of four modules electrically connected in series and/or parallel. The packaging of the modules is designed to satisfy requirements for series and parallel interconnection among modules, high power density, high thermal efficiency, small size, and light weight. Each module includes four output power connectors two for serial and two for parallel output power connections among the modules. Each module also includes two signal connectors, electrically isolated from the power connectors, that afford four zones for signal interconnections among the SOI controllers. Finally, each module includes two input power connectors, through which it receives power from an in-line power bus. This design feature is included in anticipation of a custom-designed power bus incorporating sockets compatible with snap-on type connectors to enable rapid replacement of failed modules.

Lostetter, Alexander↗

NASA NTRS2007

Mo/Ti Diffusion Bonding for Making Thermoelectric Devices

An all-solid-state diffusion bonding process that exploits the eutectoid reaction between molybdenum and titanium has been developed for use in fabricating thermoelectric devices based on skutterudite compounds. In essence, the process is one of heating a flat piece of pure titanium in contact with a flat piece of pure molybdenum to a temperature of about 700 C while pushing the pieces together with a slight pressure [a few psi (of the order of 10 kPa)]. The process exploits the energy of mixing of these two metals to form a strong bond between them. These two metals were selected partly because the bonds formed between them are free of brittle intermetallic phases and are mechanically and chemically stable at high temperatures. The process is a solution of the problem of bonding hot-side metallic interconnections (denoted hot shoes in thermoelectric jargon) to titanium-terminated skutterudite n and p legs during the course of fabrication of a unicouple, which is the basic unit cell of a thermoelectric device (see figure). The hot-side operating temperature required for a skutterudite thermoelectric device is 700 C. This temperature precludes the use of brazing to attach the hot shoe; because brazing compounds melt at lower temperatures, the hot shoe would become detached during operation. Moreover, the decomposition temperature of one of the skutterudite compounds is 762 C; this places an upper limit on the temperature used in bonding the hot shoe. Molybdenum was selected as the interconnection metal because the eutectoid reaction between it and the titanium at the ends of the p and n legs has characteristics that are well suited for this application. In addition to being suitable for use in the present bonding process, molybdenum has high electrical and thermal conductivity and excellent thermal stability - characteristics that are desired for hot shoes of thermoelectric devices. The process takes advantage of the chemical potential energy of mixing between molybdenum and titanium. These metals have a strong affinity for each other. They are almost completely soluble in each other and remain in the solid state at temperatures above the eutectoid temperature of 695 C. As a result, bonds formed by interdiffusion of molybdenum and titanium are mechanically stable at and well above the original bonding temperature of about 700 C. Inasmuch as the bonds are made at approximately the operating temperature, thermomechanical stresses associated with differences in thermal expansion are minimized.

Sakamoto, Jeffrey↗

NASA NTRS2010

High-Speed Ring Bus

The high-speed ring bus at the Jet Propulsion Laboratory (JPL) allows for future growth trends in spacecraft seen with future scientific missions. This innovation constitutes an enhancement of the 1393 bus as documented in the Institute of Electrical and Electronics Engineers (IEEE) 1393-1999 standard for a spaceborne fiber-optic data bus. It allows for high-bandwidth and time synchronization of all nodes on the ring. The JPL ring bus allows for interconnection of active units with autonomous operation and increased fault handling at high bandwidths. It minimizes the flight software interface with an intelligent physical layer design that has few states to manage as well as simplified testability. The design will soon be documented in the AS-1393 standard (Serial Hi-Rel Ring Network for Aerospace Applications). The framework is designed for "Class A" spacecraft operation and provides redundant data paths. It is based on "fault containment regions" and "redundant functional regions (RFR)" and has a method for allocating cables that completely supports the redundancy in spacecraft design, allowing for a complete RFR to fail. This design reduces the mass of the bus by incorporating both the Control Unit and the Data Unit in the same hardware. The standard uses ATM (asynchronous transfer mode) packets, standardized by ITU-T, ANSI, ETSI, and the ATM Forum. The IEEE-1393 standard uses the UNI form of the packet and provides no protection for the data portion of the cell. The JPL design adds optional formatting to this data portion. This design extends fault protection beyond that of the interconnect. This includes adding protection to the data portion that is contained within the Bus Interface Units (BIUs) and by adding to the signal interface between the Data Host and the JPL 1393 Ring Bus. Data transfer on the ring bus does not involve a master or initiator. Following bus protocol, any BIU may transmit data on the ring whenever it has data received from its host. There is no centralized arbitration or bus granting. The JPL design provides for autonomous synchronization of the nodes on the ring bus. An address-synchronous latency adjust buffer (LAB) has been designed that cannot get out of synchronization and needs no external input. Also, a priority-driven cable selection behavior has been programmed into each unit on the ring bus. This makes the bus able to connect itself up, according to a maximum redundancy priority system, without the need for computer intervention at startup. Switching around a failed or switched-off unit is also autonomous. The JPL bus provides a map of all the active units for the host computer to read and use for fault management. With regard to timing, this enhanced bus recognizes coordinated timing on a spacecraft as critical and addresses this with a single source of absolute and relative time, which is broadcast to all units on the bus with synchronization maintained to the tens of nanoseconds. Each BIU consists of up to five programmable triggers, which may be programmed for synchronization of events within the spacecraft of instrument. All JPL-formatted data transmitted on the ring bus are automatically time-stamped.

Wysocky, Terry↗

NASA NTRS2009

NASA 2009 Body of Knowledge (BoK) Through-Slicon Via Technology

Through-silicon via (TSV) is the latest in a progression of technologies for stacking silicon devices in three dimensions (3D). Driven by the need for improved performance, methods to use short vertical interconnects to replace the long interconnects found in 2D structures have been developed. The industry is moving past the feasibility (research and development [R and D]) phase for TSV technology into the commercialization phase where economic realities will determine which technologies are adopted. Low-cost fine via hole formation and highly reliable via filling technologies have been demonstrated; process equipment and materials are available. Even though design, thermal, and test issues remain, much progress has been made.

3D packaging↗

NASA NTRS2009

Smart and Intelligent Sensors

John C. Stennis Space Center (SSC) provides rocket engine propulsion testing for NASA's space programs. Since the development of the Space Shuttle, every Space Shuttle Main Engine (SSME) has undergone acceptance testing at SSC before going to Kennedy Space Center (KSC) for integration into the Space Shuttle. The SSME is a large cryogenic rocket engine that uses Liquid Hydrogen (LH2) as the fuel. As NASA moves to the new ARES V launch system, the main engines on the new vehicle, as well as the upper stage engine, are currently base lined to be cryogenic rocket engines that will also use LH2. The main rocket engines for the ARES V will be larger than the SSME, while the upper stage engine will be approximately half that size. As a result, significant quantities of hydrogen will be required during the development, testing, and operation of these rocket engines.Better approaches are needed to simplify sensor integration and help reduce life-cycle costs. 1.Smarter sensors. Sensor integration should be a matter of "plug-and-play" making sensors easier to add to a system. Sensors that implement new standards can help address this problem; for example, IEEE STD 1451.4 defines transducer electronic data sheet (TEDS) templates for commonly used sensors such as bridge elements and thermocouples. When a 1451.4 compliant smart sensor is connected to a system that can read the TEDS memory, all information needed to configure the data acquisition system can be uploaded. This reduces the amount of labor required and helps minimize configuration errors. 2.Intelligent sensors. Data received from a sensor be scaled, linearized; and converted to engineering units. Methods to reduce sensor processing overhead at the application node are needed. Smart sensors using low-cost microprocessors with integral data acquisition and communication support offer the means to add these capabilities. Once a processor is embedded, other features can be added; for example, intelligent sensors can make a health assessment to inform the data acquisition client when sensor performance is suspect. 3.Distributed sample synchronization. Networks of sensors require new ways for synchronizing samples. Standards that address the distributed timing problem (for example, IEEE STD 1588) provide the means to aggregate samples from many distributed smart sensors with sub-microsecond accuracy. 4. Reduction in interconnect. Alternative means are needed to reduce the frequent problems associated with cabling and connectors. Wireless technologies offer the promise of reducing interconnects and simultaneously making it easy to quickly add a sensor to a system.

Lansaw, John↗

NASA NTRS2010

Development and Testing of an Ultracapacitor Based Uninterruptible Power Supply (UPS) System

The NASA Glenn Research Center (GRC) initiated the development and testing of an ultracapacitor based uninterruptible power supply (UPS) system as a means to provide backup power for the many critical NASA applications. A UPS system typically utilizes batteries for energy storage. The battery is the most vulnerable part of the UPS system, requiring regular maintenance and replacement. Battery performance is also extremely temperature dependent. Ultracapacitors are ideal for UPS systems where long life, maintenance free operation, and excellent low temperature performance is essential. State of the art symmetric ultracapacitors were used for these tests. The ultracapacitors were interconnected in an innovative configuration to minimize interconnection impedance, and to provide voltage balancing. Ultracapacitors can be charged extremely rapidly and supply high current, which are essential characteristics for an effective UPS system. Charging ultracapacitors is significantly less complex than charging batteries since there is no chemical reaction occurring while charging ultracapacitors. The report concludes that the implementation of symmetric ultracapacitors in a UPS system can provide significant improvements in power system performance and reliability.

Eichenberg, Dennis J.↗

NASA NTRS2010

Multiple Differential-Amplifier MMICs Embedded in Waveguides

Compact amplifier assemblies of a type now being developed for operation at frequencies of hundreds of gigahertz comprise multiple amplifier units in parallel arrangements to increase power and/or cascade arrangements to increase gains. Each amplifier unit is a monolithic microwave integrated circuit (MMIC) implementation of a pair of amplifiers in differential (in contradistinction to single-ended) configuration. Heretofore, in cascading amplifiers to increase gain, it has been common practice to interconnect the amplifiers by use of wires and/or thin films on substrates. This practice has not yielded satisfactory results at frequencies greater than 200 Hz, in each case, for either or both of two reasons: Wire bonds introduce large discontinuities. Because the interconnections are typically tens of wavelengths long, any impedance mismatches give rise to ripples in the gain-vs.-frequency response, which degrade the performance of the cascade.

Kangaslahti, Pekka↗

NASA NTRS2010

The Assurance Challenges of Advanced Packaging Technologies for Electronics

Advances in microelectronic parts performance are driving towards finer feature sizes, three-dimensional geometries and ever-increasing number of transistor equivalents that are resulting in increased die sizes and interconnection (I/O) counts. The resultant packaging necessary to provide assemble-ability, environmental protection, testability and interconnection to the circuit board for the active die creates major challenges, particularly for space applications, Traditionally, NASA has used hermetically packaged microcircuits whenever available but the new demands make hermetic packaging less and less practical at the same time as more and more expensive, Some part types of great interest to NASA designers are currently only available in non-hermetic packaging. It is a far more complex quality and reliability assurance challenge to gain confidence in the long-term survivability and effectiveness of nonhermetic packages than for hermetic ones. Although they may provide more rugged environmental protection than the familiar Plastic Encapsulated Microcircuits (PEMs), the non-hermetic Ceramic Column Grid Array (CCGA) packages that are the focus of this presentation present a unique combination of challenges to assessing their suitability for spaceflight use. The presentation will discuss the bases for these challenges, some examples of the techniques proposed to mitigate them and a proposed approach to a US MIL specification Class for non-hermetic microcircuits suitable for space application, Class Y, to be incorporated into M. IL-PRF-38535. It has recently emerged that some major packaging suppliers are offering hermetic area array packages that may offer alternatives to the nonhermetic CCGA styles but have also got their own inspectability and testability issues which will be briefly discussed in the presentation,

Sampson, Michael J.↗

NASA NTRS2009

UAVSAR Phased Array Aperture

This paper describes the development of a patch antenna array for an L-band repeat-pass interferometric synthetic aperture radar (InSAR) instrument that is to be flown on an unmanned aerial vehicle (UAV). The antenna operates at a center frequency of 1.2575 GHz and with a bandwidth of 80 MHz, consistent with a number of radar instruments that JPL has previously flown. The antenna is designed to radiate orthogonal linear polarizations in order to facilitate fully-polarimetric measurements. Beam-pointing requirements for repeat-pass SAR interferometry necessitate electronic scanning in azimuth over a range of -20degrees in order to compensate for aircraft yaw. Beam-steering is accomplished by transmit/receive (T/R) modules and a beamforming network implemented in a stripline circuit board. This paper, while providing an overview of phased array architecture, focuses on the electromagnetic design of the antenna tiles and associated interconnects. An important aspect of the design of this antenna is that it has an amplitude taper of 10dB in the elevation direction. This is to reduce multipath reflections from the wing that would otherwise be detrimental to interferometric radar measurements. This taper is provided by coupling networks in the interconnect circuits as opposed to attenuating the output of the T/R modules. Details are given of material choices and fabrication techniques that meet the demanding environmental conditions that the antenna must operate in. Predicted array performance is reported in terms of co-polarized and crosspolarized far-field antenna patterns, and also in terms of active reflection coefficient.

Unmanned Aerial Vehicle (UAV)↗

NASA NTRS2011

Miniaturized Airborne Imaging Central Server System

In recent years, some remote-sensing applications require advanced airborne multi-sensor systems to provide high performance reflective and emissive spectral imaging measurement rapidly over large areas. The key or unique problem of characteristics is associated with a black box back-end system that operates a suite of cutting-edge imaging sensors to collect simultaneously the high throughput reflective and emissive spectral imaging data with precision georeference. This back-end system needs to be portable, easy-to-use, and reliable with advanced onboard processing. The innovation of the black box backend is a miniaturized airborne imaging central server system (MAICSS). MAICSS integrates a complex embedded system of systems with dedicated power and signal electronic circuits inside to serve a suite of configurable cutting-edge electro- optical (EO), long-wave infrared (LWIR), and medium-wave infrared (MWIR) cameras, a hyperspectral imaging scanner, and a GPS and inertial measurement unit (IMU) for atmospheric and surface remote sensing. Its compatible sensor packages include NASA s 1,024 1,024 pixel LWIR quantum well infrared photodetector (QWIP) imager; a 60.5 megapixel BuckEye EO camera; and a fast (e.g. 200+ scanlines/s) and wide swath-width (e.g., 1,920+ pixels) CCD/InGaAs imager-based visible/near infrared reflectance (VNIR) and shortwave infrared (SWIR) imaging spectrometer. MAICSS records continuous precision georeferenced and time-tagged multisensor throughputs to mass storage devices at a high aggregate rate, typically 60 MB/s for its LWIR/EO payload. MAICSS is a complete stand-alone imaging server instrument with an easy-to-use software package for either autonomous data collection or interactive airborne operation. Advanced multisensor data acquisition and onboard processing software features have been implemented for MAICSS. With the onboard processing for real time image development, correction, histogram-equalization, compression, georeference, and data organization, fast aerial imaging applications, including the real time LWIR image mosaic for Google Earth, have been realized for NASA fs LWIR QWIP instrument. MAICSS is a significant improvement and miniaturization of current multisensor technologies. Structurally, it has a complete modular and solid-state design. Without rotating hard drives and other moving parts, it is operational at high altitudes and survivable in high-vibration environments. It is assembled from a suite of miniaturized, precision-machined, standardized, and stackable interchangeable embedded instrument modules. These stackable modules can be bolted together with the interconnection wires inside for the maximal simplicity and portability. Multiple modules are electronically interconnected as stacked. Alternatively, these dedicated modules can be flexibly distributed to fit the space constraints of a flying vehicle. As a flexibly configurable system, MAICSS can be tailored to interface a variety of multisensor packages. For example, with a 1,024x1,024 pixel LWIR and a 8,984x6,732 pixel EO payload, the complete MAICSS volume is approximately 7x9x11 in. (=18x23x28 cm), with a weight of 25 lb (=11.4 kg).

Sun, Xiuhong↗

NASA NTRS2004

Freeze-Tolerant Condensers

Two condensers designed for use in dissipating heat carried by working fluids feature two-phase, self-adjusting configurations such that their working lengths automatically vary to suit their input power levels and/or heat-sink temperatures. A key advantage of these condensers is that they can function even if the temperatures of their heat sinks fall below the freezing temperatures of their working fluids and the fluids freeze. The condensers can even be restarted from the frozen condition. The top part of the figure depicts the layout of the first condenser. A two-phase (liquid and vapor) condenser/vapor tube is thermally connected to a heat sink typically, a radiatively or convectively cooled metal panel. A single-phase (liquid) condensate-return tube (return artery) is also thermally connected to the heat sink. At intervals along their lengths, the condenser/vapor tube and the return artery are interconnected through porous plugs. This condenser configuration affords tolerance of freezing, variable effective thermal conductance (such that the return temperature remains nearly constant, independently of the ultimate sink temperature), and overall pressure drop smaller than it would be without the porous interconnections. An additional benefit of this configuration is that the condenser can be made to recover from the completely frozen condition either without using heaters, or else with the help of heaters much smaller than would otherwise be needed. The second condenser affords the same advantages and is based on a similar principle, but it has a different configuration that affords improved flow of working fluid, simplified construction, reduced weight, and faster recovery from a frozen condition.

Crowley, Christopher J.↗

NASA NTRS2003

Hybrid VLSI/QCA Architecture for Computing FFTs

A data-processor architecture that would incorporate elements of both conventional very-large-scale integrated (VLSI) circuitry and quantum-dot cellular automata (QCA) has been proposed to enable the highly parallel and systolic computation of fast Fourier transforms (FFTs). The proposed circuit would complement the QCA-based circuits described in several prior NASA Tech Briefs articles, namely Implementing Permutation Matrices by Use of Quantum Dots (NPO-20801), Vol. 25, No. 10 (October 2001), page 42; Compact Interconnection Networks Based on Quantum Dots (NPO-20855) Vol. 27, No. 1 (January 2003), page 32; and Bit-Serial Adder Based on Quantum Dots (NPO-20869), Vol. 27, No. 1 (January 2003), page 35. The cited prior articles described the limitations of very-large-scale integrated (VLSI) circuitry and the major potential advantage afforded by QCA. To recapitulate: In a VLSI circuit, signal paths that are required not to interact with each other must not cross in the same plane. In contrast, for reasons too complex to describe in the limited space available for this article, suitably designed and operated QCAbased signal paths that are required not to interact with each other can nevertheless be allowed to cross each other in the same plane without adverse effect. In principle, this characteristic could be exploited to design compact, coplanar, simple (relative to VLSI) QCA-based networks to implement complex, advanced interconnection schemes.

Fijany, Amir↗

NASA NTRS2003

Bit-Serial Adder Based on Quantum Dots

A proposed integrated circuit based on quantum-dot cellular automata (QCA) would function as a bit-serial adder. This circuit would serve as a prototype building block for demonstrating the feasibility of quantum-dots computing and for the further development of increasingly complex and increasingly capable quantum-dots computing circuits. QCA-based bit-serial adders would be especially useful in that they would enable the development of highly parallel and systolic processors for implementing fast Fourier, cosine, Hartley, and wavelet transforms. The proposed circuit would complement the QCA-based circuits described in "Implementing Permutation Matrices by Use of Quantum Dots" (NPO-20801), NASA Tech Briefs, Vol. 25, No. 10 (October 2001), page 42 and "Compact Interconnection Networks Based on Quantum Dots" (NPO-20855), which appears elsewhere in this issue. Those articles described the limitations of very-large-scale-integrated (VLSI) circuitry and the major potential advantage afforded by QCA. To recapitulate: In a VLSI circuit, signal paths that are required not to interact with each other must not cross in the same plane. In contrast, for reasons too complex to describe in the limited space available for this article, suitably designed and operated QCA-based signal paths that are required not to interact with each other can nevertheless be allowed to cross each other in the same plane without adverse effect. In principle, this characteristic could be exploited to design compact, coplanar, simple (relative to VLSI) QCA-based networks to implement complex, advanced interconnection schemes. To enable a meaningful description of the proposed bit-serial adder, it is necessary to further recapitulate the description of a quantum-dot cellular automation from the first-mentioned prior article: A quantum-dot cellular automaton contains four quantum dots positioned at the corners of a square cell. The cell contains two extra mobile electrons that can tunnel (in the quantum-mechanical sense) between neighboring dots within the cell. The Coulomb repulsion between the two electrons tends to make them occupy antipodal dots in the cell. For an isolated cell, there are two energetically equivalent arrangements (denoted polarization states) of the extra electrons. The cell polarization is used to encode binary information. Because the polarization of a nonisolated cell depends on Coulomb-repulsion interactions with neighboring cells, universal logic gates and binary wires could be constructed, in principle, by arraying QCA of suitable design in suitable patterns. Again, for reasons too complex to describe here, in order to ensure accuracy and timeliness of the output of a QCA array, it is necessary to resort to an adiabatic switching scheme in which the QCA array is divided into subarrays, each controlled by a different phase of a multiphase clock signal. In this scheme, each subarray is given time to perform its computation, then its state is frozen by raising its inter-dot potential barriers and its output is fed as the input to the successor subarray. The successor subarray is kept in an unpolarized state so it does not influence the calculation of preceding subarray. Such a clocking scheme is consistent with pipeline computation in the sense that each different subarray can perform a different part of an overall computation. In other words, QCA arrays are inherently suitable for pipeline and, moreover, systolic computations. This sequential or pipeline aspect of QCA would be utilized in the proposed bit-serial adders.

Fijany, Amir↗

NASA NTRS2011

Observability and Estimation of Distributed Space Systems via Local Information-Exchange Networks

Spacecraft formation flying involves the coordination of states among multiple spacecraft through relative sensing, inter-spacecraft communication, and control. Most existing formation-flying estimation algorithms can only be supported via highly centralized, all-to-all, static relative sensing. New algorithms are proposed that are scalable, modular, and robust to variations in the topology and link characteristics of the formation exchange network. These distributed algorithms rely on a local information exchange network, relaxing the assumptions on existing algorithms. Distributed space systems rely on a signal transmission network among multiple spacecraft for their operation. Control and coordination among multiple spacecraft in a formation is facilitated via a network of relative sensing and interspacecraft communications. Guidance, navigation, and control rely on the sensing network. This network becomes more complex the more spacecraft are added, or as mission requirements become more complex. The observability of a formation state was observed by a set of local observations from a particular node in the formation. Formation observability can be parameterized in terms of the matrices appearing in the formation dynamics and observation matrices. An agreement protocol was used as a mechanism for observing formation states from local measurements. An agreement protocol is essentially an unforced dynamic system whose trajectory is governed by the interconnection geometry and initial condition of each node, with a goal of reaching a common value of interest. The observability of the interconnected system depends on the geometry of the network, as well as the position of the observer relative to the topology. For the first time, critical GN&C (guidance, navigation, and control estimation) subsystems are synthesized by bringing the contribution of the spacecraft information-exchange network to the forefront of algorithmic analysis and design. The result is a formation estimation algorithm that is modular and robust to variations in the topology and link properties of the underlying formation network.

Fathpour, Nanaz↗

NASA NTRS2012

Precipitation from Space: Advancing Earth System Science

Of the three primary sources of spatially contiguous precipitation observations (surface networks, ground-based radar, and satellite-based radar/radiometers), only the last is a viable source over ocean and much of the Earth's land. As recently as 15 years ago, users needing quantitative detail of precipitation on anything under a monthly time scale relied upon products derived from geostationary satellite thermal infrared (IR) indices. The Special Sensor Microwave Imager (SSMI) passive microwave (PMW) imagers originated in 1987 and continue today with the SSMI sounder (SSMIS) sensor. The fortunate longevity of the joint National Aeronautics and Space Administration (NASA) and Japan Aerospace Exploration Agency (JAXA) Tropical Rainfall Measuring Mission (TRMM) is providing the environmental science community a nearly unbroken data record (as of April 2012, over 14 years) of tropical and sub-tropical precipitation processes. TRMM was originally conceived in the mid-1980s as a climate mission with relatively modest goals, including monthly averaged precipitation. TRMM data were quickly exploited for model data assimilation and, beginning in 1999 with the availability of near real time data, for tropical cyclone warnings. To overcome the intermittently spaced revisit from these and other low Earth-orbiting satellites, many methods to merge PMW-based precipitation data and geostationary satellite observations have been developed, such as the TRMM Multisatellite Precipitation Product and the Climate Prediction Center (CPC) morphing method (CMORPH. The purpose of this article is not to provide a survey or assessment of these and other satellite-based precipitation datasets, which are well summarized in several recent articles. Rather, the intent is to demonstrate how the availability and continuity of satellite-based precipitation data records is transforming the ways that scientific and societal issues related to precipitation are addressed, in ways that would not be otherwise possible. These developments have taken place in parallel with the growth of an increasingly interconnected scientific environment. Scientists from different disciplines can easily interact with each other via information and materials they encounter online, and collaborate remotely without ever meeting each other in person. Likewise, these precipitation datasets are quickly and easily available via various data portals and are widely used. Within the framework of the NASA/JAXA Global Precipitation Measurement (GPM mission, these applications will become increasingly interconnected. We emphasize that precipitation observations by themselves provide an incomplete picture of the state of the atmosphere. For example, it is unlikely that a richer understanding of the global water cycle will be possible by standalone missions and algorithms, but must also involve some component of data, where model analyses of the physical state are constrained alongside multiple observations (e.g., precipitation, evaporation, radiation). The next section provides examples extracted from the many applications that use various high-resolution precipitation products. The final section summarizes the future system for global precipitation processing.

Kucera, Paul A.↗

NASA NTRS2012

Inverted Three-Junction Tandem Thermophotovoltaic Modules

An InGaAs-based three-junction (3J) tandem thermophotovoltaic (TPV) cell has been investigated to utilize more of the blackbody spectrum (from a 1,100 C general purpose heat source GPHS) efficiently. The tandem consists of three vertically stacked subcells, a 0.74-eV InGaAs cell, a 0.6- eV InGaAs cell, and a 0.55-eV InGaAs cell, as well as two interconnecting tunnel junctions. A greater than 20% TPV system efficiency was achieved by another group with a 1,040 C blackbody using a single-bandgap 0.6- eV InGaAs cell MIM (monolithic interconnected module) (30 lateral junctions) that delivered about 12 V/30 or 0.4 V/junction. It is expected that a three-bandgap tandem MIM will eventually have about 3 this voltage (1.15 V) and about half the current. A 4 A/cm2 would be generated by a single-bandgap 0.6-V InGaAs MIM, as opposed to the 2 A/cm2 available from the same spectrum when split among the three series-connected junctions in the tandem stack. This would then be about a 50% increase (3xVoc, 0.5xIsc) in output power if the proposed tandem replaced the single- bandgap MIM. The advantage of the innovation, if successful, would be a 50% increase in power conversion efficiency from radioisotope heat sources using existing thermophotovoltaics. Up to 50% more power would be generated for radioisotope GPHS deep space missions. This type of InGaAs multijunction stack could be used with terrestrial concentrator solar cells to increase efficiency from 41 to 45% or more.

Wojtczuk, Steven↗

NASA NTRS2009

NASA-DoD Lead-Free Electronics Project

In response to concerns about risks from lead-free induced faults to high reliability products, NASA has initiated a multi-year project to provide manufacturers and users with data to clarify the risks of lead-free materials in their products. The project will also be of interest to component manufacturers supplying to high reliability markets. The project was launched in November 2006. The primary technical objective of the project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: - Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with solder interconnects consisting of lead-free alloys - Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with solder interconnects consisting of mixed alloys, lead component finish/lead-free solder and lead-free component finish/SnPb solder.

Kessel, Kurt R.↗